Abstract: The present disclosure provides insulated electrical conductors, e.g., wires, and methods for producing such insulated electrical conductors to combat partial discharge by enhancing bond strength between the electrical conductor and a base insulating thermoplastic layer (e.g., including a PAEK). Such insulated electrical conductors can include: an electrical conductor; an insulating coating on at least a portion of a surface of the electrical conductor; and an oxide layer between the electrical conductor and the insulating coating. Methods for producing such insulated electrical conductors can involve extrusion of an insulating polymer onto the electrical conductor under ambient atmosphere and a subsequent heat treatment step, which can also be conducted under ambient atmosphere.

Abstract: A water blocking layer/sheathing for subsea power cables made from a CuNiSi-alloy.

Abstract: A high-frequency line connection structure connects a coaxial line and a planar line. The high-frequency line connection structure includes a conductive base that is formed into a planar shape having a length that matches a length of the planar line along a lengthwise direction of a substrate, where the planar line is disposed on a surface of the conductive base, and a protrusion structure provided in a region, on the surface of the conductive base, adjacent to the coaxial line, the protrusion structure protruding from the surface of the conductive base, where the protrusion structure is in contact with a side surface of a region along the lengthwise direction of the substrate, where a ground conductive film with a smaller width out of a pair of ground conductive films of the planar line, is formed.

Abstract: A coaxial cable includes a conductor, an electrically insulating member provided over a periphery of the conductor, a shielding layer composed of served shields formed by helically wrapping a plurality of metal wires around the electrically insulating member, and a sheath provided around the shielding layer. The electrically insulating member includes indentations on portions of its surface to be brought into contact with and mated to the metal wires respectively. The shielding layer includes portions in respective circumferential directions of the plurality of metal wires being brought into contact with the electrically insulating member are mated to the indentations, respectively, on the electrically insulating member, and adjacent ones of the metal wires in a circumferential direction of the shielding layer are in surface contact with each other.

Abstract: A method for manufacturing a superconductor is described. A metal assembly precursor can be formed within a hollow copper support element. Forming the metal assembly precursor within a hollow copper support element by positioning a plurality of conductor elements about a core including Sn to provide a first plurality of inner interstitial spaces between the plurality of conductor elements between the core and conductor elements and a second plurality of outer interstitial spaces between the hollow copper support element and the core, the plurality of conductor elements including unreacted Nb. The metal assembly precursor can be reduced via cold drawing to produce a reduced metal assembly. The reduced metal assembly can be reaction heat treated so that the unreacted Nb undergoes a phase transformation to a reacted superconductor.

Abstract: A double-layer longitudinal wrapping mold is disclosed, including a base, a first longitudinal wrapping structure, a first pressing structure, a second longitudinal wrapping structure, a second pressing structure and a first necking structure. The first longitudinal wrapping structure is disposed on the base and has a first guide hole, a first outer layer wrapping hole and an inner layer wrapping hole. The first pressing structure is disposed on the base and has a first pressing hole and a second outer layer wrapping tape hole. The second longitudinal wrapping structure is disposed on the base and has a second guide hole and a third outer layer wrapping tape hole. The second pressing structure is disposed on the base and has a second pressing hole and a fourth outer layer wrapping tape hole. The first necking structure is disposed on the base and has a necking hole.

Abstract: There is described an electrical isolator comprising a first fluid-carrying member and a second fluid-carrying member spaced apart from said first fluid-carrying member, a resistive, semi-conductive or non-conductive component located between and sealed against said first and second fluid-carrying member, wherein said resistive, semi-conductive or non-conductive component is adapted to convey fluid flowing from said first fluid-carrying member to said second fluid-carrying member, a reinforcing composite encircling said first fluid-carrying member, said second fluid-carrying member and said resistive, semi-conductive or non-conductive component, wherein said reinforcing composite is continuous and provides a conductive path between said first fluid-carrying member and said second fluid-carrying member, wherein said reinforcing composite comprises fibre and a resin mixture, and said resin mixture comprises resin and a conductive additive.

