Abstract: A memory device. There is a hall effect device, a current source in electrical communication with the hall effect device, a current drain in electrical communication with the hall effect device, a first sensor arm in electrical communication with the hall effect device and current drain, and a second sensor arm in electrical communication with the hall effect device and current drain. The second sensor arm has a higher resistance than the first sensor arm. There is a voltage measurement module in electrical communication with the current drain and configured to provide a signal based on the voltage in the current drain.

Abstract: An integrated circuit device, including first to Nth circuit blocks CB1 to CBN disposed along a first direction D1, when the first direction D1 is a direction from a first side of the integrated circuit device toward a third side which is opposite to the first side, the first side being a short side, and when a second direction D2 is a direction from a second side of the integrated circuit device toward a fourth side which is opposite to the second side, the second side being a long side. The circuit blocks CB1 to CBN include at least one memory block MB which stores image data, and at least one data driver block DB which drives data lines; and the memory block MB includes a memory cell array, a row address decoder RD, and a sense amplifier block SAB.

Abstract: A clock-generating circuit for forming internal clock signals by comparing a signal obtained by delaying, through a variable delay circuit, an input clock signal input through an external terminal with the input clock signal through a phase comparator circuit, and so controlling the delay time of the variable delay circuit that they are brought into agreement with each other, wherein the clock-generating circuit and an internal circuit to be operated by the clock signals formed thereby are formed on a common semiconductor substrate, and an element-forming region in which the clock-generating circuit is formed is electrically isolated from an element-forming region in which the digital circuit is constituted on the semiconductor substrate relying upon the element-isolation technology. The power-source passages, too, are formed independently of other digital circuits.

Abstract: A memory module has a plurality of DRAMs (115), which share a bus line, on the front surface and the back surface of a board. The bus line is connected through a via hole (113) from a terminal (111) to one end of a strip line (112), and the other end of the strip line is connected to a strip line in the other layer through a via hole (119) provided for looping back the line. A termination resistor (120), provided near a termination voltage terminal (VTT), is connected to the looped-back strip line in the other layer through a via hole. The DRAM terminals are connected to the strip line each through a via hole. This memory module is mounted on a motherboard, on which a memory controller is provided, through a connector. The effective characteristic impedance of the bus line is matched with the characteristic impedance of the line in the motherboard.

Abstract: A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled to an address decoder and control logic, respectively. The address and control converters are operable to receive and convert optical address and control signals, respectively, into corresponding electrical address signals applied to the address decoder and control signals applied to the control logic. A read/write circuit on the substrate is coupled to a data converter formed in the substrate. The data converter is operable to receive and convert optical write data signals into corresponding electrical data signals to be applied to the read/write circuit and to receive and convert electrical read data signals into corresponding optical read data signals.

Abstract: A method for reading data stored in a multiple bit memory cell, the memory cell comprising a switch located within an array of switches arranged in columns and rows, each switch having a control node and first and second switched nodes between which the flow of current is dependent on the voltage applied to the control node, wherein each row has a word line connected to the control nodes of the switches of that row, each column comprises only one switch from each row, and each column has first, second and third bit lines connectable to one of the switched nodes of each switch of that column to define the stored data, the method comprising: fixing the voltage of the second bit line of the switch and reading data from the first and third bit lines, and subsequently: fixing the voltage of the first bit line of the switch and reading data from the second and third bit lines.

Abstract: A unit cell is formed by a ferroelectric capacitor and first MOS transistor, and a block is formed by connecting a plurality of unit cells in series. The gates of the first MOS transistors in the individual unit cells are connected to word lines, which are selectively driven by a word line driver on the basis of a row address signal. A plate line is connected to one terminal of the block, and driven by a plate line driver. A bit line is connected to the other terminal of the block via a second MOS transistor for block selection, and selected by a column decoder on the basis of a column address. A driver/controller controls the plate line driver and column decoder to apply a potential difference between the plate line and bit line, while a plurality of word lines are kept off.

