Polishes Patents (Class 106/3)
  • Patent number: 7316993
    Abstract: A single step rub-on, rub-off combination cleaning and waxing composition particularly suited for automobiles, glass, plastics, fiberglass, tile, and floor coverings.
    Type: Grant
    Filed: February 5, 2005
    Date of Patent: January 8, 2008
    Inventor: Leslie C. Anderson
  • Patent number: 7306638
    Abstract: The present invention is directed to methods for polishing and cleaning a wafer having CoFeNi structures within alumina fill to achieve corrosion-free, smooth, and planar surface. A preferred chemical mechanical polishing (CMP) method includes a CMP polishing compound including alumina abrasive particulates, 1H-Benzotriazole (BTA), and hydrogen peroxide (H2O2) in a concentration working range of 4% to 12%. In a preferred embodiment the H2O2 concentration is approximately 6% and the pH is approximately 4.0 at polishing pressure 6 psi. A cleaning solution for CoFeNi structures in alumina fill of the present invention preferably includes 4-Methyl-1H-Benzotriazole, 5-Methyl-1H-Benzotriazole, hydrogenated 4-Methyl-1H-Benzotriazole, hydrogenated 5-Methyl-1H-Benzotriazole, sodium octanoate, and water.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: December 11, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Hung-Chin Guthrie, Ming Jiang, Nick Lara
  • Patent number: 7306637
    Abstract: The invention provides chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged polyelectrolyte.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: December 11, 2007
    Assignee: Cabot Microelectronics Corporation
    Inventors: Isaac K Cherian, Phillip Carter, Jeffrey P. Chamberlain, Kevin Moeggenborg, David W. Boldridge
  • Publication number: 20070277697
    Abstract: A product for treating the surfaces of vehicles comprising a silanol-containing composition used to enhance gloss and aid in protecting substrates. More particularly, a product for treating vehicles comprising silanols and catalysts that cure to form a durable coating when exposed to the moisture in air.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 6, 2007
    Inventors: Keri Diamond, Cheryl H. Rodriquez, Ashot K. Serobian, Stephanie Farkas Gathman
  • Patent number: 7303993
    Abstract: The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: December 4, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang
  • Patent number: 7303601
    Abstract: A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles in the range of particle sizes of from 40 to 100 nm satisfy the following formula (1): V?0.5×R+40 (1), wherein the particle size is determined by observation with a transmission electron microscope (TEM). The polishing composition of the present invention can be even more suitably used for the manufacture of a substrate for precision parts such as substrates for memory hard disks.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: December 4, 2007
    Assignee: Kao Corporation
    Inventors: Kenichi Suenaga, Yoshiaki Oshima, Toshiya Hagihara
  • Patent number: 7300478
    Abstract: The present invention provides an aqueous slurry composition that comprises cerium oxide and/or cerium oxide-containing mixed rare earth oxide abrasive particles, a polyacrylate, and an agent that retards hard settling. The agent that retards hard settling is preferably a polysaccharide such as xanthan gum, microcrystalline cellulose and/or sodium alginate, the latter of which may be treated with a divalent metal salt such as calcium carbonate. The slurry composition according to the invention can be used to polish glass and glass ceramics at a high removal rate, but does not hard settle upon extended static conditions and can be easily resuspended. The present invention also provides a method of polishing a glass or glass ceramic substrate using the slurry composition.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: November 27, 2007
    Assignee: Ferro Corporation
    Inventors: Steven A. Ferranti, Dana L. Zagari, LeVern G. Burm, Jr., Karla Marie Goff
  • Patent number: 7300480
