Abstract: A magnetic recording head having an air bearing surface for confronting a surface of a rotating disc and comprising a pole tip and a generally rounded and substantially planar body attached to the pole tip is disclosed. The width of the pole tip defines a track width of data written to the rotating disc. The generally rounded shape of the top pole body is such that top pole magnetization gradually changes its direction and follows the edges of the body. Further, the pole tip has low remanence, gradual spin structure and no domain walls formed near the pole tip.

Abstract: A magnetic recording medium deposited on glass and having an orientation ratio greater than one is disclosed. The magnetic recording medium includes a CoW seedlayer deposited on a circumferentially textured glass substrate. The magnetic recording medium with such a seedlayer can have an OR that is similar or higher than that with a NiP seedlayer. Magnetic recording medium with a CoW seedlayer can produce oriented glass media with orientation ratio OR>1 when sputtered on substrates which have been circumferentially textured before the deposition of the CoW seedlayer. The W content of the CoW seedlayer can range between 30-50 at %. The thickness of the CoW seedlayer can range between 10 ? and 200 ?. The method for sputter depositing the magnetic recording medium is also disclosed and includes sputter depositing the CoW seedlayer using pure Ar as sputtering gas or using a mixture of Ar and O2, H2O and N2 as sputtering gas.

Abstract: Techniques for reducing weight while maintaining sufficient stiffness of a suspension assembly in provided. The suspension assembly includes a surface having a proximal end and distal end. A length is defined between the proximal end and the distal end. At least one support member (such as an edge rail) is formed to provide stiffness. The support member is contoured. In a specific embodiment, a portion of at least one cutout is disposed in at least one support member, and extends from the horizontal portion of the load beam member vertically into the at least one support member.

Abstract: A disk drive suspension and method uses two proximally cantilevered members to limit tongue movement in a suspension of a load beam having a beam portion and a flexure having a tongue. The suspension has a limiter structure comprising the two proximally cantilevered members arranged on the beam portion and the tongue respectively and intersecting for increasing engagement responsive to undue tongue travel against dislodgment.

Abstract: Embodiments of the present invention provide a rotating disk storage device having a mechanism to reliably retract an actuator into a retraction area in the event that the power supply is suddenly interrupted. A bias chip is embedded in a coil support that supports the voice coil. When a head stays in an access area, the bias chip is away from an end of the voice coil magnet. Therefore, no influence of the magnetic leakage flux is exerted on the bias chip. When the head is in a retraction area, the bias chip is attracted under the influence of the magnetic leakage flux of the voice coil magnet, which thereby produces bias torque causing an actuator to pivotally move in a retraction direction. Accordingly, the bias torque can be utilized as energy for retracting the actuator immediately after power shutdown.

Abstract: Provided is an actuator of a disk drive to move a read/write head, for recording and reproducing data, to a predetermined position on a disk. The actuator includes an actuator pivot installed on a base member of the disk drive, a swing arm that is rotatably coupled to the actuator pivot and has a suspension supporting the head at a leading end portion of the swing arm, a coil support portion provided at a rear end portion of the swing arm, a VCM coil coupled to the coil support portion and having four sections having respective particular directions, and magnets arranged to face the VCM coil and having four poles respectively corresponding to the four sections of the VCM coil.

Abstract: A HGA includes a slider, a micro-actuator horizontally rotating the slider with a central portion of the slider as a rotation center, and a suspension to load the slider and the micro-actuator; wherein the micro-actuator comprises a support frame having a base, a moving plate, and a leading beam to connect the base and the moving plate; and at least one piezoelectric pieces to be connected with the base and the moving plate; wherein the leading beam has a pivot part to assist the horizontal swing of the slider. The pivot part has a narrower width than that of the leading beam. The suspension also includes a support means to support the base of the support frame on a suspension tongue portion. The invention also discloses a disk drive unit having the HGA.

Abstract: Magnetoresistive devices with increased response sensitivity to external magnetic fields and an increased magnetoresistive ratio (MR ratio) to cope with rapid advances made in a highdensity magnetic recording device. A patterned dielectric layer is laminated in a flat shape on a substrate capable of being doped with carriers (holes) in an electric field, and an FET structure with gate electrodes is then fabricated on that dielectric layer, and the substrate spatially modulated by applying a nonuniform electrical field to induce a first ferromagnetic domain, a nonmiagnetic domain and a second ferromagnetic domain.

