Patents Issued in March 20, 2007
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Patent number: 7193312Abstract: Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and, depending on the embodiment, input/output pads. The castellation blocks and input/output pads are encapsulated and held in place by an encapsulant. When the devices are being fabricated, the castellation blocks and input/output pads are sawed through. If necessary, the wafer portion on which the devices are fabricated may be thinned. The packages may be used as a leadless chip carrier package or may be stacked on top of one another. When stacked, the respective contacts of the packages are preferably coupled. Data may be written to, and received from, packaged chips when a chip is activated. Chips may be activated by applying the appropriate signal or signals to the appropriate contact or contacts.Type: GrantFiled: September 7, 2005Date of Patent: March 20, 2007Assignee: Micron Technology, Inc.Inventors: Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Swee Kwang Chua, Shuang Wu Huang, Yong Loo Neo, Wei Zhou
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Patent number: 7193314Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.Type: GrantFiled: January 14, 2003Date of Patent: March 20, 2007Assignee: Silicon Integrated Systems Corp.Inventors: Wei Feng Lin, Chung Ju Wu, Wen-Yu Lo, Wen-Dong Yen
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Patent number: 7193315Abstract: A TV-BGA package comprises: a PCB having bonding fingers; an adhesive material being coated on an edge of the PCB; a sealing post being adhered on the adhesive material; a semiconductor testing chip having a plurality of bonding pads adhered on the PCB; a plurality of metal wires separately connecting bonding pads of the PCB to the bonding fingers of the PCB; a sealing cap adhered on a sealing post for sealing the semiconductor chip; and a plurality of solder balls adhered to a lower side of the PCB. An extrusion is formed at a upper end of the sealing post, and the sealing cap is adhered on the extrusion of the sealing post. Further, the sealing cap is adhered on the extrusion of the sealing post by a low temperature thermoplastic tape or a material similar to low temperature thermoplastic tape. In the TV-BGA package, a sealing post is adhered on the adhesive material coated on an edge of the PCB, and then a sealing cap is capped on the sealing post, so that a test vehicle is manufactured.Type: GrantFiled: July 14, 2003Date of Patent: March 20, 2007Assignee: Hynix Semiconductor Inc.Inventors: Chae Kyu Jang, Sang Kwon Lee
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Patent number: 7193316Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).Type: GrantFiled: December 16, 2004Date of Patent: March 20, 2007Assignee: Intel CorporationInventors: Rajiv K. Mongia, Himanshu Pokharna, Eric DiStefano
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Patent number: 7193317Abstract: One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.Type: GrantFiled: July 2, 2003Date of Patent: March 20, 2007Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Atsuhiro Yoshizaki, Keiichi Mashino, Hiromichi Anan, Yoshitaka Ochiai
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Patent number: 7193318Abstract: A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned to insure that the chips requiring the lowest thermal resistance has the thinnest layer of a thermal adhesive or metal or solder interface between the chip and thermal spreader.Type: GrantFiled: August 18, 2004Date of Patent: March 20, 2007Assignee: International Business Machines CorporationInventors: Evan G. Colgan, George A. Katopis, Chandrashekhar Ramaswamy, Herbert I. Stoller
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Patent number: 7193319Abstract: A semiconductor device is provided, in which buffer layers having a coefficient of linear expansion of 3×10?6/° C. to 8×10?6/° C. are joined to upper and lower surfaces of a silicon chip through a Pb-free solder having a thickness of not more than 0.05 mm and a melting point of not less than 250° C. The upper surface of the upper buffer layer and the lower surface of the lower buffer layer are respectively joined to a lead and a base through Pb-free solders having a thickness of not less than 0.15 mm and a melting point of not less than 250° C.Type: GrantFiled: November 29, 2005Date of Patent: March 20, 2007Assignee: Hitachi, Ltd.Inventors: Koji Sasaki, Shinji Hiramitsu, Tadaaki Kariya, Satoshi Matsuyoshi, Ryouichi Kajiwara, Shosaku Ishihara
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Patent number: 7193320Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.Type: GrantFiled: January 28, 2003Date of Patent: March 20, 2007Assignee: Fujitsu LimitedInventors: Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa, Toshio Hamano, Toshiyuki Honda, Katsuro Hiraiwa, Masashi Takenaka
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Patent number: 7193321Abstract: Disclosed is an IC package including an interpose substrate and lands for external connection disposed on a face of the interpose substrate in a grid pattern, the interpose substrate having a penetration hole on at least a position between the lands for external connection disposed in a grid pattern. Besides, there are disclosed an inspection method of an IC package mounting body mounting this IC package, a repairing method of an IC package mounting body mounting this IC package, and an inspection pin for an IC package mounting body used for such an inspection.Type: GrantFiled: September 15, 2004Date of Patent: March 20, 2007Assignee: Kabushiki Kaisha ToshibaInventors: Hideki Ogawa, Hidenori Tanaka
