RF transistor package and mounting pad
An improved semiconductor package is provided wherein the mounting pad for the semiconductor is made from a material selected from the group consisting of aluminum nitride, diamond, alumina, and boron nitride.
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Claims
Referenced Cited
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Patent History
Patent number: RE35845
Type: Grant
Filed: Apr 28, 1994
Date of Patent: Jul 14, 1998
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventor: Gasper Butera (Blue Bell, PA)
Primary Examiner: Frank Gonzalez
Assistant Examiner: Reginald A. Ratliff
Attorneys: Theodore E. Galanthay, Lisa K. Jorgenson
Application Number: 8/235,022
Type: Grant
Filed: Apr 28, 1994
Date of Patent: Jul 14, 1998
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventor: Gasper Butera (Blue Bell, PA)
Primary Examiner: Frank Gonzalez
Assistant Examiner: Reginald A. Ratliff
Attorneys: Theodore E. Galanthay, Lisa K. Jorgenson
Application Number: 8/235,022
Classifications
Current U.S. Class:
Of Insulating Material Other Than Ceramic (257/702);
Insulating Material (257/701);
Directly Attached To Semiconductor Device (257/707);
Diamond Or Silicon Carbide (257/77)
International Classification: H01L 3902;
International Classification: H01L 3902;