Abstract: A method for providing a self-pinned differential GMR sensor and self-pinned differential GMR sensor. The differential GMR head includes two self-pinned GMR sensors separated by a gap layer. The gap layer may act as a bias structure to provide antiparallel magnetizations for the first and second free layers without using an antiferromagnetic layer. The gap layer may include four NiFe ferromagnetic layers separated with three interlayers. The gap may also be formed to include a structure defined by Ta/Al2O3/NiFeCr/CuOx. One of the pinned layer may include three ferromagnetic layers so that the top ferromagnetic layer of the bottom pinned layer and the bottom ferromagnetic layer of the bottom pinned layer have a magnetization 180° out of phase. The self-pinned GMR sensors may include synthetic free layers that includes a first free sublayer, an interlayer and a second free sublayer that are biased 180° out of phase.

Abstract: A magneto-resistance effect head is provided with a lower conductive layer which is provided with a recessed portion, and a vertical bias layer is provided in the recessed portion. A free layer is provided on the lower conductive layer. On the free layer, layered in the following order are the non-magnetic layer, the fixed layer, the fixing layer, and the upper layer so as not to be placed immediately above the vertical bias layer. The non-magnetic layer, the fixed layer, the fixing layer, and the upper layer are buried in an insulation layer. Furthermore, an upper conductive layer is provided on the upper layer and the insulation layer. In the direction of the magnetic field applied by the vertical bias layer, the free layer is made greater in length than the fixed layer and the free layer is disposed in proximity to the vertical bias layer with the distance between the fixed layer and the vertical bias layer remaining unchanged.

Abstract: A magnetoresistive sensor based on the spin accumulation effect has an in-stack biasing structure with a ferromagnetic biasing layer that is magnetically-coupled orthogonally with the sensor free ferromagnetic layer across a spacer layer. The sensor has an electrically conductive strip with a first tunnel barrier and a free ferromagnetic layer on the front or sensing end of the strip and second tunnel barrier and a fixed ferromagnetic layer on the back end of the strip. A magnetically-coupling spacer layer is formed on the free layer and the ferromagnetic biasing layer is formed on the spacer layer. The magnetically-coupling layer induces direct orthogonal magnetic coupling between the in-plane magnetization directions of the biasing layer and the free layer.

Abstract: The present invention is directed to a protective wiring device that includes a plurality of line terminals coupled to a plurality of load terminals by way of at least one conductive path. A miswire detection circuit is coupled to the at least one conductive path. The miswire detection circuit is configured to monitor signal propagation characteristics on the at least one conductive path and generate a miswire detection signal based on the signal propagation characteristics commencing each time source power is applied to either the plurality of line terminals or the plurality of load terminals. A fault detection circuit is coupled to the at least one conductive path. The fault detection circuit is configured to detect a fault condition propagating on the at least one conductive path. The fault detection circuit is configured to generate a trip signal in response to either the fault condition or the miswire detection signal. A circuit interrupter is coupled to the fault detection circuit.

Abstract: A snapback ESD protection network coupled across first and second integrated circuit pads and including first and second snapback devices, such as SCR devices, with the second device having a turnoff current ITOFF which is greater than the turnoff current of the first device. Each of the snapback devices has an anode terminal and a cathode terminal, with the first device anode and cathode terminals being coupled to the respective first and second integrated circuit pads through a first effective series resistance and the second device being coupled to the respective first and second integrated circuit pads through a second effective series resistance, with the first effective series resistance being smaller than the second so as to cause the first and second snapback devices to tend to turn on at about the same time at the beginning of an ESD event. The differences in turnoff current cause the second snapback device to turn off prior to the first snapback device at the conclusion of an ESD event.

Abstract: Into an internal circuit to operate in a high-frequency band, there is incorporated a protective circuit of a multistage connection which is constructed to include a plurality of diode-connected transistors having a low parasitic capacity and free from a malfunction even when an input signal higher than the power supply voltage is applied. Into an internal circuit to operate in a low-frequency band, there is incorporated a protective circuit which is constructed to include one diode-connected transistor. The protective circuits include two lines of protective circuit, in which the directions of electric currents are so reversed as to protect the internal circuits against positive/negative static electricities.

Abstract: A protection circuit for a parallel power system having at least two parallel coupled voltage regulators is disclosed. The protection circuit includes at least two isolation control circuits, each control circuit being coupled to a respective voltage regulator. Each isolation control circuit includes a current sense circuit for sensing current polarity at an output of the respective voltage regulator, and a controller for automatically isolating the respective voltage regulator when an over-voltage condition exists at an output of the parallel power system and a positive current polarity is sensed at the output of the respective voltage regulator. The at least two isolation control circuits isolate only a voltage regulator having positive current outflow during the over-voltage condition. In one embodiment, each isolation control circuit further includes an over-voltage detection circuit for detecting when the over-voltage condition exists at the output of the parallel power system.