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Patent number: 7193322Abstract: A strained-silicon (Si) channel CMOS device shallow trench isolation (STI) oxide region, and method for forming same have been provided. The method forms a Si substrate with a relaxed-SiGe layer overlying the Si substrate, or a SiGe on insulator (SGOI) substrate with a buried oxide (BOX) layer. The method forms a strained-Si layer overlying the relaxed-SiGe layer; a silicon oxide layer overlying the strained-Si layer, a silicon nitride layer overlying the silicon oxide layer, and etches the silicon nitride layer, the silicon oxide layer, the strained-Si layer, and the relaxed-SiGe layer, forming a STI trench with trench corners and a trench surface. The method forms a sacrificial oxide liner on the STI trench surface. In response to forming the sacrificial oxide liner, the method rounds and reduces stress at the STI trench corners, removes the sacrificial oxide liner, and fills the STI trench with silicon oxide.Type: GrantFiled: November 9, 2004Date of Patent: March 20, 2007Assignee: Sharp Laboratories of America, Inc.Inventors: Jong-Jan Lee, Sheng Teng Hsu
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Patent number: 7193323Abstract: A composite material comprising a layer containing copper, and an electrodeposited CoWP film on the copper layer. The CoWP film contains from 11 atom percent to 25 atom percent phosphorus and has a thickness from 5 nm to 200 nm. The invention is also directed to a method of making an interconnect structure comprising: providing a trench or via within a dielectric material, and a conducting metal containing copper within the trench or the via; and forming a CoWP film by electrodeposition on the copper layer. The CoWP film contains from 10 atom percent to 25 atom percent phosphorus and has a thickness from 5 nm to 200 nm. The invention is also directed to a interconnect structure comprising a dielectric layer in contact with a metal layer; an electrodeposited CoWP film on the metal layer, and a copper layer on the CoWP film.Type: GrantFiled: November 18, 2003Date of Patent: March 20, 2007Assignee: International Business Machines CorporationInventors: Cyril Cabral, Jr., Stefanie R. Chiras, Emanuel Cooper, Hariklia Deligianni, Andrew J. Kellock, Judith M. Rubino, Roger Y. Tsai
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Patent number: 7193324Abstract: A circuit structure for a package substrate or a circuit board is provided. The circuit structure has a dielectric layer with an upper surface and a lower surface, at least a first line and at least a second line. The first line is disposed on the dielectric layer on which a base of the first line is aligned with the upper surface. In addition, the second line is disposed on the dielectric layer on which a base of the second line is embedded below the upper surface. Since the second line is embedded into the dielectric layer, the distance with a reference plane is reduced and the crosstalk between the signals is further effectively reduced.Type: GrantFiled: January 21, 2005Date of Patent: March 20, 2007Assignee: Via Technologies, Inc.Inventor: Chi-Hsing Hsu
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Patent number: 7193325Abstract: A method of forming a SiCOH etch stop layer in a copper damascene process is described. A substrate with an exposed metal layer is treated with H2 or NH3 plasma to remove metal oxides. Trimethylsilane is flowed into a chamber with no RF power at about 350° C. to form at least a monolayer on the exposed metal layer. The SiCOH layer is formed by a PECVD process including trimethylsilane and CO2 source gases. Optionally, a composite SiCOH layer comprised of a low compressive stress layer on a high compressive stress layer is formed on the substrate. A conventional damascene sequence is then used to form a second metal layer on the exposed metal layer. Via Rc stability is improved and a lower leakage current is achieved with the trimethylsilane passivation layer. A composite SiCOH etch stop layer provides improved stress migration resistance compared to a single low stress SiCOH layer.Type: GrantFiled: April 30, 2004Date of Patent: March 20, 2007Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Zhen-Cheng Wu, Bi-Troug Chen, Weng Chang, Syun-Ming Jang, Su-Horng Lin
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Patent number: 7193326Abstract: A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.Type: GrantFiled: June 3, 2004Date of Patent: March 20, 2007Assignee: DENSO CorporationInventors: Naohiko Hirano, Nobuyuki Kato, Takanori Teshima, Yoshitsugu Sakamoto, Shoji Miura, Akihiro Niimi
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Patent number: 7193327Abstract: An opening in a dielectric layer having a unique barrier layer structure is provided. In an embodiment, the opening is a via and a trench. The barrier layer, which may comprise one or more barrier layers, is formed such that the ratio of the thickness of the barrier layers along a sidewall approximately midway between the bottom of the trench and the top of the dielectric layer to the thickness of the barrier layers along the bottom of the trench is greater than about 0.55. In another embodiment, the ratio of the thickness of the barrier layers along a sidewall approximately midway between the bottom of the trench and the top of the dielectric layer to the thickness of the barrier layers along the bottom of the via is greater than about 1.0. An underlying conductive layer may be recessed.Type: GrantFiled: January 25, 2005Date of Patent: March 20, 2007Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Shing-Chyang Pan, Shau-Lin Shue, Ching-Hua Hsieh, Cheng-Lin Huang, Hsien-Ming Lee, Jing-Cheng Lin
