Abstract: In an example, for manufacturing a semiconductor device, first dopants are implanted through a first surface section of a first surface of a silicon carbide body. A trench is formed that extends from the first surface into the silicon carbide body. The trench includes a first sidewall surface and an opposite second sidewall surface. A spacer mask is formed. The spacer mask covers at least the first sidewall surface. Second dopants are implanted through a portion of a bottom surface of the trench exposed by the spacer mask. The first dopants and the second dopants have a same conductivity type. The first dopants and the second dopants are activated. The first dopants form a doped top shielding region adjoining the second sidewall surface. The second dopants form a doped buried shielding region adjoining the bottom surface.

Abstract: A power semiconductor device is proposed. The vertical power semiconductor device includes a silicon carbide (SiC) semiconductor body having a first surface and a second surface opposite to the first surface. The SiC semiconductor body includes a transistor cell area comprising gate structures, a gate pad area, and an interconnection area electrically coupling a gate electrode of the gate structures and a gate pad of the gate pad area via a gate interconnection. The vertical power semiconductor device further includes a source or emitter electrode. The vertical power semiconductor device further includes a first interlayer dielectric comprising a first interface to the source or emitter electrode and a second interface to at least one of the gate electrode, or the gate interconnection, or the gate pad, and wherein a conduction band offset at the first interface ranges from 1 eV to 2.5 eV.

Abstract: A semiconductor device includes a semiconductor layer having a first surface and a second surface, a unit cell including a diode region of a first conductivity type formed in a surface layer portion of the first surface of the semiconductor layer, a well region of a second conductivity type formed in the surface layer portion of the first surface of the semiconductor layer along a peripheral edge of the diode region, and a first conductivity type region formed in a surface layer portion of the well region, a gate electrode layer facing the well region and the first conductivity type region through a gate insulating layer and a first surface electrode covering the diode region and the first conductivity type region on the first surface of the semiconductor layer, and forming a Schottky junction with the diode region and an ohmic junction with the first conductivity type region.

Abstract: Heterostructure and double-heterostructure trench-gate devices, in which the substrate and/or the body are constructed of a narrower-bandgap semiconductor material than the uppermost portion of the drift region. Fabrication most preferably uses a process where gate dielectric anneal is performed after all other high-temperature steps have already been done.

Abstract: A semiconductor device has an active area in which a main current flows and an outer-edge area surrounding the active area. The semiconductor device includes: an n-type semiconductor layer made of a wide bandgap semiconductor; a plurality of p-type guard rings provided inside the semiconductor layer in the outer-edge area to surround the active area; and a separation region provided in a concentric ring shape in the outer-edge area to be in contact with both of the adjacent guard rings, wherein the separation region contains both n-type first impurities and p-type second impurities.

Abstract: The present disclosure discloses a semiconductor device, a method of manufacturing the same, and a semiconductor package structure. The semiconductor device including a substrate, a multilayer semiconductor layer located on one side of the substrate, in which a Two-Dimensional Electron Gas is formed, a first source, a first gate and a first drain located on one side of the multilayer semiconductor layer and located within an active region of the multilayer semiconductor layer, the first gate being located between the first source and the first drain, and a back surface gate contact electrode located on one side of the substrate away from the multilayer semiconductor layer, wherein the first gate is electrically connected to the back surface gate contact electrode. A signal is provided from the back surface of the semiconductor device to the first gate, to reduce the parasitic inductance and parasitic resistance caused by the device during the packaging process.

Abstract: The present invention relates to a semiconductor device having trench gates. The semiconductor device includes the following: a first semiconductor layer; a first semiconductor region selectively disposed in the upper layer of the first semiconductor layer; a second semiconductor region in contact with the first semiconductor region; a third semiconductor region on the bottom surfaces of the first and second semiconductor regions; gate trenches provided to penetrate the first and third semiconductor regions in the thickness direction of the first and third semiconductor regions to reach the inside of the first semiconductor layer; a field-reducing region on the bottom of each gate trench; and connection layers arranged in the first semiconductor layer at intervals so as to be each in contact with at least one of sidewalls of the gate trenches, the connection layers each electrically connecting the field-reducing region to the third semiconductor region.

