Abstract: An object of the present invention is to provide a solid electrolytic capacitor separator configured such that thickness non-uniformity is reduced, internal short-circuit is less likely to occur, an impedance is not too high, and a high heat resistance is exhibited. In a solid electrolytic capacitor separator including non-woven fabric, the non-woven fabric contains fibrillated heat-resistant fibers and synthetic short fibers as essential components, the fiber length of the fibrillated heat-resistant fiber is 0.30 to 0.75 mm, and the percentage of fibrillated heat-resistant fibers with a fiber width of 12 to 40 ?m is equal to or higher than 55% and lower than 75%.

Abstract: An electrochemical capacitor (300) for use with a biofilm is presented. The electrochemical capacitor includes a first electrode (324) coupled to a first porous layer (326), a second electrode (334) coupled to a second porous layer (336); and an electrolyte (310) provided between the first porous layer (326) and the second porous layer (336). At least one of the first porous layer (326) and the second porous layer (336) has a plurality of cavities adapted to receive redox-active metabolites produced by the biofilm. Also presented is an electrochemical capacitor device, such as a skin patch that includes a support layer attached to the electrochemical capacitor (300). Also presented is a power source that includes the electrochemical capacitor (300) and a biofilm provided between the first electrode (324) and the second electrode (334) of the electrochemical capacitor (300).

Abstract: An electrical connection device (200) connected between a main body and a draw-out device of an electrical appliance having a draw-out structure. The electrical connection device comprises: a draw-out device connection assembly (202) being fixed on the draw-out device and electrically connected to inlet and outlet ends of the draw-out device; a main body connection assembly (204) including contact pieces (241, 441, 541) with a clamping mechanism, wherein the clamping mechanism makes the contact pieces (241, 441, 541) close to and clamp main body busbars (208, 408, 508); and a flexible assembly (206) connecting the draw-out device connection assembly (202) and the main body connection assembly (204) to form a conductive path.

Abstract: An electrical device such as, for example, a battery-powered electrical switch is disclosed. The battery-powered wireless switch includes one or more mechanisms arranged and configured to provide simplified access for servicing (e.g., replacing) the batteries located within the wireless switch. In one embodiment, the wireless switch is arranged and configured so that the batteries may be accessed by reconfiguring the wireless switch from a first closed position to a second opened position to access the batteries. Thus arranged, removal of the wireless switch from a wall-box or a surface of a wall is not required, the user may only need to remove the wall-plate in order to reconfigure the wireless switch. In one embodiment, at least a portion of the wireless switch is pivoted from the first position to the second position to provide access to the batteries.

Abstract: A control device may be configured to control one or more electrical loads in a load control system. The control device may be a wall-mounted device such as dimmer switch, a remote control device, or a retrofit remote control device. The control device may include a gesture-based user interface for applying advanced control over the one or more electrical loads. The types of control may include absolute and relative control, intensity and color control, preset, zone, or operational mode selection, etc. Feedback may be provided on the control device regarding a status of the one or more electrical loads or the control device.

Abstract: Electrical switching devices, such contactor and fuse devices, are disclosed that have improved reliability particularly through thermal cycling. One electrical switching device according to the present invention comprises an outer housing and internal operational components within the outer housing. An internal housing in included in that outer housing that surrounds at least some of the internal operational components. A sealing material is also included within the outer housing that is capable of forming a hermetic seal within the outer housing, wherein the sealing material contacts the internal housing. The internal housing has a CTE that substantially matches the CTE of the sealing material. Electrical system according to the present invention comprises an electrical circuit and an improved electrical switching device electrically connected to the electrical circuit to reliably open or close the circuit.

Abstract: An illumination system and method are disclosed for maintaining a consistent change in illumination value among a group of illumination devices whenever a change command is manually sent from a keypad to those illumination devices. The consistent change results from maintaining a common start illumination value among not only the group, but also the keypad which controls the group. From the start illumination value, the keypad can then compute an end illumination value depending upon the amount of time that an increase or decrease in illumination value button is depressed and held.

