Polishes Patents (Class 106/3)
  • Patent number: 8425276
    Abstract: The present invention provides a polishing composition for polishing copper or copper alloy, comprising: an oxidizing agent (A); at least one acids (B) selected from amino acids, carboxylic acids of 8 or less carbon atoms, or inorganic acids; a sulfonic acid (C) having an alkyl group of 8 or more carbon atoms; a fatty acid (D) having an alkyl group of 8 or more carbon atoms; and an N-substituted imidazole (E) represented by the following general formula (1). (In the formula (1), Ra, Rb, and Rc represent H or an alkyl group of 1 to 4 carbon atoms, and Rd represents a group selected from the group consisting of a benzyl group, a vinyl group, an alkyl group of 1 to 4 carbon atoms, and a group in which a portion of H of these groups has been substituted with OH or NH2.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: April 23, 2013
    Assignee: Showa Denko K.K.
    Inventors: Takashi Sato, Hiroshi Takahashi, Yoshitomo Shimazu, Yuji Itoh
  • Patent number: 8361177
    Abstract: Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a barrier film in a shallow trench isolation CMP process needed to fabricate ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 ?m or less) and which decreases the occurrence of scratches on a flattened surface, and a method of polishing a substrate using the same.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: January 29, 2013
    Assignees: K.C. Tech Co., Ltd., IUCF-HYU
    Inventors: Dae Hyeong Kim, Seok Min Hong, Jae Hyun Jeon, Un Gyu Park, Jea Gun Park, Yong Kuk Kim
  • Patent number: 8349062
    Abstract: The invention is directed to a composition for simultaneously washing and waxing an automotive exterior surface. More particularly, this invention relates to a wash and wax composition that imparts a detergent-resistant wax to the vehicle surface. The composition comprises water, nano-scale particles of a wax, a surfactant, n-octyltriethoxysilane, diethoxyoctylsilyl trimethylsilyl ester of silicic acid, and an amino-functional siloxane or tetra(trimethylsiloxy) silane, wherein the wax particles, n-octyltriethoxysilane, diethoxyoctylsilyl trimethylsilyl ester of silicic acid, and amino-functional siloxane or tetra(trimethylsiloxy) silane form an emulsion or dispersion in the water.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: January 8, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Brent R Dunning, Gary M Silvers
  • Publication number: 20120255651
    Abstract: Disclosed is a method of altering the surface behavior of a liquid by adding to the liquid a compound of a Formula (1): Rf—O—(CF2)x(CH2)y—O-(QO)z—H ??(1) Wherein Rf is a linear or branched perfluoroalkyl having 1 to 6 carbon atoms, optionally interrupted by one to three ether oxygen atoms, x is an integer of 1 to 6; y is an integer of 1 to 6; Q is a linear 1,2-alkylene group of the formula CmH2m where m is an integer of 2 to 10; and z is an integer of 1 to 30.
    Type: Application
    Filed: April 7, 2011
    Publication date: October 11, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: CHERYL LYNN IACONELLI, Kenneth Gene Moloy, Sheng Peng, Sourav Kumar Sengupta
  • Publication number: 20120230925
    Abstract: Disclosed is the use of benzotropolone derivatives of formula (1), wherein R1, R2 and R7 independently from each other are hydrogen; C1-C3alkyl; or COR8; R3 is hydrogen; or COOR9 R4 is hydrogen; or C1-C3alkyl; R5 is hydrogen; hydroxy; C1-C3-alkoxy; or -0-(CO)—R10; R6 is hydrogen; C1-C3alkyl; or COR8; or R5 and R6 together may form a five or six membered ring; or R6 and R7 together form a five or six membered ring; and R8, R9, R10 independently of each other are C1-C30alkyl; for protecting body-care and household products from photolytic and oxidative degradation.
