Abstract: An electronic component package includes a dielectric substrate having a first surface where an electronic component is sealed. A first signal line connecting to the electronic component and a first ground conductor are formed on the first surface of the dielectric substrate. A second signal line connected to an outside connection electrode and a second ground conductor are formed on a second surface of the dielectric substrate. The first ground conductor and the second ground conductor are connected by a plurality of ground conductor via-holes. A substrate-buried signal line connected to the first signal line and the second signal line is provided inside of the dielectric substrate so as to be put between the first ground conductor and the second ground conductor above and below and between the ground conductor via-holes on the right and left.

Abstract: Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder.

Abstract: Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.

Abstract: An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheet 3 formed on a base board 4, including thermal-conductive resin 6, a heat sink 2 provided on the base board 4 through the thermal-conductive sheet 3, a semiconductor chip 1 mounted on the heat sink 2, and a ceramic-embedded region 31 selectively provided in a region of the thermal-conductive sheet 3 under the semiconductor chip 1, including a ceramic component 5. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.

Abstract: An electronic component device of the present invention includes a package main body constructed by a lower package portion and an upper package portion and having a housing portion in an inside, and an electronic component mounted in a state that the electronic component is hermetically sealed in the housing portion of the package main body, wherein at least the lower package portion out of the lower package portion and the upper package portion is formed of silicon, in the case that an optical device as the electronic component is mounted, a transparent glass (light transmission window glass) is provided to an opening portion formed in the upper package portion.

Abstract: An electronic device with a movable mechanism mainly comprises a plurality of rolling elements at appropriate positions on the case thereof, so as to support the electronic device and to move it along a plane. Several fixing stands are installed vertically at appropriate positions on the case. When the fixing stands are withdrawn, the electronic device can move on the plane. When the fixing stands extend out and support the electronic device, one side of the electronic device has a contact with the plane so that the electronic device cannot move.

Abstract: A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in a multidirectional offset stack configuration with the first peripheral contact exposed, the multidirectional offset stack configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate contact along a package first edge, and electrically connecting the second peripheral contact and the package substrate contact along a package second edge.

Abstract: A capture ring is provided. The capture ring has a top surface and a bottom surface. A support surface is located at the inner periphery of the capture ring parallel to the top surface for supporting a wafer. An inside diameter lead angle is located between the top surface and the support surface. There is an included angle between the inside diameter lead angle and a normal line of the support surface, wherein the included angle is more than 30 degrees but less than or equal to 90 degrees. Because the foregoing included angle is more than 30 degrees but less than or equal to 90 degrees, the refraction and reflecting area of plasma inside an etching machine will be increased. Therefore, the wafer bevel flake type defect size can be controlled and the wafer bevel defect count can be reduced.

Abstract: A method for forming a damascene structure by providing a single process solution for resist ashing while avoiding and repairing plasma etching damage as well as removing absorbed moisture in the dielectric layer, the method including providing a substrate comprising an uppermost photoresist layer and an opening extending through a thickness of an inter-metal dielectric (IMD) layer to expose an underlying metal region; and, carrying out at least one supercritical fluid treatment comprising supercritical CO2, a first co-solvent, and an additive selected from the group consisting of a metal corrosion inhibitor and a metal anti-oxidation agent to remove the uppermost photoresist layer, as well as including an optional dielectric insulating layer bond forming agent.

Abstract: A conductive structure for electronic device includes at least a first conductor, at least a second conductor and a conductive material for connecting the first conductor and the second conductor.

Abstract: A semiconductor apparatus including: a semiconductor substrate having a through hole; an electrode pad provided on a first surface of the semiconductor substrate so as to cover the through hole; an external connection terminal provided on a second surface of the semiconductor substrate; a conductive wiring passing through the through hole and allowing conduction between the electrode pad and an external connection terminal; a first insulating film provided on the first surface of the semiconductor substrate; and a second insulating film provided on a second surface of the semiconductor substrate and on an inner surface of the through hole to insulate the semiconductor substrate from the conductive wiring; the conductive wiring being connected to the electrode pad via the connection opening formed in at least one of the first insulating film and the second insulating film that are formed in such a way that at least a part of the first insulating film and a part of the second insulating film overlap, in a direc

Abstract: A metal/metal nitride barrier layer for semiconductor device applications. The barrier layer is particularly useful in contact vias where high conductivity of the via is important, and a lower resistivity barrier layer provides improved overall via conductivity.

