Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract: A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.

Abstract: A method of improving the performance of a ball grid array package under temperature cycling and drop tests is disclosed. The method comprises forming a ball grid array with two types of solder balls. The first type of ball has a composition that improves performance under temperature cycling and the second set of solder balls has a composition that improves performance under drop testing. Preferably, the first set of balls is under the die near its perimeter and the second set of balls is located near the package perimeter, particularly at corners. A related concept pertains to a semiconductor device comprising a printed circuit board and a ball grid array package attached to the printed circuit board by an array of solder balls. The solder ball array comprises first and second sets of solder balls, the two sets having distinctly different compositions.

Abstract: A method for manufacturing an electronic device in which a bonding pad composed of a foundation layer and a surface layer is formed on an Si layer or an Si-base insulation layer, comprises: forming, on the Si layer or Si-base insulation layer and by a droplet discharging method, the foundation layer using liquid material including one or more material(s) selected from Ni, Cr, and Mn or a compound thereof; and forming, on the foundation layer and by the droplet discharging method, the surface layer.

Abstract: In forming a layer of a semiconductor wafer, a dielectric layer is deposited on the semiconductor wafer. The dielectric layer includes material having a low dielectric constant. Recessed and non-recessed areas are formed in the dielectric layer. A metal layer is deposited on the dielectric layer to fill the recessed areas and cover the non-recessed areas. The metal layer is then electropolished to remove the metal layer covering the non-recessed areas while maintaining the metal layer in the recessed areas.

Abstract: A circuit board comprises a resin-filled plated (RFP) through-hole; a dielectric layer over the RFP through-hole; a substantially circular RFP cap in the dielectric layer and connected to an upper opening of the RFP through-hole; a via stack in the dielectric layer; and a plurality of via lands extending radially outward from the via stack, wherein each of the plurality of via lands is diametrically larger than the RFP cap. Preferably, the RFP cap comprises a diameter of at least 300 ?m. Preferably, each of the via lands comprises a substantially circular shape having a diameter of at least 400 ?m. Moreover, the circuit board further comprises a ball grid array pad connected to the via stack; and input/output ball grid array pads connected to the ball grid array pad. Additionally, the circuit board further comprises metal planes in the dielectric layer.

Abstract: Devices and methods are described including a conducting pathway with improved electromigration properties. The conducting pathway can be used in integrated circuits and semiconductor chips for devices such as semiconductor memory, or information handling systems. Conducting pathways are provided that eliminate electromigration problems without reducing conductivity in the conductive pathway. Embodiments using a carbon nanotube for the electromigration barrier segment provide the high electrical conductivity of carbon nanotubes, combined with a high resistance to atomic displacement from the nanotube microstructure.

Abstract: A semiconductor chip includes an active inner circuit; a die seal ring surrounding the active inner circuit; a first circuit structure fabricated at a first corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the first circuit structure has a first solder pad; and a second circuit structure fabricated at a second corner of the semiconductor chip outside the die seal ring and electrically connected to the die seal, wherein the second circuit structure has a second solder pad.

Abstract: The semiconductor structure includes an etch target layer to be pattemed, a multiple bottom anti-reflective coating (BARC) layer, and a photoresist (PR) pattern. The multiple BARC layer includes a first mask layer formed on the etch target layer and containing carbon, and a second mask layer formed on the first mask layer and containing silicon. A PR layer formed on the multiple BARC layer undergoes photolithography to form the PR pattern on the multiple BARC layer. The multiple BARC layer has a reflectance of 2% or less, and an interface angle between the PR pattern and the multiple BARC layer is 80° to 90°.

Abstract: A plurality of wiring layers made from a conductive material are formed in the same level layer on a substrate. A plurality of cavity layers are formed in the same level layer as the plurality of wiring layers. The plurality of cavity layers have a cavity ratio which is not smaller than 60%. An interlayer insulating film is formed on the plurality of wiring layers and on the plurality of cavity layers. A barrier metal, an oxygen barrier layer and an insulating layer are formed on side walls of the plurality of wiring layers.

Abstract: By directly forming an underbump metallization layer on a copper-based contact region, the formation of any other terminal metals, such as aluminum and corresponding adhesion/barrier layers may be avoided. Consequently, the thermal and electrical behavior of the resulting bump structure may be improved, while process complexity may significantly be reduced.

Abstract: A bonding pad structure is fabricated on an integrated circuit (IC) substrate having at least a contact layer on its top surface. A passivation layer covers the top surface of the IC substrate and the contact layer. The passivation layer has an opening exposing a portion of the contact layer. An electrically conductive adhesion/barrier layer directly is bonded to the contact layer. The electrically conductive adhesion/barrier layer extends to a top surface of the passivation layer. A bonding metal layer is stacked on the electrically conductive adhesion/barrier layer.