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Patent number: 7193328Abstract: Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and the wiring pattern. The semiconductor device of the present invention includes a semiconductor element and a wiring substrate which is provided with a film substrate and a wiring pattern which is formed on the film substrate, the semiconductor element is connected to the wiring pattern, and the semiconductor element and the wiring substrate are sealed with a resin. A metallic film, made of material having a smaller coefficient of linear thermal expansion than the film substrate, is formed in a region where the wiring pattern is not formed on at least one surface of the film substrate.Type: GrantFiled: June 11, 2002Date of Patent: March 20, 2007Assignee: Sharp Kabushiki KaishaInventors: Takehiro Suzuki, Kenji Toyosawa
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Patent number: 7193329Abstract: The semiconductor device includes a tabular base metal having an insulating layer provided on a bottom surface thereof, and the insulating layer includes a plurality of wiring patterns, each of which is provided with a connecting pad at one end thereof. A semiconductor chip is adhered at a substantial center of the insulating layer with an adhesive. Electrodes provided on a bottom surface of the semiconductor chip are connected to the other ends of the wiring patterns by wire bonding via wires. The semiconductor chip is molded with a resin. The connecting pads are connected to solder balls via an interposer substrate provided with conductors.Type: GrantFiled: October 30, 2002Date of Patent: March 20, 2007Assignee: Oki Electric Industry Co., Ltd.Inventor: Norio Takahashi
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Patent number: 7193330Abstract: A semiconductor device comprises: a semiconductor chip; an extension portion which contacts the side surfaces of the semiconductor chip to thereby surround the semiconductor chip; an insulating film which is formed such that a part of each of the plurality of electrode pads is exposed; a plurality of wiring patterns individually electrically connected to each of the electrode pads, respectively and extended from the electrode pads to the upper side of the extension portion; and a plurality of external terminals provided over the wiring patterns in a region including the upper side of the extension portion.Type: GrantFiled: October 31, 2003Date of Patent: March 20, 2007Assignee: Oki Electric Industry Co., Ltd.Inventor: Yoshinori Shizuno
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Patent number: 7193331Abstract: One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side.Type: GrantFiled: May 19, 2005Date of Patent: March 20, 2007Assignee: Renesas Technology Corp.Inventor: Hideki Ishii
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Patent number: 7193332Abstract: A method for generating power from a moving vehicle is provided. The method comprising: positioning at least one device for converting an airflow from a passing vehicle into power near a path of the moving vehicle; and generating power from the at least one device at least partially from the airflow.Type: GrantFiled: October 25, 2004Date of Patent: March 20, 2007Inventor: Thomas Spinelli
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Patent number: 7193333Abstract: The present invention is a gasoline engine driven electrical generating system for use in confined space enclosures wherein all routine servicing can be accomplished from the single exposed side. The ambient operating temperature of the confined enclosure is minimized by a combination of component locations, sizing and a thermal siphoning exhaust enclosure. Through the use of an electronic fuel management system, throttle body furl injection and a catalytic converter all current EPA NOX emission standards can be met.Type: GrantFiled: March 24, 2005Date of Patent: March 20, 2007Inventor: Timothy Blair Kitch
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Patent number: 7193334Abstract: A controller for an electronic key system including a portable device and an engine. When the ID code of the portable device cannot be authenticated, the controller instructs the driver of the necessary operations. When a transmitter circuit is transmitting a request signal but a receiver circuit does not receive a signal including an ID code matching the ID code stored in a memory, an authentication ECU authenticates a transponder code of the portable device with a stored transponder code to enable the starting of the engine. The authentication ECU displays the necessary operations for performing transponder code authentication.Type: GrantFiled: May 13, 2005Date of Patent: March 20, 2007Assignee: Kabushiki Kaisha Tokai Rika Denki SeisakushoInventors: Takayuki Hiramitsu, Kiyokazu Ohtaki, Tomohiro Ohmura, Toshiki Akita, Teruya Tomiyasu, Noriyasu Onishi, Manabu Mizutani