Abstract: A key structure includes a casing, a restoring member and a keycap assembly. The casing has an opening. The restoring member is disposed in the casing. The keycap assembly includes a keycap and a holder. The keycap includes a pressing portion and a central shaft. The pressing portion has a bottom surface. The central shaft connects to the bottom surface. The central shaft has a hemispherical portion adjacent to the bottom surface. The holder is inserted into the casing via the opening and contacts the restoring member. The holder includes a shaft bore. The shaft bore has an arcuate socket. The central shaft passes through the shaft bore and contacts the restoring member, and the hemispherical portion is accommodated in the arcuate socket.

Abstract: An input module includes a base, a keycap assembly and an identification unit. The base includes a magnetic sensor. The keycap assembly is assembled on the base, and the keycap assembly includes a magnetic element. The identification unit is electrically coupled to the magnetic sensor, and the identification unit determines the type of the keycap assembly according to the characteristics of magnetic field lines of the magnetic element sensed by the magnetic sensor. An electronic device is also disclosed.

Abstract: A three-position disconnector switch includes an earthing contact, a power out contact, a power in contact, a piston, and a threaded rod. A length of the piston is such that in a first switch position an outer surface of a wall of the piston makes an electrical contact between the power out contact and the power in contact. The length of the piston is such that in a second switch position the outer surface of the wall of the piston does not make an electrical contact with either the earthing contact or the power in contact. The length of the piston is such that in a third switch position the outer surface of wall of the piston makes an electrical contact between the earthing contact and the power out contact. The piston includes an inner threaded section configured to engage with the threaded rod.

Abstract: A medium voltage circuit breaker switching pole includes: a fixed contact of a vacuum interrupter; a movable contact of the interrupter; and a threaded drive element. The movable contact is configured to move along a longitudinal axis of the interrupter. A centre axis of the drive element is parallel to the longitudinal axis of the interrupter. When in an open configuration the fixed contact and movable contact are separated from one another. When in a closed configuration the fixed contact and movable contact are in contact with one another. Rotation of the drive element about its centre axis in a first direction is configured to transition the switching pole from the open configuration to the closed configuration. Rotation of the drive element about its centre axis in a second direction counter to the first direction is configured to transition the switching pole from the closed configuration to the open configuration.

Abstract: The present disclosure provides a contact point monitoring device for a vacuum circuit breaker comprising: a fixed electrode which is fixed in an insulated container; a fixed contact point which is disposed at one end of the fixed electrode; a movable electrode which is installed in the insulated container and is movable in the upward or downward direction; a vacuum interrupter which is disposed at one end of the movable electrode and includes a movable contact point coming into contact with or separated from the fixed contact point; and a pushrod assembly which is coupled to the other end of the movable electrode and allows the movable electrode to move upwards or downwards.

Abstract: An electric switch including a frame, a first stationary contact, a roll element adapted to rotate relative to the frame, a rotating contact stationary fixed to the roll element, and an arc extinguisher plate system. The arc extinguisher plate system includes at least one first arc extinguisher plate for extinguishing an electric arc generated during an opening event between the first stationary contact and a first contact portion of the rotating contact. The at least one first arc extinguisher plate is fixed to the roll element.

Abstract: Provided herein are methods for an improved bi-stable relay. In some embodiments, a method may include providing a core assembly within a housing, the core assembly comprising a plunger extending through a coil support structure. The method may further include winding a first coil and a second coil about a central section of the coil support structure, providing a first magnet and a first ferromagnetic plate at a first end of the coil support structure, and providing a second magnet and a second ferromagnetic plate at a second end of the coil support structure. In some embodiments, the method may further include activating the first coil or the second coil to move the plunger between a first position and a second position, wherein in the first position a circuit formed by a set of contacts is closed, and wherein in the second position the circuit is open.

Abstract: Provided herein is an improved bi-stable relay. In some embodiments, the bi-stable relay assembly may include a housing, and a core assembly within the housing. The core assembly may include a coil support structure, a first coil and a second coil along a central section of the coil support structure, a first magnet at a first end of the coil support structure, a second magnet at a second end of the coil support structure, and a first electromagnetic shell component and a second electromagnetic shell component each extending between the first and second magnets.

Abstract: Provided herein are coil support structures and methods of retaining a printed circuit board assembly (PCBA) of a relay. In some embodiments, a bi-stable relay assembly may include a coil support structure, having a central section extending between a first end section and a second end section, and set of biasable fasteners extending from the first end section and the second end section, wherein each of the set of biasable fasteners includes a sloped engagement surface and a retention slot. The coil support structure may further include a PCBA coupled to the first and second end sections of the coil support structure, wherein the coil support structure extends within the retention slot of each of the set of biasable fasteners.

