Abstract: The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of fabricating the same. In the wafer level chip size package, with such an n-shape junction instead of a conventional T-shape junction observed in Shellcase type wafer level chip size package technology, electrical connections between compatible pads and external leads are more reliable due to larger connection area than the counterpart in the T-shape junction.

Abstract: Provided are a semiconductor package and a method for manufacturing the same. The semiconductor package includes: a substrate having a top surface on which a lead is formed and a bottom surface opposite to the top surface; a semiconductor chip attached to the top surface of the substrate and having an active surface on which a chip pad is formed and a back surface opposite to the active surface; a redistribution pattern electrically connected to the chip pad and extending from the active surface to a lateral surface of the semiconductor chip; and an interconnector electrically connecting the redistribution to the lead on the lateral surface of the semiconductor chip.

Abstract: A wiring film including wires, a semiconductor package including the wiring film, and a method of fabricating the semiconductor package are provided. The wiring film comprises a base film and first wires arranged on a first surface of the base film. First bumps are respectively positioned at ends of the first wires. A first adhesive layer is also provided to cover the first wires and the first bumps.

Abstract: One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.

Abstract: A semiconductor package that includes a conductive clip having an interior surface that includes a plurality of spaced raised portions, a semiconductor device having a first major surface that includes a plurality of spaced depressions each receiving one of the raised portions in the interior thereof, and a conductive adhesive disposed between each raised portion and a respective interior surface of a depression.

Abstract: A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the direction of the z-axis (i.e., in a direction normal to the circuit side of the die). The semiconductor package can include a die mounted in a face-up configuration (similar to a wire bond package) or in a face-down or flip chip configuration.

Abstract: A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract: The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elastomer. A barrier/seed layer is deposited, a first photoresist mask is created exposing the barrier/seed layer where this layer overlies the contact pad and, contiguous therewith, over a surface area that is adjacent to the contact pad and emanating in one direction from the contact pad. The exposed surface of the barrier/seed layer is electroplated for the creation of interconnect traces. The first photoresist mask is removed from the surface of the barrier/seed layer. A second photoresist mask, defining the solder bump, is created exposing the surface area of the barrier/seed layer that is adjacent to the contact pad and emanating in one direction from the contact pad.

Abstract: A method of manufacturing a semiconductor device that comprises forming an insulating layer over a semiconductive substrate 110 and forming a copper interconnect. Forming the interconnect includes etching an interconnect opening in the insulating layer and filling the opening with copper plating. Filling with copper plating includes using a first and second ECD. An electrolyte solution of the first and second ECD contains organic additives, and a current of the first ECD is greater than a current of the second ECD.

Abstract: An integrated circuit processing system is provided including providing a substrate having an integrated circuit, forming an interconnect layer over the integrated circuit, applying a low-K dielectric layer over the interconnect layer, applying an ultra low-K dielectric layer over the low-K dielectric layer, forming an opening through the ultra low-K dielectric layer and the low-K dielectric layer to the interconnect layer, depositing an interconnect metal in the opening, and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer.

Abstract: An interconnect structure having improved electromigration (EM) reliability is provided. The inventive interconnect structure avoids a circuit dead opening that is caused by EM failure by incorporating a EM preventing liner at least partially within a metal interconnect. In one embodiment, a “U-shaped” EM preventing liner is provided that abuts a diffusion barrier that separates conductive material from the dielectric material. In another embodiment, a space is located between the “U-shaped” EM preventing liner and the diffusion barrier. In yet another embodiment, a horizontal EM liner that abuts the diffusion barrier is provided. In yet a further embodiment, a space exists between the horizontal EM liner and the diffusion barrier.

Abstract: A semiconductor device and fabricating method thereof are provided. A carbon interconnection line can be formed on an interlayer insulating layer such that the carbon interconnection line is electrically connected to a conductive metal layer disposed in a contact hole of the semiconductor device.

