Abstract: A nonvolatile semiconductor memory includes a cell unit having a select gate transistor and a memory cell connected in series, a select gate line connected to the select gate transistor, and a word line connected to the memory cell. One end of the word line is bent to the select gate line side, and a fringe is connected between a bent point and a distal end of the word line.

Abstract: Mechanisms of forming a bond pad structure are provided. The bond pad has a recess region, which is formed by an opening in the passivation layer underneath the bond pad. An upper passivation layer covers at least the recess region of the bond pad to reduce trapping of patterning and/or etching residues in the recess region. As a result, the likelihood of bond pad corrosion is reduced.

Abstract: The present disclosure relates to a dielectric solder barrier for a semiconductor die. In one embodiment, a semiconductor die includes a substrate, a semiconductor body on a first surface of the substrate, one or more first metallization layers on the semiconductor body opposite the substrate, a via that extends from a second surface of the substrate through the substrate and the semiconductor body to the one or more first metallization layers, and a second metallization layer on the second surface of the substrate and within the via. A portion of the second metallization layer within the via provides an electrical connection between the second metallization layer and the one or more first metallization layers. The semiconductor die further includes a dielectric solder barrier on the second metallization layer. Preferably, the dielectric solder barrier is on a surface of the portion of the second metallization layer within the via.

Abstract: A semiconductor device includes a stacked via structure including a plurality of first vias formed over a substrate, a first interconnect formed on the plurality of first vias, a plurality of second vias formed on the first interconnect, and a second interconnect formed on the plurality of second vias. One of the first vias closest to one end part of the first interconnect and one of the second vias closest to the one end part of the first interconnect at least partially overlap with each other as viewed in the plane, and the first interconnect has a first extension part extending from a position of an end of the first via toward the one end part of the first interconnect and having a length which is more than six times as long as a via width of the first via.

Abstract: A semiconductor device has a substrate with a plurality of conductive vias and conductive layer formed over the substrate. A semiconductor die is mounted over a carrier. The substrate is mounted to the semiconductor die opposite the carrier. An encapsulant is deposited between the substrate and carrier around the semiconductor die. A plurality of conductive TMVs is formed through the substrate and encapsulant. The conductive TMVs protrude from the encapsulant to aid with alignment of the interconnect structure. The conductive TMVs are electrically connected to the conductive layer and conductive vias. The carrier is removed and an interconnect structure is formed over a surface of the encapsulant and semiconductor die opposite the substrate. The interconnect structure is electrically connected to the conductive TMVs. A plurality of semiconductor devices can be stacked and electrically connected through the substrate, conductive TMVs, and interconnect structure.

Abstract: A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. A conductive micro via array is formed outside a footprint of the semiconductor die and over the semiconductor die and encapsulant. A first through-mold-hole (TMH) is formed including a step-through-hole structure through the encapsulant to expose the conductive micro via array. An insulating layer is formed over the semiconductor die and the encapsulant. A micro via array is formed through the insulating layer and outside the footprint of the semiconductor die. A conductive layer is formed over the insulating layer. A conductive ring is formed comprising the conductive micro via array. A second TMH is formed partially through the encapsulant to a recessed surface of the encapsulant. A third TMH is formed through the encapsulant and extending from the recessed surface of the encapsulant to the conductive micro via array.

Abstract: A thin film transistor element includes: a gate electrode; a source electrode and a drain electrode; an insulating layer; partition walls; and an organic semiconductor layer. The partition walls define a first aperture. Within the first aperture, at least a part of the source electrode and at least a part of the drain electrode are in contact with the semiconductor layer. In plan view of the bottom of the first aperture, the center of the total of the areas of the source electrode and the drain electrode is offset from the center of the area of the bottom in a given direction.

Abstract: A semiconductor device has a through electrode formed in a through hole which penetrates a Si substrate from one surface to the other surface of the Si substrate, wherein a rectangular electrode pad is provided on the other surface with an insulation film laid between the electrode pad and the other surface, an opening of the through hole on the one surface side is circular, an opening of the through hole on the other surface side is rectangular, and the area of the opening on the other surface side is made smaller than the area of the opening on the one surface side.

