Abstract: An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.

Abstract: An electronic component includes an insulating layer that has a principal surface, a passive device that includes a low voltage pattern that is formed in the insulating layer and a high voltage pattern that is formed in the insulating layer such as to oppose the low voltage pattern in a normal direction to the principal surface and to which a voltage exceeding a voltage to be applied to the low voltage pattern is to be applied, and a shield conductor layer that is formed in the insulating layer such as to be positioned in a periphery of the high voltage pattern in plan view, shields an electric field formed between the low voltage pattern and the high voltage pattern, and suppresses electric field concentration with respect to the high voltage pattern.

Abstract: A coil component includes: a core part including: a winding shaft, and a flange part provided on an axial-direction end of the winding shaft, which has an exterior face on the opposite side of the winding shaft, first and second side faces, and first and second groove parts provided on the exterior face and having a cut-out part on each the first and second side faces; a coil part including: a winding part of a conductor wound around the winding shaft, and two lead parts of the conductor led out from the winding part; and two terminal parts formed on the exterior face of the flange part; wherein the two lead parts are led in from the cut-out parts on the first and second side faces and fitted inside the groove parts, respectively, on the exterior face, and included in the pair of terminal parts, respectively.

Abstract: A connection sleeve connects two wire end portions adjacent to each other in an axial direction of a center axis, among wire end portions of flat-type wires that constitute each of a plurality of disc-shaped windings. A through hole allows the flat-type wire to be inserted from both sides. A pair of pressed portions sandwich the flat-type wire inserted in the through hole therebetween. At least one of a pair of end portions has a slit that divides an end surface when viewed from the direction in which a pair of end portions are aligned.

Abstract: Systems and methods for forming a magnetically-enabled part via additive manufacturing. The method includes depositing a layer of additive manufacturing material on a build plate, melting or sintering the layer of additive manufacturing material, depositing additional layers of additive manufacturing material on previous layers of additive manufacturing material, the additive manufacturing material of at least some of the additional layers being magnetically permeable, and melting or sintering the additional layers of additive manufacturing material such that the magnetically-enabled part has a transition region including at least some of the magnetically permeable additive manufacturing material.

Abstract: An apparatus comprising a signal transformer coupled to a power line and a signal transmission, reception, or detection circuit. A sensor is configured to be responsive to the power line current or magnetic flux generated in a ferrite core of the signal transformer. When the sensor indicates that the flux generated by the power line current mat cause an attenuation of the signal strength, a second circuit generates a current through a flux cancelling winding that cancels at least some of the flux generated by the power line current.

Abstract: In a solenoid valve, a length in an axial direction from a stator core end surface to a bottom portion of a yoke is equal to or longer than a total length in the axial direction of a shaft and a plunger. When the shaft and the plunger move to the bottom portion side, the stator core end surface and the spool end surface come into contact with each other so as to restrict a movement of a spool. A groove portion, which communicates a space formed by the stator core, the spool, and the shaft with an accommodating portion when the stator core end surface and the spool end surface come into contact with each other, is formed on at least one of the stator core end surface and the spool end surface, and a communication hole communicates an inside and an outside of the accommodating portion.

Abstract: A solenoid contains a yoke, a bobbin having an electromagnetic coil disposed inside the yoke, and an iron core disposed inside the bobbin. In the solenoid, a connector part incorporating a prescribed number of terminal metal fittings is provided on one end portion of the bobbin.

Abstract: An electrochemical device electrode includes a conductive polymer as an active material. The conductive polymer has a grain shape, and an intensity distribution pattern obtained by X-ray diffraction measurement with respect to the conductive polymer has a first peak in which a diffraction angle 2? ranges from 18° to 21°, inclusive, and a second peak in which a diffraction angle 2? ranges from 24° to 26°, inclusive.