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Patent number: 7193335Abstract: A socket assembly enables a number of electrical appliances to be automatically isolated from, and reconnected to, an electrical power supply upon respectively switching off or on a “master” appliance. Generally, the assembly includes: a master electrical outlet and at least one slave electrical outlet, both connectable to a common power source; sensing means for sensing power drawn from the master electrical outlet; a controller operable to isolate the at least one slave electrical outlet from the power source when the sensing means detects a fall in power drawn from the master electrical outlet from a first, higher level to a second, lower level.Type: GrantFiled: November 11, 2002Date of Patent: March 20, 2007Assignee: One Click (IP) LimitedInventors: Norman Palmer, Peter Steven Robertson, Ian Browne
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Patent number: 7193336Abstract: A method and apparatus for reducing conductive thermal losses in high-current cryogenic power electronics systems needing large cables to interface between warm and cold environments. Thermal losses increase with increasing cross-sectional area. The total current at the warm/cold interface is split into many smaller currents by splitting the power buss into a plurality of parallel leads. Respective physical switches in each smaller lead at the interface interrupt current flow, and at the same time open the path for thermal conduction along the lead. When little or no current is flowing through the system, selected smaller leads of the power buss are physically opened by the associated switches to stop the thermal and electrical flow along these leads. Current diverts to another parallel lead in the buss but the cross section for heat flow is reduced at the interface.Type: GrantFiled: October 23, 2003Date of Patent: March 20, 2007Inventors: Otward M. Mueller, Michael J. Hennessy
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Patent number: 7193337Abstract: A solid state power controller (SSPC) (100) includes a power switching controller (30) and power switching devices (PSDs) (20A, 20B, 20C) for controlling each phase of a multiple-phase load to switch-on or -off at a zero-crossing point of a corresponding phase of a multiple-phase power source. The power switching controller (30) may include an ASIC (25A, 25B, 25C) for controlling each PSD (20A, 20B, 20C) to switch the corresponding load phase on or off. The ASIC (25A, 25B, 25C) may be configured to control the PSD (20A, 20B, 20C) to switch-on the load phase at a detected zero-crossing point of the voltage supplied by the corresponding phase of the power source, and to switch-off the load phase at a detected zero-crossing point of the load current supplied by the corresponding phase of the power source.Type: GrantFiled: September 9, 2003Date of Patent: March 20, 2007Assignee: Honeywell International Inc.Inventor: That Nguyen
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Patent number: 7193338Abstract: A method of tapping a high voltage transmission line for input into a power distribution substation is disclosed. The method comprises the steps of dividing the transmission line and attaching the conductors to the primaries of at least two transformers via a series connected first disconnect switch, second disconnect switch and circuit breaker. A bus interconnects the first disconnect switch and the second disconnect switch and the bus of the first transformer bay is connected to the bus of the second transformer bay using a circuit breaker. A system for the conversion of tapped high voltage electricity to medium voltage electricity is also disclosed.Type: GrantFiled: September 5, 2003Date of Patent: March 20, 2007Inventor: Gamal A. Ghali
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Patent number: 7193339Abstract: A positioning apparatus includes a movable member for transmitting a driving force in a driving-axis direction to a stage, a first electromagnet for driving the movable member in the driving-axis direction by forming a magnetic path between the movable member and the first electromagnet and generating first magnetic flux, and a second electromagnet, which is positioned away from the first electromagnet and arranged in an overlapping direction, for driving the movable member in the same direction as the driving-axis direction of the first electromagnet by forming a magnetic path between the movable member and the second electromagnet and generating second magnetic flux having an inverted plurality from the first magnetic flux.Type: GrantFiled: October 27, 2003Date of Patent: March 20, 2007Assignee: Canon Kabushiki KaishaInventor: Shinji Uchida
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Patent number: 7193340Abstract: A low-profile stepping motor is disclosed, which is preferably used in downsized and lower-profiled electronic devices, such as a printer, a facsimile, a floppy disk drive, and the like. The motor comprises a stator assembly composed of first and second stator units (A, B) , and a rotor assembly (50) rotatably disposes inside the stator assembly. The stator units (A, B) are shaped and structured identically with each other, and each structured such that upper and lower stator yokes (30/32, 31/33) , which each have a plurality of pole teeth formed along one side, and which each have an exciting coil (40/42) disposed toward one side opposite to the one side having the pole teeth, are coupled to each other with their respective pole teeth intermeshing with each other with a shift of 180 degree electrical angle.Type: GrantFiled: February 12, 2003Date of Patent: March 20, 2007Assignee: Minebea Co., Ltd.Inventor: Kunitake Matsushita
