Abstract: An integrated circuit structure includes a semiconductor chip, which includes a corner, a side, and a center. The semiconductor chip further includes a plurality of bump pad structures distributed on a major surface of a substrate; a first region of the substrate having formed thereon a first bump pad structure having a first number of supporting metal pads associated with it; and a second region of the substrate having formed thereon a second bump structure having a second number of supported metal pads associated with it, the second number being greater than the first number.

Abstract: An integrated circuit structure includes a semiconductor substrate; a first titanium layer over the semiconductor substrate, wherein the first titanium layer has a first thickness less than 130 ?; a first titanium nitride layer over and contacting the first titanium layer; and an aluminum-containing layer over and contacting the first titanium nitride layer.

Abstract: An electronic structure may include a conductive pad on a substrate, and an insulating layer on the substrate and on the conductive pad. The insulating layer may have a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer. A conductive layer comprising copper may be on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, and the conductive layer comprising copper may have a thickness of at least approximately 1.0 ?m. A conductive barrier layer may be on the conductive layer comprising copper, and the conductive barrier layer may include at least one of nickel, platinum, palladium, and/or combinations thereof.

Abstract: A contact metallurgy structure comprising a patterned dielectric layer having vias on a substrate; a silicide layer of cobalt and/or nickel located at the bottom of vias; a contact layer comprising Ti located in vias on top of the silicide layer; a diffusion layer located in vias and on top of the contact layer; a metal fill layer in vias is provided along with a method of fabrication. The metal fill layer comprises at least one member selected from the group consisting of copper, ruthenium, rhodium platinum, palladium, iridium, rhenium, tungsten, gold, silver and osmium and alloys thereof. When the metal fill layer comprises rhodium, the diffusion layer is not required. Optionally a seed layer for the metal fill layer can be employed.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a dielectric layer, a pad structure and a protection structure. The dielectric layer is disposed on the substrate. The pad structure is disposed in the dielectric layer. The pad structure includes a plurality of first metal layers and a plurality of plugs which are electrically connected to each other vertically. There is no contact plug disposed between the pad structure and the substrate. The protection structure is disposed in the dielectric layer and encompasses the pad structure.

Abstract: A semiconductor device includes a semiconductor chip and a package substrate on which the semiconductor chip is mounted. The package substrate has internal terminals connected to the semiconductor chip, front surface wirings connected to the internal terminals, rear surface wirings connected to external electrodes, and contacts connecting the front surface wiring and rear surface wiring. Out of the plurality of contact, some contacts included in the wirings for signal transmission are disposed near the internal terminals. Thus, a signal led out from the semiconductor chip is immediately taken away from the chip mounting surface of the package substrate. This reduces the floating capacitance between the wirings on the package substrate and chip, thereby improving the signal quality.

Abstract: A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package.

Abstract: A three-dimensional 3D interconnect structure with a small footprint is described, useful for connection from above to levels of circuit structures in a multi-level device. Also, an efficient and low cost method for manufacturing the 3D interconnect structure is provided.

Abstract: A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.

Abstract: A semiconductor device with a transistor region has a first conductor pattern formed within a multilayer interconnect structure positioned under a signal line and above the transistor region. The first conductor pattern is coupled to ground or a power supply and overlaps the transistor region. The signal line overlaps the first conductor pattern.

Abstract: A semiconductor device includes a substrate, at least one via hole provided on the substrate, a through silicon via provided in the at least one via hole, and an interface chip that is electrically connected to the core chips through the through silicon via. The via hole includes a bowing shaped portion in which a diameter of a center portion is larger than diameters of both edges.

Abstract: A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.

Abstract: Packaged semiconductor assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One embodiment of a packaged semiconductor assembly includes a support member having a first bond-site and a die carried by the support member having a second bond-site. An interconnect structure is connected between the first and second bond-sites and includes a wire that is coupled to at least one of the first and second bond-sites. The interconnect structure also includes a third bond-site coupled to the wire between the first and second bond-sites.

Abstract: Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.

Abstract: One interface chip and a plurality of core chips are stacked, and these semiconductor chips are electrically connected to each other via a plurality of through silicon vias. A data signal output from a driver circuit is input into the core chip via one of the through silicon vias. An output selection circuit selects any one of the through silicon vias by activating a corresponding one of a plurality of tri-state inverters. When an inverter is activated, a primary selection circuit causes a test signal to be supplied to a receiver circuit from a test pad. When the inverter is inactivated, a data signal from any one of the through silicon vias is supplied to the receiver circuit.