Abstract: A thermistor chip is provided, which includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode. The surface electrode and the bottom electrode are respectively arranged on the two surfaces of the thermosensitive ceramic substrate. The surface electrode is a silver layer. The bottom electrode consists of a silver layer, a titanium-tungsten alloy layer, a copper layer and a gold layer, laminating on the thermosensitive ceramic substrate in turn from inside to outside. A preparation method thereof is also provided. The thermistor chip can meet the requirements of both solder paste reflow soldering and wire bonding process simultaneously, and has the advantages of good bonding effect and high temperature resistance, high reliability and high stability.

Abstract: A variable resistor according to the present invention includes a substrate, a resistive element disposed on a first surface of the substrate, oil that coats an upper surface of the resistive element, and a slide member that slides on the upper surface of the resistive element coated with the oil, wherein an output of the variable registor changes as a position at which the slide member makes contact with the resistive element changes. The variable resistor further includes an oil repellent part that surrounds at least a part of the resistive element in plan view viewed from above the first surface of the substrate, the oil repellant part having surface free energy smaller than that of the resistive element, whereby oil can be stably held on a resistive element surface without forming irregularities on the resistive element surface.

Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 ?m or more and 5.0 ?m or less (i.e., from 1.3 ?m to 5.0 ?m), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: Disclosed is a superconducting magnet with improved thermal and electrical stabilities and a method for manufacturing the same. The superconducting magnet includes a bobbin disposed at a center of the superconducting magnet, a superconducting winding wound around an outer face of the bobbin, and an epoxy impregnated at an exterior of the superconducting winding, wherein the epoxy contains carbon nanotubes.

Abstract: A filter device includes a first filter including series resonators and parallel resonators, a first inductor connected in parallel between a first terminal and the first filter, a second inductor provided in series between the first filter and a second terminal, and a third inductor provided in series in a channel connecting the parallel resonator and ground, the third inductor is incorporated in a multilayer substrate, the first filter is mounted on a main surface of the multilayer substrate and incorporated in a filter chip, and the first inductor and the second inductor are chip inductors including coil conductors and are mounted on the main surface of the multilayer substrate beside the filter chip so as to be adjacent to each other and such that coil axes thereof are orthogonal or substantially orthogonal to each other.

Abstract: Provided is an inductor stack structure. The inductor stack structure include a substrate; at least two metal layers sequentially stacked on one side of the substrate, each metal layer at least comprises a first plane inductor; a through hole, which is located between any two neighboring metal layers, first plane inductors in different metal layers are electrically connected through the through hole; and a thickness of the through hole is greater than that of the metal layer.

Abstract: An 8-shaped inductive coil device that includes a first and a second spiral coils and a connection segment structure is provided. The first spiral coil includes first metal segments and crossing connection segments disposed at a first and a second metal layers respectively and includes first connection terminals. The second spiral coil includes second connection terminals. The connection segment structure electrically couples the first and the second connection terminals. The first and the second spiral coils are disposed along an imaginary line passing through a central region of each of ranges surrounded by the first and the second spiral coils. The connection segment structure and the crossing connection segments electrically couple the part of the first metal segments substantially vertical to the imaginary line, and the connection segment structure and the crossing connection segments are disposed substantially on the imaginary line.

Abstract: A power inductor includes a housing and a magnetic core disposed in the housing. The core includes a first segment and a second segment spaced apart from each other to define a gap. The first and second segments are supported in the housing such that the they are movable relative to each other to increase and decrease the size of the gap. A fluid having a positive thermal expansion coefficient is disposed in the housing such that expansion and contraction of the fluid due to change in temperature increases and decreases the gap, respectively.

Abstract: Disclosed is a magnetic core having improved reliability. The magnetic core includes 37 to 44 mol % of manganese (Mn), 9 to 16 mol % of zinc (Zn), 42 to 52 mol % of iron (Fe), a magnetic additive, and a non-magnetic additive, wherein the magnetic core has a permeability of 2,900 or more and a core loss of 500 mW/cm3 or less.

Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

Abstract: A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.