Abstract: The present invention provides a semiconductor device which is characterized as follows. The semiconductor device includes: an interlayer insulating film formed above a semiconductor substrate and provided with a hole above an impurity diffusion region; a conductive plug formed in the hole and electrically connected to the impurity diffusion region; a conductive oxygen barrier film formed on the conductive plug and the interlayer insulating film around the conductive plug; a conductive anti-diffusion film formed on the conductive oxygen barrier film; and a capacitor that has a lower electrode which is formed on the conductive anti-diffusion film and which exposes platinum or palladium on the upper surface, a capacitor dielectric film made of a ferroelectric material, and an upper electrode. The conductive anti-diffusion film is made of a non-oxide conductive material for preventing the diffusion of the constituent element of the capacitor dielectric film.

Abstract: An integrated circuit chip includes a silicon substrate, a first circuit in or over said silicon substrate, a second circuit device in or over said silicon substrate, a dielectric structure over said silicon substrate, a first interconnecting structure in said dielectric structure, a first pad connected to said first node of said voltage regulator through said first interconnecting structure, a second interconnecting structure in said dielectric structure, a second pad connected to said first node of said internal circuit through said second interconnecting structure, a passivation layer over said dielectric structure, wherein multiple opening in said passivation layer exposes said first and second pads, and a third interconnecting structure over said passivation layer and over said first and second pads.

Abstract: The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.

Abstract: A semiconductor device having copper interconnecting metallization (111) protected by a first (102) and a second (120) overcoat layer (homogeneous silicon dioxide), portions of the metallization exposed in a window (103) opened through the thicknesses of the first and second overcoat layers. A patterned conductive barrier layer (130) is positioned on the exposed portion of the copper metallization and on portions of the second overcoat layer surrounding the window. A bondable metal layer (150) is positioned on the barrier layer; the thickness of this bondable layer is suitable for wire bonding. A third overcoat layer (160) consist of a homogeneous silicon nitride compound is positioned on the second overcoat layer so that the ledge (162, more than 500 nm high) of the third overcoat layer overlays the edge (150b) of the bondable metal layer. The resulting contoured chip surface improves the adhesion to plastic device encapsulation.

Abstract: An electric element includes a first electrode (1), a second electrode (3), and a variable-resistance film (2) connected between the first electrode (1) and the second electrode (3). The variable-resistance film (2) contains Fe (iron) and O (oxygen) as constituent elements. The content of oxygen in the variable-resistance film (2) is modulated along the film thickness direction.

Abstract: A method and apparatus for partially strapping two polysilicon lines, each having a first end and second end, uses a metal line having a plurality of spaced apart metal segments with each metal segment partially strapping a different portion of a polysilicon line. The metal segments are arranged from the first end to the second end with the signals propagating from the second end to the first end. Where two metal segments are used, the segments have lengths of x = 2 ? L 7 and L?X where L is the length between the first end and the second end. Where three segments are used, the segments have lengths of X=0.25 L, Y=0.48 L, and Z=0.27 L.

Abstract: There is provided a method of fabricating an electronic device including flip-chip mounting a device chip on a substrate, and supplying solder between adjacent device chips by supplying the solder on the device chips and applying heat and pressure on the solder, and a contact angle of the device chip and the solder is greater than 90° with the solder melted.

Abstract: A semiconductor package (100, 150, 200, 250), and method of forming the package, including a substrate (102, 102?, 202, 202?) having an opening (104, 104?, 204, 204?) formed therein. Contact pads (112, 112?, 212, 212?) are formed about a periphery of the opening on a first side of the substrate (106, 106?, 206, 206?) and a second opposing side (132, 132?, 232, 232?) of the substrate. A flip chip die (120, 120?, 220, 220?) is mounted to the substrate, having an active side (114, 114?, 214, 214?) mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die (110, 110?, 210, 210?) is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract: In conventional semiconductor devices, an insufficient supply of the resin to the end portions of the components that should be encapsulated is caused, resulting in an insufficient permeation of the resin into gaps between the components and the substrate, causing a spreading resin-wet. A semiconductor device 1 includes a mounting interconnect substrate 10, a semiconductor chip 20 mounted on the mounting interconnect substrate 10, an underfill resin 30 provided in a gap between the mounting interconnect substrate 10 and the semiconductor chip 20 and a flow-inducing section 40 provided in vicinity of the semiconductor chip 20 on the mounting interconnect substrate 10 and being capable of inducing a flow of the underfill resin 30 to the gap.