Abstract: A silicon carbide device includes: a transistor cell having a stripe-shaped trench gate structure extending from a first surface into a silicon carbide body, the gate structure having a gate length along a lateral first direction, a bottom surface and a first gate sidewall of the gate structure being connected via a first bottom edge of the gate structure; at least one source region of a first conductivity type in contact with the first gate sidewall; and a shielding region of a second conductivity type in contact with the first bottom edge of the gate structure across at least 20% of the gate length. No source regions of the first conductivity type are in contact with a second gate sidewall of the gate structure.

Abstract: A multilayered semiconductor device including a substrate including n-type or p-type doped silicon carbide (SiC), an epitaxial oxide layer above the substrate, and a metal layer above the epitaxial oxide layer. In some cases, the epitaxial oxide layer includes n-type conductivity and the substrate is p-type doped, and the substrate and the epitaxial oxide layer form a p/n junction. In some cases, the device can further include an epitaxial transition layer between the substrate and the epitaxial oxide layer, where the epitaxial transition layer includes an n-type doping density that is at least an order of magnitude greater than an n-type doping density of the epitaxial oxide layer. In some cases, the substrate can be a composite substrate including a surface layer including single crystal SiC on a polycrystalline SiC layer. In some cases, a second metal layer is in contact with the substrate.

Abstract: The present application discloses an SiC MOSFET device, including an SiC epitaxial layer in which a trench gate is formed, wherein a first bottom doped region is formed below a bottom surface of a gate trench, a second deep doped region with spacing from the gate trench is formed in the SiC epitaxial layer, the first bottom doped region is connected to a source so that voltage borne by a gate dielectric layer on the bottom surface of the gate trench is determined by gate-source voltage; the second deep doped region extends downward from a top surface of the SiC epitaxial layer, and a bottom surface of the second deep doped region is located below a bottom surface of the first bottom doped region; a top of the second deep doped region is connected to the source. The present application further discloses a method for manufacturing an SiC MOSFET device.

Abstract: A silicon carbide semiconductor device has an active region and a termination structure portion disposed outside of the active region. The silicon carbide semiconductor device includes a semiconductor substrate of a second conductivity type, a first semiconductor layer of the second conductivity type, a second semiconductor layer of a first conductivity type, first semiconductor regions of the second conductivity type, second semiconductor regions of the first conductivity type, a gate insulating film, a gate electrode, a first electrode, and a second electrode. During bipolar operation, a smaller density among an electron density and a hole density of an end of the second semiconductor layer in the termination structure portion is at most 1×1015/cm3.

Abstract: A semiconductor device includes: a first wiring layer having a first main surface facing a thickness direction; a second wiring layer having a second main surface facing the same side as the first main surface and located away from the first wiring layer; a first semiconductor element having a first main surface electrode and bonded to the first main surface; a second semiconductor element having a second main surface electrode and bonded to the second main surface; a first terminal electrically connected to the second main surface electrode; a first conductive member bonded to the first main surface electrode and the second main surface; and a second conductive member bonded to the second main surface electrode and the first terminal, wherein the first terminal is located away from the first wiring layer in the thickness direction, and the second conductive member overlaps the first wiring layer in the thickness direction.

Abstract: This method of evaluating a SiC substrate includes a preparation step of preparing two or more SiC substrates obtained from the same SiC ingot grown from the same seed crystal, a defect position specifying step of specifying positions of defects in the substrates by observing a main surface of each of the two or more SiC substrates, and a comparison step of comparing the positions of the defects of the two or more SiC substrates, in which, in the preparation step, a SiC substrate positioned closest to the seed crystal is used as a reference wafer among the two or more SiC substrates, and the comparison step comprises a sub-step wherein a first defect of the reference wafer is compared with a second defect of a SiC substrate other than the reference wafer, it is judged whether a defect distance of the two compared defects in a [11-20] direction is 0.6 mm or more or less than 0.