Abstract: In a stacking semiconductor device in which a first-layer and a second-layer semiconductor devices are stacked and bonded with a solder, warpage occurs due to a difference in thermal expansion coefficient of constituent members or a difference in elastic modulus of individual members. Therefore, between the first-layer and the second-layer semiconductor devices are provided an external connection terminal of solder and a thermosetting resin, and the stacking semiconductor device is heated at 150 to 180° C., which are the temperatures of preheating for reflow of the solder, for 30 to 90 seconds. Thereby the warpage of the first-layer semiconductor device is reduced and the thermosetting resin is cured completely in this state. Then, the temperature is raised to a reflow temperature of the solder and solder bonding using the external connection terminal is performed. Thereby, the bonding reliability of a solder-bonded portion of the stacking semiconductor device is considerably improved.

Abstract: The present invention discloses a device in flip chip architecture. The device comprises at least two integrated circuits, which are interconnected by a passive device. The integrated circuits are mounted on a base ground plate, and are each connected to the passive device via conductive elements. For the interconnection of the integrated circuits with the passive device, the device employs the structure of an inverted microstrip line, a suspended microstrip line, a covered microstrip line or a conventional microstrip line. Depending on the interconnection scheme, low transmission loss, low susceptibility to external interferences, easy alignment properties in the assembly process, a compact package size, a high reproducibility and/or low cost can be achieved.

Abstract: A system and method are disclosed for preventing metal corrosion on bond pads. During manufacture of an integrated circuit device an anti-reflective coating (ARC) layer is applied to a metal stack of a bond pad. A mask and etch process is applied to etch an aperture through the ARC layer down to the metal stack. Then a passivation layer is applied to cover the ARC layer and the aperture through the ARC layer. Then another mask and etch process is applied to etch a bond pad opening through the passivation layer inside the ARC layer aperture down to the metal stack. Interior edge portions of the passivation layer seal the interior edge portions of the ARC layer aperture to prevent corrosion of the ARC layer due to high temperatures, high humidity and corrosive materials encountered in subsequent assembly operations of the integrated circuit device.

Abstract: An object of the present invention is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, comprising at least an epoxy resin and a phenol resin as a thermosetting component, wherein the ratio of the number of moles of epoxy groups to the number of moles of phenolic hydroxyl groups in the thermosetting component is in a range of 1.5 to 6.

Abstract: A semiconductor element mounting board includes: a board having surfaces; a semiconductor element provided at a side of one of the surfaces of the board; a bonding agent layer through which the board and the semiconductor element are bonded together, the bonding agent layer having a storage modulus at 25° C. of 5 to 1,000 MPa; a first layer into which the semiconductor element is embedded, the first layer provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer.

Abstract: A wiring substrate for a semiconductor chip includes a substrate, first and second wiring layers and a plurality of first and second bonding pads. The substrate has a first surface and a second surface opposite to the first surface, a window extending from the first surface to the second surface to expose chip pads of a semiconductor chip adherable to the first surface. The first and second wiring layers of a multi-layered structure are sequentially formed on the second surface of the substrate with at least one insulation layer interposed between the first and second wiring layers. A plurality of the first and second bonding pads are respectively connected to the first and second wiring layers, the first and second bonding pads having a concavo-convex arrangement on the second surface of the substrate along a side of the window.

Abstract: A semiconductor die has a polyimide layer disposed on its top surface. At the corners of the die top, the polyimide layer is roughened or patterned, but not enough such that the die top is exposed. The patterned corners enhance adhesion of a mold compound later disposed on the die top by allowing for enhanced hydrogen bonding between the polyimide layer and the mold compound.

Abstract: A solution for indexing electronic devices includes corresponding electronic device including a die integrating an electronic circuit, the die having at least one index including a reference defining an ordered alignment of a plurality of locations on the die and a marker for defining a value of the index according to an arrangement of the marker with respect to the reference. In one embodiment, the marker includes a plurality of markers each one arranged at a selected one of the locations, the selected location of the marker defining a value of a digit associated with a corresponding power of a base higher than 2 within a number in a positional notation in the base representing the value of the index.

Abstract: An object thereof is to provide a thermosetting die-bonding film that is capable of preventing warping of an adherend by suppressing curing contraction of the film after die bonding, and a dicing die-bonding film. The present invention relates to a thermosetting die-bonding film for adhering and fixing a semiconductor element onto an adherend, wherein the gel fraction in an organic component after thermal curing is performed by a heat treatment at 120° C. for 1 hour is 20% by weight or less, and the gel fraction in the organic component after thermal curing is performed by a heat treatment at 175° C. for 1 hour is in a range of 10 to 30% by weight.