Abstract: The present invention provides for a novel technique for placing superconducting magnets into operation. For example, the technique provides for automatically controlling ramp-up of a superconducting magnet. In one aspect, the technique includes connecting a power supply to the magnet, determining constraining parameters of the ramp-up, automatically applying power to the magnet, automatically controlling the ramp-up based on the constraining parameters, and wherein the ramp-up is complete upon reaching a predetermined value of a target parameter.

Abstract: In one inventive aspect, a multilayer ceramic capacitor is provided, in which occurrence of cracks can be prevented even when temperature of the capacitor itself is increased. Non-flat portions are formed in both sides in a width direction of each of inner electrode layers. In addition, the non-flat portions comprise regions substantially changed into oxide regions, therefore a thermal expansion coefficient of the non-flat portions can be decreased so that stress due to difference in thermal expansion coefficient to non-flat portions can be reduced, and the stress can be dispersed in accordance with curvature or inclination of the non-flat portions. That is, stress generated when temperature of the capacitor itself is increased is decreased and dispersed, thereby occurrence of cracks due to the stress can be prevented in side margins of the ceramic chip.

Abstract: A multilayer capacitor includes a multilayer body in which dielectric layers and inner electrodes are alternately laminated, and terminal electrodes formed on the multilayer body. The inner electrodes include first inner electrodes and second inner electrodes alternately arranged. The terminal electrodes include at least three terminal electrodes. The first inner electrodes are electrically connected to each other via a through-hole conductor. The second inner electrodes are electrically connected to each other via a through-hole conductor. At least two first inner electrodes in the first inner electrodes are electrically connected via a lead conductor to at least two respective terminal electrodes whose number is smaller than the total number of the terminal electrodes by at least 1 in the at least three terminal electrodes.

Abstract: The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.

Abstract: A multi-pole mounting base for interfacing a circuit breaker and/or circuit interrupter with an electrical panel is disclosed. The electrical panel has an interior configured to receive remote operated circuit breakers (ROCBs) in signal communication with a communication board internal to the electrical panel, non-ROCBs, and ground fault circuit interrupters (GFCls). The mounting base includes a unitary support platform assemblable to the interior of the electrical panel and having first mounting regions with common structure configured to receive any one of the ROCBs, the non-ROCBs, and the GFCls. The support platform also has second mounting regions configured to receive the communication board. The support platform is configured to assemble adjacent to another support platform in the electrical panel.

Abstract: A chassis reinforcing apparatus includes a chassis defining a component housing. A chassis reinforcing member is coupled to the chassis and comprises a bend which is directed towards the component housing. The bend is designed such that, with components housed in the component housing, the chassis reinforcing member is deflected into a substantially planar orientation.

Abstract: The invention provides a liquid crystal television including a cord binding hook excellent in design and beautiful appearance by making it to be able to bind cords easily, and by covering the binding part of the cords with a detachable cover member. An oblong stepped recessed part 11, which makes it possible to dispose a number of input and output terminals 7 and cords 8 such as a power supply cord, is formed at a lower side of the back casing 5, a cord binding hook 21 is formed at a step surface 12 of the stepped recessed part 11 to make it possible to easily bind the number of cords 8 and lead out them downward, and a cover member 6 which covers and hides the stepped recessed part 11 is provided to be easily attached and detached.

Abstract: A computer comprising a casing forming an outer appearance and having a main board attaching surface to which a main board is attached, further comprises a main board supporting unit provided on the main board attaching surface so as to support the main board, the main board supporting unit comprising a holder having a locking part, slidably combined to the main board attaching surface, and preventing the main board attached onto the main board attaching surface from moving; and a guiding part formed on the main board attaching surface at a position spaced from the main board so as to guide the holder, the locking part being locked to the guiding part.

Abstract: A supporting apparatus for a portable computer is provided. The portable computer includes a base part and a pivoting part pivotally coupled to the base part. The apparatus includes a support structure projecting from side rear portions of the base part, so as to provide support for a pivoting of the pivoting part.

Abstract: An external expanding apparatus or “docking station” operable with a portable computer device of a type having a display unit having a display screen on an inner surface thereof and a hard shell backing surface opposite thereof and pivotally mounted on a substantially rigid casing having a pair of locating holes adjacent to opposite corners of a substantially planar bottom surface thereof, and an input/output (I/O) connector positioned on a back plane thereof with a pair of positioning apertures provided on opposite sides thereof.