Abstract: Disclosed herein is a symmetric split planar transformer in the context of a DC-DC isolated converter. The symmetric split planar transformer reduces or eliminates asymmetry in the distribution of parasitic capacitance across the isolation barrier going from one end to another end of a primary coil, and as a result, undesirable electromagnetic interference (EMI) due to common mode dipole emission across the isolation barrier may be reduced. In some embodiments, the primary winding is split into at least a first coil and a second coil, each occupying a different area side-by-side on a substrate. The transformer is symmetric in the sense that a capacitive coupling of the first coil to a secondary winding is the same as a capacitive coupling of the second coil to the secondary winding, such that common mode EMI may be reduced. Each coil may include stacked spiral coil portions in multiple metal planes to increase inductive density across the isolation barrier.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple turn units 32 connected in a coil axial direction; wherein each turn unit 32 has, in a cross-sectional view in the width direction of the turn unit 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

Abstract: Disclosed herein is a coil component that includes a winding core part and a wire wound around the winding core part. An i-th turn (i is an integer equal to or larger than 1) to a j-th turn (j is an integer equal to or larger than (i+2)) of the wire are wound in this order around the winding core part in an aligned state. A (j-th+1) turn of the wire is wound around a valley line formed by the i-th turn and a (i-th+1) turn. A (j-th+2) turn of the wire is wound adjacent to the j-th turn around the winding core part.

Abstract: An inductor component that includes an element body; a coil wiring line that is arranged parallel to a first main surface of the element body inside the element body; and a first vertical wiring line and a second vertical wiring line that are buried inside the element body so that end surfaces thereof are exposed from the first main surface of the element body and that are electrically connected to the coil wiring line. In a first cross section that is perpendicular to a direction in which the coil wiring line extends and intersects the first vertical wiring line, a top surface of the coil wiring line contacts a bottom surface of the first vertical wiring line and the top surface of the coil wiring line is substantially shaped like a convex surface.

Abstract: A coil component includes a main body portion containing resin, a coil provided in the main body portion, and an outer electrode electrically connected to the coil. A recess extending from a top surface of the main body portion toward a bottom surface thereof is provided in the side surface of the main body portion. The outer electrode is disposed in the recess, and a wall layer is interposed between the outer electrode and the inner surface of the recess.

Abstract: The inductor includes a coil including a winding portion formed by winding a conductor wire having an insulating coating and lead-out portions extended from the winding portion, and a body made of a magnetic portion including magnetic powder and resin, and containing the coil, and outer electrodes on a body surface. The body includes a mounting surface, an upper surface opposite the mounting surface, a pair of opposing end surfaces adjacent to the mounting and upper surfaces, and a pair of opposing side surfaces adjacent to the mounting surface, the upper surface, and the end surfaces. End portions of the lead-out portions respectively have a flat portion exposed from the body surface, a covered portion adjacent to the flat portion at at least one of the end portions covered with the magnetic portion, and the flat portion is electrically connected to the outer electrode.

Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.

Abstract: A multilayer coil component includes an element body and a plurality of coil conductors. The element body includes a plurality of metal magnetic particles and resin existing between the plurality of metal magnetic particles. The plurality of coil conductors is disposed in the element body, the plurality of coil conductors being separated from each other in a predetermined direction and electrically connected to each other. The plurality of metal magnetic particles included in the element body includes a plurality of metal magnetic particles having a particle size equal to or greater than one third of a distance between the coil conductors adjacent to each other in the predetermined direction and equal to or less than a half of the distance. Between the coil conductors adjacent to each other in the predetermined direction, the metal magnetic particles having the particle size are distributed along the predetermined direction.

Abstract: A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and including a plurality of wall surfaces respectively connecting the one surface and the other surface, a coil portion embedded in the body, first and second external electrodes spaced apart from each other on one surface of the body, and respectively connected to the coil portion, a groove formed continuously along an edge of the other surface of the body, and a stress relieving portion disposed on the other surface of the body to fill at least a portion of the groove.

Abstract: Provided are a large area type complex magnetic field shielding sheet and a wireless power transfer module including the same. A large area type complex magnetic field shielding sheet wherein at least one of an overall width, an overall length, and a diameter is 100 mm or more may include a main shielding layer arranged so that a plurality of ferrite block bodies each having a predetermined area are adjacent to each other, and an auxiliary shielding layer formed of at least one magnetic sheet having a predetermined area and laminated on the main shielding layer through an adhesive layer, wherein a boundary region between two ferrite block bodies disposed to be adjacent each other is disposed to be located in an inner region of the magnetic sheet and thus a magnetic field which leaks into a gap between the two ferrite block bodies is blocked by the magnetic sheet.

Abstract: A transformer includes a tank with an insulating fluid, a radiator for cooling the insulating fluid, and one or more sensors arranged to measure insulating fluid properties in a location where the insulating fluid has a lower temperature.