Abstract: A structure having a cavity or enclosed space is fabricated by forming a recessed region in a surface of a substrate, and providing a first layer adjacent the recessed region. A liquid mixture including first and second components is supplied to the recessed region. The first component has a higher chemical affinity to the first layer than the second component such that the first component separates from the second component and adheres to an edge portion of the first layer. The substrate may then be heated to remove the second component from the recessed region through evaporation. As a result, the first component remains as a second layer adhering to the edge portion of the first layer and covering the recessed region, thereby defining a cavity or enclosed space with the recessed region. Unique structures including such cavities may be employed to realize a capacitor having a fluid, as opposed to solid, dielectric material, in order to increase the capacitance of the capacitor.

Abstract: Methods may be provided for forming an electronic device including a substrate, a conductive pad on the substrate, and an insulating layer on the substrate wherein the insulating layer has a via hole therein exposing a portion of the conductive pad. In particular, a conductive structure may be formed on the insulating layer and on the exposed portion of the conductive pad. The conductive structure may include a base layer of titanium-tungsten (TiW) and a conduction layer of at least one of aluminum and/or copper. Moreover, the base layer of the conductive structure may be between the conduction layer and the insulating layer. Related devices are also discussed.

Abstract: Some embodiments of the invention provide a programmable system in package (“PSiP”). The PSiP includes a single IC housing, a substrate and several IC's that are arranged within the single IC housing. At least one of the IC's is a configurable IC. In some embodiments, the configurable IC is a reconfigurable IC that can reconfigure more than once during run time. In some of these embodiments, the reconfigurable IC can be reconfigured at a first clock rate that is faster (i.e., larger) than the clock rates of one or more of the other IC's in the PSiP. The first clock rate is faster than the clock rate of all of the other IC's in the PSiP in some embodiments.

Abstract: A wiring board includes: an insulating substrate; a plurality of conductive wirings provided on the insulating substrate so as to be aligned with a semiconductor mounting region where a semiconductor chip is to be mounted; and bump electrodes provided on the respective conductive wirings. The bump electrodes include a first bump electrode for mounting the semiconductor chip and a second bump electrode for adjusting a height of the first bump electrode. The second bump electrode is provided at a region of at least one of the plurality of conductive wirings other than the semiconductor mounting region.

Abstract: Metal posts are formed by etching a metal plate. Therefore, the metal posts can be formed with an accurate height and at a fine pitch. By connecting together upper and lower packages using the metal posts formed in the upper package, there is obtained a miniaturized semiconductor device having a fine electrode pitch.

Abstract: A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. A solder mask has an opening over the interconnect site, and the solder mask makes contact with the interconnect structure, or is in close proximity to the interconnect structure, at the margin of the opening. The flip chip interconnect is provided with an underfill. During the underfill process, the contact (or near proximity) of the solder mask with the interconnect structure interferes with flow of the underfill material toward the substrate adjacent the site, resulting in formation of a void left unfilled by the underfill, adjacent the contact of the interconnect structure with the site on the substrate metallization. The void can help provide relief from strain induced by changes in temperature of the system.

Abstract: A multi-port memory device includes a first package ball out region in which a plurality of balls for a serial I/O interface part are arranged; and a second package ball out region in which a plurality of balls for a dynamic random access memory (DRAM) part are arranged.

Abstract: A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.

Abstract: A fluid distribution tray that is capable of providing for the distribution of a fluid across a surface area of a bed of contact material contained within a vessel, wherein the fluid distribution tray includes lost area due to a support element upon which the fluid distribution tray is supported within the vessel, wherein the fluid distribution tray includes a plurality of fluid flow means distributed across the fluid distribution tray in a distribution pattern providing for a high density distribution of fluid flow means within a compensation area that is adjacent and near to the lost area and a low density distribution of fluid flow means within the remaining useable area of the fluid distribution tray. Also included is a method providing for a uniform fluid distribution within a vessel.