Abstract: A flip-chip package includes a packaging substrate; an integrated circuit die affixed to the packaging substrate, wherein the integrated circuit die includes an active integrated circuit surrounded by a peripheral die seal ring therein; and a thermal stress releasing pad disposed in a stress-releasing area that is at a corner of the integrated circuit die outside the die seal ring, wherein the thermal stress releasing pad is connected to the packaging substrate by using a solder bump, which, in turn, is connected to a dummy heat-spreading metal plate embedded in the packaging substrate so as to form a heat shunting path for reducing thermal stress during temperature cycling test.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Abstract: A semiconductor package includes a circuit board having connection pads formed on a front and back surfaces, and a wiring network connected to these connection pads, as a package base. Metal bumps connected to at least part of the connection pads on the front and back surfaces via the wiring network are formed on the back surface of the circuit board as external connection terminals. One or a plurality of semiconductor elements electrically connected to the connection pad on the front surface side is or are mounted on a first element mounting part provided on the front surface side of the circuit board. One or plurality of semiconductor elements electrically connected to the connection pad on the back surface side is or are mounted on a second element mounting part provided on the back surface side of the circuit board.

Abstract: A flip chip interface is described between a semiconductor chip and a substrate having interconnection circuits. Flip chip bumps are provided at the active face of the chip; each bump is preferably a flexible copper pillar fabricated on a pad, and terminating at the substrate in a well filled with conductive material. The conductive material may be a conductive powder during testing and rework, converting to a melted solder in the final assembly. A mixed array of pillars is provided: signal pillars for signals and power, and more closely spaced heat pillars for conducting heat away from the chip. The signal pillars may be provided in row and column arrays on a background of heat pillars, and the layout of pillars may be adjusted to match local heat patterns in the chip.

Abstract: Provided is a semiconductor device having a semiconductor chip mounted over a substrate, in which an interconnect is formed, by using an adhesive layer to permit contact conduction between a stud bump of the semiconductor chip and an interconnect of a tape substrate, wherein an adhesive layer formed integral as a film is adhered to each block made of substrates corresponding to a plurality of semiconductor devices and contact bonding under heat is conducted. The adhesive layer corresponding to the plurality of semiconductor devices is thus formed continuously and with this adhesive layer, the interconnect formation surface at the end portion of the substrate is covered. Moreover, with a thermosetting resin used as the adhesive layer, the semiconductor chip and substrate are adhered by contact bonding under heat while placing the substrate on a rigid heat insulating plate.

Abstract: A semiconductor device and a fabrication method thereof are provided. A first passivation layer and a second passivation layer are applied on a semiconductor substrate having at least one bond pad, with the bond pad being exposed. A first metallic layer is formed on the second passivation layer and electrically connected to the bond pad. A third passivation layer is applied on the first metallic layer and exposes a portion of the first metallic layer. A second metallic layer is formed on the third passivation layer and electrically connected to the exposed portion of the first metallic layer. A fourth passivation layer is applied on the second metallic layer and has an opening corresponding in position to the bond pad, allowing a portion of the second metallic layer to be exposed via the opening, such that a solder bump is formed on the exposed portion of the second metallic layer.

Abstract: Techniques for an integrated circuit device with planar bond pads are provided. A metal layer region is formed on a substrate. The integrated circuit device also includes a passivation layer that has an opening formed around the metal layer region. The passivation layer and a top surface of the metal layer region defines a continuous planar surface. An under bump metallurgy structure, sized and positioned to completely overlay the top surface of the metal layer region, is coupled to the continuous planar surface. The under bump metallurgy structure is coupled to a bump termination electrode. Preferably, a top surface of the bump termination electrode has a maximum surface nonuniformity of less than about 1 micron.

Abstract: When an interlayer film (22) is formed to have a large thickness and an electrode pad (11) is partly or wholly led out from an active region (16), an I/O region (15) can be reduced in area. Thus, it is possible to reduce an area of a semiconductor device.

Abstract: By patterning the underbump metallization layer stack on the basis of a dry etch process, significant advantages may be achieved compared to conventional techniques involving a highly complex wet chemical etch process. In particular embodiments, a titanium tungsten layer or any other appropriate last layer of an underbump metallization layer stack may be etched on the basis of a plasma etch process using a fluorine-based chemistry and oxygen as a physical component. Moreover, appropriate cleaning processes may be performed for removing particles and residues prior to and after the plasma-based patterning process.