Abstract: A device for use with integrated circuits is provided. The device includes a substrate having a through-substrate via formed therethrough. Dielectric layers are formed over at least one side of the substrate and metallization layers are formed within the dielectric layers. A first metallization layer closest to the through-substrate via is larger than one or more overlying metallization layers. In an embodiment, a top metallization layer is larger than one or more underlying metallization layers. Integrated circuit dies may be attached to the substrate on either or both sides of the substrate, and either side of the substrate may be attached to another substrate, such as a printed circuit board, a high-density interconnect, a packaging substrate, an organic substrate, a laminate substrate, or the like.

Abstract: Methods of fabricating semiconductor structures incorporating tight pitch contacts aligned with active area features and of simultaneously fabricating self-aligned tight pitch contacts and conductive lines using various techniques for defining patterns having sublithographic dimensions. Semiconductor structures having tight pitch contacts aligned with active area features and, optionally, aligned conductive lines are also disclosed, as are semiconductor structures with tight pitch contact holes and aligned trenches for conductive lines.

Abstract: A mechanism for electrically coupling a semiconductor device die to a semiconductor device package substrate that avoids introduction of excessive temperature induced stresses to the semiconductor device die interconnect is provided. In one embodiment, the semiconductor device die is mechanically attached to the package substrate (or another semiconductor device die) at room temperature through the use of a plug-in socket or wedge connection having corresponding mating features formed on the die and substrate. The mechanical interconnect features can be formed on the die and substrate interconnects using an electroplating process. The surfaces of the semiconductor device die and package substrate can then be coupled using an underfill material. A low-temperature solid state bonding process can then be used to diffuse the materials forming the plug and socket features in order to form the electrical connection.

Abstract: The present invention relates to die-die stacking structure and the method for making the same. The die-die stacking structure comprises a top die having a bottom surface, a first insulation layer covering the bottom surface of the top die, a bottom die having a top surface, a second insulation layer covering the top surface of the bottom die, a plurality of connection members between the top die and the bottom die and a protection material between the first insulation layer and the second insulation layer. The plurality of connection members communicates the top die with the bottom die. The protection material bridges the plurality of connection members to form a mesh layout between the first insulation layer and the second insulation layer.

Abstract: A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; and forming a perimeter antiwarpage structure on and along a perimeter of the package carrier.

Abstract: A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer.

Abstract: A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.

Abstract: A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

Abstract: A semiconductor device includes a backing plate, a semiconductor wafer, and integrated devices. The semiconductor wafer includes a plurality of semiconductor die having edges oriented along a reference line, a front surface facing the backing plate, and a backside surface. The backside surface is formed opposite the front surface and includes linear grind marks oriented along the reference line and diagonal with respect to the edges of the plurality of semiconductor die. The linear grind marks are formed by a linear motion of an abrasive surface, such as by a cylinder or wheel having an abrasive surface, and in one embodiment are oriented at 45 degrees with respect to the reference line. The linear grind marks increase a strength of the plurality of semiconductor die to resist cracking. Integrated devices are formed on the front surface of the semiconductor wafer.

Abstract: An alignment mark includes a plurality of mark units. Each mark unit includes a first element and a plurality of second elements. Each second element includes opposite first and second end portions. The plurality of second elements are arranged along a direction. The first element extends adjacent to the first end portions of the plurality of second elements and parallel to the direction of the plurality of second elements.

Abstract: A system for generating electricity from the motion of a door is provided. In one embodiment, the system includes an AC or a DC generator acted upon by a flexible member coupled to at or near an edge of a door opposite a hinge. The sweep of the door causes the flexible member to impart rotary motion to the generator, thereby generating electricity.

Abstract: A system, in one embodiment, may include a static starter subsystem having detection logic for indicating a conductive state of a solid state semiconductor device. The detection logic includes a first logic gate having a first input that receives a first input signal indicating a state of the static starter subsystem, a second input that receives a second input signal indicating a state of a gate firing command being applied to the solid state semiconductor device, and a third input that receives a third input signal indicating whether the solid state semiconductor device is conducting. The first logic gate may be configured to evaluate the first, second, and third input signals and provide a first output signal indicating conductivity of the solid state semiconductor device in response to the gate firing command.

