Semiconductor device

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line in the figure drawings is included for the purpose of illustrating environment and forms no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.

Referenced Cited
U.S. Patent Documents
D357462 April 18, 1995 Terasawa
D401912 December 1, 1998 Majumdar
D705184 May 20, 2014 Takahashi
D767516 September 27, 2016 Yoneyama
D773413 December 6, 2016 Yoneyama
20100149774 June 17, 2010 Matsumoto
Patent History
Patent number: D783549
Type: Grant
Filed: Jun 18, 2015
Date of Patent: Apr 11, 2017
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Takehiro Araki (Fukuoka), Yoshitaka Kimura (Tokyo), Akira Goto (Fukuoka), Akihiko Yamashita (Hyogo), Mariko Ono (Fukuoka), Ryo Goto (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/530,661