Abstract: An electrochemical energy storage device comprises: a cover plate (4), comprising a lead-out bar (41) and a fixing plate (42), wherein the lead-out bar (41) is a conductor, the fixing plate (42) is an insulator, and the lead-out bar (41) vertically passes through the fixing plate (42) and is fixed thereon; a housing (9), which is cylindrical and is provided with an opening at at least one end thereof, wherein the insulating fixing plate (42) and the opening of the housing (9) are connected in a sealed manner by means of a sealing ring (2); and a rolled core (7), provided in an inner cavity of the housing (9), wherein the rolled core (7) is conductively connected to the lead-out bar (41) by means of an upper connecting piece (6), and is conductively connected to another lead-out end of the housing (9) by means of a lower connecting piece (8); and the device further comprises: a welding ring (1), conductively connected to the housing (9) by means of welding, and a welding bar (3), conductively connected to the

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABO3 as a main phase, and includes a region in which Dy is solid solubilized. In the region in which the Dy is solid solubilized, an X-ray count of Dy solid-solubilized in an A-site of the perovskite structure measured by using Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy (STEM-EDS) is AD, an X-ray count of Dy solid-solubilized in a B-site of the perovskite structure is BD, and an average value of AD/BD is 1.6 or more and 2.0 or less.

Abstract: A dielectric ceramic composition includes a base material main component of barium titanate and a subcomponent. A microstructure of the dielectric ceramic composition after sintering includes a first grain having a Ca content of less than 3.5 at % and a second grain having a Ca content of 3.5 to 13.5 at %, and an area ratio of the second grain to an area of the total grains is 70% to 95%.

Abstract: A board terminal electrode component includes a board, and a pair of land pads spaced apart from each other on a surface of the substrate. The pair of land pads respectively include inner ends which are proximal to each other in an arrangement direction, and outer ends farther from each other in the arrangement direction than the inner ends. The pair of land pads respectively include expanding width portions expanding in a width direction from the inner end toward the outer end. The pair of land pads respectively include insulators on a surface of an end portion of the outer end of the land pads.

Abstract: A ceramic electronic component includes an element body, a first external electrode, and a second external electrode. The element body includes a dielectric, at least one first internal electrode, and at least one second internal electrode laminated over the first internal electrode via the dielectric interposed therebetween. The element body has a top surface, a bottom surface, a pair of side surfaces, a first end surface, and a second end surface, thereby the element body having a generally cuboid shape. The first internal electrode is exposed on the first end surface. The second internal electrode is exposed on the second end surface. The side surfaces of the element body are concavely curved along a longitudinal direction, so that the element body has a longitudinal central part at which a width is less than a width at the end surface. The first external electrode is formed on the first end surface and electrically connected with the first internal electrode.

Abstract: A multilayer ceramic capacitor includes a ceramic element body including ceramic layers and internal electrode layers, and a pair of external electrodes on both end surfaces of the ceramic element body so as to be electrically connected to the internal electrode layers. Each of the external electrodes includes a base electrode layer and a resin external electrode layer stacked on the base electrode layer. The resin external electrode layer includes a thermosetting resin and a metal powder and amine, isocyanate, epoxy, mercapto, and/or ureido silane coupling agents.

Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrode layers alternately laminated therein, two outer layer portions respectively provided on both sides of the inner layer portion in a lamination direction, and two side gap portions respectively provided on both side surfaces of the inner layer portion and the outer layer portions, in a width direction intersecting the lamination direction, and external electrodes respectively provided on both end surfaces of the multilayer body in a length direction intersecting the lamination direction and the width direction, and each connected to the internal electrode layers, wherein nickel and magnesium are segregated between the side gap portions and the outer layer portions.

Abstract: A method for producing an electrical switch contact arrangement for a vacuum circuit breaker includes the following steps: a) providing two electrical contact pieces made of copper or a copper alloy; b) coating the electrical contact pieces with aluminum or an aluminum alloy, the coating of the contact pieces taking place by means of a cold gas spraying method; c) welding each of the sides coated in method step b) to a current transfer contact; and d) arranging the units obtained in method step b) inside the vacuum circuit breaker. There is also described an electrical switch contact arrangement for a vacuum circuit breaker with the contact pieces produced by the method according to the invention.