Abstract: A dew point cooling tower system utilizes cooled water produced by the system to reduces the wet bulb temperature of ambient air before the ambient air is directed through fill in the cooling tower. One preferred heat exchanger utilized in the cooling tower is an air-to-liquid heat exchanger comprising a plurality of spaced apart plate units each comprised of a pair of adhesively bonded spaced apart plates having a liquid flow channel formed intermediate the adhesively bonded plates.

Abstract: Spherical convex micro-lenses are arranged between rectangular grooves adjacent to each other of a lens plate. The arrangement of convex micro-lenses is made to be in parallel with the short-side direction of the lens plate, namely, the direction of the rectangular grooves. Since stray light appears mainly on the convex micro-lenses arranged in the long-side direction of the lens plate, the stray light to appear in the long-side direction of the lens plate is removed by forming grooves at regular intervals in the long-side direction of the lens plate and forming a light absorbing film in each of the rectangular grooves. Or the stray light to appear in the long-side direction of the lens plate is removed by making the direction of arrangement of convex micro-lenses different from the long-side direction of the lens plate.

Abstract: A system is disclosed for converting energy from the electromagnetic quantum vacuum available at any point in the universe to usable energy in the form of heat, electricity, mechanical energy or other forms of power. By suppressing electromagnetic quantum vacuum energy at appropriate frequencies a change may be effected in the electron energy levels which will result in the emission or release of energy. Mode suppression of electromagnetic quantum vacuum radiation is known to take place in Casimir cavities. A Casimir cavity refers to any region in which electromagnetic modes are suppressed or restricted. When atoms enter into suitable micro Casimir cavities a decrease in the orbital energies of electrons in atoms will thus occur. Such energy will be captured in the claimed devices. Upon emergence form such micro Casimir cavities the atoms will be re-energized by the ambient electromagnetic quantum vacuum.

Abstract: A method and apparatus for manufacturing plastic opthomalic and intra-ocular lenses and molds. The apparatus comprises a master mold for creating disposable or re-usable molds that may be used at point of sale. The molds comprise a “moth-eye” anti-reflective surface. The anti-reflective surface may be an integral part of the lens. The anti-reflective surface can be incorporated into a hardened surface of the lens. An improved curing chamber comprising reflective inner surfaces and directionally vector-less light is used for curing lenses. A gasket-less or reduced number of gaskets molding system are provided that may be either re-useable or disposable. An improved method of providing photosensitive eyeglasses and coatings.

Abstract: Gypsum-based molding materials are customized by hydrating the molding material to workable (malleable) consistency with a moistening solution containing 0.001 to 60% polytetrafluoroethylene. The addition of latex results in a more flowable material.

Abstract: Disclosed is both a method and apparatus for controlling and measuring an embossed texture on a decorative article. The embossed textured article includes both peaks and valleys that are measured and quantified to determine a profile of the textured article. Typically, the textured article comprises both chemically and mechanically embossed areas. The method uses moving average subtraction and peak/valley determinations to eliminate web flutter that often distorts the quantification of the mechanically embossed texture. The resulting profile may then be used to control a desired embossed profile.

Abstract: A method for producing a water-soluble or water-dispersible receptacle comprising at least one receiving chamber. Said method comprises the following steps: a) a first water-soluble or water-dispersible enveloping material is heated to a temperature T1; b) said enveloping material is deformed so as to obtain at least one receiving chamber; c) the deformed enveloping material is cooled to a temperature T2<T1; d) the enveloping material is deformed so as to increase the size of at least one of the receiving chambers formed in step b) and/or obtain at least one additional receiving chamber.

Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.5-10 wt % modified organo clay by intercalating with a polyether amine, based on the weight of the vinyl ester resin, is added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.

Abstract: The process enables articles to be produced comprising a transparent solid matrix (16; 16A, 16B) obtained from a liquid material able to solidify. In the transparent matrix (16; 16A, 16B) there being partially incorporated inserts (14) which emerge from a flat surface of these articles.

Abstract: The present invention relates to cellulose fiber containing 500 to 2000 of filaments and having homogeneous physical properties and the multi-filaments according to the present invention is characterized in that the strength and the breaking elongation of the multi-filaments are 4 to 9 g/d and 4 to 15%, respectively. In particular, the present invention is characterized in that each mono-filament selected 100 strands from every three part divided from multi-filaments has properties as following: (a) 3 to 9 g/d in average strength, 7 to 15% in average breaking elongation and 0.035 to 0.055 in by birefringence, (b) the differences of the above three parts are below 1.0 g/d in average strength, 1.5% in breaking elongation and 0.7 denier in denier, (c) the CV (%)(coefficient of variation) of the above three parts are below 10%, and (d) the birefringence differences of the above three parts are below 0.004.