Abstract: In the present invention, one-time programmable memory includes a diode as an access device and a capacitor as a storage device, the diode includes four terminals, wherein the first terminal is connected to a word line, the second terminal is connected to one plate of the capacitor, the third terminal is floating, and the fourth terminal is connected to a bit line, and the capacitor includes two electrodes, wherein one of the capacitor plate serves as a storage node which is connected to the second terminal of the diode, and another plate of the capacitor is connected to a plate line, and the plate line is asserted to programming voltage which is higher than the regular supply voltage of the decoders and data latches, in order to breakdown the insulator of the capacitor when programming, but the plate line is connected to the regular supply voltage when read.

Abstract: In a semiconductor storage device with cross point type arrays of memory cells including variable resistor elements, a selected data line and unselected data lines are supplied with a row selecting potential and a row unselecting potential through a data line selecting transistor respectively, a selected bit line and unselected bit lines are supplied with a column selecting potential and a column unselecting potential through a bit line selecting transistor respectively. Data lines and bit lines are separately driven so that when the data line selecting transistor is higher in the current driving capability than the bit line selecting transistor, a second bias voltage between the row unselecting potential and column selecting potential is lower than a first bias voltage between the row selecting potential and column unselecting potential, in the opposite case, the first bias voltage is lower than the second voltage.

Abstract: An architecture, and its method of formation and operation, containing a high density memory array of semi-volatile or non-volatile memory elements, including, but not limited to, programmable conductive access memory elements. The architecture in one exemplary embodiment has a pair of semi-volatile or non-volatile memory elements which selectively share a bit line through respective first electrodes and access transistors controlled by respective word lines. The memory elements each have a respective second electrode coupled thereto which in cooperation with the bit line access transistors and first electrode, serves to apply read, write and erase signals to the memory element.

Abstract: In case that data are written in a flip-flop circuit by inverting the voltage to be supplied to a pair of write bit lines, the peak of the current waveform flowing in the pair of write bit lines is to be made gentler, whereby reduced power source noise and low power consumption should be achieved. To this end in a semiconductor device wherein flip-flop circuit for holding data, a memory cell including a transfer gate, a pair of write bit lines for writing data in the memory cell, are provided, in case that data are written in the flip-flop circuit by inverting the voltage to be supplied to the pair of write bit lines, the slew rate of the voltage to be supplied to the pair of write bit lines is made equal to predetermined value or less.

Abstract: A memory device has an information plane (32) for storing data bits in a magnetic state of an electro-magnetic material at an array of bit locations (31). The device further has an array of electro-magnetic sensor elements (51) that are aligned with the bit locations. The information plane (32) is programmable or programmed via a separate magnetic writing device (21). In particular a read-only sensor element (60) is described for a read-only magnetic memory.

Abstract: A design for a memory array that uses bi-directional write currents and that avoids switched ground connections for memory cells, thereby reducing signal loss and noise problems is described. Positive and negative current sources are provided to supply the bi-directional current that is used to write to a memory cell. These current sources may be selectively connected to bit lines that are electrically connected to the memory cells. Applying a positive current, from the positive current source, through a memory cell writes a “1”, and applying a negative current, from the negative current source, through a memory cell writes a “0”. Use of both a positive and a negative current source enables writing to the memory cells without relying on a switched ground connection to provide bi-directional current. This permits a ground connection of each memory cell to be connected to a fixed ground. An example in which this design is used with a spin injection magneto-resistive random access memory (MRAM) device is shown.

Abstract: An MRAM circuit includes an MRAM array having a plurality of operational MRAM elements and a reference cell made up of one or more reference MRAM elements. A plurality of program lines within a first region are cladded with a flux-concentrating layer configured to focus a generated magnetic field while the portions of the program lines within a second region are uncladded so that the generated magnetic field is unfocused. Generally, the first region is associated with the operational MRAM elements and the second region is associated with the reference cell.

Abstract: A system and method for writing to a magnetic memory written in a thermally assisted manner, each memory point formed by a magnetic tunnel junction, and having a substantially circular cross-section of the memory which is parallel to the plane of the layers forming the tunnel junction. The tunnel junction includes at least a trapped layer with a fixed magnetisation direction, a free layer with a variable magnetisation direction with an insulating layer arranged there between. The free layer is formed from at least one soft magnetic layer and a trapped layer, with the two layers being magnetically coupled by contact. During read operations and at rest, the operating temperature of the memory is lower than the blocking temperature of the free and trapped layers, respectively.