Abstract: A keyboard device with a display panel including a base, a scissors feet assembly movably disposed on the base, an elastic member disposed on the base, a display panel supported by the scissors feet assembly and the elastic member, and multiple light transmittance keycaps disposed on the display panel is provided. The display panel has multiple display surfaces, multiple hollow portions, and multiple elastic portions. Each of the display surfaces is surrounded by the hollow portions, and is suspended between the hollow portions by the elastic portions. The light transmittance keycaps respectively and correspondingly cover the display surfaces.

Abstract: A method of assembly for a switch within a user interface for a home appliance includes housing a circuit board within the user interface. The circuit board has at least one mechanically actuated switch having a first area. An input interface of the user interface has a button defining a second area, greater than the first area, and having an actuator corresponding to the switch. The button is coupled to at least one of the circuit board or the input interface for relative movement between an actuation position, where the actuator actuates the switch, and a non-actuation position, where the actuator does not actuate the switch.

Abstract: An arc path forming part and a direct-current relay are disclosed. An arc path forming part according to an embodiment of the present invention comprises: a magnet frame extending in the length direction; and a plurality of main magnet portions placed in the length direction. The respective opposing surfaces of the main magnet portions facing each another have the same polarity. Therefore, magnetic fields in the direction of pushing away from each other are generated in a space between the respective main magnet portions. Due to the magnetic fields, an electromagnetic force in the direction toward the outside of the arc path forming part is formed. Accordingly, the generated arc is moved in the direction of the electromagnetic force and can be stably extinguished. Therefore, various members positioned in the central part of the direct-current relay are prevented from damages caused by the arc.

Abstract: A vacuum valve includes: a vacuum vessel; a cylinder; a partition wall separating an inside of the vacuum vessel from an inside of the cylinder; a movable conductor penetrating the partition wall being movable in an axial direction; a fixed contact fixed inside the vacuum vessel; a moving contact integrated with the movable conductor and being capable of separating from the fixed contact and coming into contact with the fixed contact in association with movement of the movable conductor; a lid that covers an end of the cylinder, the end being on a side opposite to the partition wall; a connecting rod penetrating the lid and coupled to the movable conductor via an insulating rod as an insulator; and a holder that holds the connecting rod while preventing movement of the connecting rod toward the fixed contact in a state where the moving contact is separated from the fixed contact.

Abstract: A switch device includes a phase change switch and a memory for storing a target state of the phase change switch. A controller determines a phase state of the phase change switch, and, if the state of the phase change switch does not correspond to the target state, controls a heater of the phase change switch to change the state of the phase changes switch to the target state.

Abstract: A protection element (10) of the present invention has a substrate (11), a first fuse element (12) and a second fuse element (13) connected in series on the substrate (11), a heater (14) connected between the first fuse element (12) and the second fuse element (13), a third upper electrode part (17) connected between the first fuse element (12) and the second fuse element (13) and connected to the heater (14) in series, a first conduction part (18) connected to the third upper electrode part (17) and having a lower resistance value than the heater (14), and a third lower electrode part (19) connected to the first conduction part (18) and configured to be connectable to an external protection circuit.

Abstract: The present disclosure relates to a semiconductor circuit breaker, and more specifically, to a semiconductor circuit breaker provided with a detachable interface module. The semiconductor circuit breaker, according to one embodiment of the present disclosure, comprises: a circuit breaker main body connected to a main circuit and provided with a module receiving unit on the outer surface thereof; and an interface module provided independently from the circuit breaker main body and detachably coupled to the module receiving unit. The circuit breaker main body comprises: a terminal cover rotatably coupled to a terminal unit of the circuit breaker main body; and an interlock member provided to the circuit breaker main body and restricting or releasing the opening of the terminal cover. The interface module comprises an interlock driving unit for operating the interlock member.

Abstract: In some embodiments, an electrical device can include a body having a shape that extends along a longitudinal direction, and a set of electrodes implemented on the body at different locations along the longitudinal direction and configured to allow the electrical device to be positioned and mounted to a surface. The set of electrodes can include first and second electrodes configured to provide first and second engagements with the surface, respectively, and to allow a settling motion when the electrical device is positioned on the surface. The set of electrodes can further include a selected electrode having a side configured to allow the settling motion and an engagement portion configured to stop the settling motion and thereby provide a third engagement with the surface.