Abstract: The present invention relates to methods of making preforms, fiber-reinforced molded articles and fiber mats, wherein the methods use electroluminescent devices such as LED's and/or quantum dots.

Abstract: A return ensuring assembly (20) includes a switch (21) and a connector (22). The switch has a body (211), an actuator (212) formed on the body, and a number of contacts (213) electrically coupled to the body. The connector is electrically coupled to the contacts of the switch. The connector has a number of connector ends (2221).

Abstract: A rubber/short fiber master batch obtained by stirring and mixing an aqueous dispersion of short fibers having an average diameter of less than 0.5 ?m and a rubber latex, followed by removing the water from the mixture and a practical production method of the same and a pneumatic tire using the master batch.

Abstract: The present invention provides a method for the continuous production of semiconductor ribbons by growth from a linear molten zone. The creation of the molten zone is achieved by application of an electric current, direct or alternating, parallel to the surface of the ribbon and perpendicular to the direction of growth, and intense enough to melt the said material, preferably using electrodes of the said material. The molten zone is fed by transference of the material, in the liquid state, from one or more reservoirs, where melting of the feedstock occurs. Preferably, the said electrodes and the said reservoir(s) are only constituted by the said material, thus avoiding contamination by foreign materials. The present invention is applicable, for example, in the industry of silicon ribbons production for photovoltaic application.

Abstract: Process, materials, and equipment for producing three-dimensional objects from a particulate material by melting and adhering, for example, by fusion or sintering, portions of the particulate material.

Abstract: Process to produce improved biodegradable plastic films, comprising producing a biodegradable plastic film by bubble blowing, then subjecting it to monoaxial or biaxial cold stretching with a stretch ratio in the range from 1:1 to 1:4.

Abstract: The method for producing a porous honeycomb structural body according to the present invention is the method, which comprises preparing a green body by kneading a forming material containing a main constituent material consisting of non-oxide ceramics and/or a metal and an organic binder, manufacturing a honeycomb shaped formed body (honeycomb formed body) by shaping and drying said green body, calcining the honeycomb formed body to obtain a calcined body, and firing finally the calcined body to obtain a porous honeycomb structural body, wherein said forming material further includes 0.01-10 parts by mass of an inorganic layer material to 100 parts by mass of said main constituent material, in addition to said main constituent material and said organic binder.

Abstract: The invention relates to a method of improving the cooling of a blown-gas cooling chamber or of a blown-air cooling section in a line for heat treating steel and/or aluminum, and/or of improving the quality of products for treatment by reducing the vibration generated by the cooling, in which jets of gas or air are projected against each of the faces of the strip traveling through said section or chamber.

Abstract: The invention relates to a sliding plate for a valve closure on metallurgical melt containers.

Abstract: The object of the invention is to simplify the method for controlling the air volume in a closed air supply installation. To this end, the pressure of the pneumatic springs (3, 4) is first determined when air is let out of the pneumatic springs (3, 4) into a defined control chamber, the average volume flow of a defined controlling process between the air chamber (5) and the pneumatic springs (3, 4) is determined, and the pressure in the air chamber (5) is calculated from a functional dependency in relation to the determined pressure in the pneumatic springs (3, 4), the determined average volume flow and the measured external temperature. The pressurised air volume of the air supply installation is then calculated from the calculated or determined pressures, the known or determined volumes of the air chamber (5) and the pneumatic springs (3, 4), and compared with an optimum pressurised air volume.

Abstract: A damping assembly includes a supporting base, a stainless steel layer having an arcuate slippery top face mating to the arcuate top face of the supporting base, a Teflon® layer movably seated on top of the arcuate slippery top face of the stainless steel layer, a supporting stainless steel layer placed on top of the Teflon® layer to force the Teflon® layer, a rubber pad provided on top of the supporting stainless steel layer providing necessary resilience, a confinement to confine the rubber pad when experiencing a load on the rubber pad and a top supporting plate for firm attachment to a bottom face of a main construction such that movement of the Teflon® layer offsets a shaking force and the rubber pad provides balance to the top supporting plate and absorbs vertical vibration force to protect the main construction from damage of an earthquake.