Abstract: A superconducting device includes a first superconducting wire configured to carry a first current in a superconducting state, and to generate thermal energy upon occurrence of a hot spot during conduction. The device includes a second superconducting wire, thermally coupled to and electrically isolated from the first superconducting wire. The second superconducting wire is configured to conduct a second current in a superconducting state below, but sufficiently near its critical surface to be quenched to a non-superconducting state upon conduction of the thermal energy from the first superconducting wire.

Abstract: The present disclosure generally relates to a storage device comprising soft bias structures having high coercivity and high anisotropy, and a method of forming thereof. The soft bias structures may be formed by moving a wafer in a first direction under a plume of NiFe to deposit a first NiFe layer at a first angle, moving the wafer in a second direction anti-parallel to the first direction to deposit a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The soft bias structures may be formed by rotating a wafer to a first position, depositing a first NiFe layer at a first angle, rotating the wafer to a second position, depositing a second NiFe layer at a second angle on the first NiFe layer, and repeating one or more times. The first and second NiFe layers have different grain structures.

Abstract: An electronic component includes a body including a plurality of dielectric layers, and a plurality of internal electrodes disposed with a corresponding one of the dielectric layers interposed therebetween; and an external electrode disposed on the body and connected to at least one of the plurality of internal electrodes. One of the plurality of internal electrodes includes an alloy metal including nickel, tin and aluminum. One of the plurality of internal electrodes includes a core internal electrode including a first surface and a second surface opposing each other, and a capping internal electrode disposed on the first surface of the core internal electrode and the second surface of the core internal electrode. The capping internal electrode includes a first alloy region including an alloy of nickel and aluminum.

Abstract: A multilayer ceramic capacitor includes a laminate and an external electrode. The laminate includes a central layer portion in which first and second internal electrode layers are alternately laminated with a dielectric ceramic layer therebetween, a peripheral layer portion sandwiching the central layer portion in a lamination direction, and a side margin sandwiching the central layer portion and the peripheral layer portion in a width direction. When viewing the laminate and the first external electrode through a cross-section parallel to the width direction and the lamination direction at a central portion in a length direction of the first external electrode, W1>R1 is satisfied and T1>R1 is satisfied.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

Abstract: A capacitor component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween, and a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth and sixth surfaces of the body, and respectively disposed on the fifth and sixth surfaces of the body.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first edge face and a second edge face of the multilayer structure, wherein: a concentration of Mo with respect to a main component ceramic of an end margin region and a side margin region is lower than a concentration of Mo with respect to a main component ceramic of the dielectric layers in the multilayer structure.

Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.

Abstract: An electronic component includes an element body having a dielectric and an inner electrode. The electronic component also includes at least one external electrode. Each external electrode includes a base layer, a plating layer and a covering layer. The base layer is formed on a plurality of surfaces of the element body to have a plurality of faces facing different directions. The base layer is connected to the inner electrode, and contains a metal. The plating layer is formed on a mounting face of the base layer and on a side face of the base layer to which the inner electrode is connected. The covering layer is formed on at least a portion of a face of the base layer, which is opposite to the mounting face of the base layer. A surface of the covering layer is less wettable than a surface of the plating layer by solder.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode, the ceramic body including a protective portion and a functional portion, the protective portion including an end surface facing in a first direction, circumferential surfaces connected to the end surface and extending in the first direction, and a ridge that includes a recess extending along the first direction and connects the circumferential surfaces, the functional portion being disposed inside the protective portion, the external electrode including a base film covering the end surface, an intermediate film formed on the base film, and a surface film formed on the intermediate film, the base film including a first covering portion formed on the end surface, second covering portions formed on the circumferential surfaces, and a third covering portion formed on the recess and spaced apart from at least one second covering portion, the intermediate film continuously covering the first, second, and third covering po

Abstract: The present invention relates to an energy storage device comprising a flexible substrate comprising at least two patterned regions spaced apart from one another along the length of the flexible substrate. Each patterned region comprises at least one groove extending in the longitudinal direction of the substrate (web direction) having a first and a second face, wherein the first and second faces are each coated with a conductor such that there is no direct electrical communication between the conductor on the first and second faces, the at least one groove contains a material for storing electrical potential energy (e.g. capacitive material), the first and the second face of the at least one groove of each patterned region are each in electrical connection with an electrical conductor at opposing edges of the flexible substrate, and the first and the second patterned region are electrically connectable to one another.