Abstract: The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

Abstract: A method of manufacturing an electronic component comprising an integrated circuit and a core, includes the steps of providing the integrated circuit having at least two accessible contacts, providing the core, assembling the integrated circuit and the core together by means of an adhesive substance, winding a wire on the core in order to produce a winding, bonding or soldering a first end of the wire to a first one of said contacts and bonding or soldering a second end of the wire to a second one of said contacts.

Abstract: In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump without severing the wire. This is then followed by a further set of coordinated xy motions to from the loop and bring the capillary over the second bond site (e.g., on the lead frame). The wire is then stitch bonded to the second bond site and the tail severed to complete the wire loop interconnect.

Abstract: An electrical device comprising an integrated circuit (IC) having an uppermost layer that includes landing pads that are distributed throughout one side of the IC.

Abstract: A pattern film in accordance with one aspect of the present invention includes a first film and a second film. A first pattern array is built in the first film. The second film is attached to the first film. Further, a second pattern array is built in the second film. The second pattern array is partially overlapped with the first pattern array. The first and the second pattern arrays may be electrically connected to each other by a pressurizing process. Thus, a time and a cost for manufacturing the pattern film may be reduced. As a result, a printed circuit board and a semiconductor package having the pattern film may also be manufactured at a low expense.

Abstract: In a semiconductor integrated circuit requiring a large number of pads, an internal circuit is arranged in the center portion, and a plurality of two kinds of I/O circuits for inputting and outputting signals from and to the outside and many pads are arranged along four sides of the semiconductor integrated circuit. The plurality of I/O circuits that are of one of the foregoing two kinds are one-pad I/O circuits on which one pad is arranged in a direction toward the internal circuit, whereas the plurality of I/O circuits that are of the other of the foregoing two kinds are two-pad I/O circuits on which two pads are arranged in zigzag relationship in a direction toward the internal circuit. The number of arranged pads equals to the number of pads required for the semiconductor integrated circuit. The one-pad I/O circuits and the two-pad I/O circuits are provided with power source wirings for supplying power thereto.

Abstract: Disclosed is an anionic diinitiator prepared using a diisopropenyl benzene compound and an organo lithium compound having primary polymerization sites. The anionic diinitiators are prepared by admixing a diisopropenyl benzene compound with diethyl ether, ethylene, an organo lithium compound, and a solvent under reaction conditions sufficient to prepare a diinitiator having primary lithium alkyl reactive sites. The diinitiators are particularly useful in preparing block copolymers.

Abstract: A humidifying fan includes a base, a water swinging device and a fan device. The base has a water tank for storing an appropriate amount of water or other liquids, and an atomized water hole. The water swinging device has a power element and a water swinging fan connected with a suction tube extending in the water tank and having slots in its inner wall and plural water exits. When water is sucked up to spray through the exits, it is dispersed by the swinging fan to get atomized. But, a large number of droplets without atomized are to attach on a fur comb set around the swinging fan and then drop in the water tank. The fan device consisting of blades and power element is to blow and spread the atomized water for cooling air.

Abstract: Method and apparatus are presented for the mass production manufacturing of planar mirrors inside transparent micro balls circumscribed by lubricated bearings for solar energy concentration and related applications such as optical switches, etc. These bearings permit rotational alignment of the balls with minimal friction. The preferred mass production process utilizes photolithography in an optical microlithographic photoresist process. The micro-balls are in the size range of ˜1 micron (1×10-6 m) to 1000 microns (1 mm). The micro-balls vary in geometry from spheres to cylinders to oblate ellipsoids to disks. The term “elements” is used to encompass all these shapes, which have one thing in common—a flat specularly reflecting mirrored surface.

Abstract: A manufacturing method of an optical member includes forming an optical film which has a first glass transition temperature and includes a pattern formed on a surface of the optical film, and an optical plate which has a second glass transition temperature that is lower than the first glass transition temperature, disposing the optical film and the optical plate adjacent each other so that the pattern faces the optical plate, pressurizing the optical film and the optical plate while heating the optical plate to the second glass transition temperature or higher, and forming the optical member by the pressurizing and the heating.

Abstract: The present invention provides a lithographic method for manufacturing molds, and mold inserts, for use in producing ophthalmic lenses. The invention may be used in a method for the delivery of customized ophthalmic lenses to a lens wearer.

