Patents Issued in January 6, 2004
  • Patent number: 6674150
    Abstract: A heterojunction bipolar transistor is fabricated by stacking a Si collector layer, a SiGeC base layer and a Si emitter layer in this order. By making the amount of a lattice strain in the SiGeC base layer on the Si collector layer 1.0% or less, the band gap can be narrower than the band gap of the conventional practical SiGe (the Ge content is about 10%), and good crystalline can be maintained after a heat treatment. As a result, a narrow band gap base with no practical inconvenience can be realized.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: January 6, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Takagi, Koichiro Yuki, Kenji Toyoda, Yoshihiko Kanzawa
  • Patent number: 6674151
    Abstract: A semiconductor device having trap sites passivated with deuterium has enhanced immunity to hot carrier effects. The trap sites which are passivated with deuterium are encapsulated beneath a barrier film and are therefore resistant to having the deuterium diffuse away from the trap sites during subsequent high temperature processing operations.
    Type: Grant
    Filed: August 23, 1999
    Date of Patent: January 6, 2004
    Assignee: Agere Systems Inc.
    Inventors: Sundar S. Chetlur, Pradip K. Roy, Anthony S. Oates, Sidhartha Sen, Jonathan Z-N. Zhou
  • Patent number: 6674152
    Abstract: A bipolar p-i-n diode has a first (1) and second (5) region of opposite conductivity type and an intermediate drift region (3) between the first and second regions. Trenched field relief regions (14) are arranged to deplete the intermediate drift region (3) when the diode is reverse biased, so permitting a higher doping (12) to be used for the intermediate drift region (3) for a given breakdown voltage. This improves both the turn-on and turn-off characteristics of the diode.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: January 6, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Eddie Huang
  • Patent number: 6674153
    Abstract: A semiconductor device has: an inner active region 3 including a first electronic circuit formed on a semiconductor substrate; an outer active region 4 positioned between the edges 2a, 2b of the semiconductor substrate 2 and the inner active region 3 and including a second electronic circuit formed on the semiconductor substrate 2; a main bonding pad 6a for assembly formed inside a region where the inner active region 3 is opposed to the outer active region 4 and formed along the outer periphery of the inner active region 3; a sub-bonding pad 7 for analysis formed outside the opposing region 5 where the inner active region 3 is opposed to the outer active region 4; and a pad-to-pad interconnection wiring 8 for connecting the main bonding pad 6a to the sub-bonding pad 7.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takehiko Shimomura, Katsuyoshi Watanabe
  • Patent number: 6674154
    Abstract: A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead and the third lead are connected to each other upon production of the lead frame, a connecting portion therebetween has a smaller thickness than that of the frame body so that the first lead and the third lead can be separated from each other in a subsequent step.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: January 6, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masanori Minamio, Toru Nomura, Fumihiko Kawai
  • Patent number: 6674155
    Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: January 6, 2004
    Assignee: Advanced Display Inc.
    Inventors: Kouki Nakahara, Hitoshi Morishita
  • Patent number: 6674156
    Abstract: A leadless leadframe panel comprising a partially etched top surface of a substrate panel that forms recessed regions that define a portion of a first and a second set of tie bars and a portion of a first and second set of contact pads. A bottom surface of the panel forms lower recessed regions that define the remaining portion of the first and second set of tie bars and the remaining portion of the first and second set of contact pads. The resulting contact pads are connected to a respective one of the tie bars.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: January 6, 2004
    Assignee: National Semiconductor Corporation
    Inventors: Jaime Bayan, Peter Howard Spalding
  • Patent number: 6674157
    Abstract: A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: January 6, 2004
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Dennis Lang
  • Patent number: 6674158
    Abstract: A permanent protective semiconductor die coating made from a polymer that is fully curable through exposure to ultra violet light. A mixture of polymer resin and a photoactive compound is applied to the die and then cured through exposure to ultraviolet light to form the protective coating. In one preferred embodiment, the polymer resin is a phenol-formaldehyde epoxy resin and the photoactive compound is CD1011 (marketed under the brand name SARTOMER”. The coating may be applied as a thin protective film, such as a passivation layer, or as a thicker encapsulant used for semiconductor device packages. Such film coatings exhibit reduced film shrinkage and lower film stresses while maintaining mechanical properties comparable to polyimide film coatings.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Guy Blalock
  • Patent number: 6674159
    Abstract: A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: January 6, 2004
    Assignee: Sandia National Laboratories
    Inventors: Kenneth A. Peterson, Robert D. Watson
  • Patent number: 6674160
    Abstract: There is provided a semiconductor device including (a) a package comprised of a base, a sidewall standing on the base at a periphery of the base, and a cover mounted over the sidewall, the base, sidewall and cover defining a closed adiabatic space in the package, (b) a first semiconductor chip mounted on the base in the close adiabatic space, and (c) a second semiconductor chip mounted on the cover. The semiconductor device makes it possible to prevent heat generated in an upper semiconductor chip from being transferred to a lower semiconductor chip, and more highly integrate semiconductor chips than a conventional one.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: January 6, 2004
    Assignee: NEC Electronics Corporation
    Inventor: Kazuhiro Taguchi
  • Patent number: 6674161
    Abstract: Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate. In a preferred embodiment, the conductive structures comprise multi-layered, conductive pad structures.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: January 6, 2004
    Assignee: Rambus Inc.