Abstract: A semiconductor device includes a first silicon carbide region of a first conductivity type, a second silicon carbide region of a second conductivity type on the first region, and a third silicon carbide region of a second conductivity type on the second region. Fourth and fifth silicon carbide region of the first conductivity type are on the third region. A first electrode has a first portion between the fourth region and fifth region in a first direction. A metal silicide layer is between the first portion and the third region, between the first portion and the fourth region in the first direction, and between the first portion and the fifth silicon carbide region in the first direction.

Abstract: Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Processes and articles utilizing such high purity SiOC and SiC.

Abstract: In a semiconductor device, it is preferable to suppress a variation in characteristics of a temperature sensor. The semiconductor device is provided that includes a semiconductor substrate having a first conductivity type drift region, a transistor section provided in the semiconductor substrate, a diode section provided in the semiconductor substrate, a second conductivity type well region exposed at an upper surface of the semiconductor substrate, a temperature sensing unit that is adjacent to the diode section in top view and is provided above the well region, and an upper lifetime control region that is provided in the diode section, at the upper surface side of the semiconductor substrate, and in a region not overlapping with the temperature sensing unit in top view.

Abstract: A p-GaN high-electron-mobility transistor, includes a substrate, a channel layer stacked on the substrate, a supply layer stacked on the channel layer, a first doped layer stacked on the supply layer, a second doped layer stacked on the first doped layer, and a third doped layer stacked on the second doped layer. A doping concentration of the first doped layer and the doping concentration of the third doped layer are lower than a doping concentration of the second doped layer. A gate is located on the third doped layer, and a source and a drain are electrically connected to the channel layer and the supply layer, respectively.

Abstract: In a semiconductor device, a source region is made of an epitaxial layer so as to reduce variation in thickness of a base region and variation in a threshold value. Outside of a cell part, a side surface of a gate trench is inclined relative to a normal direction to a main surface of a substrate, as compared with a side surface of a gate trench in the cell part that is provided by the epitaxial layer of the source region being in contact with the base region.

Abstract: Junction field effect transistors (JFETs) and related manufacturing methods are disclosed herein. A disclosed JFET includes a vertical channel region located in a mesa and a first channel control region located on a first side of the mesa. The first channel control region is at least one of a gate region and a first base region. The JEFT also includes a second base region located on a second side of the mesa and extending through the mesa to contact the vertical channel region. The vertical channel can be an implanted vertical channel. The vertical channel can be asymmetrically located in the mesa towards the first side of the mesa.

Abstract: A semiconductor device includes a semiconductor layer made of SiC. A transistor element having an impurity region is formed in a front surface portion of the semiconductor layer. A first contact wiring is formed on a back surface portion of the semiconductor layer, and defines one electrode electrically connected to the transistor element. The first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer and having a resistivity lower than that of the first wiring layer.

Abstract: The present disclosure relates to a semiconductor device including a substrate, a first region disposed in the substrate, a terminal region disposed in the first region, a body contact region disposed in the first region and spaced apart from the terminal region, a dielectric layer disposed on the substrate over the first region between the terminal region and the body contact region, an electrically conductive layer disposed on the dielectric layer, and a continuous metallic layer disposed on the electrically conductive layer and extending to the body contact region, the continuous metallic layer disposed on the body contact region and in physical contact with a top and side portions of the electrically conductive layer. The semiconductor device may additionally include a body contact interconnect disposed on a portion of the continuous metallic layer over the electrically conductive layer.