    Type: Application
    Filed: October 5, 2010
    Publication date: September 13, 2012
    Applicant: BASF SE
    Inventors: Barbara Wagner, Oliver Reich, Alexander Mantler, Reinhold Öhrlein, Walter Fischer, Albert Schneider
  • Patent number: 8252101
    Abstract: The invention is a method and composition for polishing a wet surface. The invention is a water based composition for polishing wet surfaces and a method of applying the water based composition to polish wet surfaces. The method does not include a dry to haze or buffing step in order to achieve a lasting high gloss shine on the polished surface.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: August 28, 2012
    Inventor: Roman A. Glemba, Jr.
  • Patent number: 8252076
    Abstract: A buffing composition includes an emulsion having an aqueous liquid phase and an oily liquid phase; a solubilized zirconium carboxylate; and fine abrasive particles having a Mohs hardness of at least 4. The fine abrasive particles have a particle size distribution having at least one mode with a particle size of at least 5 micrometers. A method of finishing a surface of a material using the buffing composition is also disclosed.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: August 28, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Ronald J. Israelson, Rajesh K. Katare
  • Publication number: 20120132103
    Abstract: A fluorine-containing compound exhibiting excellent surface tension-reducing ability despite the absence of perfluoroalkyl group having a chain length of 8 or more which had been the cause of the PFOS and PFOA problems and use of a fluorine material with low environmental load is provided. Also provided are a fluorine-containing surfactant and a composition thereof, an aqueous resin emulsion and a floor polish composition containing such surfactant. The fluorine-containing compound is represented by the following formula (1): Rf1—CpH2p—CH(OH)—CqH2q—NR—CrH2r—(O)n—SO3M??(1) wherein Rf1 is a C1-6 perfluoroalkyl group, p, q, and r are independently an integer of 1 to 6, M is a cationic atom or atomic group, n is 0 or 1, R is hydrogen atom, a C1-12 alkyl group, or a group represented by the following formula (2): Rf2—CsH2s—CH(OH)—CtH2t—??(2) wherein Rf2 is a C1-6 perfluoroalkyl group, and s and t are independently an integer of 1 to 6.
    Type: Application
    Filed: July 26, 2010
    Publication date: May 31, 2012
    Applicant: AGC Seimi Chemical Co., Ltd.
    Inventors: Katsuyuki Tsugita, Masato Mitsuhashi
  • Patent number: 8167684
    Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: May 1, 2012
    Assignee: Cabot Microelectronics Corporation
    Inventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen
  • Patent number: 8157876
    Abstract: A wiresaw cutting fluid composition of the present invention comprises about 25 to about 75% by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity modifier that comprises a polymer including a majority of non-ionic monomer units (preferably 100 mol % non-ionic monomer units), has a number average molecular weight (Mn) of at least about 5 kDa, and is present in the composition at a concentration sufficient to provide a Brookfield viscosity for the composition in the range of about 50 to about 1000 cP, e.g., 50 to about 700 cP, at about 25° C. at a spindle rotation rate of about 60 rpm. In one embodiment, the viscosity modifier comprises a polymer having a weight average molecular weight (Mw) of at least about 200 kDa. When a viscosity modifier of 200 kDa or greater Mw is utilized, a preferred wiresaw cutting method the cutting fluid is circulated and applied by pumps and nozzles operating at a relatively low shear rate of not more than about 104 s?1.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: April 17, 2012
    Assignee: Cabot Microelectronics Corporation
    Inventors: Steven Grumbine, Chul Woo Nam, William Ward, Ramasubramanyam Nagarajan
  • Patent number: 8157877
    Abstract: A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: April 17, 2012
    Assignee: JSR Corporation
    Inventors: Norihiko Ikeda, Tomikazu Ueno
  • Patent number: 8147711
    Abstract: Disclosed is an adjuvant for controlling polishing selectivity when polishing a cationically charged material simultaneously with an anionically charged material. CMP slurry comprising the adjuvant is also disclosed. The adjuvant comprises: (a) a polyelectrolyte that forms an adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material; (b) a basic material; and (c) a fluorine-based compound. when the adjuvant for controlling polishing selectivity of CMP slurry according to the present invention is applied to a CMP process, it is possible to increase the polishing selectivity of a silicon oxide layer, to obtain a uniform particle size of CMP slurry, to stabilize variations in viscosity under an external force and to minimize generation of microscratches during a polishing process.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: April 3, 2012
    Assignee: LG Chem, Ltd.