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Patent number: 7193341Abstract: A turbomachine for low-temperature applications, has a rotor shaft; at least one rotor disk that is arranged in overhung manner at one shaft end of the rotor shaft; an electric machine having a stator having windings, and an electric rotor arranged on the rotor shaft; a stage housing that surrounds the rotor disk and has connections for a cold gas that flows through the stage housing; and a machine housing in which the electric machine and shaft bearings for the rotor shaft are arranged. The machine housing is connected with the stage housing. A partition made of insulating material is arranged between the stage housing and the machine housing, which thermally separates the stage housing from the machine housing. A line provided with a flow-through regulation fitting is connected to the flow path of the cold gas, for branching off an amount-regulated cooling stream, which is passed to the electric machine within the machine housing.Type: GrantFiled: July 20, 2004Date of Patent: March 20, 2007Assignee: Atlas Copco Energas GmbHInventor: Werner Bosen
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Patent number: 7193342Abstract: Electrical devices such as motors and generators create heat as they operate. This can lead to lower performance and life. Therefore, it is important to provide cooling for such devices. This is particularly true in heavy duty applications such as earthmoving or other industries. Methods and apparatus are disclosed to provide cooling that involves the circulation of two fluids in defined pathways. Heat within a case or other enclosure for an electrical device is transferred to one fluid. Heat from the one fluid is subsequently transferred to the other fluid. In one example, this heat transfer may occur across fins for increased effectiveness. It is also preferred that the flow of fluid be closed loop so that contaminants are not introduced into the electrical device. By providing the heat transfer out of the electrical device as described, cooling is enhanced that can lead to longer lived and better performing devices.Type: GrantFiled: December 17, 2002Date of Patent: March 20, 2007Assignee: Caterpillar IncInventors: Kent A. Casey, Gerald P. Simmons
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Patent number: 7193343Abstract: A stator having a stator core about which a coil is wound is secured to an aluminum frame. A magnet-embedded type rotor is rotatably accommodated inward of the stator. A circuit substrate is attached to the surface of the aluminum frame opposite to the surface to which the stator is secured. A control circuit and hall ICs for detecting the rotational position of the rotor are mounted on the circuit substrate. Detection signals of the hall ICs are received by the control circuit. The control circuit supplies a drive current to the coil of the stator in accordance with the detection signals.Type: GrantFiled: March 18, 2005Date of Patent: March 20, 2007Assignees: ASMO Co., Ltd., Denso CorporationInventors: Noboru Tsuge, Toshihiro Matsuura, Hideji Tani, Masafuyu Sano
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Patent number: 7193344Abstract: A wiring structure for a hybrid vehicle motor 3 arranged between an internal combustion engine 1 and a transmission 2 comprises; an electrically conductive member 6 which performs collecting and distributing electricity for a coil 29 of the hybrid vehicle motor 3, a connection terminal 8 which electrically connects the electrically conductive member 6 and a power source cable 7, and a terminal box 9 accommodating the connection terminal 8. The electrically conductive member 6 extends from the hybrid vehicle motor 3 to the transmission 2 side, and the terminal box 9 is provided so as to extend to the transmission 2 side. As a result maintenance for the power source cable is improved, and production costs lowered.Type: GrantFiled: August 23, 2002Date of Patent: March 20, 2007Assignee: Honda Motor Co., Ltd.Inventors: Akira Kabasawa, Satoshi Shikata, Kenji Fukuda
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Patent number: 7193345Abstract: A collection-distribution ring comprises three busbars, each having a circular ring shape, which are integrally connected together with prescribed distances therebetween by an insulating resin. Coil connection terminals project inwardly in a radial direction and are alternately arranged in relation to the three busbars. External terminals project outwardly in the radial direction and are arranged to adjoin together at the prescribed position. These terminals are all exposed from surfaces of the insulating resin. A stator comprises the prescribed number of stator units that are arranged in a circumferential direction and are assembled together with the collection-distribution ring. Each stator unit comprises a core unit realizing magnetic teeth, an insulating member, and a coil. An outer terminal member electrically connects a first end of the coil and the coil connection terminal, and an inner terminal member provides electrical connections between second ends of the adjacent coils.Type: GrantFiled: September 3, 2002Date of Patent: March 20, 2007Assignee: Honda Motor Co., Ltd.Inventors: Satoru Shinzaki, Tatsuro Horie, Kenji Fukuda, Akihiro Okamura