    Abstract: The solution is useful for removing a barrier material from a semiconductor substrate. The solution comprises, by weight percent, 0.01 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal, 0 to 15 abrasive, 0 to 20 complexing agent for the nonferrous metal, 0.01 to 12 barrier removal agent and balance water. The barrier removal agent is selected from the group comprising imine derivative compounds, hydrazine derivative compounds and mixtures thereof.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: November 27, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Jinru Bian, Kai Hu, Hugh Li, Zhendong Liu, John Quanci, Matthew R. VanHanehem
  • Patent number: 7288509
    Abstract: There is provided a composition comprising (a) at least one aqueous polymer dispersion, (b) at least one ester in the amount of 0.005 to 50 parts by weight of said ester, based on 100 weight parts of solids of all polymers in said aqueous composition, wherein said ester is selected from the group consisting of (i) a monoester of a C7-C10 aliphatic monocarboxylic acid with a dihydric alcohol, (ii) a monoester of a C7-C10 aliphatic monocarboxylic acid with a trihydric alcohol, (iii) a diester of a C7-C10 aliphatic monocarboxylic acid with a trihydric alcohol, and (iv) a mixture of two or more of said (i), (ii), and (iii), and (c) at least one surfactant, in the amount of 1.2 to 10 parts by weight of said surfactant, based on 100 weight parts of solids of all polymers in said aqueous composition.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: October 30, 2007
    Assignee: Rohm and Haas Company
    Inventor: Alan Wayne Kohr
  • Patent number: 7267702
    Abstract: A polishing composition is provided containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above polishing composition between a substrate and a polishing pad, and polishing the substrate, while contacting the substrate with the polishing composition; and a method for reducing scratches of a substrate to be polished, including the step of polishing the substrate to be polished with the above polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, substrates for magnetic recording media, such as magnetic disks, and opto-magnetic disks, photomask substrates, optical disks, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: September 11, 2007
    Assignee: Kao Corporation
    Inventors: Yuichi Honma, Kouji Taira, Shigeaki Takashina
  • Patent number: 7264787
    Abstract: Polycrystalline cerium oxide powder in the form of aggregates of primary particles with a specific surface of between 70 and 150 m2/g, an average primary particle diameter of between 5 and 20 nm and an average, projected aggregate diameter of between 20 and 100 nm. It is produced in that an aerosol is reacted in a flame obtained from a hydrogen-containing combustible gas and primary air and the solid obtained is then separated from the gaseous substances.
    Type: Grant
    Filed: July 12, 2004
    Date of Patent: September 4, 2007
    Assignee: Degussa AG
    Inventors: Stipan Katusic, Stefan Heberer, Michael Kraemer, Peter Kress, Michael Kroell, Edwin Staab
  • Patent number: 7255843
    Abstract: A fumed-silica, which can make a slurry having sufficient wettability to a polar liquid, excellent dispersibility, and low viscosity even in the high concentration, and a slurry thereof. A fumed-silica and its slurry are provided, wherein the water content is controlled so that a weight loss after drying Y, and a dynamic wetting rate to water Z, have specified values.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: August 14, 2007
    Assignee: Nippon Aerosil Co., Ltd.
    Inventors: Hitoshi Kobayashi, Masamichi Murota, Hirokuni Shirono
  • Patent number: 7247179
    Abstract: A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e.g., tungsten CMP).
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: July 24, 2007
    Assignee: DuPont Air Products Nanomaterials LLD
    Inventors: Junaid Ahmed Siddiqui, Timothy Frederick Compton
  • Patent number: 7241325
    Abstract: An abrasive composition is provided based on the following: an abrasive, preferably feldspar ??7-59% a clay, preferably smectite clay ??3-7% water ??37-64% an organic solvent, such as kerosene ??3-20%, and additionally, preferably contains calcium carbonate ??20-30%, and a surfactant 0.01-1%. The composition may have particles of up to 100 ?m, and preferably average particle size diameter of 30-45 ?m.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: July 10, 2007
    Assignee: R.T. Vanderbilt Company, Inc.