Abstract: The invention relates to a laminate structure comprising a first active layer having a first electrode potential, a second active layer having a second electrode potential, wherein the second electrode potential being different from the first electrode potential and wherein the first and second active layers are arranged at a distance from each other, and wherein the laminate further comprises a third layer of an electrically weakable adhesive at least partly bridging said distance between the first and second layers.

Abstract: The embodiments of the present invention are directed toward the design of routing patterns, including elements such as contacts, traces, and vias, for high speed differential signal pairs in integrated circuit package substrates.

Abstract: A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.

Abstract: A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.

Abstract: A foam-forming unit is disclosed. The foam-forming unit includes a mixing chamber communicating with the outlet of a pump for the purpose of mixing liquid and air, and includes a dispensing part provided with an outflow channel with a foam opening for dispensing foam, wherein the outflow channel is in communication with the mixing chamber. Further, a first foam-forming element is included, arranged in the outflow channel such that the foam flowing through the outflow channel passes through the foam-forming element at least twice. The dispensing part is further provided with a spout element in which is located the final part of the outflow channel and the foam opening. Finally, the outflow channel includes a cavity after the first passage through the first foam-forming element, which cavity lies before the spout element as seen in flow direction.

Abstract: A carburetor of an internal combustion engine for operating a manually-guided implement, comprising an intake channel having a venturi section for combustion air, a fuel channel that opens into the intake channel via a fuel opening, and an accelerator pump that is in flow-conducting communication with the fuel opening. During operation of the carburetor, the fuel channel is adapted to have fuel flow continuously therethrough. The fuel channel is guided through a pump chamber of the accelerator pump.

Abstract: A carbonating apparatus includes an elongated carbonation chamber defining a longitudinal axis and having an inlet end and an outlet end. A manifold assembly is provided at the inlet end of the carbonation chamber. The manifold assembly includes a manifold body having an outlet end connected to the inlet end of the carbonation chamber and an inlet end. A liquid passage and a carbon dioxide passage extend in a direction between the inlet and outlet ends of the manifold body in communication with the inlet end of the carbonation chamber. At least one check valve is disposed inside the liquid passage within the manifold body. At least one check valve is disposed inside the carbon dioxide passage within the manifold body.

Abstract: An assembly in an exchange column includes a plurality of generally vertically adjacent layers of structured packing. Each layer includes a plurality of generally horizontally adjacent structured packing elements, each of which has an upper edge and a lower edge. Each layer has a top having a plurality of the upper edges and a bottom having a plurality of the lower edges. In a first layer of packing at least one of the upper edge and the lower edge is modified on at least one element. In a second layer of the packing, located vertically adjacent the first layer, the upper edges and the lower edges are unmodified on substantially all of the elements, whereby one of the unmodified upper edge and the unmodified lower edge on at least one of the elements in the second layer is adjacent one of the modified edges in the first layer.

Abstract: A multi-tray distillation unit having a separator for de-entraining liquid particles. The separator comprises vertically spaced tiers of elongated, substantially horizontal open-topped liquid collector channels arrayed in parallel rows transversely to the flow of the gas. The liquid collector channels are vertically staggered to deflect the gas flow from a lower tier level through the gaps between the collection channels of an upper tier and around the channels so as to cause the entrained liquid particles to separate from the gaseous stream by inertia into the channels of the lower tier. An improved channel configuration has a rigidly-mounted, horizontally-elongated flow deflector extending downwards from an upper tier channel toward a lower tier channel, this provides gas flow deflection and increased efficiency of liquid particle de-entrainment.

Abstract: The tray valve for a tray column includes an opening in a tray for a vapor passage and a valve body that is made to match the tray opening. The valve body consists of a top plate and vertically downwardly directed guide limbs arranged at the edge of the plate. The guide limbs have barbs for the anchoring of the valve body in the opening. The material and shape of the valve body are selected so that upon insertion of the valve body into the tray opening the top plate deforms in an arched manner while the guide limbs and barbs without deformation pass through the opening in a snap-fit manner. Weakened portions, in the form of grooves, slits or bores, can be provided in the top plate to facilitate upward arching of the top plate. Any deformation at the inserted valve body can be reversed, with the exception of a slight residual deformation, by an application of force onto the top plate.

Abstract: This invention is a humidifier used to increase and maintain the humidity of a musical instrument, such as a guitar. The humidifier is a container made of a water vapor permeable material that contains a water absorbent material such as acrylate polymer. The container is held within the body of the instrument by being mounted onto the strings of the instrument. The container is filled with water by an opening that is sealed with a cap. The water absorbent material can hold water without dripping, but will allows the water to evaporate.