Abstract: A charge balanced (CB) trench-metal-oxide-semiconductor field-effect transistor (MOSFET) device may include a charge balanced (CB) layer defined within a first epitaxial (epi) layer that has a first conductivity type. The CB layer may include charge balanced (CB) regions that has a second conductivity type. The CB trench-MOSFET device may include a device layer defined in a second epi layer and having the first conductivity type, where the device layer is disposed on the CB layer. The device layer may include a source region, a base region, a trench feature, and a shield region having the second conductivity type disposed at a bottom surface of the trench feature. The device layer may also include a charge balanced (CB) bus region having the second conductivity type that extends between and electrically couples the CB regions of the CB layer to at least one region of the device layer having the second conductivity type.

Abstract: A merged PiN Schottky (MPS) diode includes a substrate, a first epitaxial layer of a first conductivity type, doped regions of a second conductivity type, a second epitaxial layer of the first conductivity type, and a Schottky metal layer. The first epitaxial layer is disposed on the first surface of the substrate. The doped regions are disposed in a surface of the first epitaxial layer, wherein the doped regions consist of first portions and second portions, the first portions are electrically floating, and the second portions are electrically connected to a top metal. The second epitaxial layer is disposed on the surface of the first epitaxial layer, wherein trenches are formed in the second epitaxial layer to expose the second portions of the doped regions. The Schottky metal layer is conformally deposited on the second epitaxial layer and the exposed second portions of the doped regions.

Abstract: A semiconductor device of embodiments includes: a silicon carbide layer having a first face and a second face and including a first trench, a second trench having a distance of 100 nm or less from the first trench, a first silicon carbide region of n-type, a second silicon carbide region of p-type between the first trench and the second trench, a third silicon carbide region of n-type between the second silicon carbide region and the first face, a fourth silicon carbide region between the first trench and the second silicon carbide region and containing oxygen, and a fifth silicon carbide region between the second trench and the second silicon carbide region and containing oxygen; a first gate electrode in the first trench; a second gate electrode in the second trench; a first gate insulating layer; a second gate insulating layer; a first electrode; and a second electrode.

Abstract: A power semiconductor device includes: a substrate; drain metal; a drift region; a base region; a gate structure; a first conductive type doped region contacting the base region on the side of the base region distant from the gate structure; a source region provided in the base region and between the first conductive type doped region and the gate structure; contact metal that is provided on the first conductive type doped region and forms a contact barrier having rectifying characteristics together with the first conductive type doped region below; and source metal wrapping the contact metal and contacting the source region.

Abstract: Methods of manufacturing heterojunction bipolar transistors are described herein. An exemplary method can include providing an emitter/base stack comprising a substrate, a base over the substrate, and/or an emitter over the base. The exemplary method further can include forming a collector. The exemplary method also can include wafer bonding the base to the collector. Other embodiments are also disclosed herein.

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

Abstract: A silicon carbide semiconductor power transistor and a method of manufacturing the same. The silicon carbide semiconductor power transistor of the disclosure includes a substrate made of silicon carbide (SiC), a drift layer disposed on the substrate, a gate layer formed on the drift layer, a plurality of first and second well pick-up regions disposed in the drift layer, a plurality of source electrodes, and a plurality of contacts. A plurality of V-grooves is formed in the drift layer. A first opening is formed in the gate layer at a bottom of each of the V-grooves, and a second opening is formed in the gate layer at a top of the drift layer between the V-grooves. The plurality of contacts is disposed inside the second opening to be in direct contact with the second well pick-up regions.

Abstract: A power semiconductor device includes: a semiconductor layer of silicon carbide (SiC); at least one trench recessed into the semiconductor layer from a surface of the semiconductor layer; a gate insulating layer disposed on an inner surface of the at least one trench; at least one gate electrode layer disposed on the gate insulating layer to bury the at least one trench; a drift region disposed in the semiconductor layer under the at least one gate electrode layer, including a protrusion in contact with a part of a bottom surface of the at least one trench, and having a first conductivity type; a well region disposed in the semiconductor layer to contact the drift region while surrounding side surfaces and bottom edges of the at least one trench, and having a second conductivity type; and a source region disposed in the well region and having the first conductivity type.