    Inventors: George B. Collins, Jr., Stanley Brent Henley, Janis Wylam Anderson
  • Patent number: 7229484
    Abstract: The present invention relates to the manufacture and use of novel pre-coated abrasive particles and particle slurries for the chemical mechanical polishing (CMP) of semiconductor wafers, thin films, inter-layer dielectric, metals, and other components during integrated circuit, flat panel display, or MEMS manufacturing. For example, polishing slurry abrasive particles can be pre-coated with additives, such as, inhibitors and/or surfactants during manufacture of the abrasive particles or slurry. The additive's opportunity to react directly with the abrasive particles early in the particle manufacturing process provides a slurry having a more stable, selectable, and predictable ratio of abrasive particles pre-coated with a more stable, selectable, and predictable amount and type of additives.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: June 12, 2007
    Assignee: Intel Corporation
    Inventors: Reza M. Golzarian, Mansour Moinpour, Andrea C. Oehler
  • Patent number: 7229486
    Abstract: The invention provides a water-based low VOC shoe and leather care product having good product properties and characteristics, which can be formulated by making an appropriate and careful selection of ingredients and their amounts. A shoe and leather care product according to the invention has been found to give results in the treatment of leather (shoes) closely resembling the results found when using a conventional, high VOC shoe care product. Furthermore, such favourable results can be achieved while significantly reducing the amount of organic solvents in the product.
    Type: Grant
    Filed: April 15, 2004
    Date of Patent: June 12, 2007
    Assignee: SaraLee/DE N.V.
    Inventors: Pieter-Jan Wiersema, Wilhelmus Franciscus Petrus Maria Boonman, Shengyu Jin
  • Patent number: 7211122
    Abstract: A polishing composition for reducing the haze level of the surface of silicon wafers contains hydroxyethyl cellulose, polyethylene oxide, an alkaline compound, water, and silicon dioxide.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: May 1, 2007
    Assignee: Fujimi Incorporated
    Inventor: Shoji Iwasa
  • Patent number: 7211121
    Abstract: The present invention relates to a polishing composition more suitable for use in polishing synthetic resin products or metal products. The polishing composition includes a reaction product produced by a reaction between a polyalkylene oxide and a compound having a functional group having reactivity with a hydroxyl group, aluminum oxide, a polishing accelerator including at least one salt selected from the group consisting of a metal salt of an inorganic acid or organic acid and an ammonium salt of an inorganic acid or organic acid, and water.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: May 1, 2007
    Assignee: Fujimi Incorporated
    Inventors: Tatsuhito Mutoh, Hirohito Kitano
  • Patent number: 7204865
    Abstract: The present invention relates to a polishing composition that can be preferably used to polish a silicon wafer. The polishing composition includes a block polyether represented by the chemical formula HO—(EO)a—(PO)b—(EO)c—H, wherein EO represents an oxyethylene group, PO represents an oxypropylene group, each of a and c represents the polymerization degree of ethylene oxide, b represents the polymerization degree of propylene oxide, and each of a, b, and c is an integer of 1 or greater; silicon dioxide; a basic compound; at least either one of hydroxyethyl cellulose and polyvinyl alcohol; and water.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: April 17, 2007
    Assignee: Fujimi Incorporated
    Inventor: Shuhei Yamada
  • Patent number: 7201784
    Abstract: Slurries and methods for the chemical mechanical polishing of high density copper interconnects in a low k ILD are presented. In a particular embodiment of the present invention, a slurry for polishing copper is formed by combining a surfactant comprising an alkyl ethoxy organic acid such as glycolic acid ethoxylate lauryl ether (GAELE), an abrasive such as silica, an oxidizing agent such as hydrogen peroxide, and a chelating buffer system such as citric acid and potassium citrate dissolved in the mixture. This slurry provides a very low incidence of bent line defects, a low erosion rate, and a low dishing rate on a substrate comprising high density copper interconnects in a low k ILD. Embodiments of methods of the present invention use the disclosed slurries.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: April 10, 2007
    Assignee: Intel Corporation
    Inventors: Anne E. Miller, Charles Poutasse
  • Patent number: 7192470
    Abstract: Preservative composition for various materials and method of preserving the same is disclosed. The preservative composition includes at least one silane-containing material and at least one hydrocarbon solvent containing molecules of at least five carbon atoms.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: March 20, 2007
    Assignee: Woodholdings Environmental, Inc.