Abstract: In some embodiments, a gas discharge tube (GDT) can include first and second electrodes each including an edge and an inward facing surface, such that the inward facing surfaces of the first and second electrodes face each other. The GDT can further include a sealing portion implemented to join and seal the edge portions of the inward facing surfaces of the first and second electrodes to define a sealed chamber between the inward facing surfaces of the first and second electrodes. The GDT can further include an electrically insulating portion implemented to provide a surface in the sealed chamber and to cover a portion of the inward facing surface of each of at least one of the first and second electrodes such that a leakage path within the sealed chamber includes the surface of the electrically insulating portion.

Abstract: A charged particle beam apparatus acquires an image that is not affected by movement of a stage at a high speed. The apparatus includes: a charged particle source for irradiating a sample with a charged particle beam; a stage on which the sample is placed; a measurement unit for measuring a movement amount of the stage; a deflector; a deflector offset control unit, which is a feedback control unit for adjusting a deflection amount of the deflector according to the movement amount of the stage; a plurality of detectors for detecting secondary charged particles emitted from the sample by irradiation of the charged particle beam; a composition ratio calculation unit that calculates composition ratios of signals output from the detectors based on the deflection amount adjusted by the feedback control unit; and an image generation unit for generating a composite image by compositing the signals using the composition ratio.

Abstract: The present invention provides an apparatus of charged-particle beam e.g. an electron microscope comprising an in-column plasma generator for selectively cleaning BSE detector and BF/DF detector. In various embodiments, the plasma generator is located between a lower pole piece of objective lens and the BF/DF detectors, but outside trajectory area of the charged-particles from the sample stage to the BF/DF detector. Cleaning decomposed biological samples or contaminants on the surface of the detectors frequently and selectively with in-situ generated plasma can prevent the detectors from performance deterioration such as losing resolution and contrast in imaging at high levels of magnification.

Abstract: Systems and method for the preparation and delivery of biological samples for charged particle analysis are disclosed herein. An example system at least includes an ion filter coupled to select a sample ion from an ionized sample supply, the ion filter including a quadrupole filter to select the sample ion from the sample supply, an energy reduction cell coupled to receive the selected sample ion and reduce a kinetic energy of the sample ion, a validation unit coupled to receive the sample ion and determine whether the sample ion is a target sample ion, a substrate coupled to receive the sample, wherein the substrate is electron transparent, an ion transport module coupled to receive the sample ion from the ion filter and transport the sample ion to the substrate, and an imaging system arranged to image, with a low energy charged particle beam, the sample located on the substrate, wherein the substrate is arranged in an analysis location.

Abstract: A radio-frequency (RF) power circuit for a multi-electrode cathode in a processing chamber may include an RF source and inductive element(s) that are conductively coupled to the RF source. A first inductive element may be inductively coupled to the inductive element(s), and the first inductive element may be configured to receive a first portion of RF power originating from the RF source and provide the first portion of the RF power for a first pedestal electrode. A second inductive element may also be inductively coupled to the inductive element(s), and the second inductive element may be configured to receive a second portion of RF power originating from the RF source through the inductive element(s) and provide the second portion of the RF power for a second pedestal electrode.

Abstract: A method adjusts an output power of a power supply supplying electrical power to a plasma in a plasma chamber. The method includes: connecting the power supply to at least one electrode in the plasma chamber; transporting one or more substrates relative to the electrode using a substrate carrier; maintaining the plasma by the electrical power; processing the one or more substrates with the plasma; and adjusting the output power based on a parameter related to a distance between a surface of the electrode facing a carrier-substrate-assembly and a surface of the substrate-carrier-assembly facing the electrode.

Abstract: A plasma processing apparatus includes a processing chamber configured to accommodate a substrate, a gas supply configured to supply a processing gas into the processing chamber, a power supply configured to supply power to the processing chamber to generate plasma such that the substrate is processed by using the generated plasma, and a control device configured to control the power supply. The control device controls the power supply to perform a process of supplying a first power including a frequency component within a first band having a first bandwidth to the processing chamber when the plasma is generated from the processing gas, and a process of supplying a second power including a frequency component within a second band having a second bandwidth smaller than or equal to the first bandwidth to the processing chamber when the substrate is processed by using the generated plasma.