    Inventors: Jung Hee Lee, Jong Pil Kim, Gi Ra Yi, Kwang Ik Moon, Chang Bum Ko, Soon Ho Jang, Seung Beom Cho, Young Jun Hong
  • Publication number: 20120064022
    Abstract: Provided herein are cyclosiloxane-substituted polysiloxane compounds, compositions that include the polysiloxane compounds, and methods for preparation and use of the polysiloxane compounds. Provided are mechanical lubricant compositions, hydraulic fluid compositions, anti-foam compositions, water repellant agent compositions, release agent compositions, personal care compositions, cosmetic compositions, household care compositions and drug delivery compositions that include one or more of the cyclosiloxane-substituted polysiloxane compounds provided herein.
    Type: Application
    Filed: August 4, 2011
    Publication date: March 15, 2012
    Inventors: Daniel X. Wray, Michael B. Halsdorff, Robert L. De Armond
  • Publication number: 20120052195
    Abstract: The invention provides an anti-corrosive package which can be added to release agents used in preparing textiles and molded articles from lignocellulosic materials, concrete and polyurethane foam.
    Type: Application
    Filed: October 31, 2011
    Publication date: March 1, 2012
    Inventors: Joseph F. Massidda, Allan P. Short
  • Publication number: 20120053252
    Abstract: The present invention comprises fluorinated ethoxylated polyurethanes of formula [Rf—(X)n—(CH2CHR1—O)m—CH2CH2—O—C(O)—NH]p-A, wherein Rf is a C1 to C6 perfluoroalkyl; X is a divalent radical; n is 0 or 1; R1 is H or C1 to C4 alkyl; m is 1 to 20; p is a positive integer of at least 2; and A is the residue of a polyisocyanate, and methods for altering surface behavior of liquids using such compounds.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 1, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Michael Henry Ober, Kathleen L. Kanetsky, Allison Mary Yake
  • Patent number: 8114178
    Abstract: The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: February 14, 2012
    Assignees: Nippon Chemical Industrial Co., Ltd., Speedfam Co., Ltd.
    Inventors: Masahiro Izumi, Shinsuke Miyabe, Kuniaki Maejima, Hiroaki Tanaka
  • Patent number: 8080476
    Abstract: To provide a polishing composition particularly useful for an application to polish a conductor layer made of copper in a semiconductor wiring process, and a polishing process employing it. A polishing composition comprising an anionic surfactant and a nonionic surfactant, characterized in that the composition is prepared so that the water contact angle of the surface of an object to be polished, after being polished by the composition, would be at most 60°.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: December 20, 2011
    Assignee: Fujimi Incorporated
    Inventors: Atsunori Kawamura, Masayuki Hattori
  • Publication number: 20110257068
    Abstract: An ultrasonic mixing system having a treatment chamber in which at least two separate phases can be mixed to prepare an emulsion is disclosed. Specifically, at least one phase is a dispersed phase and one phase in a continuous phase. The treatment chamber has an elongate housing through which the phases flow longitudinally from a first inlet port and a second inlet port, respectively, to an outlet port thereof. An elongate ultrasonic waveguide assembly extends within the housing and is operable at a predetermined ultrasonic frequency to ultrasonically energize the phases within the housing. An elongate ultrasonic horn of the waveguide assembly is disposed at least in part intermediate the inlet and outlet ports, and has a plurality of discrete agitating members in contact with and extending transversely outward from the horn intermediate the inlet and outlet ports in longitudinally spaced relationship with each other.
    Type: Application
    Filed: June 1, 2011
    Publication date: October 20, 2011
    Applicant: KIMBERLY-CLARK WORLDWIDE, INC.