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Patent number: 7193346Abstract: A multi-mode vibration generating device for a communication terminal includes a first vibration generator and one or more second vibration generators. The first vibration generator includes a first coil assembly and a first magnet and generating a vibration of a given direction by an interaction between an electric field generated by the first coil assembly and a magnet field generated by the first magnet. The one or more second vibration generators include a second coil assembly and a second magnet and generate a vibration of a given direction by an interaction between an electric field generated by the second coil assembly and an magnet field generated by the second magnet. The second vibration generator generates a vibration of a direction or frequency different from a vibration direction or frequency of the first vibration generator, whereby various mode vibrations are generated.Type: GrantFiled: May 12, 2005Date of Patent: March 20, 2007Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Ju Ho Kim
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Patent number: 7193347Abstract: A motor-sensor system of an electric motor with a shaft end on an encoder side, a mounting device for the motor, terminals for supplying power to the motor and a printed circuit board with electronic components for controlling and regulating an encoder unit. Contact pins are provided for supplying power to the motor and for forming contact guides with correspondingly formed bore holes disposed in the motor are positioned on a solid printed circuit board. An angular mounting clamp encompasses the electric motor on the shaft end of the encoder side. The clamp ends are formed as pegs which secure the end face and at least one longitudinal side of the motor on the printed circuit board. The angular mounting clamp has in the plane of the end face of the motor a contact surface for the shaft end of the encoder side of the electric motor.Type: GrantFiled: October 22, 2002Date of Patent: March 20, 2007Assignee: PWB-Ruhlatec Industrieprodukte GmbHInventors: Vittorio Tenca, Ernesto Zanotti, Andrea Bari, Carradori Corrado
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Patent number: 7193348Abstract: In a vehicular alternator, a stator is arranged to oppose a rotor in a housing. The stator includes a stator core, which forms a plurality of slots extending in an axial direction of the stator core, and a stator winding wound around the stator core. The stator winding includes electric conductors held in the slots. Each of the electric conductors has a circumferential width that is smaller than a circumferential distance between a first wall and a second wall defining the slot. The first wall and the second wall oppose each other in a circumferential direction. The electric conductors are alternately in contact with one of the first wall and the second wall.Type: GrantFiled: September 12, 2005Date of Patent: March 20, 2007Assignee: Denso CorporationInventors: Hitoshi Wada, Hiroaki Ishikawa, Hiroshi Ishida
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Patent number: 7193349Abstract: An electric motor, in particular a motor and gear box unit for activating functional equipment in a vehicle, includes a rotor shaft carrying a commutator co-operating with conductive brushes disposed in brush supports fixed to a printed circuit card; the motor is provided with means for enabling brush supports to be fixed to the printed circuit card solely by surface mounting. These means may comprise, for each brush, a metal casing containing the brush and having one wall with at least one transverse tab adapted to pass through the printed circuit card in order to position and hold the casing on the card and in order to provide an electrical connection. The invention enables brush-support devices to be fixed to the printed circuit card solely by surface mounting, thus making it pointless to perform an additional flow soldering operation as is required in the prior art.Type: GrantFiled: May 29, 2001Date of Patent: March 20, 2007Assignee: Meritor Light Vehicle Systems - FranceInventors: Hervé Laurandel, Philippe Raoul
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Patent number: 7193350Abstract: An electroactive polymer (EAP) structure. The structure includes at least one EAP strand. An EAP strand includes a plurality of EAP segments and a plurality of insulators. An EAP segment includes an EAP tile and an activator. The activator facilitates activation of the EAP tile. The plurality of EAP segments and the plurality of insulators have a concatenated configuration, wherein adjacent EAP segments are electrically separated by one of the plurality of insulators, and wherein the EAP segments are operatively coupled to the plurality of insulators. A method for the system is also described.Type: GrantFiled: February 25, 2005Date of Patent: March 20, 2007Assignee: United States of America as Represented by the Secretary of the NavyInventors: Michael R. Blackburn, Selahattin Ozcelik
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Patent number: 7193351Abstract: A rod is sawtooth-like vibrated by cyclically applying, to a piezoelectric element, voltage values which are stepwise and sequentially increased or decreased, so that a moving unit is driven along the rod in one direction or the opposite direction. The sequentially increased or decreased voltage values are generated by controlling of turning “on” or “off” of a plurality of switching elements, which are disposed in a circuit arrangement, wherein the piezoelectric element, and 1st and 2nd capacitors are arranged between a positive power supply and a negative power supply. When the 1st capacitor has a parallel positional relationship with the piezoelectric element and the 2nd capacitor serially connected, a switching element serially connected to the 1st capacitor is opened. When the 2nd capacitor has a parallel positional relationship with the piezoelectric element and the 1st capacitor serially connected, a switching element serially connected to the 2nd capacitor is opened.Type: GrantFiled: November 21, 2005Date of Patent: March 20, 2007Assignee: Konica Minolta Opto, Inc.Inventor: Ryuichi Yoshida