Abstract: A programmable phase change material (PCM) structure includes a heater element formed at a transistor gate level of a semiconductor device, the heater element further including a pair of electrodes connected by a thin wire structure with respect to the electrodes, the heater element configured to receive programming current passed therethrough, a layer of phase change material disposed on top of a portion of the thin wire structure, and sensing circuitry configured to sense the resistance of the phase change material.

Abstract: A semiconductor integrated circuit device has a first memory cell group including a plurality of rewritable nonvolatile memory cells arranged on a semiconductor chip and a second memory cell group including a plurality of rewritable nonvolatile memory cells arranged on the semiconductor chip. Setting of the write threshold voltage of the memory cell of the first memory cell group and setting of the write threshold voltage of the memory cell of the second memory cell group are variable.

Abstract: A nonvolatile semiconductor memory device comprises a memory array of 3-level nonvolatile memory cells. The memory array comprises first even and odd strings of memory cells connected to respective first even and odd bit lines and second even and odd strings of memory cells connected to respective second even and odd bit lines. The first even and odd bit lines are selectively connected to a first common bit line during data programming and read operations, and the second even and odd bit lines are selectively connected to a second common bit line during data programming and read operations. The device programs and reads data in a pair of memory cells using three bits of data corresponding to three threshold voltage distributions of the 3-level nonvolatile memory cells.

Abstract: An apparatus, system, method, and article for protecting nonvolatile memory from viruses are described. The apparatus may include a nonvolatile memory comprising one or more protected storage areas. The nonvolatile memory may be arranged to transform buffered information to be programmed in the protected areas and to program transformed information in the protected storage areas. Other embodiments are described and claimed.

Abstract: Memory transistors are arranged in a plurality of rows and columns. A first source/drain terminal of each memory transistor of a first column is connected to an electrically conductive conductor track in a first metallization plane, and a first source/drain terminal of each memory transistor of a second column adjacent to the first column is connected to an electrically conductive conductor track in a second metallization plane.

Abstract: A memory cell that has both a DRAM cell and a non-volatile memory cell. The non-volatile memory cell might include a flash memory or an NROM cell. The memory cell is comprised of a vertical floating body transistor with dual gates, one on either side of a vertical pillar of a substrate. One gate is a polysilicon gate and gate insulator that is adjacent to the floating body of the transistor and acts as a DRAM cell. The non-volatile memory cell is constructed on the other side of the pillar with a floating gate or NROM structure. The DRAM and non-volatile cells are linked by a drain region coupling the two cells to a memory array bitline. The bottom of trenches on either side of the pillar have source regions that are linked to respective source lines of the memory array.

Abstract: A memory cell array has a structure in which a plurality of memory cells connected with word lines and bit lines and connected in series are arranged in a matrix form. A selection transistor selects the word lines. A control circuit controls potentials of the word lines and the bit lines in accordance with input data, and controls write, read and erase operations of data with respect to the memory cell. The selection transistor is formed on a well, and a first negative voltage is supplied to a well, a first voltage (the first voltage?the first negative voltage) is supplied to a selected word line and a second voltage is supplied to a non-selected word line in the read operation.

Abstract: A semiconductor integrated circuit device includes first to third memory cell units, first and second bit lines, and first and second source lines. The first to third memory cell units include memory cell transistors serially connected between selection transistors. The first bit line is commonly connected to one end of the current path of the first memory cell unit and one end of the current path of the second memory cell unit. The second bit line is connected to one end of the current path of the third memory cell unit. The first source line is connected to the other end of the current path of the first memory cell unit. The second source line is commonly connected to the other end of the current path of the second memory cell unit and the other end of the current path of the third memory cell unit.

Abstract: A semiconductor integrated circuit device includes a semiconductor substrate, an element isolation region, a first interconnection, a second interconnection, and a memory cell unit connected between a corresponding one of the first interconnection and a second interconnection. The memory cell unit includes two selection transistors and memory cell transistors of not larger than two. The memory cell transistors are connected between the two selection transistors. The memory cell transistor has a charge storage layer whose side surface lies in the same plane or in substantially the same plane as the side surface of the element isolation regions.

