Temporary protective film for manufacturing semiconductor devices

Description

FIG. 1 is a front, top and left side perspective view of a temporary protective film for manufacturing semiconductor devices of the present invention;

FIG. 2 is a rear, bottom and left side perspective view of the thereof.

FIG. 3 is a front, top and right side perspective view of the thereof.

FIG. 4 is a front view of the thereof.

FIG. 5 is a rear view of the thereof.

FIG. 6 is a top view of the thereof.

FIG. 7 is a bottom view of the thereof.

FIG. 8 is a left side view of the thereof.

FIG. 9 is a right side view of the thereof; and,

FIG. 10 is a sectional view taken along the line 10-10 of FIG. 8.

Claims

The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.