Abstract: An air cleaning humidifier having a disc assembly performing a purifying function and a humidifying function of indoor air, and a disc assembly thereof. The air cleaning humidifier includes a main body, a tub provided in the main body, an air blower fan to generate an air current in the tub, and a disc assembly rotated under the condition that a part of the disc assembly is disposed in the tub. The disc assembly includes a disc member provided with assembly parts formed by cutting parts of the disc member, at least one plate member disposed at one side of the disc member, and at least one fixing member formed on at least one plate member to fix the assembly parts, and each of the at least one fixing member includes a protrusion part respectively inserted into the assembly parts, and a water storage part.

Abstract: Disclosed herein is an air cleaning humidifier having a disc assembly performing a purifying function and a humidifying function of indoor air, and a disc assembly thereof. The air cleaning humidifier includes a main body, a tub provided in the main body, an air blower fan generating an air current in the tub, and a rotatable disc assembly having a part of the disc assembly being disposed in the tub, and including a plurality of stacked discs, each of at least two of the discs including a body, a plurality of assembly parts defined through a surface of the body, first protrusion parts protruded from one surface of the body, and second protrusion parts protruded from the other surface of the body, the body being divided into a plurality of sectors by the plurality of assembly parts, and the first protrusion parts and the second protrusion parts being alternately formed in even-numbered regions, into which each of the plurality of sectors is divided.

Abstract: A system for mixing and mixing processes and structures are disclosed. In addition a nozzle used for mixing is disclosed.

Abstract: Systems and methods for imprinting and aligning an imprint lithography template with a field on a substrate are described. The field of the substrate may include an elongated side, and alignment sensitivity on the elongated side may be intentionally minimized.

Abstract: Described herein is a machine (1) for shredding portions (30) of bituminous material in the solid state into recyclable granules (31) of small dimensions comprising a shredding unit (5), which in turn comprises a perforated tubular body (6), and a pressing member (7) for pushing the portions (30) into the perforated tubular body (6) in such a way as to force the bituminous material by compression to come out through the holes of the perforated tubular body (6) so as to obtain a plurality of substantially filiform extruded portions (33) of the bituminous material, and a cutting member (8) for cutting the extruded portions (33) coming out of the holes of the perforated tubular body (6) in such a way as to obtain the granules (31) of small dimensions.

Abstract: An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content of 25-45 wt. % and an imidation ratio of 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C.

Abstract: An apparatus and method for manufacturing a down hole tool that reduces manufacturing costs and enhances the tool's performance. A belted mold assembly includes a casting assembly, a belt assembly, and a mid-belt. The belted mold assembly is used to fabricate a casting that allows for a larger diameter blank to be used which displaces the more expensive casting material and for using a smaller outer diameter thin-walled mold. The casting assembly is disposed within the belt assembly and the mid-belt is loaded in the volume created between the casting assembly's outer surface and the belt assembly's inner surface. The mid-belt provides a bracing for the casting assembly during the casting process. Optionally, a cap can be disposed on top of the blank for preventing metallurgical bonds from forming between the binder material and the upper portion of the blank. This allows for the excess binder material to remain high in purity so that it can be reprocessed.

Abstract: Compositions and methods are disclosed for imparting ultraphobicity to substrates. Ultraphobicity can be exhibited by superhydrophobicity, oleophobicity, or both. In some instances, techniques for imparting ultraphobicity can include the use of particles that are appropriately configured. For instance, the particles can be arranged to form a roughened surface that enhances and/or imparts ultraphobicity. In another instance, the particles can have surfaces that repel at least one of a oil-based liquid and a water-based liquid. For example, the particles can be attached to an ultraphobic-inducing composition (e.g., copolymer) that comprises at least one polyamine segment and a plurality of branch segments. Such particles can be mixed with a binder composition to form a coating or film for imparting the ultraphobic properties. Other embodiments are directed to other techniques that can also aid in imparting ultraphobicity.

Abstract: Multi-layered golf balls having an inner core, at least one intermediate layer, and outer cover are provided. The outer cover is made from am ultra-low melt index (ULMI) thermoplastic material using an in-molding coating process that involves applying a thin layer of the material to the interior surface of the cover mold members. Preferably, the ultra-low melt index material is a highly neutralized ionomer ethylene-based copolymer. The cover layers made from these highly neutralized polymers (HNPs) are thin and uniform and provide the golf ball with good playing performance properties. Yet, the cover layers also are tough and provide the golf ball with good impact durability.