    Inventors: Scott W. Wenzel, John Glen Ahles, Thomas David Ehlert, Robert Allen Janssen, David William Koenig, Paul Warren Rasmussen, Steve Roffers, Shiming Zhuang
  • Publication number: 20110201505
    Abstract: An asymmetric organomodified disiloxane surfactant having the formula: MM? wherein M comprises branched hydrocarbon substituents and M? comprises a cationic, anionic or zwitterionic substituent and a polyether substituent that may be combined as one moiety, wherein the disiloxane surfactant has an enhanced resistance to hydrolysis between a pH of about 3 to about 12.
    Type: Application
    Filed: December 26, 2008
    Publication date: August 18, 2011
    Inventors: Mark D. Leatherman, George A. Policello, Wenqing N. Peng, Liping Zheng, Roland Wagner, Suresh K. Rajaraman, Xia Zijun
  • Patent number: 7998228
    Abstract: A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive, about 0.1 to about 10 percent by weight of an alkali metal iodate salt and an aqueous carrier. The composition has a pH of at least about 10. The composition is utilized to polish a surface of a tantalum-containing substrate.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: August 16, 2011
    Assignee: Cabot Microelectronics Corporation
    Inventor: Shoutian Li
  • Patent number: 7998229
    Abstract: The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: August 16, 2011
    Assignee: Fujimi Incorporated
    Inventor: Shuhei Yamada
  • Patent number: 7976624
    Abstract: An aqueous gel wax formulation includes a cationic wax microemulsion and an anionically charged polishing agent having a particle size less than about 200 nanometers and optimally a quaternary ammonium substituted silicone and an amino functional silicone. The components combine to form a gel wax formulation which can be applied without buffing.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: July 12, 2011
    Inventors: Hida Hasinovic, Gefei Wu
  • Patent number: 7964005
    Abstract: A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of copper-containing surfaces is disclosed. The composition is a solution having a pH of equal to or greater than 9 and having an oxidation potential sufficient to oxidize the surface to form non-soluble copper oxides. Also disclosed are methods of making and using the composition.
    Type: Grant
    Filed: April 4, 2004
    Date of Patent: June 21, 2011
    Assignee: Technion Research & Development Foundation Ltd.
    Inventors: Yair Ein-Eli, David Starosvetsky, Esta Abelev, Eugene Rabkin
  • Patent number: 7951717
    Abstract: Post-CMP treating liquids are provided, one of which includes water, an amphoteric surfactant, an anionic surfactant, a complexing agent, resin particles having carboxylic group and sulfonyl group on their surfaces, a primary particle diameter thereof ranging from 10 to 60 nm, and tetramethyl ammonium hydroxide. Another includes water, polyphenol, an anionic surfactant, ethylene diamine tetraacetic acid, resin particles having carboxylic group and sulfonyl group on their surfaces, a primary particle diameter thereof ranging from 10 to 60 nm, and tetramethyl ammonium hydroxide. Both of the treating liquids have a pH ranging from 4 to 9, and exhibit a polishing rate both of an insulating film and a conductive film at a rate of 10 nm/min or less.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: May 31, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuyuki Kurashima, Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano
  • Patent number: 7942945
    Abstract: The proposed slurry can be used to planarize polymeric candidate ILD materials such Benzocylobutene (BCB), SILK, Polyimide, etc. The slurry consists of colloidal suspension of nanoparticle abrasives made up of Tetraethylorthosilicate (TEOS)-derived silica and Zirconium-dioxide (ZrO2), its derivatives and any materials modified from ZrO2 and/or TEOS, in a chemically active medium. The base solution of the slurry consists of deionized (Dl) water, buffering agents like inorganic buffer comprised of inorganic acids such as TRIS-Hcl, its derivatives and variants, cleansing agents, surface modified catalysts, and surface reagents. The organic solvents like isopropyl alcohol, methanol, and other organic alcohols ranging from 0.0005 to 0.05% are employed for active dissolution of the chemical surface complex formed as a result of the slurry chemical action. The inorganic buffer is so chosen that the complex salts resulting from the reaction impart hydrophobicity to the polished thin film surface.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: May 17, 2011
    Assignee: University of South Florida
    Inventors: Parshuram B. Zantye, Arun Kumar, Ashok Kumar
  • Patent number: 7887609
    Abstract: A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film comprising a polyvalent carboxylic acid having a first stage acid dissociation exponent at 25° C. of 3 or lower, colloidal silica, and water, and having a pH from 2 to 4, and a polishing method for polishing an aluminum film using the polishing slurry.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: February 15, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hiroshi Ono, Toranosuke Ashizawa, Yasuo Kamigata
  • Patent number: 7887625
    Abstract: A composition for sealing exposed wood before finishing the wood, which composition includes polymer solids and an acid neutralizing agent. The acid neutralizing agent may be a weak base and/or a buffering agent. The polymer solids may include acrylate monomers, urethane monomers, and the like. Also disclosed is a method of sealing and neutralizing a wood surface before finishing the wood surface by applying the composition to the exposed wood surface.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: February 15, 2011
    Assignee: Harris Research, Inc.