Abstract: A method for producing a substrate assembly for a plasma display panel includes the steps of providing a laser beam absorbing substance on a projection in the surface of a dielectric layer covering electrodes on a substrate, the laser beam absorbing substance absorbing a laser beam more easily than a material of the dielectric layer; and irradiating the laser beam absorbing substance with the laser beam to fuse and flatten the projection by heat generated in the laser beam absorbing substance by the irradiation.

Abstract: A method of inserting a cured in-place pipe from a cleanout includes positioning a lining along a portion of a length of a bladder, wherein the lining is frangibly connected to the bladder, inserting the bladder through the cleanout, to a position wherein the lining is within the pipe and does not block the pipe.

Abstract: A method for reusing foamed material comprises the steps of: crumbling waste material into smaller pieces by blocks and by batches by using a crumbling machine; extruding the crumbling waste material block into a screw rod machine and forging the block so as to destroy the molecular structures of the waste material block; grinding the waste material block into waste material powders by a grinding machine so as to increasing total surface areas of the waste material; and activating the waste material powders by adding foaming material thereinto so that the waste material powders are reacted with the foaming material so as to form, as an active foaming material.

Abstract: A system and method for evaluating the structural integrity of an injection molding machine and/or a component thereof may comprise at least one sensor operatively connected to a component of the injection molding machine. The sensor may transmit a signal representative of the movement of the injection molding machine. A processor may convert this signal into a frequency domain signal and compare it against a frequency template. Changes to the structural integrity of the injection molding machine may result in changes to the system's frequency response spectrum such as, but not limited to, amplification of certain frequency peaks, amplitude variations, changes in the damping characteristics, the shifting of the fundamental mode (i.e., the first natural frequency), shifting of higher order modes (those above the fundamental mode), or the introduction of a new frequency mode of vibration that did not exist prior to the damage of the component.

Abstract: Active decompression to prevent melt drool from a mold (12, 14) or runner system (20) is achieved through the selective coupling and de-coupling of an injection piston (34) to a plunger (38). Following successive injection (FIG. 5a) and hold phases (FIG. 5b) of an injection molding process (FIG. 5), the runner and channel system is partially de-compressed (FIG. 5c) by drawing back together, over a short distance, the plunger (38) and the injection pressure (34) as one unit. The injection piston is then mechanically de-coupled from the plunger (FIG. 5e), with the injection piston (34) withdrawn to essentially its final shot position, but minus a customary packing distance (6). Plastic melt (100), extruded into a shooting pot (28) positioned in front of the plunger (38), is permitted to push the plunger backwards, but now with minimal work expenditure. When the plunger again contacts (FIG. 5f) the injection piston (34), melt pressure now causes both units to be moved back to reach a final shot size volume.

Abstract: The present invention provides a manufacturing method of a cross-linked foam, comprises processing foaming material for a foam body to have a certain shape with a cross-linked foaming suppressed and processing at least one foaming material for an outer skin to have a shape of a thin film with a cross-linked foaming suppressed, the foaming material for the outer skin including a pigment; disposing the foaming material for the outer skin and the foaming material for the foam body in a molding die, the foaming material for the outer skin disposed in an inner cavity of the molding die and then the foaming material for the foam body disposed on the foaming material for the outer skin for the foaming material for the outer skin to cover a surface of the foaming material for the foam body; and cross-linked foaming the disposed foaming material for the foam body and the outer skin, whereby an united foam covered with the outer skin having a wide variety of colors can be manufactured even without an additional attachm

Abstract: In a method for manufacturing slabs which are thin (10-30 mm) and broad, a cement mix comprising water, cement and a fluidizer is mixed with inert stone aggregrate having a controlled particle size. The resultant mix is deposited in a predetermined thickness onto a temporary support and subjected to vacuum vibrocompression. The slab thus formed is subjected to the steps of setting and hardening by means of curing, enclosing it between two thin sheets of plastic impermeable to water vapour which are hermetically sealed along their edges. The method envisages specific measures as regards the method of mixing performed during the steps of preparation of the cement mix and mixing of the cement paste with the stone aggregrate. Other improvements concern the components of the cement paste as well as the order of introduction of the aggregate during mixing with the latter.

