Semiconductor module
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Description
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted.
Claims
The ornamental design for a semiconductor module, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D705184
Type: Grant
Filed: Sep 24, 2013
Date of Patent: May 20, 2014
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Hideaki Takahashi (Matsumoto), Kenshi Terashima (Matsumoto), Satoru Motohashi (Matsumoto), Masahiro Taoka (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/467,820
Type: Grant
Filed: Sep 24, 2013
Date of Patent: May 20, 2014
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Hideaki Takahashi (Matsumoto), Kenshi Terashima (Matsumoto), Satoru Motohashi (Matsumoto), Masahiro Taoka (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/467,820
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)