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Patent number: 7193352Abstract: Thin film bulk acoustic wave sensors with coatings of biological and chemical materials, multiple electrode depositions and a piezo-active thin film transducer layer are hosted on a substrate. The thin film bulk acoustic wave sensor suite, or T-BASS, produces a low-voltage, IC-compliant thickness-directed electric field that is substantially uniform over a substantial portion of the active area of the BAW structure. The BAWs produced are essentially extensional plane waves propagating away from the substrate surface and having phase progression substantially oblique to the substrate surface. For BAW applications requiring sensing by an active layer, it would be most desirable to have an electrode structure that is both IC-compliant and can be energized from a low-voltage source of electrical energy. The thin film BAW sensors are compatible with IC fabrication and processing techniques, such as photolithography. Both single channel and multiple channel thin film bulk acoustic wave sensors are provided.Type: GrantFiled: March 11, 2005Date of Patent: March 20, 2007Assignee: The United States of America as represented by the Secretary of the ArmyInventors: Arthur Ballato, Richard H. Wittstruck, Xiaojun Tong, Yicheng Lu
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Patent number: 7193353Abstract: An operating apparatus 1 of the present invention has a driven element 5 having an imaging element and a contacted element, a frame 4 rotatably supporting the driven element 5, and an ultrasonic motor. The ultrasonic motor includes a vibrating element 6. The vibrating element 6 includes a first piezoelectric element 62 that undergoes extension and contraction by application of an AC voltage, a reinforcing plate 63 having a contact portion 66 and an arm portion 68, and a second piezoelectric element 64 that undergoes extension and contraction by application of an AC voltage. The first piezoelectric element 62, the reinforcing plate 63, and the second piezoelectric element 64 are laminated in this order. The vibrating element 6 is fixedly mounted on the frame 4 in a state where the contact portion 66 abuts on the contacted element 51. Further, in the operating apparatus 1, the driven element 5 is driven by vibration of the vibrating element 6 via the contacted element 51 to rotate with respect to the frame 4.Type: GrantFiled: April 2, 2004Date of Patent: March 20, 2007Assignee: Seiko Epson CorporationInventor: Osamu Miyazawa
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Patent number: 7193354Abstract: An electronic apparatus comprises a display portion and a plurality of oscillators, one of which is a quartz crystal oscillator comprising: a quartz crystal oscillating circuit comprising; an amplification circuit and a feedback circuit. For example, the feedback circuit is constructed by a quartz crystal resonator comprising vibrational arms and a base portion, and having novel shape and electrode construction. Also, the quartz crystal resonator is housed in a package. In addition, from a relationship of an amplification rate of the amplification circuit and a feedback rate of the feedback circuit, an output signal of the quartz crystal oscillating circuit having an oscillation frequency of a fundamental mode of vibration for the quartz crystal resonator can be provided with a frequency of high stability.Type: GrantFiled: June 23, 2004Date of Patent: March 20, 2007Assignee: Piedek Technical LaboratoryInventor: Hirofumi Kawashima
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Patent number: 7193355Abstract: An aluminum oxide particle mixture for reflection layers in discharge lamps, and to discharge lamps of this type. The mixture has a first coarse-grained component and a second fine-grained component, with a primary grain size of preferably d50(1) between 0.3 ?m and 0.5 ?m and d50(2) of at most 0.05 ?m, respectively (with an agglomerated size of the fine particles of less than 0.15 ?m).Type: GrantFiled: September 22, 2004Date of Patent: March 20, 2007Assignee: Patent-Treuhand-Gesellschaft fuer elektrische Gluehlampen mbHInventors: Sylvain Mayer, Ulrich Müller, Martin Zachau
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Patent number: 7193356Abstract: An image display apparatus is provided that enables the chromaticity of a display screen of a display apparatus to be adjusted to the chromaticity desired by a user. The image display apparatus is formed by a backlight unit that is provided with a plurality of light sources and by an image display panel that is placed at a front surface of the backlight unit. The image display apparatus performs a monochrome display. In the image display apparatus, the light sources have at least three different types of luminescent colors that surround a target color on a chromaticity diagram.Type: GrantFiled: November 15, 2004Date of Patent: March 20, 2007Assignees: NEC-Mitsubishi Electric Visual System Corporation, Mitsubishi Denki Kabushiki KaishaInventors: Hisato Kokubo, Kazuo Yoshioka, Hideki Itaya, Hideki Teramatsu, Akimasa Yuuki, Kyoichiro Oda
