Adhesive tape for semiconductor manufacturing
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Description
Claims
The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D664511
Type: Grant
Filed: Apr 15, 2011
Date of Patent: Jul 31, 2012
Assignee: Hitachi Chemical Company, Ltd. (Tokyo)
Inventors: Kouhei Taniguchi (Ichihara), Takayuki Matsuzaki (Ichihara), Shinya Katou (Ichihara), Kouji Komorida (Ichihara), Michio Mashino (Ichihara), Tatsuya Sakuta (Ichihara), Rie Katou (Ichihara)
Primary Examiner: Selina Sikder
Attorney: Miles & Stockbridge P.C.
Application Number: 29/389,790
Type: Grant
Filed: Apr 15, 2011
Date of Patent: Jul 31, 2012
Assignee: Hitachi Chemical Company, Ltd. (Tokyo)
Inventors: Kouhei Taniguchi (Ichihara), Takayuki Matsuzaki (Ichihara), Shinya Katou (Ichihara), Kouji Komorida (Ichihara), Michio Mashino (Ichihara), Tatsuya Sakuta (Ichihara), Rie Katou (Ichihara)
Primary Examiner: Selina Sikder
Attorney: Miles & Stockbridge P.C.
Application Number: 29/389,790
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)