Abstract: A power generation system is provided. The power generation system including a power generation unit operable to supply electrical power to an utility system; a synchronous machine coupled to the utility system; a grid measurement device arranged for measuring the current and power that is exchanged between the synchronous machine and the utility system; a controller for adjusting the output power of the power generation unit as a function of the power and current that is measured by the grid measurement device; and a communication link between the grid measurement device, controller and/or the power generation unit. The power generation unit is configured to provide current and power to the utility system as a function of the power and current that is measured by the grid measurement device.

Abstract: A turbine assembly is provided. The turbine assembly includes a plurality of sails and a generator assembly configured to convert rotation thereabout to power. A brake assembly may be provided. The brake assembly may include a magnet assembly that rotates with rotation of the plurality of sails, a conducting plate initially spaced-apart from the magnet assembly, and an actuator for translating the conducting plate relative to the magnet assembly during rotation thereof to thereby induce eddy currents that create a magnetic field acting on the conducting plate to impart a retarding force to control the rotational speed thereof. A control module is configured to control the actuator to adjust the spacing between the magnet assembly and the conducting plate in order to maintain the turbine assembly at a predetermined speed.

Abstract: A method of operating a wind turbine is disclosed, the wind turbine comprising a power generator, a machine-side converter connected to the power generator, a line-side converter connected to a power grid through associated power components, and a DC-link connected between the machine-side converter and the line-side converter. The method includes monitoring the power grid for overvoltage events, and upon detecting an overvoltage event: (1) disabling active operation of the machine-side converter and the line-side converter, (2) enabling an AC load dump connected between the machine side converter and the power generator in order to dissipate power output from the power generator, (3) waiting for a waiting period, and (4) enabling active operation of the line-side converter and the machine converter when the overvoltage event ends within the waiting period.

Abstract: A hydrokinetic energy conversion system (HKECS) is provided, comprising design configurations suitable for efficient production of tidal or river in-stream kinetic energy into useful mechanical energy for tasks such as generating electricity or water pumping. The apparatus includes a set of blades with an airfoil cross sectional contour moving on a horizontal or vertical closed loop track, whereby the blades are propelled through the water by a net tangential lift force, rather than drag, to effectively convert the kinetic energy of flowing water to useful power.

Abstract: The invention relates to a high efficiency waterwheel apparatus having track-type blades and a track-type blade set thereof, which includes at least one track disk, a plurality of moving elements and a plurality of blades. The track disk has at least one track surrounding a central axis of the track disk. The moving elements move in the track. The blades are connected to the moving elements. The blades are pushed by water flow to revolving around a central axis. The moving elements connected to the blades are guided by a track so that the blades have different angles while revolving to different positions of the track. Thus, the blade set rotate at a variable angular velocity. When the track-type blade set is applied for power generation, the power generation efficiency is improved in a low-speed ocean current.

Abstract: A wind turbine that includes a rotor, a generator, and a tower is described. The rotor includes a rotor hub and one or more rotor blades. The generator includes a generator stator and a generator rotor. The rotor hub is rotatably mounted on a frame and the generator and tower are arranged on the same side of the rotor. The generator stator is attached to the frame substantially in a plane perpendicular to the rotor's rotational axis, and the generator rotor is rotatably mounted on a part of the generator stator.

Abstract: An energy generation system includes a turbine, an electric generator, a step-up transformer, and a converter. The turbine is operable to extract energy from a fluid flow and convert the extracted energy into mechanical energy. The electric generator is operable to convert the mechanical energy from the turbine into AC electrical energy. The step-up transformer is operable to transfer the AC electrical energy at a lower voltage from the electric generator to a higher voltage. The converter is operable to convert the AC electrical energy at the higher voltage to DC electrical energy. The converter includes a converter leg for a phase of the AC electrical energy. The converter leg has an upper arm with a first plurality of sub-modules and a lower arm with a second plurality of sub-modules. Each sub-module is operable to function as a controlled voltage source.

Abstract: The invention relates to a system for generating electrical energy from wind energy, said system being characterized in that the design makes use of small air currents and does not require a large amount of air in order to generate electrical energy or power. This system incorporates two generating technologies designed based on the vertical rotation axis concept, achieving movement that is independent of wind direction. The invention combines two technologies, namely: one based on drag forces, ideal for low speed conditions; and another based on lift force, which is best for high speed work.