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Patent number: 7193357Abstract: A field emission backlight device may include a first substrate and a second substrate separate from and roughly parallel to each other, a first anode electrode and a second anode electrode that face each other on inner surfaces of the first substrate and the second substrate, and cathode electrodes separate from and roughly parallel to one another between the first substrate and the second substrate. It may also include electron emission sources disposed on the cathode electrodes to emit electrons by an electric field and a phosphorous layer disposed on the first anode electrode or the second anode electrode.Type: GrantFiled: February 11, 2005Date of Patent: March 20, 2007Assignee: Samsung SDI Co., Ltd.Inventors: Jun hee Choi, Byong-gwon Song, Moon-jin Shin, Andrei Zoulkarneev, Deuk-seok Chung, Min-jong Bae
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Patent number: 7193358Abstract: The light distribution pattern for a vehicle having a predetermined horizontal cut-off line section at the top portion on one side of the vertical central line and an oblique cut-off line section whose central line side is lowered in another side. The light distribution pattern of the light source is formed by arranging a plurality of semiconductor light emitting devices with a configuration almost the same shape as the light distribution pattern for a vehicle. The semiconductor light emitting device has a luminance surface whose configuration is almost the same shape as the light distribution pattern for a vehicle. Further, the light source comprising the semiconductor light emitting device includes a fluorescent material whose excitation source is the emission from the nitride semiconductor device and a part of region of the fluorescent material emits light with higher luminance or higher color rendering properties compared with the other regions.Type: GrantFiled: September 7, 2004Date of Patent: March 20, 2007Assignee: Nichia CorporationInventors: Motokazu Yamada, Takahiro Naitou
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Patent number: 7193359Abstract: A measure for improving the light emission efficiency of a light emitting element without degrading characteristics of anode materials used in prior art is provided in manufacture of an upward emission type light emitting element. The present invention is characterized in that nitride or carbide of a metal element belonging to one of Group 4, 5, and 6 in the periodic table (hereinafter referred to as metal compound) is used as the material for forming an anode of a light emitting element. The metal compound has a work function equal to or larger than the work function of conventional anode materials. Therefore, injection of holes from the anode can be improved ever more. Also, with regard to conductivity, the metal compound is smaller in resistivity than ITO. It therefore can fulfil the function as a wire and can lower the drive voltage in the light emitting element compared to prior art.Type: GrantFiled: September 26, 2002Date of Patent: March 20, 2007Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Satoshi Seo, Yasuo Nakamura
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Patent number: 7193360Abstract: In a self light emitting display device of the present invention, a first electrode 3 for example formed of a thin film of ITO is formed in a striped pattern on a glass substrate 2, and a film of a light emission functional layer 6 is formed thereon. A metallic second electrode 7 is formed on the light emission functional layer 6, and a light transmitting sealing member 8 for example formed of a glass material is superimposed on the second electrode 7. Apertures 7a for allowing image light from the light emission functional layer 6 to pass through are formed on a part of the second electrode 7, a first light emitting area L1 is formed in the glass substrate 2 side, and a second light emitting area L2 is formed in the sealing member 8 side. As a result, display images can be visually recognized on both front and rear surfaces.Type: GrantFiled: April 21, 2004Date of Patent: March 20, 2007Assignee: Tohoku Pioneer CorporationInventor: Shuichi Seki
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Patent number: 7193361Abstract: The present invention is an organic EL device in which an anode, a hole injection layer, a first carrier transportation layer, a first luminescent layer, a second carrier transportation layer, a second luminescent layer, an electron transportation layer, and a cathode are formed on a glass substrate in order, wherein layers with a smaller electron affinity Ea and a larger energy gap Eg than those of the first and second luminescent layers are employed for the first and second carrier transportation layers, so as to enhance the emission efficiency of the first and second luminescent layers.Type: GrantFiled: January 24, 2005Date of Patent: March 20, 2007Assignee: Fuji Photo Film Co., Ltd.Inventors: Masaru Kinoshita, Yuichiro Itai, Masaya Nakayama, Jun Kodama
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Patent number: 7193362Abstract: A luminescent device for reducing unevenness of brightness. The luminescent device includes a transparent substrate, which has a light exit surface and an incident surface, and a luminescent element, which is formed on the incident surface of the transparent substrate. The luminescent element includes a transparent electrode formed on the incident surface of the transparent substrate, an auxiliary electrode formed on a part of the transparent electrode, and a thin-film layer, which is formed on the transparent electrode, for emitting light. The transparent substrate includes a projection formed on the light exit surface.Type: GrantFiled: June 3, 2004Date of Patent: March 20, 2007Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Yoshifumi Kato, Masato Hieda, Mitsuhara Muta