    Inventor: Edward Durrant
  • Patent number: 7879406
    Abstract: A composition for sealing exposed wood before finishing the wood, which composition includes polymer solids and an acid neutralizing agent. The acid neutralizing agent may be a weak base and/or a buffering agent. The polymer solids may include acrylate monomers, urethane monomers, and the like. Also disclosed is a method of sealing and neutralizing a wood surface before finishing the wood surface by applying the composition to the exposed wood surface.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: February 1, 2011
    Assignee: Harris Research, Inc
    Inventor: Edward E. Durrant
  • Patent number: 7875212
    Abstract: Embodiments of the present invention provide polymer matrix nanocomposites reinforced with nano-scale materials such as nanoparticles and carbon nanotubes and methods of fabricating. The nanomaterials are provided within relatively low weight fractions, for example in the range of approximately 0.01 to about 0.4% by weight and distributed within the matrix by a magnetic mixing procedure to provide substantially uniform reinforcement of the nanocomposites. Advantageously, these nanocomposites provide significantly enhanced tensile strength, strain to failure, and fracture toughness over corresponding neat matrices.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: January 25, 2011
    Assignee: University of Hawaii
    Inventors: Mohammad Naghi Ghasemi Nejhad, Vinod P Veedu, Andrea Yuen, Davood Askari
  • Patent number: 7872063
    Abstract: This invention provides film-forming compositions, including but not limited to polishes, coatings, adhesives and inks, comprising a at least one acrylic or vinyl acetate polymer or copolymer as a film-forming ingredient and, as the plasticizer, a blend in specified proportions of a) the benzoate of a 6-carbon monohydric alcohol, b) diethylene glycol dibenzoate and c) diethylene glycol monobenzoate.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: January 18, 2011
    Assignee: Genovique Specialties Holdings Corporation
    Inventors: Arron Strepka, Makarand V. Joshi, William D. Arendt, Jason Butt
  • Patent number: 7867303
    Abstract: A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: January 11, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno, Yuuto Ootuki
  • Patent number: 7857876
    Abstract: Diamond clusters are used as a polishing material of free abrading particles, each being a combination of artificial diamond particles having primary particle diameters of 20 nm or less and impurities that are attached around these diamond particles. The density of non-diamond carbon contained in the impurities is in the range of 95% or more and 99% or less, and the density of chlorine contained in other than non-diamond carbon in the impurities is 0.5% or more and preferably 3.5% or less. The diameters of these diamond clusters are in the range of 30 nm or more and 500 nm or less, and their average diameter is in the range of 30 nm or more and 200 nm or less. Such polishing material is produced first by an explosion shock method to obtain diamond clusters and then removing the impurities such that density of non-diamond carbon contained in the impurities and density of chlorine contained in other than non-diamond carbon in the impurities become adjusted.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: December 28, 2010
    Assignee: Nihon Micro Coating Co., Ltd.