Abstract: An apparatus for treating a substrate is disclosed. The apparatus includes a radio frequency (RF) power source to apply an RF signal to excite a process gas to be in a plasma state. A supporting unit to support the substrate includes an edge ring to surround the substrate, a coupling ring disposed under the edge ring and including an electrode in the coupling ring, and an edge impedance control circuit connected with the electrode. The edge impedance control circuit includes a harmonic control circuit unit to control a harmonic generated from the RF power source, an ion flux control circuit unit to adjust an ion flux of an edge region of the substrate, and a cable impedance control circuit unit to adjust an impedance made due to a length of the RF cable.

Abstract: A radio frequency (RF) generator device for supplying RF powers of different frequencies to multiple antennas disposed in a chamber is provided. The RF generator device includes a plurality of RF generators configured to supply the RF powers of the different frequencies to the multiple antennas, and a plurality of RF controllers configured to control the RF generators, respectively. Each of the RF controllers includes a fast Fourier transformer, and a filter. The fast Fourier transformer performs fast Fourier transform on a signal introduced as a reflected wave to decompose the signal into frequency components, and the filter removes waves having frequency components that are not outputted from the corresponding RF generator.

Abstract: Provided is a method of igniting a plasma to quickly ignite a plasma without causing undesirable arcing. The method of igniting a plasma according to the present invention includes: a supplying step of supplying a process gas into a chamber 1 provided in a plasma generating system; an igniting step of igniting a plasma by irradiating the process gas supplied into the chamber with laser light L emitted from a semiconductor laser 10 and applying a high frequency power to a coil 2 or an electrode 91 for generating plasma provided in the plasma generating system; and a stopping step of stopping emission of the laser light from the semiconductor laser after the plasma is ignited. Preferably, the coil is a cylindrical coil, and in the igniting step, the laser light is obliquely irradiated from above the cylindrical coil toward below the cylindrical coil.

Abstract: A plasma processing apparatus or a plasma processing method having an improved yield, the plasma processing apparatus includes: a processing chamber arranged inside a vacuum container; a processing gas supply line connecting to the vacuum container, communicating with the processing chamber, and configured to supply processing gas having adhesiveness to the processing chamber; and a gas exhaust line for the processing gas connecting and communicating the processing gas supply line with a processing chamber exhaust line that is connected to an exhaust pump and communicates with the processing chamber, in which the plasma processing apparatus exhausts the processing gas in the processing gas supply line through the gas exhaust line and the processing chamber exhaust line in a state where supplying of the processing gas to the processing chamber is stopped between one processing step of etching the wafer and a subsequent processing step.

Abstract: When a gas supplied to a gas injection unit is switched from a first processing gas to a second processing gas, a controller of a gas supply system performs control to open a first supply on/off valve connected to the gas injection unit and provided in a first gas supply line for supplying the first processing gas and a second exhaust on/off valve provided in a first gas exhaust line branched from the first gas supply line, close a second supply on/off valve connected to the gas injection unit and provided in a second gas supply line for supplying the second processing gas and a first exhaust on/off valve provided in a second gas exhaust line branched from the second gas supply line; and then open the second supply on/off valve and the first exhaust on/off valve and close the first supply on/off valve and the second exhaust on/off valve.

Abstract: An apparatus adapted for use in a plasma processing chamber is provided. An aluminum body with at least one surface is provided. An aluminum oxide containing aerosol deposition coating is disposed over the at least one surface of the aluminum body. An yttrium containing aerosol deposition coating is disposed over the aluminum oxide containing aerosol deposition coating.

Abstract: A substrate processing apparatus includes a chamber which has a processing room in which a substrate is processed, a cover which is provided in the processing room and is provided between the substrate and the chamber, and a heater which is provided only on the cover among the chamber and the cover and heats the cover.

Abstract: A plasma processing apparatus or method that improves the yield of wafer processing, including a sample stand on which the wafer is mounted; plural heaters which are arranged in three or more regions in the radial direction including a circular region concentrically arranged around the center and ring-like regions surrounding the outer periphery on plural radii in the radial direction from the center toward the outer peripheral side, and which include one arranged in each of plural arc-like regions divided in the circumferential direction around the center of at least one of the ring-like regions; plural temperature sensors arranged in the radial direction and the number of which is smaller than that of heaters; and a control unit which adjusts the output of each of the plural heaters according to the output from the temperature sensor so that the temperature of the sample stand becomes closer to a target value.