Abstract: A planar backplane is arranged in a horizontal orientation in a server configured for rack mounting. The planar backplane is configured to accept and mount a plurality of disk drives in a vertical orientation in a dense server arrangement.

Abstract: A portable computer docking station comprising a base and a panel rotatably connected to the base. An angle is formed between the base and the panel. A mounting point is disposed on the panel and provides a releasable connection to an interface assembly that is operable to releasably connect to a portable computer. An adjusting system controls the angle of the panel relative to the base.

Abstract: A telco hub in a chassis having a front side and a rear side, where the chassis includes a midplane having a first side and a second side, the telco hub includes an interposer module coupled to slidably insert into a switch slot on the rear side and connect to the second side of the midplane, a mezzanine module coupled to the interposer module, where the mezzanine module includes a telco I/O interface, where the mezzanine module is coupled to receive non-packetized telephony data. The telco hub is coupled to convert the non-packetized telephony data to packetized data, and communicate the packetized data to one or more of a plurality of payload modules over a switched fabric on the midplane, where each of the one or more payload modules is coupled to the first side of the midplane via a payload slot on the front side of the chassis.

Abstract: A media centre computing device includes a housing, and a mains-powered personal computer motherboard including a main processor with a heatsink disposed at or near to one edge of the motherboard and connectors disposed at an adjacent edge of the motherboard, the motherboard being secured in the housing with the connectors contacting the rear face of the housing and the main processor being disposed adjacent a first side face of the housing and in the proximity of a first vent formed therein. The device also includes a power supply secured to the housing and proximate to rear and second side faces of the housing, and a fixed mass-storage device and a removable memory media drive located one above the other in the volume between the power supply and the front face of the housing. Media being transportable to and from the removable memory media drive though an aperture in the front face of the housing.

Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: In electronic and/or electrical equipment, a cable management assembly is configured for usage in an electronic and/or electrical equipment rack assembly. The cable management assembly comprises at least two arm members, at least one flexible coupling configured to attach two of the at least two arm members, and connectors configured to flexibly attach an electronic and/or electrical equipment component to an electronic and/or electrical equipment rack. The at least two arm members, the at least one flexible coupling, and the connectors are constructed from a material that removes heat from interior to the rack and is connected in a configuration that draws the removed heat to a heat sink element.

Abstract: A heat dissipation device for dissipating heat from an electronic device comprises a base, a heat dissipation member provided with two heat-dissipating plate groups intercrossed with each other and defining a plurality of air passages. At least a heat pipe connects the base with the heat dissipation member to transfer heat from the base to the heat dissipation member. A first heat sink and a second heat sink respectively contact with lateral sides of the heat dissipation member. The heat pipe is partly sandwiched between the heat dissipation member and the first and second heat sinks.

Abstract: A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.

Abstract: A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.

Abstract: A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

Abstract: A data storage device chassis for housing a plurality of data storage devices has a plurality of walls at least some of which have at least one guide strip along at least part of the length of the wall to define a plurality of bays in which data storage devices (18) can be housed. The guide strips support respective data storage devices in the bays such that the data storage devices can be slid into and out of the bays by sliding along the guide strips. The at least some of the walls are composed of a non-metallic material such that the surface of said guide strips along which a data storage device slides is non-metallic. Each of said at least some of the walls have an electrically conductive portion passing through the wall to provide for electrical conduction between the bays thereby providing electrical shielding for data storage devices housed in the bays.

Abstract: An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the motherboard, at least one second memory module slot is disposed on one side of the substrate, and a plurality of third memory module slots is disposed on the other side of the substrate. The third memory module slots are electrically connected to the second memory module slot, and two ends of the circuit switch board are plugged into one of the first memory module slots and the second memory module slot. When memory modules are plugged in the third memory module slots, the memory modules are electrically connected to the first memory module slots respectively through the circuit switch board and then transmit data and signals with the motherboard.

Abstract: A system is provided which includes a plurality of nodes on a network which each interface with equipment on in a particular equipment housing. The nodes also interface with a an external database. The network-accessible external database is used to maintain asset management information which is received from the nodes.