Abstract: A vibration damping apparatus actively damping vibration of a vibration source by adding vibration to the vibration source includes a vibrational state detecting means and a vibrator including a magnetic pole, a coil, and a controlling means, and the vibrator adds vibration to the vibration source by controlling a current-supplied state of the coil to vibrate the coil and the magnetic pole relatively, wherein the controlling means selectively switches a vibration generating mode and a regenerative mode based on the vibrational state of the vibration source, the vibration is added to the vibration source to damp the vibration of the vibration source in the vibration generating mode, and regenerative current is caused by an electro motive force generated at the coil by the vibration of the vibration source to flow into a regenerative resistor in the regenerative mode.

Abstract: A pen vise includes a jaw assembly having parallel front and rear grooved bars which are drawn together by two clamping bolts located at opposite ends of the jaw assembly in order to secure multiple workpieces between the grooved bars. The rear grooved bar has a longitudinal projection of dovetail cross section that slideably engages a groove of dovetail cross section on a base member of the vise, so that the jaw assembly can be moved in an X direction to position each of the workpieces beneath a machining axis. The jaw assembly is disposed between front and back walls of the base member. A securing bolt engages a threaded aperture in the front wall and both indexes and clamps the jaw assembly against the rear wall.

Abstract: The invention relates to a device for supporting workpieces, in particular, for multi-side coating of workpieces in a coating press, comprising a press table for housing the device and an adjusting carriage, arranged below the press table, whereby a number of support elements (1), forming the laying surface of the coating press, are provided. Each support element (1) comprises a support sleeve (2), a vertically-displaceable pin (3), housed therein, guide devices (6a, 6b; 7) and fixing devices (5; 8) for the pin (3) and a return element (12), for return of the pin (3) from an upper position into a lower position. The support elements (1) are arranged without a separation.

Abstract: Various embodiments and methods relating to a booklet maker are disclosed.

Abstract: A transfer device for sheet products, comprising at least one drum which rotates about its own axis and is provided with retention apparatus adapted to retain the products so that they adhere to its outer surface along at least one portion of its rotation, and at least one star conveyor which is provided peripherally with a plurality of receptacles for the insertion of the products and for the release of the products at subsequent production stations. At least one element for rotationally entraining the products one by one, is further provided which is arranged substantially between the drum and the star conveyor and is adapted to follow the insertion of each of the products within the receptacles.

Abstract: A method and device for feeding sheets to a user machine, whereby the sheets, arranged in a stack along a channel having a substantially horizontal longitudinal axis, are fed to a single-sheet pickup member by dividing the stack into an output portion, an intermediate portion, and an input portion; pushing the output portion towards the pickup member at a given constant first pressure; compressing the input portion at a given second pressure; transferring sheets from the intermediate portion to the output portion to compensate for the withdrawn sheets and keep a length of the output portion substantially constant and equal to a given value; and transferring sheets from the input portion to the intermediate portion to keep the density of the sheets along the intermediate portion substantially constant and equal to a given value.

Abstract: There is described a paper sheet post processing apparatus that includes a paper sheet stacking apparatus in which the paper sheet stacking operation can be smoothly and stably conducted during a high-speed post processing of paper sheets. The paper sheet stacking apparatus includes: a paper sheet stacking tray that is inclined with respect to a horizontal line; an ejecting member to press-push a lower end portion of the paper sheets stacked on the paper sheet stacking tray, so as to eject the paper sheets outside the paper sheet stacking apparatus; and a protrusion member to push up substantially a center portion of the paper sheets stacked on the paper sheet stacking tray. The protrusion member is formed as a separate member being independent of the ejecting member. Further, the height of the protrusion member is lower than that of the ejecting member.

Abstract: A playing card handling system includes a pivoting pair of jaws to retrieve playing cards from a playing card receiver, for example a carousel. The rotational or angular velocity of a picker may be approximately equal to a rotational or angular velocity of a pickup roller, as the picker approaches the pickup roller.