Abstract: A vacuum processing apparatus with improved processing efficiency, which includes a pusher arm to support the wafer on a beam portion, or deliver the supported wafer, and a cooling plate disposed on a bottom in the lock chamber for cooling the wafer and placed on tip ends of multiple support pins. The pusher arm includes four pusher pins disposed around a center of the wafer to be placed on the horizontally extending beam portion, and a drive unit connected to the proximal part for vertically moving the beam portion. The cooling plate includes a recess portion in its center, into which the beam portion of the pusher arm which has been moved downward is stored. The support pins are positioned closer to an outer circumference side of the wafer on the cooling plate with respect to the center than the pusher pins of the pusher arm.

Abstract: A method for cleaning a substrate processing apparatus includes mounting a substrate on a mounting portion of an electrostatic chuck of the substrate processing apparatus to process the substrate; mounting a protector including a small diameter portion that covers the mounting portion and a large diameter portion that is disposed apart from an edge ring disposed on an outer periphery of the mounting portion and has a diameter larger than that of the small diameter portion, on the mounting portion; and supplying a cleaning gas, thereby removing by-products deposited between the mounting portion and the edge ring.

Abstract: A first trend chart and a second trend chart are displayed along with a chromatogram. The first trend chart is generated based on a plurality of first representative value arrays obtained from a plurality of mass spectra. The second trend chart is generated based on a plurality of second representative value arrays obtained from the plurality of mass spectra. A mass spectrum stable period is determined based on the first trend chart and the second trend chart.

Abstract: Exemplary embodiments provide methods, mediums, and systems for comparing a sample of interest to a library of known compounds to quickly determine how similar the sample is to the compounds in the library. Peaks of interest in the sample data are compared to corresponding peaks in the library compound data. These peaks may be represented as vectors, and an angle between the sample vector and the library vector may be used as a similarity metric. In some embodiments, a cosine similarity may be calculated for the vectors. If the similarity score for a given library compound/sample pair exceed a threshold, then the system determines that the library compound and the sample are similar and takes appropriate action. Various parameters associated with the comparison can be adjusted in order to improve the quality of the results and/or the efficiency of the process.

Abstract: A pulse shaping circuit for a spectrometer comprises a circuit input terminal for receiving detector pulses from an analog ion detector, a flip-flop for receiving detector pulses from the circuit input terminal, a delay unit for receiving output pulses from the flip-flop and feeding delayed output pulses to a reset input terminal of said flip-flop, and a circuit output terminal for supplying the output pulses or the delayed output pulses to a counter. The duration of the output pulses and the minimum duration of the interval between the output pulses is determined by the delay unit. The pulse shaping circuit may comprise at least one Schmitt trigger.

Abstract: A method of analysis using mass spectrometry and/or ion mobility spectrometry is disclosed comprising: (a) using a first device to generate smoke, aerosol or vapour from a target in vitro or ex vivo cell population; (b) mass analysing and/or ion mobility analysing said smoke, aerosol or vapour, or ions derived therefrom, in order to obtain spectrometric data; and (c) analysing said spectrometric data in order to identify and/or characterise said target cell population or one or more cells and/or compounds present in said target cell population.

Abstract: A method and apparatus for monitoring and/or controlling the extent of denaturation and/or bond cleavages of proteins on any surface (e.g., biological tissues, biofilms, etc.). In one embodiment, a low power laser (e.g., a 5 mW, 362 nm diode laser) is directed through a biological sample to a photodetector. The sample is heated by a set of radiant heaters to between about 220° C. and about 250° C. in a time period of between 10 seconds to 60 seconds. The baseline transmissivity of the sample is monitored continuously throughout treatment of the biological sample via continuous monitoring of the signal voltage detected at the photodetector. Upon detection of increase in relative transmissivity in the biological sample, the heating treatment is concluded and the biological sample is removed for in situ protein identification as part of an imaging MALDI-MS measurement.

Abstract: An electrode assembly, such as for an ion mirror, comprising: a first layer having a plurality of electrodes that are separated by one or more gaps; a second layer arranged to cover said one or more gaps and prevent electric fields passing through said one or more gaps, said second layer having electrically conductive material located to be coincident with said one or more gaps in the first layer.