    Inventors: Edwin Neal, Michael M. Thompson
  • Patent number: 7192461
    Abstract: A high concentration silica slurry can be used for polishing of substrates, such as semiconductor materials. The slurry contains a silica powder dispersed in an solvent. The silica slurry has a silica concentration of more than 50% by weight and a viscosity of less than 1000 mPa·s, wherein the silica powder has a ratio DL/DT of less than 1.3, wherein DL is an average particle size of the silica powder measured by a laser diffraction particle size distribution method and DT is an average primary particle size of the silica powder measured by a TEM photography observation, and wherein the silica powder has an average primary particle size of from 0.08 ?m to 0.8 ?m.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: March 20, 2007
    Assignee: Nippon Aerosil Co., Ltd.
    Inventors: Toshio Morii, Paul Brandl
  • Patent number: 7186654
    Abstract: A chemical mechanical polishing slurry contains an alumina powder including ?-alumina particles and at least one other alumina particles having a crystal structure different from that of ?-alumina, and resin particles.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: March 6, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yukiteru Matsui
  • Patent number: 7182798
    Abstract: The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: February 27, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Richard E. Partch, Nathaniel A. Barney, Hongyu Wang, John Quanci
  • Patent number: 7175680
    Abstract: Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate monolayers to prevent the electromigration and surface diffusion of copper atoms while minimizing the resistance of the interconnect lines. Self assembled thiolate monolayers are used to cap the copper interconnect lines and chemically hold the copper atoms at the top of the lines in place, thus preventing surface diffusion. The use of self assembled thiolate monolayers minimizes the resistance of copper interconnect lines because only a single monolayer of approximately 10 ? and 20 ? in thickness is used.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: February 13, 2007
    Assignee: Intel Corporation
    Inventor: David H. Gracias
  • Patent number: 7169322
    Abstract: Aqueous dispersion containing a silicon-aluminum mixed oxide powder, the powder containing 0.1 to 99.9 wt. % Al2O3 and Si—O—Al-bonds. The dispersion can be produced using dispersing and/or grinding devices which a achieve an energy input of at least 200 KJ/m3. The dispersion can be used for the chemical-mechanical polishing of semiconductor substrates.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: January 30, 2007
    Assignee: Degussa AG
    Inventors: Frank Menzel, Wolfgang Lortz, Helmut Mangold
  • Patent number: 7153335
    Abstract: A composition and associated method for chemical mechanical planarization (or other polishing) are described which afford high tantalum to copper selectivity in copper CMP and which are tunable (in relation to polishing performance). The composition comprises an abrasive and an N-acyl-N-hydrocarbonoxyalkyl aspartic acid compound and/or a tolyltriazole derivative.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: December 26, 2006
    Assignee: Dupont Air Products Nanomaterials LLC
    Inventors: Junaid Ahmed Siddiqui, Timothy Frederick Compton, Bin Hu, Robin Edward Richards
  • Patent number: 7147682
    Abstract: A polishing composition for a substrate for memory hard disk comprising water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles satisfies the above formula (1) and the above formula (2), and wherein a particle size at 90% of a cumulative volume frequency (D90) is within the range of 65 nm or more and less than 105 nm. By using the polishing composition of the present invention, there can be efficiently manufactured an Ni—P plated substrate for a disk polished to have an excellent surface smoothness, in which the micropits are effectively reduced.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: December 12, 2006
    Assignee: Kao Corporation
    Inventors: Yoshiaki Oshima, Kazuhiko Nishimoto, Toshiya Hagihara
  • Patent number: 7097677
    Abstract: Polishing slurry has abrading particles dispersed in a liquid dispersant. The abrading particles are composite particles each having a first particle and a plurality of second particles smaller than the first particles attached to the surface of the first particle through a metal oxide membrane. The first particles have average diameter of 0.1–20 ?m and the second particles have average diameter of 0.001–0.5 ?m. Elastic particles may be used as the first particles such as polymer particles.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Nihon Microcoating Co., Ltd.