Abstract: In a first aspect, the invention is directed to a circuit for powering a gate drive for an electric motor for a vehicle with an electric motor. The circuit provides a primary power supply and a secondary power supply that powers the gate drive in the event the primary power supply fails. The primary power supply may draw power from the 12V battery on the vehicle. The secondary power supply may draw power from a high voltage battery pack on the vehicle that is normally used to provide power to the electric motor. By providing the secondary power supply to the gate drive, a 3-phase short can be applied to the motor in the event that it is needed as a safety measure even if there is a failure in the primary power supply.

Abstract: The present invention relates to: an electrical-power-feed connector connecting an electrical power source and an electrical-power-fed object, the electrical-power-feed connector having a configuration to form a signal path as a closed system, the signal path being to transmit a signal between the electrical-power-feed connector and the electrical power source, the signal having a value to vary depending on: an electrical connection status of the electrical-power-feed connector with the electrical power source, and an instruction to allow feeding of electrical power from the electrical power source to the electrical-power-fed object; and an electrical power source being feedable electrical power to an electrical-power-fed object by being connected with the electrical-power-fed object via the electrical-power-feed connector, the electrical power source having a configuration corresponding to the configuration of the electrical-power-feed connector.

Abstract: A driver circuit and a diagnostic method are provided. The driver circuit includes a first voltage driver, a second voltage driver, and a microprocessor. The microprocessor iteratively measures voltages on first and second sides of a contact to obtain a first plurality of voltage values and a second plurality of voltage values. The microprocessor determines first and second filtered voltage values based on the first and second plurality of voltage values, respectively. The microprocessor de-energizes a contactor coil if both the first filtered voltage value is substantially equal to the second filtered voltage value, and a first filtered current value is less than a threshold current value.

Abstract: According to one embodiment, a circuit for providing redundant power includes a first channel having a first input, a first electronic circuit breaker, and a first output, a second channel having a second input, a second electronic circuit breaker, and a second output, and a first transistor coupled to the first electronic circuit breaker, the first transistor in series with a second transistor coupled to the second channel. The circuit normally operates by providing power to the first and second outputs from the first and second channels, respectively. However, if the first channel fails, the transistors switch on to allow power from the second channel to feed the first output in the first channel in addition to feeding power to the second output, and vice versa. Other embodiments and methods for providing redundant power are described as well.

Abstract: A control device of an electric power supply apparatus controls a voltage applied to an inverter to fall within a voltage range between a first voltage that is the voltage of one of a first electric power supply and a second electric power supply and a second voltage that is the sum of the voltage of the first electric power supply and the voltage of the second electric power supply, by alternately switching between a series state in which a current loop that connects the first electric power supply, the second electric power supply, and a reactor in series with the inverter is formed, and a parallel state in which the first electric power supply and the second electric power supply are connected in parallel with the inverter as an electric load.

Abstract: A method of maintaining electrical power to electrical systems in operation during reconfiguration or maintenance of a power distribution system for the electrical systems includes providing a Y-connection in a set of electrical power lines. The Y-connection includes an input, a primary output, and a feed output. The set of electrical power lines supplies electrical power from a power source to the electrical systems through the primary output. To establish a feed for maintenance or reconfiguration of the power feed, power is fed from the power source through the feed output of the Y-connection to the electrical systems while power is being supplied to the electrical systems through the primary output.

Abstract: A portable generator system provides power to a load source including an engine and a generator. The engine drives the generator to provide a generator alternating current (AC) electrical power output. An energy storage system (ESS) provides an ESS direct current (DC) electrical power output. A first inverter is connected to the generator for receiving the generator AC electrical power output and for providing a DC power output. A second inverter is connected to the first inverter and the ESS for receiving the DC power output from the first inverter and the ESS DC electrical power output for providing an AC power output. A first power mode includes the generator maintaining a first generator power output level corresponding to a specified power requirement of a load source, and the ESS providing an additional first ESS power output level for satisfying the specified power requirement of the load source.

