Semiconductor module

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Description

FIG. 1 is a front view of a semiconductor module according to our new design;

FIG. 2 is a rear view of the semiconductor module of FIG. 1;

FIG. 3 is a left side view of the semiconductor module of FIG. 1;

FIG. 4 is a right side view of the semiconductor module of FIG. 1;

FIG. 5 is a top view of the semiconductor module of FIG. 1;

FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,

FIG. 7 is a top, front, right side perspective view of the semiconductor module of FIG. 1.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D705184
Type: Grant
Filed: Sep 24, 2013
Date of Patent: May 20, 2014
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Hideaki Takahashi (Matsumoto), Kenshi Terashima (Matsumoto), Satoru Motohashi (Matsumoto), Masahiro Taoka (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/467,820