    Inventors: Noriyuki Kumasaka, Yuji Horie, Mitsuru Saito, Kazuei Yamaguchi
  • Patent number: 7854777
    Abstract: A heterocyclic benzene compound such as benzotriazole, is dissolved in at least one substance selected from the group consisting of a primary alcohol having from 1 to 4 carbon atoms, a glycol having from 2 to 4 carbon atoms, an ether represented by the Formula 2 (wherein m is an integer of from 1 to 4), N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, ?-butyrolactone and propylene carbonate, and an aqueous dispersion of fine oxide particles which constitute abrasive grains is mixed therewith, whereby a polishing compound is obtained. By use of this polishing compound in polishing a substrate provided with an insulating film 2 on which a wiring metal film 4 and a barrier film 3 are formed, the formation of an embedded wiring 5 is made possible with low dishing, low erosion and low scratching at a high removal rate.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: December 21, 2010
    Assignees: Asahi Glass Company, Limited, Seimi Chemical Co., Ltd.
    Inventors: Satoshi Takemiya, Norihito Nakazawa, Yoshinori Kon
  • Patent number: 7842129
    Abstract: A coating formulation containing at least one surface-modified silicon dioxide having a 60° reflectometer value of <3 and a black number My of at least 140 has excellent performance properties, for example, a very good transparency.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: November 30, 2010
    Assignee: Evonik Degussa GmbH
    Inventors: Hans-Dieter Christian, Reinhard Behl, Hans-Werner Köhler, Uwe Schmeier, Jürgen Meyer
  • Patent number: 7825178
    Abstract: A floor-polish leveling agent containing an ester compound obtained by reacting a hydroxycarboxylic acid with at least one glycol ether so that substantially all of the carboxyl groups are esterified. The ester compound may be an acetylated ester compound in which one or more hydroxyl groups are acetylated. An aqueous floor-polish composition containing this ester compound and/or acetylated ester compound, and a water-insoluble polymer.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: November 2, 2010
    Assignee: Daihachi Chemical Industry Co., Ltd.
    Inventors: Atsushi Nagata, Yasunori Fujita
  • Patent number: 7820067
    Abstract: The inventive chemical-mechanical polishing system comprises a polishing component, a liquid carrier, an oxidizing agent, and a halogen anion. The inventive method comprises chemically-mechanically polishing a substrate with the polishing system.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: October 26, 2010
    Assignee: Cabot Microelectronics Corporation
    Inventor: Shoutian Li
  • Publication number: 20100267843
    Abstract: A surfactant of formula 1 (Rf-A)a-Q-([B]k—R)b??Formula 1 wherein a and b are each independently 1 or 2; Rf is a linear or branched perfluoroalkyl radical having from 2 to about 20 carbon atoms, optionally interrupted with at least one oxygen; R is a C1 to C20 linear, branched or cyclic alkyl, or a C6 to C10 aryl; B is —(CH2CHR1O)x—, k is 0 or 1, x is 1 to about 20, A is —(CH2)m[(CHR1CH2O)]s—[(CH2)m(CH)tCHOH(CH2)m]e—, wherein each m is independently 0 to 3, s is 0 to about 30, t is 0 or 1, and e is 0 or 1, R1 is H or CH3, Q is: —OP(O)(O?M+)(O)—, —O—, —S—(CH2)m—C(O)—O—, —SO2—O— —CH2CH2O—C(O)CH2C(OH)(V)CH2C(O)O—; —(CH2CH2O)xCH2CH(OH)—(CH2CH2O)x—(CH2)m—Si[OSi(R2)3]2—, —SO2NR2—, —(CH2CH2O)zC(O)CH(SO3?M+)CH2C(O)(OCH2CH2)z— wherein z is 1 to about 15, or a bond when s is a positive integer, V is —C(O)OR3 and R3 is H, CH3 or Rf; R2 is C1 to C4 alkyl, and M+ is a Group 1 metal or an ammonium (NHxR2y)+ cation wherein x+y=4, and R2 is C1 to C4 alkyl, provided that when Q is —OP(O)(O?M+)(O)— or when Q is —(
    Type: Application
    Filed: April 12, 2010
    Publication date: October 21, 2010
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Charles Kenneth Taylor, Michael Joseph Michalczyk, Erick Jose Acosta
  • Patent number: 7807219