Abstract: A film capacitor includes: a main body portion including a first metallized film including a first metal film on a first face of a first dielectric film, and a second metallized film including a second metal film on a second face of a second dielectric film; and external electrodes. The first or second dielectric film is located between the first and second metal films. The external electrodes are disposed on main body ends so as to be electrically connected with the first or second metal film. At least one of the first and second metal films includes a first portion which has a film thickness of 20 nm or more and is located in proximity to the main body ends, and the first portion includes a first groove extending in the first direction and being in contact with corresponding one of the main body ends.

Abstract: A capacitor and a method for producing a capacitor are disclosed. In an embodiment, a capacitor includes a winding having a cathode foil, an anode foil, separators arranged therebetween and a projection region in which the cathode foil projects beyond the anode foil, wherein, in the projection region, a plurality of layers of the cathode foil are arranged to form a bundle and are directly electrically connected to one another.

Abstract: A composition of matter having the following chemical structure: ? H x ? O ( x - 1 ) 2 ? ? Z y wherein x is and odd integer ?3; y is an integer between 1 and 20; and Z is one of a monoatomic ion from Groups 14 through 17 having a charge value between ?1 and ?3 or a polyatomic ion having a charge between ?1 and ?3.

Abstract: A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, wherein the solid electrolyte includes a conductive polymer layer, and a moisture barrier that overlies the conductive polymer layer.

Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, an alloy layer disposed on the first major surface of a substrate, and tantalum material disposed on the alloy layer such that the alloy layer is between the tantalum material and the first major surface of the substrate. The tantalum material includes bonded tantalum particles. The electrical component can also include a dielectric layer disposed on the tantalum particles, a cathode electrode disposed over the tantalum material, and an anode electrode disposed on the second major surface of the substrate.

Abstract: An apparatus is disclosed which includes an electrolytic capacitive element with multiple capacitor sections, a pressure interrupter cover assembly, and a conductor configured to electrically connect a common terminal of the multiple capacitor sections to a common cover terminal. Each first terminal of the multiple capacitor sections is electrically connected to one of a plurality of capacitor cover terminals.

Abstract: A novel electrode and associated method of manufacturing said novel electrode comprising a porous structure having absorbed polystyrene sulfonate (PSS), a self-assembled polypyrole (PPy) layer adjacent to the PSS absorbed porous structure, a self-assembled polyaniline (PANI) layer adjacent to the PPy layer, an electrochemically deposited PANI layer adjacent to the PPy layer and an electrochemically deposited PANI-molybdenum disulfide (PANI-MoS2) layer adjacent to the electrochemically deposited PANI layer. A supercapacitor and associated method of manufacturing a supercapacitor comprising a first novel electrode and a second novel electrode separated by a polyvinyl gel and a porous separator.

Abstract: The present disclosure provides a keyswitch comprising a baseplate, a circuit layer, an elastic part, a thin film, a keycap, and a linkage component. The circuit layer is disposed on the baseplate. The baseplate penetrates and is exposed from the circuit layer. The elastic part is disposed on the circuit layer. The thin film is disposed on the circuit layer. The thin film is provided with an opening. The baseplate penetrates and is exposed from the opening. The elastic part protrudes from the opening. The keycap is disposed above the elastic part and covers the elastic part. Two ends of the linkage component are respectively connected to the baseplate and the keycap. The elastic part is disposed in the linkage component. The linkage component drives the keycap to move up and down relative to the baseplate. The thin film is disposed on the movement path of the keycap.

Abstract: An operating mechanism for opening and closing at least two contacts simultaneously is provided. The operating mechanism includes a base frame and a bridge body having an elongate contact surface with a length and a width. The elongate contact surface is configured to extend in a length direction over and be in contact with operating rods of the at least two contacts. The operating mechanism further includes a first reaction arm extending substantially parallel to the length of the elongate contact surface and a second reaction arm extending parallel to the first reaction arm and at a distance of the first reaction arm in the direction perpendicular to the elongate contact surface. The operating mechanism also includes a rod mechanism of two links and a cam arranged on a shaft.