    Inventor: Noriaki Yokoi
  • Patent number: 7090821
    Abstract: The present invention relates to a metal oxide powder for high precision polishing and prepartion thereof, comprising aggregates formed by cohesion of primary particles, which has a cohesive degree (?) of 1.1 to 2.0 and a cohesive scale (?) of 3 to 10, the cohesive degree (?) and the cohesive scale (?) being defined by formula (I) and formula (II), respectively: ?=6/(S×?×d(XRD)) ??(I) ?=weight average particle diameter/d(XRD) ??(II) wherein, S is the specific surface area of the powder; ?, the density; and d(XRD), the particle diameter of the powder determined by X-ray diffraction analysis. In accordance with the present invention, it is possible to provide a high polishing speed and reduce scratches.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: August 15, 2006
    Assignee: Samsung Corning Co., Ltd.
    Inventors: Hyukjin Kwon, Myungho Ahn, Youngkwon Joung, Inyeon Lee
  • Patent number: 7077880
    Abstract: A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The composition can further include a medium containing the abrasive and an oxidizing agent (e.g., hydrogen peroxide), wherein the at least one catalyst is adapted to catalyze oxidation of a substrate by the oxidizing agent. Preferably, the abrasive is alumina, titania, zirconia, germania, silica, ceria and/or mixtures thereof, the stabilizer includes B, W and/or Al, and the catalyst is Cu, Fe, Mn, Ti, W and/or V. Both the stabilizer and the catalyst are immobilized on the abrasive surface. The method includes applying the composition to a substrate to be polished, such as substrates containing W, Cu and/or dielectrics.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: July 18, 2006
    Assignee: DuPont Air Products Nanomaterials LLC
    Inventor: Junaid Ahmed Siddiqui
  • Patent number: 7074262
    Abstract: A tire dressing composition comprises a silicone emulsion system which polishes and protects tires, while at the same time imparting water repellency to the subject tires. In some embodiments, the tire dressing composition comprises a silicone microemulsion, a wetting agent, and optionally a fluorocarbon or hydrocarbon propellant when an aerosol system is used.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: July 11, 2006
    Assignee: Shell Oil Company
    Inventors: T. Clare Huang, Ronald Logan Fausnight
  • Patent number: 7052522
    Abstract: A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, a water-soluble polymer, and water. The average primary particle diameter DSA of the silicon dioxide is at least 40 nm. The ratio D95/D5 of the silicon dioxide is no more than 3.8. The value D95/D5/DSA of the silicon dioxide is no more than 0.07.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: May 30, 2006
    Assignee: Fujimi Incorporated
    Inventor: Shinichiro Takami
  • Patent number: 7045001
    Abstract: A multi-component kit and method is provided to pretreat, resurface, and restore a plastic material, and in particular, the plastic lens covers over the headlights and taillights of an automobile. The multi-component kit includes a pretreatment formulation, a resurfacing formulation, and a restoration formulation. Each formulation is structured for application to the plastic lens covers by hand, thereby eliminating the need for specialized equipment or training. The method includes application of each formulation to the plastic lens covers using clean, lint free applicators. The pretreatment formulation is applied to clean the plastic lens covers and to prepare them for application of the resurfacing formulation, which repairs scratches and removes discoloration. The restoration formulation is applied to restore a high gloss shine to the plastic lens covers as well as to protect the plastic lens covers from the elements such as dust, dirt, and/or ultra-violet radiation.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: May 16, 2006
    Inventors: Stacy Kropp, Jeremy Drake, Victor Winik
  • Patent number: 7037350
    Abstract: A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation of polymer particles may be reduced, minimized or eliminated. The composition may additionally comprise an oxidizing agent. A method of using the composition to polish a substrate surface, such as a substrate surface having a metal surface feature or layer, is also described. A substrate so polished may exhibit good surface characteristics, such as a relatively smooth surface or a reduced number of, or a lack of, microscratches on the surface of the substrate.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: May 2, 2006
    Assignee: DA NanoMaterials L.L.C.
