Integrated circuit package
Description
Claims
The ornamental design for an integrated circuit package, as shown.
Referenced Cited
U.S. Patent Documents
Other references
5220298 | June 15, 1993 | Nagase |
D355411 | February 14, 1995 | Sadigh-Behzadi |
D396211 | July 21, 1998 | Enomoto |
D396212 | July 21, 1998 | Enomoto |
D396213 | July 21, 1998 | Enomoto |
D397092 | August 18, 1998 | Sano |
D416236 | November 9, 1999 | Kobayashi |
D489338 | May 4, 2004 | Seddon |
D510728 | October 18, 2005 | Celaya |
9142531 | September 22, 2015 | Camacho |
9184122 | November 10, 2015 | Jin |
9299661 | March 29, 2016 | Kapusta |
9355962 | May 31, 2016 | Lee |
9437512 | September 6, 2016 | Gregorich |
9530945 | December 27, 2016 | Badehi |
9653442 | May 16, 2017 | Yu |
D796459 | September 5, 2017 | Iwai |
9859253 | January 2, 2018 | Jayaraman |
10134685 | November 20, 2018 | Chen |
10615151 | April 7, 2020 | Hu |
10636757 | April 28, 2020 | Yang |
10685896 | June 16, 2020 | Liu |
10790162 | September 29, 2020 | Tsai |
D902164 | November 17, 2020 | Kondo |
10867879 | December 15, 2020 | Yu |
- What is μMAX IC package? https://electronics.stackexchange.com/questions/15839/what-is-%c2%b5max-ic-package, Jun. 23, 2011. (Year: 2011).
Patent History
Patent number: D920266
Type: Grant
Filed: Mar 17, 2020
Date of Patent: May 25, 2021
Inventor: Jian Wei Yang (Guangdong)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/728,332
Type: Grant
Filed: Mar 17, 2020
Date of Patent: May 25, 2021
Inventor: Jian Wei Yang (Guangdong)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/728,332
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)