    Inventor: Belgacem Haba
  • Patent number: 6674162
    Abstract: The present invention is directed to improving the reliability of a chip size package mounted on a print board. A metal post 9 is formed in such way that the top surface thereof is larger than the bottom surface, and that the metal post 9 is thinner in the middle than at its both ends. A solder ball 12 is mounted on the top surface of the metal post 9, achieving a larger contact area S′ between the metal post 9 and the solder ball 12 than that of the conventional art, which leads to the increased endurance against shear stresses. Furthermore, when the metal post 9 is made thinner in the middle than at its both ends, the metal post 9 is flexible in the lateral direction, and thus capable of further dissipating the stresses accumulated in the boundary area.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: January 6, 2004
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Yukihiro Takao
  • Patent number: 6674163
    Abstract: A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection protrude electrodes. The radiation protrude electrodes are formed on the back surface of the substrate in a chip area where said semiconductor chip is located. Each of the radiation protrude electrodes are formed with a first pitch so that the radiation protrude electrodes make one body joining layer when the package structure is subjected to a heat treatment. The connection protrude electrodes are formed on the back surface of the substrate in a peripheral area of the chip area. Each of the connection protrude electrodes formed with a second pitch which is larger than the first pitch so that the connection protrude electrodes stay individual when the package structure is subjected to a heat treatment.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: January 6, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Seiji Andoh
  • Patent number: 6674164
    Abstract: A means is discussed for electrically interconnecting, cooling and mechanically supporting a multiplicity of heat producing electronic and/or electrical components which is amenable to automated assembly. A structure is identified which consists of one or more fluid-cooled heatsinks; which are in proximate contact with heat producing components and one or more U-shaped spring clips which mechanically force thermal contact between the heat producing components and heatsinks. In turn, each heatsink contains two fluid-filled cavities separated by a common wall, wherein fluid in the first cavity flows in one direction, while fluid in the second cavity flows in the reverse direction. The components are powered by a bus that compensates for the location of the components, providing an equal voltage drop between a power source and each component. The bus is a flat plate that has been stamped to include slots that increase the voltage drop between selected portions of the bus.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: January 6, 2004
    Assignee: Aerovironment, Inc.