Abstract: An object of the invention is to acquire a high-quality image while maintaining an improvement in throughput of image acquisition (measurement (length measurement)). The present disclosure provides a charged particle beam system including a charged particle beam device and a computer system configured to control the charged particle beam device. The charged particle beam device includes an objective lens, a sample stage, and a backscattered electron detector that is disposed between the objective lens and the sample stage and that adjusts a focus of a charged particle beam with which a sample is irradiated. The computer system adjusts a value of an electric field on the sample in accordance with a change in a voltage applied to the backscattered electron detector.

Abstract: A system and method of a tilt-column electron beam imaging system is disclosed. The system may include an imaging sub-system. The imaging sub-system may include a plurality of electron beam sources configured to generate a plurality of beamlets. The imaging sub-system may further include a plurality of tilt-illumination columns, where a respective tilt-illumination column is configured to receive a respective beamlet from a respective electron beam source. For the system and method, a first tilt axis of a first tilt-illumination column may be orientated along a first angle and at least one additional tilt axis of at least one additional tilt-illumination column may be orientated along at least one additional angle different from the first angle, where each of the plurality of beamlets pass through a first common crossover volume.

Abstract: A charged particle buncher includes a series of spaced apart electrodes arranged to generate a shaped electric field. The series includes a first electrode, a last electrode and one- or more intermediate electrodes. The charged particle buncher includes a waveform device attached to the electrodes and configured to apply a periodic potential waveform to each electrode independently in a manner so as to form a quasi-electrostatic time varying potential gradient between adjacent electrodes and to cause spatial distribution of charged particles that form a plurality of nodes and antinodes. The nodes have a charged particle density and the antinodes have substantially no charged particle density, and the nodes and the antinodes are formed from a charged particle beam configured to hit the target.

Abstract: Systems and methods for multi-level pulsing of a parameter and multi-level pulsing of a frequency of a radio frequency (RF) signal are described. The parameter is pulsed from a low level to a high level while the frequency is pulsed from a low level to a high level. The parameter and the frequency are simultaneously pulsed to increase a rate of processing a wafer, to increase mask selectivity, and to reduce angular spread of ions within a plasma chamber.

Abstract: A radio-frequency (RF) power supply apparatus includes a first power supply, a second power supply, and a matching device connected to the first/second power supplies. The first power supply supplies first RF power to a load by outputting first RF voltage with a first fundamental frequency. The second power supply supplies second RF power to the load by outputting second RF voltage with a second fundamental frequency lower than the first fundamental frequency. The matching device generates a clock signal with a frequency higher than the first fundamental frequency and provides the clock signal to the first power supply. The first power supply generates, by using the clock signal, a waveform signal with the same cycle as the second RF voltage. The first power supply performs, by using the clock signal, frequency modulation control on the first RF voltage to be output from the first power supply.

Abstract: Proposed is a reactor that is formed by assembling a plurality of components. The reactor includes a body, in which a plurality of components are assemble, and that has a plasma forming space in an interior thereof, and an assembly line for the components is formed in an area that deviates from an area that is closest to an area of the plasma forming space of the body, in which plasma is concentrated, by a specific range.

Abstract: A system including a control plate disposed within a processing chamber. The control plate includes a set of plasma elements designed to independently expose a substrate disposed within the processing chamber to plasma related fluxes. The control plate is designed to independently activate the set of plasma elements. When activated the associated plasma elements expose the substrate to the plasma related fluxes and when not activated the associated plasma elements prevent exposure of the substrate to the plasma related fluxes. The control plate is designed to perform individual time-dependent activation of the set of plasma elements to selectively expose the substrate to the plasma related fluxes.

