Headphone

- SONY CORPORATION
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Description

FIG. 1 is a front, top, right perspective view of a first embodiment of a headphone showing our new design;

FIG. 2 is a front, bottom, right perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a partially enlarged front, top, right perspective view thereof along the lines 7-7 and 7′-7′ of FIG. 1;

FIG. 8 is a front, top, right perspective view of a second embodiment of a headphone showing our new design;

FIG. 9 is a front, bottom, right perspective view thereof;

FIG. 10 is a front elevational view thereof;

FIG. 11 is a rear elevational view thereof;

FIG. 12 is a right side elevational view thereof;

FIG. 13 is a top plan view thereof; and

FIG. 14 is a partially enlarged front, top, right perspective view thereof along the lines 14-14 and 14′-14′ of FIG. 8;

FIG. 15 is a front, top, right perspective view of a third embodiment of a headphone showing our new design;

FIG. 16 is a front, bottom, right perspective view thereof;

FIG. 17 is a front elevational view thereof;

FIG. 18 is a rear elevational view thereof;

FIG. 19 is a right side elevational view thereof;

FIG. 20 is a top plan view thereof; and

FIG. 21 is a partially enlarged front, top, right perspective view thereof along the lines 21-21 and 21′-21′ of FIG. 17;

FIG. 22 is a front, top, right perspective view of a fourth embodiment of a headphone showing our new design;

FIG. 23 is a front, bottom, right perspective view thereof;

FIG. 24 is a front elevational view thereof;

FIG. 25 is a rear elevational view thereof;

FIG. 26 is a right side elevational view thereof;

FIG. 27 is a top plan view thereof; and

FIG. 28 is a partially enlarged front, top, right perspective view thereof along the lines 28-28 and 28′-28′ of FIG. 24;

FIG. 29 is a front, top, right perspective view of a fifth embodiment of a headphone showing our new design;

FIG. 30 is a front, bottom, right perspective view thereof;

FIG. 31 is a front elevational view thereof;

FIG. 32 is a rear elevational view thereof;

FIG. 33 is a right side elevational view thereof;

FIG. 34 is a top plan view thereof; and,

FIG. 35 is a partially enlarged front, top, right perspective view thereof along the lines 35-35 and 35′-35′ of FIG. 31; Broken lines illustrate unclaimed portions of the earphone or headphone and form no part of the claimed design. Dot-dash broken lines define the boundaries of, but are not included in, the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D853985
Type: Grant
Filed: May 26, 2017
Date of Patent: Jul 16, 2019
Assignee: SONY CORPORATION (Tokyo)
Inventors: Tomohiro Ito (Tokyo), Takeshi Inoue (Kanagawa), Daisuke Matsuo (Saitama), Hisahiro Tanaka (Chiba)
Primary Examiner: Paula Allen Greene
Application Number: 29/605,564
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)