Semiconductor device package
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Description
FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof; and,
FIG. 4 is an elevational view from the front side thereof.
Claims
We claim the ornamental design for a semiconductor device package, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D510728
Type: Grant
Filed: Aug 11, 2004
Date of Patent: Oct 18, 2005
Assignee: Semiconductor Components Industries LLC (Phoenix, AZ)
Inventors: Phillip Celaya (Gilbert, AZ), Darrell D. Truhitte (Phoenix, AZ), Michael J. Seddon (Gilbert, AZ)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Application Number: 29/211,047
Type: Grant
Filed: Aug 11, 2004
Date of Patent: Oct 18, 2005
Assignee: Semiconductor Components Industries LLC (Phoenix, AZ)
Inventors: Phillip Celaya (Gilbert, AZ), Darrell D. Truhitte (Phoenix, AZ), Michael J. Seddon (Gilbert, AZ)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Application Number: 29/211,047
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)