Abstract: A gas distribution apparatus is provided having a first reservoir with a first upstream end and a first downstream end and a second reservoir with a second upstream end and a second downstream end. A reservoir switch valve is in fluid communication with the first downstream end of the first reservoir and the second downstream end of the second reservoir. The reservoir switch valve operable to selectively couple the first reservoir to an outlet of the reservoir switch valve when in a first state, and couple the second reservoir to the outlet of the reservoir switch valve when in a second state. A plurality of proportional flow control valves are provided having inlets coupled in parallel to the outlet of the reservoir switch valve The plurality of proportional flow control valves have outlets configured to provide gas to a processing chamber.

Abstract: There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supply system configured to supply a processing gas into the process chamber; a first plasma generator installed to be wound around an outer periphery of the process chamber and configured to generate plasma from the processing gas in the process chamber; and a second plasma generator installed at an upper portion of the process chamber to protrude toward an inside of the process chamber and configured to generate plasma from the processing gas in the process chamber.

Abstract: A component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.

Abstract: A semiconductor manufacturing apparatus includes a heating part, a first electrode, a first insulating part, a gas supply part, a second electrode, and a second insulating part. The heating part is arranged to be in one surface side of a substrate. The first electrode is arranged around the heating part. The gas supply part is arranged to be in another surface side of the substrate. The second electrode is arranged around the gas supply part. The first electrode and the second electrode are arranged to overlap with an outer edge portion of the substrate, which is a region existing from an outer peripheral end of the substrate to a position inside by a predetermined length, in a direction in which the first electrode and the second electrode face each other. The first electrode is arranged to be in contact with part of the outer edge portion on the one surface side.

Abstract: A plasma processing apparatus of the present disclosure includes a chamber, a shutter, and a contact portion. The chamber has an opening in a sidewall thereof so as to carry a wafer W into the chamber through the opening, and performs therein a predetermined processing on the wafer W by plasma of a processing gas supplied thereinto. The shutter opens or closes the opening by moving along the sidewall of the chamber. The contact portion is formed of a conductive material, and is not in contact with the shutter while the shutter is moving. When the shutter is in the position for closing the opening, the contact portion is displaced in a direction different from the direction of movement of the shutter to come into contact with the shutter.

Abstract: A method of monitoring a substrate processing apparatus includes applying a high-frequency radio frequency (RF) power signal and a low-frequency RF power signal from a bias power supply apparatus to an electrostatic chuck of a process chamber through a matching circuit. The method further includes applying a direct current (DC) power signal from a DC power supply apparatus to an edge ring of the process chamber through a high-frequency filter and a low-frequency filter. The method further includes measuring a low-frequency RF voltage value at a first point between the matching circuit and the electrostatic chuck, measuring the low-frequency RF voltage value at a second point between the high-frequency filter and the low-frequency filter, and acquiring a voltage ratio between the low-frequency RF voltage value at the first point and the low-frequency RF voltage value at the second point. The method further includes monitoring a state of the edge ring by comparing a threshold with the voltage ratio.

Abstract: A ring assembly includes: an outer insulating ring on an upper outer periphery of a substrate stage; an edge ring on the outer insulating ring around a wafer seated on the substrate stage; and a shadow ring on the outer insulating ring and the edge ring to be movable up and down within a predetermined stroke range and to cover an edge region of the wafer. An upper surface of the edge ring is located higher than an upper surface of the wafer by a predetermined height. The shadow ring includes an annular body portion, and a recess in a bottom surface of the body portion to receive at least a portion of a protruding upper portion of the edge ring. The shadow ring is spaced apart from the outer insulating ring and the edge ring by a predetermined distance to form a flow path for gas flow therebetween.

Abstract: Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

Abstract: A temperature adjustment method includes adjusting a temperature of a placing table on which a target object is placed. The placing table is divided into regions and equipped with temperature detectors. The regions are set along a placing surface of the placing table. The temperature detectors are disposed in the regions, respectively. The placing table is equipped with heat exchange chambers each configured to perform heat exchange by a coolant. The heat exchange chambers are disposed in the regions, respectively. The adjusting of the temperature of the placing table includes adjusting a pressure of the coolant such that the temperature of the placing table reaches a first temperature range; and individually adjusting, after the adjusting of the pressure of the coolant, flow rates of the coolant supplied to the heat exchange chambers, respectively, such that all of temperatures measured by the temperature detectors reach the first temperature range.