Abstract: An environmentally controlled enclosure for a musical instrument that continuously monitors and increases and decreases humidity levels within the enclosure as needed to maintain a humidity level selected for the purpose of preserving the musical instrument stored therein. The enclosure is particularly useful in protecting and preserving musical instruments having one or more component parts made of wood, which is particularly sensitive to abrupt changes in humidity and to exposure to humidity extremes. The enclosure is provided with a sensor for monitoring humidity levels that is operably connected to a control unit for controlling the equipment for increasing and decreasing the humidity within the enclosure.

Abstract: The present disclosure is directed to methods of making polarizing beam splitters. An exemplary method includes supporting a polarizing film within a mold, where the polarizing film has a first surface and a second surface, injecting a polymeric material into the mold adjacent the first surface of the polarizing film, solidifying the first polymeric material to form a first prism, and securing a second prism to the second surface of the polarizing film. Another exemplary method includes injection molding a component of the polarizing beam splitter including a first polymeric material and heat treating the first component up to a temperature that does not exceed about 20° C. below a glass transition temperature of the first polymeric material.

Abstract: This invention is related to lenses and the associated processes used to manufacture lenses. In particular, the present invention is related to a process for designing and creating bifocal, multifocal, and single vision ophthalmic lenses by modulating an energy source.

Abstract: A method of removing a titanium-based coating from an extrusion die includes immersing the extrusion die in a stripping bath containing a removal solution which comprises hydrogen peroxide, a first acid which accelerates stripping of the titanium-based coating from the extrusion die, and a second acid which protects the stripping bath from loss of hydrogen peroxide activity.

Abstract: Briefly, in accordance with one or more embodiments, one or more thermal forming treatments may be predicted to achieve a desired shape and/or microstructure in a workpiece.

Abstract: A process for the manufacturing of an article made of plastic material, the article comprising an expanded foam filled core with an average density in the range 50-600 kg/m3 and a solid or semi solid outer skin with an average density above 700 kg/m3. The process comprises the steps of injecting a predetermined amount of molten thermoplastic material into the cavity of a closed mould, the thermoplastic material containing an expanding agent followed by allowing the thermoplastic material to solidify somewhat closest to the surface of the whereby a skin is formed. A first portion of the mould is then retracted while a second portion of the mould is retained in a closed position, whereby a volumetric increase of the mould cavity is achieved. The pressure in the mould hereby decreased allowing the expanding agent to expand the thermoplastic material. The molten thermoplastic material is then allowed to cool and solidify to a degree where the mould may be opened and the article is removed from the mould.

Abstract: The invention relates to a method for producing solid, hollow or open profiles, in particular those including sharp edges, based on polystyrene, including the following steps: dosing polymers comprising polystyrene and optionally other additives and adjuvants plasticizing the components in an extruder in order to obtain a homogenous mixture, injecting a pressurized gas via an injection port kneading and pressurizing said homogenous mixture and gas until complete dissolution of the gas in order to obtain a mixture in a single phase, gradually cooling said mixture as a single phase in order to maintain the pressure required for solubilizing the gas, having said mixture pass as a single phase mixture, into a shaping tool in order to form a foam, having the thereby formed foam pass through an optionally temperature-controlled calibration system, drawing the calibrated foam with a motor.

Abstract: A method of producing a foamed part, in particular a car body attachment part for a motor vehicle, includes the following steps. A foaming tool is provided that includes a tool bottom part and a tool upper part. An outer skin is placed in the tool bottom part and an expandable material is applied. The foaming tool is closed, with at least one portion of the outer skin being located in a gap between the tool bottom part and the tool upper part. After the foaming process, during opening of the foaming tool, the outer skin is trimmed by the foaming tool itself. The invention further relates to a foaming tool for applying such a method.

Abstract: A porous mould for making sanitaryware comprises: two half-parts (2, 3) joined to each other to create a product forming cavity (4); one of the half-parts (2) has a first inlet opening (5) through which respective means (6) feed a liquid (7) under pressure into the product forming cavity (4); a variable volume element (8) located inside the cavity (4); second means (10) for feeding a fluid under pressure, acting on this element (8) and varying the volume of the element (8) between at least two limit states, namely, a least expanded, idle state and a most expanded working state, when the forming liquid (7) is fed in, and where the element (8) occupies a predetermined volume of the cavity (4) in such a way as to control the inflow of the liquid (7) along the surfaces of the cavity (4); means (11) for controlling and regulating the degree to which the element (8) is filled and the liquid (7) feed pressure, acting on the respective first feed means (6) and second feed means (10) in such a way as to correlate the