Abstract: A method for making patterned products includes the steps of: a) providing a plurality of differently colored granular plastic materials in a predetermined ratio to prepare one batch of molding material; b) melting together the granular plastic materials in such a manner that different colors of the granular plastic materials are put together non-homogeneously; and c) molding the granular plastic materials that have been melted to form the patterned products. The patterned products formed from the one batch of the molding material are different in color and pattern.

Abstract: The invention provides, inter alia, a method for producing granules from a powder, characterized in that a low compaction force is applied to the powder to produce a compacted mass comprising a mixture of fine particles and granules and separating fine particles from the granules by entraining the fine particles in a gas stream. Also provided are apparatus for use in the process and tablets formed by compression of the resultant granules.

Abstract: A method for forming air-laid fibrous articles. The steps of the method can include providing a stream of loose air-entrained first fibers, providing a core pocket operatively related to the stream of loose air-entrained first fibers, the core pocket including a central foraminous forming surface and an edge foraminous forming surface, applying a negative pressure to one of the foraminous forming surfaces, applying a positive pressure to the other foraminous forming surface, depositing the first fibers on one of the foraminous forming surfaces, providing a stream of loose air-entrained second fibers, operatively relating the core pocket to the stream of loose air-entrained second fibers, applying a negative pressure to one of the foraminous forming surface, and depositing the second fibers on that foraminous forming surface.

Abstract: Disclosed are methods and systems for selective inhibition of sintering in 3D fabrication. The disclosure provides methods and systems that use selective heating arrangements to selectively sinter areas during fabrication thereby reducing waste improving efficiency.

Abstract: A method of making a bioplastic, and a bioplastic produced thereby, by using human plasma in which human plasma is clotted, either dried through its gel phase or dried and powdered, and processed into a bioplastic with the addition of at least one plasticizer followed by forming and heating to form a final bioplastic construct.

Abstract: A tool for the extrusion of films, having at least one coating, the at least one coating being at least partly a metal-nitride or transition metal nitride coating, or a combination thereof.

Abstract: A degreasing jig assembling apparatus includes a robot arm and a table or a conveyor on which a degreasing jig including a bottom plate and a cover member is placed. A ceramic molded body is mounted on the degreasing jig upon degreasing the ceramic molded body. The ceramic molded body is mounted on the degreasing jig on the table or the conveyor. The degreasing jig assembling apparatus further includes a molding body mounting mechanism and a cover member. The molding body mounting mechanism mounts the ceramic molded body at a predetermined position on the bottom plate placed on the table or the conveyor by using the robot arm. The cover member attaching mechanism attaches the cover member to the bottom plate in a manner so as to cover the ceramic molded body mounted on the bottom plate.

Abstract: A system and method are provided for forming thermoplastic material using rotary forging. A volume of a thermoplastic material is delivered. The thermoplastic material is transported between a first rotating forging device and a second rotating forging device. The first forging device defines a first forging region in its surface, which receives the thermoplastic material. The thermoplastic material is at or above a forging temperature and flows into the first void region and shapes a core element from the thermoplastic material. The thermoplastic material is substantially solidified into the core element. Then, the core element is transferred from the first rotating forging device.

Abstract: A grip cap for a container has a thermoplastic shell in an inverted cup shape with a top wall and a skirt bounded by a lower rim. An elastomeric layer is integrally molded to the cap shell along the outer surface of the top wall and the skirt as well as along the underside of the lower rim. This layer defines multiple spaced apart and raised vertical ribs joined by a pad at the top wall and a gasket extending along the lower rim. The ribs and the pad provide a cushion and the gasket can seal against a shoulder of the container when tightened. Also disclosed is a two-shot method of molding such a grip cap, including integral resilient material at the outer surfaces and the underside of the cap shell rim.

Abstract: An inventive solid state drawing die has shaping walls that define a shaping channel and that, in the course of solid state drawing, direct polymer composition along a drawing path. Each cross section of the drawing path (and, hence, polymer composition in the drawing path) is non-circular, substantially proportional to one another, contains a centroid that lies on a substantially straight line parallel to the drawing direction and all cross sectional dimensions are 1.5 millimeters or more.