Abstract: The present invention provides an imprint apparatus including a mold and a stage that holds a substrate, the imprint apparatus executing a curing process of curing a resin while the mold and the resin applied to the substrate contact and a demolding process of releasing the mold from the resin cured in the curing process, the imprint apparatus including a structure that holds the mold, a pillar that supports the structure mechanically independently from the stage through an anti-vibration mount that reduces propagation of vibration, and a force providing unit that provides, to the structure, force in an opposite direction from a direction of force generated in the structure by providing demolding force to the mold during the demolding process.

Abstract: To provide a mold for nanoimprinting capable of accurately transcribing a fine concavo-convex structure, available at a low cost and having high durability, its production process, and processes for producing a molded resin having a fine concavo-convex structure on its surface having the fine concavo-convex structure of the mold accurately transcribed, and a wire-grid polarizer, with high productivity. A mold 10 for nanoimprinting having on its mold surface a fine concavo-convex structure comprising a plurality of grooves 14 formed in parallel with one another at a constant pitch, which comprises a mold base 12 made of a resin having on its surface a fine concavo-convex structure to be the base of the fine concavo-convex structure, a metal oxide layer 16 covering the surface having the fine concavo-convex structure of the mold base 12, and a release layer 18 covering the surface of the metal oxide layer 16, is used.

Abstract: The present invention provides an automotive inner ceiling material difficult to deform at a high temperature. Sheath-core type conjugate polyester fibers are prepared. The sheath is a heat fusible component. The core is a non heat fusible component. The sheath is made of copolyester which comprises acid units made of terephthalic acid and diol unites made of ethylene glycol and 1,4-butanediol. The conjugate fibers and the main fibers of polyester are mixed and provided in a card machine to be opened and accumulated to obtain a fibrous web. The fibrous web is heated to melt the sheaths, which are thereafter solidified to bind the fibers to obtain a non woven fabric. The nonwoven fabric is heat-treated at a temperature equal to or higher than the melting point of the sheath. Immediately thereafter, the nonwoven fabric is heat-molded between a pair of a mold plates. During the heat-molding process, the inner temperature is maintained at 100˜130° C. for 60 seconds to obtain the ceiling material.

Abstract: A method of notching a brittle material includes forming a spot on a predetermined face of the brittle material by irradiating an area of the predetermined face with a light beam; and forming a notch in the brittle material by exfoliating a portion of the brittle material including the area from the brittle material by cooling a part of the brittle material including the area after the heating the brittle material, wherein a length of the area in an X direction of the predetermined face is smaller than a total length of the predetermined face in the X direction, and a length of the light beam spot in a Y direction of the predetermined face is equal to a total length of the predetermined face in the Y direction.

Abstract: Methods of making ultrahigh molecular weight polyethylene (UMWPE) having increased strength and/or wear resistance, such as high yield strength, high tensile strength, high load strength, and/or high impact strength. Some embodiments include making UHMWPE having increased strength and/or wear resistance, such as that listed above, where the UHMWPE has co-monomers.

Abstract: An apparatus and method of forming a stringer or an integral stringer and fuselage skin. The apparatus may be a solid bladder made of silicone, urethane, or any similar material or combination thereof. The method may comprise placing composite material onto a surface of a tooling having a channel sized and shaped to correspond to a desired stringer size and shape. Then the solid bladder may be placed onto the composite material relative the channel. The shape of the solid bladder may correspond to the shape of the channel. Composite material may then be placed over the solid bladder, vacuum-sealed against the bladder and the tooling, and cured to harden the composite material, thereby forming a stringer or an integral stringer and fuselage skin.

Abstract: The invention relates to inorganic intermetallic compounds having a PMR effect (combined GMR/CMR effect), which are characterized in that they contain at least two elements per formula unit and have a field sensitivity of less than 10% per 0.1 T at temperatures greater than 290 K. The invention also relates to composites consisting of these compounds, to a method for the production thereof and to their use, in particular, as magnetic field sensors or in the domain of spin electronics.

Abstract: Contoured molten metal filter cups having an interstitial flow space that is maintained between the inner-wall of a molten metal pouring cone, riser sleeve or mold and the outer wall of the filter cup are disclosed. The interstitial space provided by the contoured filter cups results in significantly increased molten metal throughput during casting operations, while simultaneously providing an increased level of filtering efficiency.

Abstract: A fixture (10) for supporting a workpiece (18) during a machining operation. The fixture comprising a base (12) provided with a channel (14) for receiving part (16) of the workpiece (18), the channel having a first wall (20) facing an opposing second wall (22). An inflatable diaphragm (24) is located on the first wall (20), and configured to engage with an engagement surface (36) on the workpiece and bias the workpiece against the second wall. The diaphragm comprises a deformable portion (26) spaced apart from the first wall of the channel, the deformable portion having ends (28,30) which provide a seal with the first wall to define a chamber (32) enclosed by the first wall and diaphragm.