Abstract: To provide a reliable solid-liquid separating method and apparatus for a slurry, even though the solid component of the slurry is finely divided particles and/or of a shape difficult to entangle, without exudation through gaps in processed portions and, also, with no need to exercise a maintenance work such as replacement of filters, a solid-liquid separating apparatus includes a mold having a cylindrical inner peripheral surface, a gate for opening and closing a second open end of the mold, and a pressing rod slidable into the mold to compress the slurry. Sheet-like fibrous filters are placed on a leading end face of the pressing rod and an inner surface of the gate to seal gaps between the mold and the pressing rod and between the gate and mold. With the filters so placed, the slurry within the mold unit is compressed to provide a solidified product, thereby accomplishing solid-liquid separation.

Abstract: To provide the friction material that does not cause cracking when the heat-press molding after granulation and obtain the sufficient binding force and strength and the raw friction material granulation substance, which has sufficient strength, manufactured using the friction material. A part of the binder blended in the friction material is blended when granulating the friction material and the rest is powdered to be mixed with the formed particle friction material. The powdered binder is adhered to the particle friction material by such as the van der Waals force, electrostatic force, or adhesive force of the small amount of water contained in the binder or the raw friction material, thereby obtaining the strength of the friction material when the friction material is press-heated.

Abstract: Improved polymeric endoprostheses and methods of making endoprostheses are disclosed. Said endoprostheses exhibit improved overall compliance, selective regional compliance and selective radial strength without varying the geometries of selected regions. Numerous other physical characteristics of said endoprostheses may be selectively varied during manufacture. Some embodiments may comprise one or more erodible material. Some embodiments may comprise one or more therapeutics incorporated into said endoprosthesis via a solvent in a supercritical state.

Abstract: A method of controlling a tire belt machine having a cutting station that receives a strip of material cuts it into plural lengths that are spliced together on a belt conveyor, the method including establishing a belt conveyor index distance; receiving signals representing a width of the strip entering a cutting station; and automatically adjusting the belt conveyor index distance based on the strip's width such that uniform splice characteristics are attained.

Abstract: A thermoplastic board (20) comprising at least one smooth side edge (21) is produced by means of extrusion. The side edge of a synthetic web is heated at least to its melting temperature following calibration while the peripheral surface zones are kept at a temperature below the softening temperature by cooling. A smoothing device (10?) for a side edge of the thermoplastic board encompasses a guiding groove (14?) that is provided with at least one heating means (15?), located within the face (11?), and at least one respective cooling means (16?, 17?) located within the side surfaces (12?, 13?) that face each other. A cutting edge (21, 24) of a synthetic board (20) that can be guided inside the guiding groove (14?) rests against the face (11?) while the peripheral surface zones (22, 23) thereof lean against the side surfaces (12?, 13?).

Abstract: A low-pressure CO2 tank or an air compressor with a refrigerated air dryer is attached either at or after the vent zone of a standard twin-screw extruder. During or after extrusion, the gas is dissolved in the wood-plastic melt. The CO2 expands which foams the wood-plastic material.

Abstract: A cushioning device for a footwear sole has multiple vertically directed columns. One column is located on a medial side and another is located on a lateral side, and are adjacent and spaced apart from each other. The medial column has the relatively larger volumetric property relative to the volumetric property of the lateral column. In another sense at least one of the columns has different elastomeric and/or compression properties relative to other columns. The device is located between an upper support plate and a lower support plate, and the support plates have more rigid characteristics than the cushioning device. Each column includes an upper larger area and a lower smaller area, and downwardly directed walls taper inwardly towards a lower location. The lower portion is where the bases of the columns are spaced apart.

Abstract: A polymer molding method especially applicable to at least two materials with different physical or chemical properties. In respective procedures, the two different materials are respectively molded into blanks with certain shapes. Then the blanks are together positioned in a product mold cavity. Then a certain heat and pressure are applied to the blanks in the product mold cavity to make the blanks react in the product mold cavity and combine with each other to form a product with desired shape.

Abstract: A method for the layer-by-layer assembly of a free standing thin film includes the steps of preparing a support with a suitable substrate; forming a thin film having a plurality of layers onto the substrate utilizing a layer-by-layer assembly process; removing the substrate and thin film from the support; and separating the substrate from the thin film. Various compounds improving the strength, flexibility, tension and other mechanical properties may be included in the assembly to improve the structural quality of the film. Similar effect may also be achieved by cross-linking the applied layers.