Abstract: Boosting signals are applied to unselected word lines for a set of NAND strings while a program voltage signal is applied to a selected word line. For a selected NAND string, in a first interval, the drain select gate is opened so that the NAND string communicates with a respective bit line to discharge channel boosting in the NAND string. In a second interval, the drain select gate is closed so that the NAND string is cutoff from the bit line, and the bit line voltage is raised from the level which allows discharging to an inhibit level. In a third interval, the drain select gate is opened again, and the inhibit level of the bit line slows programming. This approach avoids raising the NAND string to a respective starting condition which is based on a source follower action of the drain select gate.

Abstract: Methods and apparatuses for programming a single-poly pFET-based nonvolatile memory cell bias the cell so that band-to-band tunneling (BTBT) is induced and electrons generated by the BTBT are injected onto a floating gate of the cell. Following a predetermined event, the single-poly pFET is biased to induce impact-ionized hot-electron injection (IHEI). The predetermined event may be, for example, the expiration of a predetermined time period or a determination that a channel has been formed by the BTBT injection process that is sufficiently conducting to support IHEI. Employing BTBT permits a previously overerased or stuck bit to be “unstuck” or “removed” and thus be made usable (i.e., able to be programmed) again.

Abstract: Methods and apparatuses for programming a single-poly pFET-based nonvolatile memory cell bias the cell so that band-to-band tunneling (BTBT) is induced and electrons generated by the BTBT are injected onto a floating gate of the cell. Following a predetermined event, the single-poly pFET is biased to induce impact-ionized hot-electron injection (IHEI). The predetermined event may be, for example, the expiration of a predetermined time period or a determination that a channel has been formed by the BTBT injection process that is sufficiently conducting to support IHEI. Employing BTBT permits a previously overerased or stuck bit to be “unstuck” or “removed” and thus be made usable (i.e., able to be programmed) again.

Abstract: A nonvolatile semiconductor memory device includes a memory cell array, read circuit, program circuit, read voltage generating circuit, memory circuit and switching circuit. The read voltage generating circuit generates and supplies a read voltage to the read circuit. The memory circuit stores information which changes the temperature characteristic of a memory cell in the memory cell array. The switching circuit changes the temperature dependency of read voltage generated from the read voltage generating circuit based on information stored in the memory circuit.

Abstract: The present invention is directed to largely reduce peak current at the time of operation of a boosting circuit provided for an EEPROM. In the erase/write operation, first, a low-frequency clock signal as a selection clock signal is input by a low-frequency clock control signal to a charge pump. After lapse of a certain period (about ? of fall time), a high-frequency clock signal having a frequency higher than that of the low-frequency clock signal is output by a high-frequency clock control signal and is input as the selection clock signal to the charge pump to boost a voltage to a predetermined voltage level. In such a manner, while suppressing the peak of consumption current, the fall time of the boosted voltage can be shortened.

Abstract: A non-volatile memory device that changes the programming step voltage between the source side of the array and the drain side of the array. After the initial programming pulse, a verify operation determines if the cell has been programmed. If the cell is still erased, the initial programming voltage is increased by the step voltage. The step voltage for the lowest word line near the source line is lower than the step voltage for the word line closest to the drain line.

Abstract: A nitride trapping memory device includes a comparator, a bias unit, a memory cell, a cycling cell, a compensation cell and a control unit. The comparator has a reference voltage. The bias unit is for outputting a bias voltage to the comparator, and the comparator outputs a bit value according to comparison of the bias voltage and the reference voltage. The memory cell is connected to the bias unit via a first switch. The cycling cell is connected to the bias unit via a second switch. The compensation cell is connected to the bias unit via a third switch. The control unit is for controlling the cycling cell and the compensation cell according to the bit value.

Abstract: A sub-decoder element provided corresponding to each word line is constructed by the same conductive type MOS transistors. The sub-decoder elements are arranged in a plurality of columns such that the layout of active regions for forming the sub-decoder elements is inverted in a Y direction and displaced by one sub-decoder element in an X direction. The arrangement of the sub-decoder elements is adjusted such that high voltage is not applied to both of gate electrodes adjacent in the Y direction. A well voltage of a well region for forming the sub-decoder element group is set to a voltage level such that a source to substrate of the transistor of the sub-decoder element is set into a deep reversed-bias state. In a nonvolatile semiconductor memory device, the leakage by a parasitic MOS in a sub-decoder circuit or word line driving circuit to which a positive or negative high voltage is supplied, can be suppressed.