Abstract: A portable power inverter/converter having a pass through device for simultaneously sourcing A.C. and multiple voltage D.C. power consuming devices through a single D.C. power source connection. Inverter and converter circuitry is provided to invert and convert D.C. voltage to an A.C. voltage source and a lower DC voltage. A.C. electrical outlets are provided to facilitate a connection to an external A.C. power-consuming device and a DC outlet to a lower volt DC power-consuming device. The pass through device provides an independent and simultaneous connection to an additional D.C. outlet that would otherwise be eliminated when occupied by the inverter thus allowing simultaneous connection and operation of both A.C. and multi source D.C power consuming devices through a single external D.C. power outlet of a single D.C. power source.

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Abstract: A circuit board has a plurality of pads arranged as a grid array in a quadrangle region. A surface mount type circuit component is connected to the circuit board through the pads. Each of pads arranged in the outermost side of the quadrangle region is formed in a substantially quadrangle shape in plan view.

Abstract: A coupling mechanism mainly includes a coupling member and two bucking blades. The coupling member has two anchor ends on two sides to anchor a plugging main board on the coupling member, and a groove on an upper side and a lower side, to hold the bucking blades. The bucking blades are squeezed and deformed when the coupling member is moved and latched on a coupling interface of an electronic device to fill the tolerance between the two, thus can prevent electromagnetic waves from leaking out. The two anchor ends are made of metal and can also prevent the electromagnetic waves from leaking out from two sides. The coupling mechanism solves the interference problem during assembly occurring to conventional coupling mechanisms that use annular conductive-foamed plastics. The cost of the coupling mechanism also decreases.

Abstract: A switching power source apparatus can reduce the size of a transformer and realize the zero-voltage switching of a switch. The apparatus is compact, highly efficient, and low in noise. The apparatus has a series circuit connected to each end of a DC power source (Vdc1) and including a primary winding (5a) of a transformer (T) and a main switch (Q1), a rectifying-smoothing circuit to rectify and smooth a voltage that is output from a secondary winding (5b) when the main switch (Q1) is turned on, a series circuit connected to each end of the primary winding (5a) and including an auxiliary switch (Q2) and a clamp capacitor (C1), a series circuit connected to each end of the primary winding (5a) and including an auxiliary reactor (Lx), a diode (Dx1), and a snubber capacitor (Cx), a series circuit connected to each end of the auxiliary switch (Q2) and including a diode (Dx2) and the snubber capacitor (Cx), and a control circuit (10) to alternately turn on/off the main switch (Q1) and auxiliary switch (Q2).

Abstract: Techniques for correcting for internal resistance losses in the secondary windings of a transformer to reduce errors in output voltage from a high voltage power supply.

Abstract: A switching power supply circuit which can achieve enhancement of the power conversion efficiency is disclosed. In a composite resonance converter wherein a current resonance type converter constructed on the primary side and a primary side partial voltage resonance circuit are combined, a primary side DC input rectification circuit is formed from a full-wave rectification circuit. Further, a gap G of the core of an insulating converter transformer (PIT) is set to 2.0 mm to set the coupling coefficient of the primary winding (N1) and the secondary winding (N2) to approximately 0.81 of a loose coupling state. Further, the numbers of turns of the primary winding (N1) and the secondary winding (N2) are selected so that the induced voltage per one turn of the secondary winding (N2) is 2 V or less.

Abstract: A switching power supply circuit includes a plurality of switching converters, each including a partial resonance voltage circuit combined with a current resonance type switching converter using a half-bridge connection system. For changeover control, a rectification circuit serves as a voltage doubler rectification circuit at an AC voltage less than or equal to 150V, but serves as a full-wave rectification circuit at an AC voltage greater than or equal to 150V. The voltage output of the converters is fed back to a rectification current path by a power factor improving transformer, the rectification current being interrupted by means of a rectification diode to expand the conduction angle of the AC input current. A DC switch circuit in the rectification current path is switched between on and off conditions in response to the input of a predetermined starting signal to control the starting order of the secondary side DC output voltage.

Abstract: A content addressable memory (CAM) cell circuit can include a match section that enables an impedance path coupled to a match line in response to a comparison between a data value and a compare data value. At least a first storage circuit can be connected to the match section, and provides the data value on a first storage node and a complementary data value on a second storage node. At least a first bit line can be coupled to the first storage node by a first access controllable impedance path and coupled to the second storage node by a second access controllable impedance path.

Abstract: A multi-functional match cell is responsive to first and second n-bit operands and configured so that the match cell operates as an n-bit range match cell when the first and second n-bit operands are equivalent, as an n-bit NOR-type CAM cell when the second n-bit operand is masked and as an n-bit NAND-type CAM cell when the first n-bit operand is masked, where “n” is a positive integer greater than one.