Abstract: A self-recharging electric generator system in communication with an external system and that includes a battery unit configured to supply power to the self-charging electric generator system, an automatic switching unit configured to switch between a main power supply source and the self-recharging electric generator system, at least one electric motor configured to receive power from the battery unit, and at least one generator configured to produce power to be supplied to the external system when a failure occurs at the main power supply source, where the power produced by the at least one generator is further supplied to the automatic switching unit for performing continuous recharging of the self-recharging electric generator system.

Abstract: A power conversion apparatus includes an inverter for converting DC power to AC power for supply to a load, a converter for converting AC power from an AC power supply to DC power for supply to the inverter, a DC voltage converter for converting a voltage value of power stored in a storage battery to supply DC power from the storage battery to the inverter when power supply from the AC power supply is faulty, and a filter including a reactor and a capacitor, for removing harmonics generated by the inverter. The inverter includes a three-level circuit which is a multi-level circuit.

Abstract: An energy storage system includes a converter coupled between an inverter and both a power generator and a battery, thereby reducing the number of devices for circuit implementation and the size of a printed circuit board (PCB). The energy storage system is coupled to an electric power system that generates a system power, and the energy storage system includes a battery for generating a battery power and a converter coupleable to a power generator for generating an electric power and the battery in parallel, wherein the converter is configured to boost or drop a voltage of at least one of the electric power, the battery power, or the system power.

Abstract: A method and apparatus is disclosed for intelligently inverting DC power from DC sources such as photovoltaic (PV) solar modules to single-phase or three-phase AC power to supply power for off-grid applications. A number of regular or redundant off-grid Mini-Inverters with one, two, three, or multiple input channels in a mixed variety can easily connect to one, two, three, or multiple DC power sources such as solar PV modules, invert the DC power to AC power, and daisy chain together to generate and supply AC power to electrical devices that are not connected to the power grid including motors, pumps, fans, lights, appliances, and homes.

Abstract: A DC/DC module comprises a buck-boost circuit, which is used to convert the input voltage of the DC/DC module into a gate off-state voltage VGL; a LDO circuit, which is used to convert the input voltage of the buck-boost circuit into a lower limit output voltage VBB of a liquid crystal driver; a BUCK circuit, which is used to convert the input voltage of the DC/DC module into an operating voltage VDD of a specific IC; a charge pump circuit, which is used to convert the input voltage of the DC/DC module into a gate on-state voltage VGH; wherein, the input voltage of the DC/DC module is used directly as an upper limit output voltage VAA. The DC/DC module according to the present invention has simple circuit structure, low hardware cost, and high load capacity.

Abstract: In a vehicle-mounted electronic control device having a switching power supply in which a switching element is controlled to obtain a predetermined intermediate voltage Va stepped down from a vehicle-mounted battery, and to which a downstream side coil, a flywheel diode, and an output capacitor are connected to suppress a pulsating voltage, a circuit for suppressing reverse conduction for the switching element is provided in order to prevent that the switching element is reversely conducted and thus a charging voltage of the output capacitor is abnormally lowered when a power supply voltage Vb of the vehicle-mounted battery is abnormally lowered.

Abstract: A wireless energy transfer system includes a primary and one (or more) secondary oscillators for transferring energy therebetween when resonating at the same frequency. The long range (up to and beyond 100 m) efficient (as high as and above 50%) energy transfer is achieved due to minimizing (or eliminating) losses in the system. Superconducting materials are used for all current carrying elements, dielectrics are either avoided altogether, or those are used with a low dissipation factor, and the system is operated at reduced frequencies (below 1 MHz). The oscillators are contoured as a compact flat coil formed from a superconducting wire material. The energy wavelengths exceed the coils diameter by several orders of magnitude. The reduction in radiative losses is enhanced by adding external dielectric-less electrical capacitance to each oscillator coil to reduce the operating frequency.

Abstract: Provided is an apparatus that may control a direction of wireless power transmission. A radiative wireless power transmitter may include at least two first unit resonators to form a magnetic field with a target resonator based on an x-axis direction and a z-axis direction, and to transmit a resonance power to the target resonator, at least two second unit resonators to form a magnetic field with the target resonator based on the x-axis direction and a y-axis direction, and to transmit a resonance power to the target resonator, at least two third unit resonators to form a magnetic field with the target resonator based on the y-axis direction and the z-axis direction, and to transmit a resonance power to the target resonator, and a feeding unit to control resonance power transmission of the at least two first unit resonators, the at least two second unit resonators, and the at least two third unit resonators.