Abstract: A circuit arrangement for the defined discharge of a capacitive load includes a first connecting terminal for connection of the load, a second connecting terminal for application of a predetermined potential, and a third connecting terminal for application of a discharge signal. The circuit arrangement further includes a first switching element, having a load path and a control connection, the load path of which is connected between the first and second connecting terminals and a second switching element, having a load path and a control connection, the load path of which is connected between the first connecting terminal and a terminal for reference potential. The first switching element is driven in a manner dependent on a switching state of the second switching element. The second switching element is driven by a drive circuit to which the discharge signal is fed and which includes a comparator arrangement.

Abstract: A method of operating a non-volatile memory comprising a substrate, a gate, a charge-trapping layer, a source region and a drain region is provided. The charge-trapping layer close to the source region is an auxiliary charge region and the charge-trapping layer close to the drain region is a data storage region. Before prosecuting the operation, electrons have been injected into the auxiliary charge region. When prosecuting the programming operation, a first voltage is applied to the gate, a second voltage is applied to the source region, a third voltage is applied to the drain region and a fourth voltage is applied to the substrate. The first voltage is bigger than the fourth voltage, the third voltage is bigger than the second voltage, and the second voltage is bigger than the fourth voltage to initiate a channel initiated secondary hot electron injection to inject electrons into the data storage region.

Abstract: A method is provided for operating an electrical writable and erasable memory cell, which has a channel region that can be operated in a first and a second direction, wherein information is stored as the difference of an effective parameter.

Abstract: A drive circuit 22 controls voltages applied to a substrate 1, selection gates SG0 and SG1, a local bit line LB2, and a control gate CGn. By respectively applying a negative voltage to the control gate CGn, a positive voltage to the selection gate SG0, a voltage lower than the voltage applied to the selection gate SG0 to the selection gate SG1, and a positive voltage to the local bit line LB2, the drive circuit 22 controls so that electrons are selectively drawn out of a floating gate FG3 to the local bit line LB2 by F-N tunneling during writing operation. Sufficient operation margin is obtained even when memory cells are miniaturized.

Abstract: A data input circuit of a semiconductor memory device and a data input operating method thereof, in which data input margin can be secured.

Abstract: A sense mechanism for data bus inversion including a first memory device and an analog adder. The first memory device stores bits of the bus in a previous bus cycle. The analog adder compares the bits of the bus in the previous bus cycle with bits of the bus in a current bus cycle and provides a data inversion signal indicative of whether more than half of the bits of the bus have changed state. The analog adder operates as a bus state change sense device which rapidly evaluates bus state changes from one bus cycle to the next. The data inversion signal is used for selectively inverting the data bits of the bus and indicating bus inversion according to data bus inversion operation, such as according to X86 microprocessor protocol.

Abstract: A memory capable of inhibiting a non-selected cell from disturbance is provided. This memory comprises a bit line, a word line arranged to intersect with the bit line and first storage means connected between the bit line and the word line, for applying voltages of opposite directions to the first storage means of a non-selected memory cell by the same number of times or substantially applying no voltages throughout a read operation and a rewrite operation while varying a rewriting method with a case of reading first data by the read operation and with a case of reading second data by the read operation.

Abstract: A data arrangement control signal generation circuit for use in a semiconductor memory device includes a plurality of data arrangement control signal generation units connected in series, each for selectively generating a data arrangement control signal according to a column address strobe (CAS) latency.

Abstract: A semiconductor memory arrangement for operation in a data memory system with at least one semiconductor memory chip for the storage of user data includes a memory controller for control of the at least one semiconductor memory chip, and at least one unidirectional signal line bus for control and address signals connected with the memory controller and branching at least once. The at least once branching bus directly connecting at least one semiconductor memory chip with the memory controller and connecting the semiconductor memory chips among each other.

Abstract: A semiconductor memory device (M) includes a memory array (MA) having a plurality of memory cells, a redundancy array (RA) having a plurality of memory cells, a non-volatile redundancy information memory (NVR) having a plurality of memory cells for storing redundancy information, and a redundancy control unit (RU) for selecting either memory cells in the memory array (MA) or memory cells in the redundancy array (RA). In one example, the non-volatile redundancy information memory (NVR) is connected directly to the redundancy control unit (RU) by means of at least one sense amplifier (SA).