    Inventors: Robert J. Small, Zhefei J. Chen
  • Patent number: 7037351
    Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: May 2, 2006
    Assignee: Dynea Chemicals Oy
    Inventors: Yuzhuo Li, Atanu Roy Chowdhury, Kwok Tang, Guomin Bian, Krishnayya Cheemalapati
  • Patent number: 7033409
    Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: April 25, 2006
    Assignee: DANanoMaterials LLC
    Inventors: Robert J. Small, Maria Peterson, Tuan Truong, Melvin Keith Carter, Lily Yao
  • Patent number: 7029508
    Abstract: The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a activator. The activator comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the activator coated on the surface of the abrasive particles and the oxidizing agent, at the activator surface, to form free radicals. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: April 18, 2006
    Assignee: DuPont Air Products NanoMaterials L.L.C.
    Inventors: Brandon Shane Scott, Robert J. Small
  • Patent number: 7029509
    Abstract: The present invention relates to a CMP (chemical mechanical polishing) slurry composition and a method for planarizing a semiconductor device. The CMP composition comprises fumed silica, tetramethyl ammonium hydroxide, phosphates, fluorine compounds and deionized water. The method of planarizing comprises the steps of etching, subsequently laminating and polishing a semiconductor device by said CMP slurry composition.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: April 18, 2006
    Assignee: Dongbuanam Semiconductor Inc.
    Inventors: Sang-Yong Kim, Kwang-Ha Suh, Tae-Kyu Kim, Hwi-Jin Kim
  • Patent number: 7025796
    Abstract: A method for evaluating the quality of abrasive grains for polishing glass, which comprises adding abrasive grains to be measured, to an aqueous medium having silica dissolved therein, to have the silica adsorbed on the abrasive grains under such a condition that the silica undergoes substantially no polymerization in the aqueous medium, followed by solid-liquid separation to separate the abrasive grains from the mother liquor, and measuring the concentration of silica remaining in the mother liquor to measure the adsorption rate (?) of silica on the abrasive grains.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: April 11, 2006
    Assignee: Seimi Chemical Co., Ltd.
    Inventors: Hirotsugu Komiya, Sumihisa Yamaguchi, Tetsufumi Hisatsune, Atsuyoshi Takenaka, Shigeaki Yonemori
  • Patent number: 7014669
    Abstract: The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a catalyst. The catalyst comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the catalyst coated on the surface of the abrasive particles and the oxidizing agent, at the catalyst surface. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: March 21, 2006
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Robert J. Small, Brandon S. Scott
  • Patent number: 7005382
    Abstract: Provided are an aqueous dispersion for chemical mechanical polishing, which planarizes a surface to be polished and has high shelf stability, a chemical mechanical polishing process excellent in selectivity when surfaces of different materials are polished, and a production process of a semiconductor device. A first aqueous dispersion contains a water-soluble quaternary ammonium salt, an inorganic acid salt, abrasive grains and an aqueous medium. A second aqueous dispersion contains at least a water-soluble quaternary ammonium salt, another basic organic compound other than the water-soluble quaternary ammonium salt, an inorganic acid salt, a water-soluble polymer, abrasive grains and an aqueous medium.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: February 28, 2006
    Assignees: JSR Corporation, Kabushiki Kaisha Toshiba
    Inventors: Kazuo Nishimoto, Tatsuaki Sakano, Akihiro Takemura, Masayuki Hattori, Nobuo Kawahashi, Naoto Miyashita, Atsushi Shigeta, Yoshitaka Matsui, Kazuhiko Ida
  • Patent number: 7001463
    Abstract: A polish composition includes a siloxane polymer of the formula wherein each group A independently represents an alkyl group having up to 6 carbon atoms, M represents an alkyl group having up to 6 carbon atoms and Q represents an alkyl group, wherein a proportion of the groups Q have more than 20 carbon atoms and the remainder have up to 6 carbon atoms, and wherein “x” is an integer selected to give a molecular weight of the polymer III in the range 3,000–30,000. In prior polish compositions the radical “Q” have been of shorter chain lengths. We have found that a longer chain length promotes reduced smearing.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: February 21, 2006
    Assignee: Reckitt Benckiser (UK) Limited
    Inventor: Christopher Lloyd Jones
  • Patent number: 6992051
    Abstract: A single step rub-on, rub-off combination cleaning and waxing composition particularly suited for automobiles, glass, plastics, fiberglass, tile, and floor coverings.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: January 31, 2006
    Inventor: Leslie C. Anderson
  • Patent number: 6986798
    Abstract: A mixed light rare earth compound which has been obtained by chemically removing medium-to-heavy rare earth elements, Nd and impurities other than rare earth elements from an ore containing rare earth elements is fired at 500 to 1100° C. to yield a mixed rare earth oxide. A cerium-based rare earth fluoride is added to the mixed rare earth oxide to obtain a mixture. The mixture is subjected to wet-pulverization, drying, firing, disintegration and classification to thereby yield a cerium-containing abrasive.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: January 17, 2006
    Assignee: Showa Denko K.K.