    Inventors: Wally E. Rippel, Darrell Buchanan
  • Patent number: 6674165
    Abstract: A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: January 6, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath, III
  • Patent number: 6674166
    Abstract: Tile-based routing between a bump pad and an input/output (I/O) device for implementation on a flip-chip integrated circuit (IC) die. A trace is routed between the bump pad and a position corresponding to a first I/O slot, the first I/O slot being at least partially occupied by the I/O device. A position is obtained for a device pad for the I/O device. The trace is then extended into an area corresponding to the position obtained for the device pad. It is a feature of this aspect of the invention that the trace extension extends the trace into a pad area for a second I/O slot, the second I/O slot being at least partially occupied by the I/O device. The invention also concerns a flip-chip integrated circuit (IC) die that includes a bump pad, an input/output (I/O) device, and a device pad electrically connected to the I/O device and disposed vertically adjacent to a portion of the I/O device.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: January 6, 2004
    Assignee: LSI Logic Corporation
    Inventors: Ramoji Karumuri Rao, Mike Liang
  • Patent number: 6674167
    Abstract: Structures, systems and methods are provide for multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance. The structures, systems and methods of the present invention include a method for forming multilevel wiring interconnects in an integrated circuit assembly. The method includes forming a number of multilayer metal lines separated by a number of air gaps above a substrate. A silicide layer is formed on the number of multilayer metal lines. The silicide layer is oxidized. And, a low dielectric constant insulator is deposited to fill a number of interstices created by the number of air gaps between the number of multilayer metal lines. In one embodiment, forming the number of multilayer metal lines includes a first conductor bridge level. In one embodiment, forming a silicide layer on the number of multilayer metal lines includes using a pyrolysis of silane at a temperature of between 300 and 500 degrees Celsius.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Kie Y. Ahn, Leonard Forbes, Jerome M. Eldridge
  • Patent number: 6674168
    Abstract: A method of reworking BEOL (back end of a processing line) metallization levels of damascene metallurgy comprises forming a plurality of BEOL metallization levels over a substrate, forming line and via portions in the BEOL metallization levels, selectively removing at least one of the BEOL metallization levels to expose the line and via portions, and replacing the removed BEOL metallization levels with at least one new BEOL metallization level, wherein the BEOL metallization levels comprise a first dielectric layer and a second dielectric layer, and wherein the first dielectric layer comprising a lower dielectric constant material than the second dielectric layer.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: January 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: Edward C. Cooney, III, Robert M Geffken, Vincent J McGahay, William T. Motsiff, Mark P. Murray, Amanda L. Piper, Anthony K. Stamper, David C. Thomas, Christy S. Tyberg, Elizabeth T. Webster
  • Patent number: 6674169
    Abstract: A semiconductor device comprised of a substantially conformal layer of titanium silicon oxide deposited on a semiconductor substrate. The layer of titanium silicon oxide is substantially free of chlorine related impurities. The layer of titanium silicon oxide may have a ratio of silicon to titanium from about 0.1 to about 1.9. The layer of titanium silicon oxide may have a dielectric constant from about 10 to about 30, and a thickness from about 15 angstroms to about 500 angstroms.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Gurtej S. Sandhu, Pierre Fazan
  • Patent number: 6674170
    Abstract: An integrated circuit and manufacturing method therefor is provided having a semiconductor substrate with a semiconductor device. A device dielectric layer formed on the semiconductor substrate. A channel dielectric layer on the device dielectric layer has an opening formed therein. A barrier layer lines the channel opening. A conductor core fills the opening over the barrier layer. An interconnect cap is disposed over the conductor core and seed layer and is capped with a capping layer. The interconnect cap is preferably of an indium oxide compound.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: January 6, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Minh Van Ngo, Pin-Chin Connie Wang
  • Patent number: 6674171
    Abstract: An impurity region is formed on the surface of a semiconductor substrate. An insulating layer is provided on the semiconductor substrate to cover the impurity region. A trench for defining a wiring layer is provided on the surface of the insulating layer. A connection hole is provided in the insulating layer for connecting the trench and the impurity region with each other. A conductive layer made of a high melting point metal or a compound thereof is embedded in the connection hole. A copper wire is formed in the trench to be connected to the conductive layer. According to the present invention, a semiconductor device improved to be capable of implementing an excellent wiring circuit and providing a highly integrated semiconductor circuit is obtained.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: January 6, 2004
    Assignee: Renesas Technology Corp.