    Abstract: A process of repairing a plasma etched low-k dielectric material having surface-bound silanol groups includes exposing at least one surface of the dielectric material to (a) a catalyst so as to form hydrogen bonds between the catalyst and the surface-bound silanol groups obtaining a catalytic intermediary that reacts with the silane capping agent so as to form surface-bound silane compounds, or (b) a solution comprising a supercritical solvent, a catalyst, and a silane capping agent so as to form hydrogen bonds between a catalyst and the surface-bound silanol groups obtaining a catalytic intermediary that reacts with the silane capping agent so as to form surface-bound silane compounds. Horizontal networks can be formed between adjacent surface-bound silane compounds.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: October 5, 2010
    Assignee: Lam Research Corporation
    Inventor: James DeYoung
  • Patent number: 7753998
    Abstract: A liquid polishing composition of the invention suitable for polishing an automobile and the like comprises about 0.01 to about 3 percent by weight of at least one silicone-based wax, about 0.20 to about 10 percent by weight of poly(alpha olefin) compounds including about 0.1 to about 5 percent by weight of at least one hyperbranched poly(alpha olefin), about 6 to about 60 percent by weight of at least one polydimethylsiloxane silicone fluid, about 1 to about 20 percent by weight of at least one volatile cyclic silicone, about 0.25 to about 3 percent by weight of at least one amino-functional silicone, about 0.01 to about 5 percent by weight of at least one UV absorber, and a petroleum-based carrier therefor. The liquid polishing composition can be packaged together with a microfiber polishing cloth in the form of a polishing kit.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: July 13, 2010
    Assignee: Turtle Wax, Inc.
    Inventors: Michael A. Schultz, Frederic W. Joseph, II, Michael A. Deddo
  • Patent number: 7753974
    Abstract: The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: July 13, 2010
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Shinsuke Miyabe, Kuniaki Maejima, Masahiro Izumi, Hiroaki Tanaka
  • Publication number: 20100152077
    Abstract: A process for replacing the continuous phase of a nanoparticle dispersion with a less polar phase, includes filtering the dispersion through a semi-permeable membrane filter to remove the continuous phase, and introducing a less polar phase.
    Type: Application
    Filed: August 28, 2009
    Publication date: June 17, 2010
    Applicant: Cerion Technology Inc.
    Inventors: Thomas D. Allston, Laura M. Herder, Andreas Langner, Kenneth J. Reed
  • Patent number: 7736405
    Abstract: A CMP composition containing a rheology agent, e.g., in combination with oxidizing agent, chelating agent, inhibiting agent, abrasive and solvent. Such CMP composition advantageously increases the materials selectivity in the CMP process and is useful for polishing surfaces of copper elements on semiconductor substrates, without the occurrence of dishing or other adverse planarization deficiencies in the polished copper.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: June 15, 2010
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Michael Darsillo, Peter Wrschka, Karl Boggs
  • Patent number: 7708788
    Abstract: A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietveld method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: May 4, 2010
    Assignee: Hitachi Chemical Co, Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno, Yuuto Ootuki
  • Patent number: 7700159
    Abstract: There is provided a hydrophilizable wax composition which provides a wax coating layer having a hydrophilic surface and imparts a gloss and long-lasting stain-proofing property on a substrate. The hydrophilizable wax composition can form a hydrophilizable wax coating layer by applying the composition containing a hydrophilizing agent and wax component and wiping off the composition, in which the hydrophilizing agent has hydrolyzable groups which are converted into hydrophilic groups by hydrolysis in the presence of water and are condensed to enable the hydrophilizing agent to have a high molecular weight and is, for example, an organometallic compound having a releasable group by hydrolysis, its oligomer and/or a co-oligomer comprising two or more of the compounds.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: April 20, 2010
    Assignee: Daikin Industries, Ltd.