Abstract: A tool for servicing a fuel dispensing nozzle, said tool comprising a substantially semicircular base plate with two uprights protruding from the top to receive a fuel pump nozzle therein; said base plate being formed to fit on the mouth of a bucket and substantially cover the mouth of said bucket, while leaving open a portion of the bucket; said base plate having on its bottom surface protruding guides to ensure a snug fit on the mouth of said bucket; so that a fuel dispensing nozzle may be easily secured for separation from a hose and residual fuel may be easily drained from said nozzle and said hose.

Abstract: A device (10) for finish-machining of optically effective surfaces of workpieces, in particular spectacle lenses (L, L?), is disclosed, comprising at least one workpiece spindle (30, 30?), to which a workpiece can be clamped, at least one tool spindle (28, 28?), which is movable relative to the workpiece spindle and at which a tool (46) for machining the workpiece can be mounted, and a loading system (22) for bringing a workpiece to and taking it away from the workpiece spindle and bringing a tool to and taking it away from the tool spindle. The loading system comprises a loading head (82), which is separate from workpiece spindle and tool spindle, with at least one loading section (102, 102?) equipped with at least one mount (106, 106?) for a workpiece and at least one mount (104, 104?) for a tool, so that both the tool and the workpiece can be loaded in a time-saving single loading process.

Abstract: An embodiment of a multiple axis positioner comprises a main headstock that has a main hollow bore. A main indexing table is attached to the main headstock. The main indexing table has a through-hole near the its center. The through-hole aligns or is substantially coaxial with the main hollow bore of the main headstock. The embodiment of the multiple axis positioner further includes at least three minor headstocks mounted to the main indexing table. The at least three minor headstocks have minor hollow bores.

Abstract: An improved adjustable work stop device for use in positioning work pieces which for machining purposes are clamped in a vice or other clamping means. The work stop comprises a laterally adjustable base, a flipper mount with flip arm movable in a vertical direction and lockable into desire position thereto, a flip arm with a positioner which is pivotably secured and rotates away from the work piece without scrubbing the work piece surface whereby clearance for machining, work or the like is accomplished on the butted side of the work piece.

Abstract: When a sheet is loaded to the sheet tray, the position of a trailing edge regulating section is set in response to the size of an insert sheet. Owing to this, the print sheet ejected from the ejection rollers onto the sheet tray falls onto the surface of the insert sheet. Further, when a booklet with an insert sheet placed therein is produced, an insert sheet is supplied to the sheet tray along the second conveying path. The shift amount of the execution position of center folding or the execution position of center stitching with respect to the sheet bundle is calculated in conformity to the finishing form of the booklet containing the insert sheet.

Abstract: A method and system for validating the completeness of a document collation includes obtaining information concerning a document having a first page and a last page, and processing the obtained information. The processed information is employed to apply a marking on the document that may be readable through an enclosure that visually obscures the marking. The marking may provide information regarding the completeness of the document collation within the enclosure. The processed information may be employed in a manner such that the applied marking includes a first page mark on the first page of the document collation and a last page mark in the last page of the document collation. The marks may be applied in respective predetermined zones on the first page and the last page. The first page zone and the last page zone may have a predetermined relationship for a document collation.

Abstract: Systems and methods are described that facilitate correcting for paper process direction arrival errors during a print job in a marker module of a print engine. Paper sheet arrival time is determined at a first registration point in a print engine or marker module thereof, and an average arrival time is compared to an expected arrival time to determine whether the pages are arriving on time, early, or late. The arrival time error is used to generate or look up a correction factor, which is added to an expected arrival time at a second registration point in the marker module or print engine to generate an updated expected arrival time. Print engine control parameters (e.g., sheet feeder timing, toner application, paper path speed, etc.) are adjusted according to the updated expected arrival time at the second registration point.

Abstract: An edge alignment control apparatus for correcting vertical alignment of sheet members is disclosed to include two base units each having multiple first power drives controllable to reciprocate a respective horizontal reciprocating member, and adjustment units arranged between the base units, each adjustment unit having two holder blocks connected to the horizontal reciprocating members of the base units at one same elevation and movable by the respective horizontal reciprocating members horizontally, sheet-transfer rollers pivotally connected between the holder blocks, a bearing board connected between the holder blocks for receiving a sheet member from the sheet-transfer rollers and a suction hood suspending above the bearing board and defining with the bearing board a passage for the passing of a sheet member and controllable to suck up a sheet member from the bearing board for allowing adjustment of the position of the sheet member horizontally subject to the operation of the first power drive.