Abstract: A silicon carbide semiconductor device includes a silicon carbide substrate having a first principal surface and a second principal surface. The silicon carbide substrate includes a drift region, a body region, and a source region. A gate trench is provided on the first principal surface. The silicon carbide substrate further includes a first reduced-electric field region provided between a bottom surface and the second principal surface. The source region includes a first region and a second region, and the first region is interposed between a side surface and the second region. The silicon carbide semiconductor device further includes a contact electrode with an ohmic junction with the second region.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, and third semiconductor layers, and a first insulating member. The first semiconductor layer includes first, second, third, fourth, and fifth partial regions. The third partial region is between the first and second partial regions. The fourth partial region is between the first and third partial regions. The fifth partial region is between the third and second partial regions. The first electrode includes a first electrode portion. The second semiconductor layer includes first and second semiconductor portions. The third semiconductor layer includes first and second semiconductor regions. The second semiconductor region is electrically connected to the first semiconductor region and the first electrode portion. The first insulating member includes a first insulating portion. The first insulating portion is provided between the third partial region and the third electrode.

Abstract: A semiconductor device according to an embodiment includes: a silicon carbide layer; a silicon oxide layer; and a region disposed between the silicon carbide layer and the silicon oxide layer and having a nitrogen concentration equal to or more than 1×1021 cm?3. Nitrogen concentration distribution in the silicon carbide layer, the silicon oxide layer, and the region have a peak in the region, a nitrogen concentration at a position 1 nm away from the peak to the side of the silicon oxide layer is equal to or less than 1×1018 cm?3, and a carbon concentration at the position is equal to or less than 1×1018 cm?3.

Abstract: The present disclosure provides an integrated circuit structure of a group III nitride semiconductor, a manufacturing method thereof, and use thereof. The integrated circuit structure is a complementary circuit of HEMT and HHMT based on the group III nitride semiconductor, and can realize the integration of HEMT and HHMT on the same substrate, and the HEMT and the HHMT respectively have a polarized junction with a vertical interface, the crystal orientations of the polarized junctions of the HEMT and the HHMT are different, the two-dimensional carrier gas forms a carrier channel in a direction parallel to the polarized junction, and corresponding channel carriers are almost depleted by burying the doped region.

Abstract: A semiconductor chip includes a semiconductor body having a main surface and a rear surface opposite the main surface, a first bond pad disposed on the main surface, a second bond pad disposed on the rear surface, a first switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the first bond pad, and a second switching device that is monolithically integrated in the semiconductor body and has a first input-output terminal that is electrically connected to the second bond pad.

Abstract: A type, size, and location of a crystal defect of an epitaxial layer of a semiconductor wafer containing silicon carbide are detected from a PL image by crystal defect inspection equipment. Detected crystal defects include a triangular polymorph stacking fault generated in the epitaxial layer during epitaxial growth and high-density BPDs extending from the stacking fault and present bundled between the stacking fault and a perfect crystal. Next, a chip region free of the triangular polymorph stacking fault and free of the high-density BPD in a specified area that is in the termination region and is located closer to a chip center than is a specified position is identified as a conforming product. A semiconductor chip set as a conforming product may contain high-density BPDs outside the specified area.

Abstract: The fabrication method for a silicon carbide semiconductor device according to this disclosure includes a step of forming a dielectric film over part of a silicon carbide layer, a step of forming an ohmic electrode adjoining the dielectric film on the silicon carbide layer, a step of removing an oxidized layer on the ohmic electrode, a step of forming a mask with its opening on the side opposite to the side where the ohmic electrode is adjoining the dielectric film on the ohmic electrode having the oxidized layer removed and on the dielectric film, and a step of wet etching of a film to be etched with hydrofluoric acid with the mask formed. With the fabrication method for a silicon carbide semiconductor device described in this disclosure, it is possible to fabricate a silicon carbide semiconductor device with reduced failure.