Abstract: Disclosed is a self-powering system for electronic circuits by detecting and converting the energy of electric field lines provided from the generator of device in the proximity of the electronic circuit. The harvesting of electric field energy by using means of capacitive coupling (contactless or (in-) direct contact) to field inducing power sources replaces or reduces the need of batteries e.g. for mobile devices, medical sensors, energy efficient circuits (e.g. stand-by) or (near field-) communication devices. A wide range of applications and technical solutions from smart labels, e-ink devices, shutter glasses, or electronic sensors up to electronic devices of any kind, can use the invention's means to power (integrated) circuits microcontrollers, light emitting items (LED) or any circuit where batteries or other power sources can be replaced by the innovation.

Abstract: A system of solar roof shingles and underlayment with wireless power transfer between the solar roof shingles and the underlayment is disclosed. Each roof shingle has a solar collector array coupled to a wireless resonator. The solar collector array establishes a voltage in response to exposure to sunlight and the wireless resonator converts the voltage to a transmittable electromagnetic signal. The signal is transmitted to resonant devices embedded in the underlayment beneath the shingles The resonant devices may be resonant capture devices that convert the received electromagnetic signal back to a usable voltage, or they may be wireless repeaters that retransmit the electromagnetic signal to remote resonant capture devices, which then convert it to a voltage. This voltage is placed on an electrical grid and made available at a remote location for use, storage, or placement on the public electrical grid.

Abstract: Provided is a wireless power resonator. The wireless power resonator, including a transmission line and a capacitor, may form a loop structure, and may additionally include a matcher to determine an impedance of the wireless power resonator.

Abstract: A subsea power distribution system includes a three-phase AC power source; multiple variable frequency drives having inputs and outputs, with their inputs connected to the AC power source; an electric motor connected in series to the output of each variable frequency drive; and a passive harmonic filter system having its input connected, in parallel with the variable frequency drives, to the AC power source. The filter system includes multiple harmonic filters, each harmonic filter tuned to a specific harmonic frequency. Each harmonic filter includes a plurality of sub-filters. Each sub-filter includes a reactor connected in series to a main capacitor and one or more detuning capacitors. Each of the multiple harmonic filters is tuned to a different specific harmonic, and includes sub-filters also tuned to the same respective harmonic, and each sub-filter is sized to equally share the kVAR load of its respective harmonic filter.

Abstract: A proximity switch assembly and method are provided having wrong touch feedback. The switch includes a plurality of proximity switches each including proximity sensors providing a sense activation field. Control circuitry processes the activation field of each proximity switch to sense activation, detects an allowed activation of one of the proximity switches and further detects an attempted activation that is not allowed. The switch further includes an output coupled to a device to perform a function when an allowed activation is detected. The switch includes one or more user perceived feedback devices for generating user perceived feedback when an attempted activation that is not allowed is detected.

Abstract: The wireless non-contact switch detects movement of human body in the beam-shaped detection are which extends from the upper area on the wall toward the floor surface, and controls opening and closing of the automatic door. Regardless of the height of the location of the movement, as long as it is in the detection area, the switch detects the movement of different height location in the detection area. Therefore, regardless of the difference of regulation between each states, it can be operated at any height of the movement.

Abstract: An electrical circuit for bi-directional power control between two devices, including a mobile communication card, an electronic device that connects to the communication card, the electronic device being either (i) a host device that operates independently of the communication card and also interoperates with the communication card, or (ii) a jacket for the communication card, wherein the jacket is a passive device that does not operate independently of the communication card, and circuitry connecting the mobile communication card with the electronic device, including a device on/off button operative to power the electronic device on and off, and a switch, wherein the circuitry uses a single connection line connecting the communication card, the electronic device, the device on/off button, and the switch, to enable the electronic device to automatically power the communication card on and off using the switch, in response to the electronic device being respectively powered on and off.