Integrated circuit package

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front elevational view of an integrated circuit package showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a front perspective view thereof; and,

FIG. 8 is a rear perspective view thereof.

Claims

The ornamental design for an integrated circuit package, as shown.

Referenced Cited
U.S. Patent Documents
5220298 June 15, 1993 Nagase
D355411 February 14, 1995 Sadigh-Behzadi
D396211 July 21, 1998 Enomoto
D396212 July 21, 1998 Enomoto
D396213 July 21, 1998 Enomoto
D397092 August 18, 1998 Sano
D416236 November 9, 1999 Kobayashi
D489338 May 4, 2004 Seddon
D510728 October 18, 2005 Celaya
9142531 September 22, 2015 Camacho
9184122 November 10, 2015 Jin
9299661 March 29, 2016 Kapusta
9355962 May 31, 2016 Lee
9437512 September 6, 2016 Gregorich
9530945 December 27, 2016 Badehi
9653442 May 16, 2017 Yu
D796459 September 5, 2017 Iwai
9859253 January 2, 2018 Jayaraman
10134685 November 20, 2018 Chen
10615151 April 7, 2020 Hu
10636757 April 28, 2020 Yang
10685896 June 16, 2020 Liu
10790162 September 29, 2020 Tsai
D902164 November 17, 2020 Kondo
10867879 December 15, 2020 Yu
Other references
  • What is μMAX IC package? https://electronics.stackexchange.com/questions/15839/what-is-%c2%b5max-ic-package, Jun. 23, 2011. (Year: 2011).
Patent History
Patent number: D920266
Type: Grant
Filed: Mar 17, 2020
Date of Patent: May 25, 2021
Inventor: Jian Wei Yang (Guangdong)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/728,332