    Inventors: Naoki Bessho, Hideo Tamamura
  • Patent number: 6955586
    Abstract: The present invention provides a chemical metal polishing (CMP) method with improved flexibility and improved processing window, especially as it relates to the chemical aspect of CMP technology. Broadly speaking, the invention has two aspects: according to one aspect, the invention provides a new CMP composition, comprising as an oxidizer, at least one of inorganic halogen derivative and dissolved oxygen while in a second aspect the invention provides an improved method for polishing metals.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: October 18, 2005
    Assignee: J. G. Systems, Inc.
    Inventor: John Grunwald
  • Patent number: 6953500
    Abstract: Water based waxing mixtures for protecting surfaces providing ionically neutral ingredients adhering to the surface while repelling environmental impurities, such as dirt. Surface precleaning need not precede the wax application because of an exchange, which takes place between the mixture and surface dirt. The mixture constitutes an emulsion of an organic phase in an aqueous phase. The aqueous phase amounts to 70 percent to 92 percent by weight, while the organic phase provides the remainder of the mixture and contains suspended waxes. The organic phase includes natural waxes, silicone compounds, nonionic emulsifiers and suspending agents. The mixture may be applied to wet or dry surfaces in shade or bright sunlight and then wiped off to leave a durable shine. The compound finds use on painted, polished, or smooth texture surfaces such as on an automobile. Surfactants and suspending agents stabilize the phase ingredients to allow suspension of the wax in the water.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: October 11, 2005
    Inventor: Glenn H. Lewis
  • Patent number: 6946010
    Abstract: Method of making abrasive compositions comprised of water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and associated cost of dry milling the abrasive particle content, and products thereof. In particular, the abrasive compositions made by the method contain appropriately sized abrasive particles provided without the need for drying or dry milling, while also providing an abrasive composition which is Theologically stable, settling-resistant, and re-agglomeration resistant, even during and after transport and/or storage before end-use, such as incorporation into dentifrice formulations or other oral cleaning compositions.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: September 20, 2005
    Assignee: J.M. Huber Corporation
    Inventor: Yung-Hui Huang
  • Patent number: 6932860
    Abstract: A finish for application over an article of furniture includes an emulsion that if formed by blending together an oil-based furniture type of wax with a water based automotive type of wax. The furniture wax is limited to less than one-third the total volume. This results in a furniture finish that resists smudging, smearing, and dust collection and is also easy to apply and durable. A deep luster similar to that obtained by the use of a quality furniture wax is obtained without the disadvantages thereof.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: August 23, 2005
    Inventor: Richard Joseph Morton
  • Patent number: 6918937
    Abstract: The present invention is based on the practice of abrasive machining with no sealed working chamber by the employment of a visco-elastic abrasive medium, behaving predominantly as an elastic solid at the applied strain of the orbital working motion, and applying orbital or other relative working motion to produce strain rates which bring the medium into a predominantly elastic deformation and often near, but not to exceed, the compressive stress limit at the strain rate employed. The preferred visco-elastic abrasive medium is a rheopectic poly(boro-siloxane) filled with viscosity increasing stiffening agents and high loadings of the abrasive of choice and relatively mono amounts of plasticizers.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: July 19, 2005
    Assignee: Extrude Hone Corporation
    Inventors: James Randall Gilmore, Lawrence J. Rhoades