    Inventors: Yasushi Yonei, Tadao Shimizu, Eiji Kondoh
  • Publication number: 20100069279
    Abstract: Compositions comprising disiloxane surfactant compositions comprising a silicone composition comprising a silicone having the formula: MM? where M=R1R2R3SiO1/2; M?=R4R5R6SiO1/2; with R1 selected from the group consisting of branched monovalent hydrocarbon radical of from 3 to 6 carbon atoms and R7, where R7 has the formula: R8R9R10SiR12 with R8, R9, and R10 each independently selected from the group of monovalent hydrocarbon radicals having from 1 to 6 carbon atoms and monovalent aryl or alkaryl hydrocarbon radicals having from 6 to 13 carbon atoms and R12 is a divalent hydrocarbon radical having from 1 to 3 carbon atoms, R2 and R3 are each independently selected from the group of from 1 to 6 carbon atom monovalent hydrocarbon radicals or R1, with R4 an alkylpolyalkyleneoxide of the general formula: R13(C2H4O)a(C3H6O)b(C4H8O)cR14 where R13 is a divalent linear or branched hydrocarbon radical having the structure: —CH2—CH(R15)(R16)dO— where R15 is H or methyl; R16 is a divalent al
    Type: Application
    Filed: November 19, 2009
    Publication date: March 18, 2010
    Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
    Inventors: Mark D. Leatherman, George A. Policello, Suresh K. Rajaramaran
  • Publication number: 20100047189
    Abstract: Provided are azeotrope-like compositions consisting essentially of 1,1,1,2-tetrafluoropropene and 1,1,1,2-tetrafluoroethane and uses thereof, including use in refrigerant compositions, refrigeration systems, blowing agent compositions, and aerosol propellants.
    Type: Application
    Filed: August 17, 2009
    Publication date: February 25, 2010
    Inventors: CHRISTOPHER J. SEETON, HANG T. PHAM, RAJIV R. SINGH, RYAN HULSE, MARK W. SPATZ, DAVID P. WILSON, SAMUEL F. YANA MOTTA
  • Patent number: 7666239
    Abstract: The present invention provides a method of synthesizing abrasive particles and methods of using the same in chemical mechanical polishing slurry applications. The nanosized abrasive particles according to the invention are produced by hydrothermal synthesis using an insoluble source of cerium. The crystallites of the particles include cerium ions and titanium ions.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: February 23, 2010
    Assignee: Ferro Corporation
    Inventors: Xiangdong Feng, Yie-Shein Her, Yi Yang
  • Patent number: 7666238
    Abstract: A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: February 23, 2010
    Assignee: Kao Corporation
    Inventors: Shigeo Fujii, Hiroyuki Yoshida, Toshiya Hagihara, Hiroaki Kitayama
  • Patent number: 7658870
    Abstract: Embodiments of the present invention provide polymer matrix nanocomposites reinforced with nano-scale materials such as nanoparticles and carbon nanotubes and methods of fabricating. The nanomaterials are provided within relatively low weight fractions, for example in the range of approximately 0.01 to about 0.4% by weight and distributed within the matrix by a magnetic mixing procedure to provide substantially uniform reinforcement of the nanocomposites. Advantageously, these nanocomposites provide significantly enhanced tensile strength, strain to failure, and fracture toughness over corresponding neat matrices.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: February 9, 2010
    Assignee: University of Hawaii
    Inventors: Mohammad Naghi Ghasemi Nejhad, Vinod P. Veedu, Andrea Yuen, Davood Askari
  • Patent number: 7628848
    Abstract: A water-based, non-oily, scented, liquid composition, with an ultraviolet filter, to be applied manually by brush or sponge, or by using an air gun, to surfaces of a synthetic nature. When impregnated, such surfaces recover their shine to an extent according to the number of layers applied, and are renewed in appearance.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: December 8, 2009
    Assignee: Janus Enterprises, LLC
    Inventor: Rodrigo F. Saldarriaga