    Inventor: Sumio Yamaguchi
  • Patent number: 6674172
    Abstract: A method and structure for solderably coupling a semiconductor chip to a substrate, with an underfill between the chip and the substrate. In forming the structure, underfill material is dispensed upon a conductive pad on the substrate. The underfill material comprises a resin and a filler. The filler density is less than the resin density. The chip is moved toward the substrate and into the underfill until a solder member coupled to the chip is proximate the conductive pad. The structure is heated, resulting in soldering the solder member to the conductive pad and in curing the underfill. Filler particles move through the resin and toward the chip, resulting in an increased filler concentration near the solder member, and a reduced underfill coefficient of thermal expansion (CTE) near the solder member that is close to the CTE of the solder member.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: January 6, 2004
    Assignee: International Business Machines Corporation
    Inventor: Michael B. Vincent
  • Patent number: 6674173
    Abstract: A semiconductor die package design incorporating at least a pair of functional semiconductor dies. The input/output pads locations on one of the dies (the daughter die) are located at the near mirror image of the original die (mother die). The package architecture includes two dies back-to-back or stacked dies back-to-back, therefore a plurality of input/output interconnections can be formed. The package increases density and performance by twofold or more compared to a regular package containing only one die with the same footprint. At least one additional pin can be dedicated as the chip select pin for the daughter die or multiple dies. The other pins can be shared with the mother die.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: January 6, 2004
    Assignee: Aptos Corporation
    Inventor: Tsing-Chow Wang
  • Patent number: 6674174
    Abstract: In one embodiment, the invention includes first and second transmission lines fabricated in a redistribution layer over a semiconductor die. The first transmission line has a first distance from a first ground return path formed in a first metal level. The first transmission line has a first impedance corresponding to the first distance. In other words, the impedance of the first transmission line is affected by the distance between the first transmission line and the first ground return path. Similar to the first transmission line, the second transmission line has a second distance from a second ground return path formed in a second metal level. The second transmission line has a second impedance corresponding to the second distance. In other words, the impedance of the second transmission line is affected by the distance between the second transmission line and the second ground return path.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: January 6, 2004
    Assignee: Skyworks Solutions, Inc.
    Inventors: Surasit Chungpaiboonpatana, Hassan S. Hashemi, Siamak Fazelpour
  • Patent number: 6674175
    Abstract: A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low-profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned-in and tested in a more efficient and cost-effective manner than prior known BGA or FBGA semiconductor packages. A high-density, low-profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Wuu Yean Tay, Jeffrey Toh Tuck Fook
  • Patent number: 6674176
    Abstract: A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: January 6, 2004
    Assignee: LSI Logic Corporation
    Inventor: Radoslav Ratchkov
  • Patent number: 6674177
    Abstract: A semiconductor device in a computer system is disclosed that includes a die having an active surface bearing integrated circuitry, the die including a plurality of bond pads thereon at least some of which are connected to the integrated circuitry and having at least one electrically conductive wire bond made between first and second bond pads of the plurality of bond pads for providing external electrical connection between the two bond pads.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Aaron Schoenfeld
  • Patent number: 6674178
    Abstract: In a semiconductor device, a semiconductor pellet having bump electrodes and a interconnection board having pad electrodes are brought into mutual opposition with a resin containing a filler therebetween, so that the bump electrode and the pad electrodes are superposed. With the filler remaining at the superposed parts between the electrodes, the electrode superposed parts are hot-pressed, and the semiconductor pellet and interconnection board are adhered by the resin.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: January 6, 2004
    Assignee: NEC Electronics Corporation
    Inventor: Gorou Ikegami
  • Patent number: 6674179
    Abstract: A method and apparatus for welding with an engine driven inverter power supply includes generating an ac output with an engine and generator. The output is rectified and inverted to provide an ac inverter output. The engine is controlled using feedback indicative of a welding output operating parameter. The feedback may also be taken from the inverter or generator, and the generator may be controlled instead of or in addition to the engine. Engine parameters that may be controlled include engine speed, selecting between an idle speed and a run speed, a throttle position, a fuel pump, an injection timer, a fuel to air ratio, fuel consumption and ignition timing. Another aspect of the invention is having the feedback be responsive to one or more of the welding current, welding voltage, welding power, or functions thereof. The feedback may be responsive to the current, voltage, power, ripple and functions thereof.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: January 6, 2004
    Assignee: Illinois Tool Works Inc.
    Inventors: Richard Beeson, Stephen Li, Alan Smith
  • Patent number: 6674180
    Abstract: An electrical system (12) is provided for an automotive vehicle (10) having a first power source (14) with a first positive terminal (16) and first negative terminal (18). A second power source (20) having a second positive terminal (22) and a second negative terminal (24) is also provided. A common electrical node N2 is coupled to the first negative terminal and the second positive terminal. A first load (26) is coupled between the first positive terminal and the second node N2. A second load (28) is coupled between the common node N2 and the second negative terminal (24).