Abstract: Exemplary semiconductor processing systems may include a pumping system, a chamber body that defines a processing region, and a pumping liner disposed within the processing region. The pumping liner may define an annular member characterized by a wall that defines an exhaust aperture coupled to the pumping system. The annular member may be characterized by an inner wall that defines a plurality of apertures distributed circumferentially along the inner wall. A plenum may be defined in the annular member between interior surfaces of the walls. A divider may be disposed within the plenum, where the divider separates the plenum into a first plenum chamber and a second plenum chamber, wherein the first plenum chamber is fluidly accessible from the apertures defined through the inner wall, and wherein the divider defines at least one aperture providing fluid access between the first plenum chamber and the second plenum chamber.

Abstract: A liquid sample introduction system for a plasma spectrometer includes a sample container for holding a liquid sample, a surface acoustic wave (SAW) nebulizer, arranged to receive a liquid sample from the sample container, an electronic controller for supplying electrical power to the SAW nebulizer so as to produce a surface acoustic wave on a surface of the SAW nebulizer, for generating an aerosol from the supplied sample liquid, and an aerosol transport arrangement for receiving the aerosol from the SAW nebulizer and carrying it into a plasma or flame of a spectrometer. The electronic controller is further configured to control the electrical power to the SAW nebulizer so as to permit adjustment of the aerosol parameters, and to control the aerosol transport arrangement so as to permit adjustment of the aerosol delivery into the plasma or flame of the spectrometer.

Abstract: The invention provides an analytic nebuliser device for delivering a sample in aerosolised form, the device comprising a nebuliser nozzle configured to receive a flow of said sample and generate a plume of aerosolised sample spray and a chamber configured to receive a flow of make-up gas and connecting with a plurality of microchannels having outlets arranged around and adjacent to said nebuliser nozzle wherein the microchannels are configured to produce a make-up gas stream with high linear velocity around said aerosolised sample spray to shape and direct said plume. The invention extends to a mass spectrometry or spectroscopy system including the above analytic nebuliser device, to provide in operation the aerosolised sample spray to an ionisation device of the system.

Abstract: Method for producing multiply-charged helium nanodroplets and charged dopant clusters and nanoparticles out of the helium nanodroplets, the method comprising: •producing neutral helium nanodroplets in a cold head (1) via expansion of a pressurized, pre-cooled, supersonic helium beam of high purity through a nozzle (3) into high vacuum with a base pressure under operation preferably below 20 mPa, •ionizing the helium nanodroplets by electron impact (15), wherein the electron impact (15) leads to multiply-charged helium nanodroplets, •doping the charged helium nanodroplets with dopant vapor in the pickup cell (19), wherein the doped nanodroplets form cluster ions with the initial charges acting as seeds, wherein the size of the nanoparticles can vary from a few atoms up to 105 atoms by arranging the size of the neutral helium nanodroplets, the charge of the helium nanodroplets and the density of dopant vapor in the pickup cell (19).

Abstract: The invention generally relates to mass spectrometers that utilize ionic wind and methods of use thereof.

Abstract: The invention provides an apparatus for cleaning semiconductor wafers. The apparatus includes at least one first tank, containing cleaning chemical, configured to implement batch cleaning process; one or more second tanks, containing cleaning liquid, configured to implement batch cleaning process; one or more single wafer cleaning modules, configured to implement single wafer cleaning and drying processes; a plurality of robots, configured to transfer one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules; and a controller, configured to control the plurality of robots to transfer the one or more wafers to the at least one first tank and the one or more second tanks successively, and then to the one or more single wafer cleaning modules.

Abstract: [Problem] To obtain a substrate cleaning solution capable of cleaning a substrate and removing particles. [Means for Solution] The present invention is a substrate cleaning solution comprising an insoluble or hardly soluble solute (A), a soluble solute (B), and a solvent (C).