Abstract: A silicon carbide semiconductor device has a silicon carbide semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of a second conductivity type, first semiconductor regions of the first conductivity type, second semiconductor regions of the second conductivity type, a gate insulating film, gate electrodes, first electrodes, a second electrode, and a gate pad portion configured by a gate electrode pad and a connecting portion. The second semiconductor layer includes a first region facing the connecting portion and a second region facing a corner portion of the gate electrode pad, and the first and second regions are free of the second semiconductor regions. The oxide film is provided on surfaces of the second semiconductor regions and the first and second regions, and the oxide film and the gate insulating film are made of a same material.

Abstract: A silicon carbide epitaxial layer includes a first silicon carbide layer, a second silicon carbide layer, a third silicon carbide layer, and a fourth silicon carbide layer. A nitrogen concentration of the second silicon carbide layer is increased from the first silicon carbide layer toward the third silicon carbide layer. A value obtained by dividing, by a thickness of the second silicon carbide layer, a value obtained by subtracting a nitrogen concentration of the first silicon carbide layer from a nitrogen concentration of the third silicon carbide layer is less than or equal to 6×1023 cm?4. Assuming that the nitrogen concentration of the third silicon carbide layer is N cm?3 and a thickness of the third silicon carbide layer is X ?m, X and N satisfy a Formula 1.

Abstract: A method of fabricating a vertical fin-based field effect transistor (FET) includes providing a semiconductor substrate having a first surface and a second surface, the semiconductor substrate having a first conductivity type, epitaxially growing a first semiconductor layer on the first surface of the semiconductor substrate, the first semiconductor layer having the first conductivity type and including a drift layer and a graded doping layer on the drift layer, and epitaxially growing a second semiconductor layer having the first conductivity type on the graded doping layer. The method also includes forming a metal compound layer on the second semiconductor layer, forming a patterned hard mask layer on the metal compound layer, and etching the metal compound layer and the second semiconductor layer using the patterned hard mask layer as a mask exposing a surface of the graded doping layer to form a plurality of fins surrounded by a trench.

Abstract: A semiconductor device includes a semiconductor chip in which a field effect transistor mainly containing GaN is formed on a surface of a SiC semiconductor substrate. The semiconductor device includes a metal base on which a back surface of the semiconductor chip is mounted through a conductive adhesive material containing Ag and a resin mold configured to seal the semiconductor chip. A metal having wettability lower than wettability of Au or Cu with respect to Ag is exposed in a region extending along an edge of the back surface.

Abstract: A semiconductor device includes: a SiC substrate; a device structure in or on the SiC substrate and subject to an electric field during operation of the semiconductor device; a current-conduction region of a first conductivity type in the SiC substrate adjoining the device structure; and a shielding region of a second conductivity type laterally adjacent to the current-conduction region and configured to at least partly shield the device structure from the electric field. The shielding region has a higher net doping concentration than the current-conduction region, and has a length (L) measured from a first position which corresponds to a bottom of the device structure to a second position which corresponds to a bottom of the shielding region. The current-conduction region has a width (d) measured between opposing lateral sides of the current-conduction region, and L/d is in a range of 1 to 10.

Abstract: Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.

Abstract: An object of the present disclosure is to suppress decrease in withstand voltage and increase in ON voltage and to increase body diode current. An SiC-MOSFET includes: a source region formed on a surface layer of a base region; a gate electrode facing a channel region which is a region of the base region sandwiched between a drift layer and the source region via a gate insulating film; a source electrode having electrically contact with the source region; and a plurality of first embedded regions of a second conductivity type formed adjacent to a lower surface of the base region. The plurality of first embedded regions are formed immediately below at least both end portions of the base region, and three or more first embedded regions are formed to be separated from each other.