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: January 6, 2004
    Assignee: Ford Global Technologies, LLC
    Inventors: Allan Roy Gale, Michael W. Degner, Paul Raymund Nicastri
  • Patent number: 6674181
    Abstract: A wind-driven turbine assembly useful for the generation of electricity. The turbine assembly has a frame which holds two parallel turbines supported by the top and floor of the frame. Each turbine has a central support pipe with turbine veins extending outwardly. The wind enters the front of the frame and is split into two streams which strike the outer blades of each of the two turbines, causing them to rotate in opposite directions. The frame has side doors which tend to open as wind velocity increases. The frame also has a back panel which also may be adjusted between open and closed positions. Electrical generators are operably connected to shafts of the turbine to convert the energy absorbed from the wind into electricity.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: January 6, 2004
    Inventor: Charles C. Harbison
  • Patent number: 6674182
    Abstract: A wiring harness for use with an emergency vehicle. The wiring harness can be an independent wiring harness added after the vehicle has been manufactured or it can be included in the original equipment manufacturer's wiring harness. The wiring harness permits the addition of emergency vehicle equipment, such as two-way radios, computers, radar guns, etc., without splicing into the original equipment manufacturer's wiring.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: January 6, 2004
    Assignee: Mannesmann VDO AG
    Inventors: Lyman B. Maynard, Tom Forsythe
  • Patent number: 6674183
    Abstract: A contact 24 is fitted to an insulator complete 25, and the contact 24 is adapted to rotate in correspondence with the operation of an operation knob. The length of an arm 38 among arm portions 37 to 39 which are provided on the contact 24 is set to be shorter than the other arm portions 37 and 39. As a result, fixed contacts 40a and 41a with which movable contacts 37a and 38a provided at distal ends of the arms 37 and 38 are brought into contact can be arranged at concentric positions, thereby making it possible to increase the number of contacts. In this case, since a relay for a small-current load is connected to the fixed contact 41a, no hindrance is caused even if the contact force of the second movable contact 38a is set to be small by devising the angles between the respective ones of the arm portions 37 to 39.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: January 6, 2004
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Masuo Noda, Kazuyoshi Ishiguro
  • Patent number: 6674184
    Abstract: The invention relates to a gasoline motor powered, hand-operated working machine, which is stopped by short-circuiting an electric circuit (70), said stop device being designed in the form of an electric switch comprising a stop control (11), which can be moved manually between two end positions; a drive position for start of the motor and for motion of the motor, in which drive position said circuit is not short-circuited, and a fixed stop position in which the circuit is short-circuited and the stop control is locked.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: January 6, 2004
    Assignee: Aktiebolaget Electrolux (publ)
    Inventors: Ove Donnerdal, Magnus Söderqvist
  • Patent number: 6674185
    Abstract: A temperature sensor circuit includes a temperature detecting circuit, a preset value storing circuit, and a current supplying circuit. The temperature detecting circuit is configured to generate a first temperature voltage in accordance with an ambient temperature and a current. The preset value storing circuit stores a second temperature voltage preset for a predetermined ambient temperature as a digital value. The current supplying circuit supplies the current to the temperature detecting circuit. The current supplying circuit supplies the current such that the first temperature voltage generated by the temperature detecting circuit at the predetermined ambient temperature is equal to the second temperature voltage.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: January 6, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masaru Mizuta
  • Patent number: 6674186
    Abstract: A plurality of permanent magnets are embedded at predetermined pitches &tgr;p in a longitudinal direction in a field yoke composed of a magnetic substance so that adjacent magnet poles have opposite polarity, and a plurality of electromagnets, which have magnetic pole pitches &tgr;e≈(2n+1)&tgr;p of preset intervals provided that n is 0, 1, 2, . . . , which are disposed at predetermined pitches &tgr;g=(2s+1/m)&tgr;e in the longitudinal direction of the field yoke provided that m is a number of exciting phase and s is 1, 2, 3, . . . , and which are separated from the field yoke by a predetermined gap while opposing to the field yoke, are provided. The field yoke is driven by successively exciting the electromagnets.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: January 6, 2004
    Assignee: SMC Kabushiki Kaisha
    Inventors: Hisashi Yajima, Kazuya Tamura, Nobuhiro Fujiwara, Hiroyuki Wakiwaka, Norhisam Misron
  • Patent number: 6674187
    Abstract: Disclosed is an inner rotor or outer rotor hybrid stepping motor of 6-phase/6 m-pole type or 10-phase/10 m-pole type. The motor includes a stator that has 6 m or 10 m pieces of magnetic poles and a rotor that is rotatably supported by the stator. Excitation windings are wound around the stator magnetic poles. The stator magnetic pole is divided into two halves in the axial direction, one half has pole teeth being line-symmetric and the other half has pole teeth being asymmetric and deviated from the symmetric pole teeth by ¼ pitch. The positions of the symmetric half and the asymmetric half are inverted between the adjacent magnetic poles. The rotor has a first and second rotor units each of which includes a permanent magnet and first and second rotor magnetic poles around which pole teeth are formed with deviation of ½ pitch.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: January 6, 2004
    Assignee: Japan Servo Co., Ltd.