Abstract: An ion analyzer that generates and analyzes product ions by irradiating precursor ions derived from a sample component with radicals, the ion analyzer including: a reaction chamber (2; 833) into which the precursor ions are introduced; a radical generation unit (5) configured to generate radicals from a first material gas; a metastable particle generation unit (5) configured to generate metastable particles from a second material gas; a radical introduction unit (5) configured to mix the radical and the metastable particles and introduce the mixture into the reaction chamber (2; 833); and an ion detection unit (4; 835) configured to detect product ions generated from the precursor ions by a reaction with the radicals.

Abstract: The application relates to a manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure. The method comprises a step of producing the wafer having a crystal orientation identifier and a certain thickness. The method further comprises a step of thinning the produced wafer from the certain thickness to a desired thickness of the wafer in order to obtain the thinned wafer. The method further comprises a step of providing a surface passivation layer having a certain layer thickness on a front surface of the thinned wafer. The method further comprises a step of polishing the passivation layer from the certain layer thickness to a desired final layer thickness of the passivation layer so that the polished front surface of the wafer enables active layer bonding in order to form the hybrid substrate structure.

Abstract: The present disclosure provides a semiconductor structure preparation process and a semiconductor structure. The preparation process includes the following steps of: introducing a first silicon source, and forming a first silicon containing material layer by deposition on the surface of a base of a semiconductor structure; introducing a first nitrogen source, and forming a first nitrided material layer by deposition on the surface of the first silicon containing material layer using a chemical vapor deposition process; introducing a second silicon source, and forming a second silicon containing material layer by deposition on the surface of the first nitrided material layer; and introducing a second nitrogen source, and forming a second nitrided material layer by deposition on the surface of the second silicon containing material layer using a plasma deposition process. According to the present disclosure, the prepared semiconductor structure has excellent film resistance uniformity and higher product yields.

Abstract: The present invention relates to technology for fabricating a gallium nitride substrate using an ion implantation process to which a self-separation technique is applied. According to the present invention, a method of fabricating a gallium nitride substrate may include a step of forming a first gallium nitride layer on a substrate, a step of implanting hydrogen ions into the first gallium nitride layer to form a separation layer, a step of grinding the edges of the substrate, the first gallium nitride layer, and the separation layer, a step of forming a second gallium nitride layer on the first gallium nitride layer having a ground edge, and a step of self-separating the second gallium nitride layer from the first gallium nitride layer having a ground edge.

Abstract: The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.

Abstract: A method of forming graphene on a flexible substrate includes providing a polymer substrate including a metal structure and providing a carbon source and a carrier gas. The method also includes subjecting the polymer substrate to a plasma enhanced chemical vapor deposition (PECVD) process and growing a graphene layer on the copper structure.

Abstract: Systems, apparatuses, and methods may provide for technology for affixing a thermal label to a solid state drive. A printed circuit board of a solid state drive includes a top surface positioned opposite from a back surface. The printed circuit board further include one or more memory chips disposed on the top surface. A thermal label is affixed to the one or more memory chips disposed on the top surface of the printed circuit board and to the back surface of the printed circuit board.

Abstract: Systems for depositing a transition metal chalcogenide film on a substrate by cyclical deposition process are disclosed. The methods may include, contacting the substrate with at least one transition metal containing vapor phase reactant comprising at least one of a hafnium precursor, or a zirconium precursor, and contacting the substrate with at least one chalcogen containing vapor phase reactant. Semiconductor device structures including a transition metal chalcogenide film deposited by the methods of the disclosure are also provided.

Abstract: A laser irradiation method includes a first scanning wherein a laser beam is scanned in a first region having a width in the X direction and a length in the Y direction by moving a laser irradiation area on the surface of the substrate along the Y direction using a spot laser beam, and a second scanning wherein laser beam is scanned in a second region having a width in the X direction and a length in the Y direction by moving a laser irradiation area on the surface of the substrate along the Y direction using the spot laser beam. A center of the second region is spaced apart from a center of the first region in the X direction.

Abstract: A semiconductor structure and a forming method thereof are provided.

Abstract: A substrate processing method includes: providing a substrate including a mask; forming a film on the mask; forming a reaction layer on a surface layer of the film; and removing the reaction layer by applying energy to the reaction layer.