Semiconductor device
Latest Mitsubishi Electric Corporation Patents:
- METHOD OF MOLDING FIBER REINFORCED RESIN IMPELLER
- PERSONNEL BIDDING SUPPORT SYSTEM, PERSONNEL BIDDING SUPPORT METHOD, PERSONNEL BIDDING SUPPORT DEVICE, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM
- VEHICLE MANAGEMENT APPARATUS AND VEHICLE MANAGEMENT METHOD
- SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- A METHOD AND SYSTEM FOR ANOMALY DETECTION IN AN OPERATIONAL ASSET, AND A METHOD FOR REPAIRING AN OPERATIONAL ASSET
Description
The broken line in the figure drawings is included for the purpose of illustrating environment and forms no part of the claimed design.
Claims
The ornamental design for a semiconductor device, as shown and described.
Referenced Cited
Patent History
Patent number: D783549
Type: Grant
Filed: Jun 18, 2015
Date of Patent: Apr 11, 2017
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Takehiro Araki (Fukuoka), Yoshitaka Kimura (Tokyo), Akira Goto (Fukuoka), Akihiko Yamashita (Hyogo), Mariko Ono (Fukuoka), Ryo Goto (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/530,661
Type: Grant
Filed: Jun 18, 2015
Date of Patent: Apr 11, 2017
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Takehiro Araki (Fukuoka), Yoshitaka Kimura (Tokyo), Akira Goto (Fukuoka), Akihiko Yamashita (Hyogo), Mariko Ono (Fukuoka), Ryo Goto (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/530,661
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)