    Inventors: Kouki Isozaki, Yoji Unoki, Noriyoshi Kikuchi
  • Patent number: 6674188
    Abstract: An alternator comprising an inner housing, an outer housing mounted over the inner housing and a plurality of o-rings positioned between the inner housing and the outer housing thereby creating a sealed flow chamber having a first plenum, an axial jacket, a second plenum, a first passageway interconnecting the first plenum and the axial jacket, a second passageway interconnecting the axial jacket and the second plenum, an inlet extending from the first plenum, and an outlet extending from the second plenum. The first and second plenums are disk shaped cavities extending diametrically across the alternator, and the axial jacket is an annular jacket extending around the alternator. The first passageway is located diametrically across from the inlet and the second passageway is located diametrically across from the first passageway. The outlet is located diametrically across from the second passageway.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: January 6, 2004
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Steven J. Yockey, Kevin Roy Harpenau, David William Linden, Tony Militello
  • Patent number: 6674189
    Abstract: A spindle apparatus of a machine tool comprises a main spindle rotatably supported in a housing via bearings. A helium circulation system is provided for introducing helium, lower in density and fluid pressure than air, through a helium supply port into a gap on the outer periphery of the main spindle within the housing, and for discharging helium to the outside through a helium discharge port. The main spindle is rotated in an atmosphere of the helium. The spindle apparatus is simple in structure, but can minimize the power loss of the main spindle and reduce the motor power, and also gives a cooling effect.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Akira Watanabe, Tetsuo Ichikizaki, Keiji Mizuta, Kenji Hamanaka
  • Patent number: 6674190
    Abstract: A vehicle electrical generator comprises a magnetic ring on one side of a wheel, and an inductive coil on a shaft of the wheel corresponding to the magnetic ring, thus when rolling the wheel, the magnetic ring rotating with the wheel within the inductive coil, this rotation produces electricity, which then transferred by a pair of negative and positive wires to the load.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: January 6, 2004
    Assignee: Far Great Plastics Industrial Co., Ltd.
    Inventor: Ting-Hsing Chen
  • Patent number: 6674191
    Abstract: A motor actuator control system includes a motor actuator having a motor, an output shaft for outputting rotation of the motor at reduced speed, and a gear train for transmitting rotation to the output shaft while reducing rotataional speed. The system further includes a first detector detecting current surges generated when contact between a commutator and brushes in the motor is broken, a second detector detecting a predetermined rotational position of a gear, and a control unit for controlling the motor on the basis of signals from the first detector and signals from the second detector. When the predetermined rotational position is detected, the position and the count of the current surges are correlated. Then, the motor is driven until the count reaches a predetermined number to rotate the output shaft to another predetermined rotational position.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: January 6, 2004
    Assignee: Asmo Co., Ltd.