Abstract: A semiconductor device includes a silicon carbide (SiC) drift zone over a SiC field stop zone and/or a SiC semiconductor substrate. A concentration of Z1/2 defects in the SiC drift zone is at least one order of magnitude smaller than in the SiC field stop zone and/or the SiC semiconductor substrate. Separately or in combination, a concentration of Z1/2 defects in a part of the SiC drift zone is at least one order of magnitude smaller than in another part of the drift zone.

Abstract: A method for producing a silicon carbide semiconductor device includes preparing a silicon carbide substrate, forming an insulating film on one main surface of the silicon carbide substrate, forming a contact hole in the insulating film and exposing the one main surface of the silicon carbide substrate at a bottom surface of the contact hole, forming an Si film on the bottom surface of the contact hole, forming an Ni film on the Si film, performing a first heat treatment at a first temperature at which Ni and Si react, after the forming of the Ni film, removing an unreacted portion of the Ni film that does not react with the Si film by wet etching after the first heat treatment, and performing a second heat treatment at a second temperature higher than the first temperature after the removing of the unreacted portion.

Abstract: An electronic device includes a solid body of SiC having a surface and having a first conductivity type. A first implanted region and a second implanted region have a second conductivity type and extend into the solid body in a direction starting from the surface and delimit between them a surface portion of the solid body. A Schottky contact is on the surface and in direct contact with the surface portion. Ohmic contacts are on the surface and in direct contact with the first and second implanted regions. The solid body includes an epitaxial layer including the surface portion and a bulk portion. The surface portion houses a plurality of doped sub-regions which extend in succession one after another in the direction, are of the first conductivity type, and have a respective conductivity level higher than that of the bulk portion.

Abstract: A merged-PN-Schottky, MPS, diode includes an N substrate, an N-drift layer, a P-doped region in the drift layer, an ohmic contact on the P-doped region, a plurality of cells within the P-doped region and being portions of the drift layer where the P-doped region is absent, an anode metallization on the ohmic contact and on said cells, to form junction-barrier contacts and Schottky contacts respectively. The P-doped region has a grid-shaped layout separating from one another each cell and defining, together with the cells, an active area of the MPS diode. Each cell has a same geometry among quadrangular, quadrangular with rounded corners and circular; and the ohmic contact extends at the doped region with continuity along the grid-shaped layout.

Abstract: A trench SiC MOSFET integrated with a high-speed flyback diode and a preparation method thereof are provided. The MOSFET is a trench structure, a trench-type gate-controlled diode is added in the vicinity of the MOSFET to solve the problem of electric field concentration at the bottom and corners of a trench, and P-type buried layers are added to the bottom of the trench to decrease the electric field intensity. Moreover, the gate-controlled diode and a body diode of the device are connected in parallel, so the on-voltage drop of the body diode is greatly decreased, thus reducing the loss in the reverse recovery mode. In addition, the gate-controlled diode is a unipolar device without the charge-storage effect, so the reverse recovery current of the body diode can be completely eliminated, thus reducing the dynamic loss.

Abstract: A vertical semiconductor device includes one or more of a substrate, a buffer layer over the substrate, one or more drift layers over the buffer layer, and a spreading layer over the one or more drift layers.

Abstract: A compound semiconductor device, a compound semiconductor substrate, and a method for manufacturing of a compound semiconductor device. Compound semiconductor device 100 comprises Si substrate 1 which has a shape surrounding hole 21 when viewed in a plane, SIC layer 3 formed on top surface 1a of Si substrate 1 and covers hole 21, nitride layer 10 containing Ga formed on the top surface side of SiC layer 3, source electrode 13, drain electrode 15, and gate electrode 17 formed on the top surface side of nitride layer 10. The current flowing between source electrode 13 and drain electrode 15 can be controlled by the voltage applied to gate electrode 17. The Si substrate does not exist in the area RG where source electrode 13, drain electrode 15, and gate electrode 17 overlap the area when viewed from the direction orthogonal to top surface 1a of Si substrate 1.