Abstract: When a redundancy circuit is fully used and a further defect is present, an irreparable-state signal is produced. When the irreparable-state signal is produced, a defect is judged. When the irreparable-state signal is not produced, upon testing for quality judgment, extraction of a defective memory cell, programming an address of the defective memory cell into a fuse, and confirmation about whether or not the address is properly programmed are carried out. Quality judgment is possible only by confirming address information of the written address as confirmation after programming into the electric fuse.

Abstract: In a memory module having a designated group of memory cells assigned to represent a logical portion of the memory structure, a memory redundancy circuit having a redundant group of memory cells; and a redundancy controller coupled with the designated group and the redundant group. The redundancy controller, which can include a redundancy decoder, assigns the redundant group to the logical portion of the memory structure in response to a preselected memory group condition, e.g., a “FAILED” memory group condition. The redundancy controller also can include selectable switches, for example, fuses, which can encode the preselected memory group condition. The designated group of memory cells and the redundant group of memory cells can be a memory row, a memory column, a preselected portion of a memory module, a selectable portion of a memory module, a memory module, or a combination thereof.

Abstract: The present invention relates to a system and method for applying a stress to a hierarchical memory structure in parallel, testing the memory structure for weak defects. The present invention includes writing a logic 0 into all the memory cells in a memory structure. All the high address predecoded lines and alternating predecoded lines for the lowest address are enabled. A voltage drop between neighboring wordlines and bitlines is affected. A logic I is written into all the memory cells in the memory structure. An opposite voltage polarity is caused on the bitlines due to the logic 1 in the memory cells. A reverse voltage polarity stress is achieved on the wordlines by flipping the state of the lowest predecoded line (i.e., by changing the input address corresponding to that line.

Abstract: A method of testing, polling and trimming memory pages in different memory banks simultaneously is presented, using a cache memory located in each one of the memory banks. The cache memory is at least as large as the individual memory pages and is used to record the programming voltage required to obtain the specified programming speed as well as the location of defective memory elements. A local on chip state machine may be used to accelerate the programming rate, and there may be a state machine per memory bank. With such an arrangement, the amount of testing time at wafer probe and final packaged device test may be reduced up to 40%, depending upon the number of memory pages tested in parallel.

Abstract: An apparatus and method for transferring a signal from a first bus circuit to a second bus circuit. The apparatus and method includes a first constant current circuit connected to the first bus circuit, a first capacitor connected between the first bus circuit and the first constant current circuit, a second constant current circuit connected to the second bus circuit, a second capacitor connected between the second bus circuit and the second constant current circuit, and an opto-coupler connected between the first and second constant current circuits and providing signal transfer control from the first capacitor to the second capacitor.

Abstract: A semiconductor storage device comprises information memory cells into which data can be written or from which data can be read; a memory cell array including the information memory cells arranged in a matrix; information word lines connected to the information memory cells in rows of the memory cell array; information bit lines connected to the information memory cells in columns of the memory cell array; a reference memory cell storing a single kind of digital data to generate a reference potential used to discriminate data stored in the information memory cells; a reference bit line connected to the reference memory cell; and sense amplifiers connected to the information bit lines and the reference bit line.

Abstract: A fuse peripheral circuit shown in FIG. 2 has a fuse 10, a potential difference imparting circuit 20, a potential difference reducing circuit 30, a terminal 40, a memory circuit 50, a transfer gate 60, and a logic gate 70. The potential difference imparting circuit 20 is configured as having a transfer gate 22 (first transfer gate), a terminal 24 (first terminal) and a terminal 26, so as to give a predetermined potential difference between both ends of the fuse 10 when disconnection of the fuse 10 is judged. The potential difference reducing circuit 30 is configured as having a transfer gate 32 (second transfer gate), a terminal 34 (second terminal) and a terminal 36, and reduces the potential difference between both ends of the fuse 10 applied by the above-described potential difference imparting circuit 20.

Abstract: A DLL Reset signal for delivering Fuse data from anti-fuses is generated from a reset signal which is supplied asynchronous to a clock when an initial setting is made. The DLL Reset signal is supplied to an anti-fuse block which comprises a plurality of anti-fuses, such that the delay amount of an internal signal is switched to a desired value in accordance with the Fuse data written into the anti-fuses.