    Inventor: Yukinobu Kujira
  • Patent number: 6674192
    Abstract: Slip rings are fixed to an outer circumference of a shaft axially inside a rear-end bearing, brushes are disposed so as to contact outer circumferential surfaces of the slip rings, a sensor rotor of a rotation detecting apparatus is fixed to an end portion of the shaft projecting axially outside the rear-end bearing, and a sensor unit is disposed in close proximity to the sensor rotor.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Morikaku, Yoshinobu Utsumi, Katsuhiko Kusumoto, Atsushi Oohashi
  • Patent number: 6674193
    Abstract: An automotive alternator secures a fastening force for a vehicular connecting terminal for an extended period of time, and restricts the axial displacement of an output terminal, thus ensuring higher reliability. The output terminal is press-fitted and secured in a through hole in a first cooling plate, and the takeout end thereof is drawn out of an opening of a rear bracket. A metal bush is loosely inserted in an insulating bush and externally fitted to the output terminal, and the vehicular connecting terminal is fasteningly secured to the metal bush by a nut. With this arrangement, the fastening force of the nut is received by the rear surface of the first cooling plate via the metal bush. A flange of the metal bush is positioned so that a gap is provided between the flange and the insulating bush. The axial displacement of the output terminal is restricted by the flange abutting against the insulating bush.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshihito Asao
  • Patent number: 6674194
    Abstract: An automotive alternator secures a fastening force for a vehicular connecting terminal for an extended period of time, and restricts the axial displacement of an output terminal, thus ensuring higher reliability. The output terminal is press-fitted and secured in a through hole in a first cooling plate, and the takeout end thereof is drawn out of an opening of a rear bracket. A metal bush is loosely inserted in an insulating bush and externally fitted to the output terminal, and the vehicular connecting terminal is fasteningly secured to the metal bush by a nut. With this arrangement, the fastening force of the nut is received by the rear surface of the first cooling plate via the metal bush. A flange of the metal bush is positioned so that a gap is provided between the flange and the insulating bush. The axial displacement of the output terminal is restricted by the flange abutting against the insulating bush.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshihito Asao
  • Patent number: 6674195
    Abstract: The invention provides a electric motor which is capable of easily holding and fixing a winding terminal connector for holding and connecting each winding terminal of a stator winding and is superior in workability and resistance to vibration.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: January 6, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuhide Yagyu, Hideki Megata, Takeshi Sugiyama
  • Patent number: 6674196
    Abstract: A portable device integrates a small dc motor. The mounting structure of the motor allows an easy installation of the motor and to lower an electric noise level substantially. An insulating first elastic member and a conductive second elastic member are disposed around outside of a motor frame. While leaf-spring type motor-terminals are conductive to feeding terminals of a device, the motor frame is shorted by the second elastic member to a grounding terminal of the device.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: January 6, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Eiichi Ibata
  • Patent number: 6674197
    Abstract: An electromagnetic sound generator is proposed that can be easily and inexpensively fabricated for producing an indicating sound to enable use in an automobile or other similar environment. A spool (2) on which a coil (3) has been wound, a core (4) that is movable up and down, and a round spring (5) are installed inside a cup-shaped yoke (1); whereby supplying or cutting off the supply of current to the coil (3) causes the core (4) to strike, in single beats in accordance with drive, against the yoke (1) itself or on the side of spring (5) to produce a sound. The yoke (1), which is the magnetic circuit for driving, also serves as a sound generator, and the provision of openings such as slits in the upper surface and side surfaces of the cup-shaped yoke (1) enhances sound effects such as the tone, volume and direction of emission of the generated sound.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: January 6, 2004
    Assignee: NEC Tokin Iwate, Ltd.
    Inventors: Katsuya Iwabuchi, Yoshinori Ohta, Tatsumi Ide
  • Patent number: 6674198
    Abstract: An electric motor structure includes an electric motor having a housing and an endcap coupled to an end of the housing. The endcap includes a bearing pocket constructed and arranged to cover a bearing structure. The motor structure also includes a heat shield coupled directly to the motor so as to surround and cover the bearing pocket, with a portion of the heat shield being spaced from the bearing pocket.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: January 6, 2004
    Assignee: Siemens VDO Automotive Inc.
    Inventor: Alex Gubbels
  • Patent number: 6674199
    Abstract: An electric motor that can be set up for operation in one of two modes including a first mode that utilizes a power cord to removably couple the electric motor to a power source, and a second mode that utilizes a line lead to permanently couple the electric motor to a power source. The electric motor includes a housing have an aperture, and a cover plate. The cover plate is attachable to the housing in a first orientation corresponding to the first mode in which the cover plate substantially covers the aperture and leaves an opening for the power cord, and a second orientation corresponding to the second mode in which the cover plate substantially covers the aperture and does not leave an opening.
    Type: Grant
    Filed: April 15, 2002
    Date of Patent: January 6, 2004
    Assignee: A. O. Smith Corporation
    Inventor: Norman Richard Long