Polishes Patents (Class 106/3)
  • Publication number: 20090286885
    Abstract: A composition comprising a compound of formula (I) or (II): (A)w-P(O)(O?M+)3-w ??(I) or wherein A is Rf—(CH2)k?[(CF2CF)y—(CH2CH2)z]mO and contains from about 8 to about 22 carbon atoms; Rf is CnF2n+1; n and k are each independently 1 to about 6; y, z, and m are each independently 1, 2, 3, or mixture thereof; w is 1 or 2 or a mixture thereof; and M is hydrogen, ammonium ion, an alkali metal ion, or an alkanolammonium ion.
    Type: Application
    Filed: May 19, 2008
    Publication date: November 19, 2009
    Applicant: E.I. du Pont de Nemuours and Company
    Inventors: Weiming Qiu, Xiuling Shirley Wang
  • Publication number: 20090274757
    Abstract: Polish compositions for coating pharmaceutical solid dosage forms such as tablets are disclosed. The polish composition comprises water, coating agent, and a film forming agent. Polished pharmaceutical solid dosage forms such as tablets comprising a polished exterior surface are also disclosed. Processes of polishing pharmaceutical solid dosage forms such as tablets are disclosed.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 5, 2009
    Applicant: WYETH
    Inventor: John C. CLARK
  • Patent number: 7611552
    Abstract: A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 ?m or more is 600,000 pieces/ml or less and the number of particles of fumed silica having a particle diameter of 1 ?m or more is 6000 pieces/ml or less.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: November 3, 2009
    Assignee: Nitta Haas Incorporated
    Inventors: Yoshiharu Ohta, Yasuyuki Itai
  • Patent number: 7597729
    Abstract: A polishing composition contains an abrasive such as colloidal silica, at least one kind of compound selected from imidazole and an imidazole derivative, and water. The polishing composition preferably further contains an alkali compound, a water-soluble polymer, or a chelating agent. The polishing composition is suitable for use in polishing an edge of an object such as a semiconductor substrate.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: October 6, 2009
    Assignee: Fujimi Incorporated
    Inventor: Shinichiro Takami
  • Patent number: 7582127
    Abstract: The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
    Type: Grant
    Filed: February 1, 2007
    Date of Patent: September 1, 2009
    Assignee: Cabot Microelectronics Corporation
    Inventors: Robert Vacassy, Dinesh N. Khanna, Alexander Simpson
  • Publication number: 20090211486
    Abstract: The invention relates to application of solvent(s) to a product including at least one binder, wherein the product is a paint or coating formulation and the solvent is a compound of renewable vegetable origin, notably agricultural origin. It also relates to a paint or coating including at least one binder and one solvent, wherein the solvent is of renewable vegetable origin. Formulations are given.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 27, 2009
    Applicant: COLAS
    Inventors: Xavier BRICOUT, Michel CHAPPAT, Christine DENEUVILLERS, Stephane HARNOIS
  • Patent number: 7578862
    Abstract: The present invention provides an abrasive compound suitable for polishing the surface of a glass substrate for an optical disk platter or a magnetic disk platter. More specifically, the present invention provides an abrasive compound for a glass hard disk platter, characterized as comprising a stable slurry having water and, dispersed therein as an abrasive, cerium(IV) oxide particles having an average secondary particle size of 0.1 to 0.5 ?m and containing CeO2 in a concentration of 0.2 to 30 wt %. Preferably, the present invention provides the above abrasive compound in which cerium amounts for 95% or more in terms of oxides of the total amount of rare earth elements in the abrasive.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: August 25, 2009
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Isao Ota, Tohru Nishimura, Kenji Tanimoto
  • Publication number: 20090209103
    Abstract: A new barrier slurry composition enables metal and barrier layer material (as well as cap layer material, if necessary) to be removed at a practical rate whilst eliminating, or significantly reducing, the removal of underlying low-k or ultra-low-k dielectric material. The barrier slurry composition comprises: water, an oxidizing agent such as hydrogen peroxide, an abrasive such as colloidal silica abrasive, a complexing agent such as citrate, and may comprise a corrosion inhibitor such as benzotriazole. The preferential removal of cap layer material relative to underlying ULK dielectric material can be enhanced by including in the barrier slurry composition a first additive, such as sodium bis(2-ethylhexyl) sulfosuccinate. The removal rate of the barrier layer material can be tuned by including in the barrier slurry composition a second additive, such as ammonium nitrate.
    Type: Application
    Filed: January 2, 2007
    Publication date: August 20, 2009
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventor: Philippe Monnoyer
  • Patent number: 7575615
    Abstract: The present invention relates to a process for preparing a polishing composition comprising a colloidal silica prepared from a silicate. The first step involves adjusting the pH of a silica dispersion comprising colloidal silica, having an average particle size of primary particles of 1 nm or more and less than 40 nm, to a range of from 10 to 14. The second step involves re-adjusting the pH of the silica dispersion obtained in the first step to a range of from 1 to 6. A density of silanol groups is formed on the surface of the colloidal silica that is from 0.06 to 0.3 mmol per 1 g of the colloidal silica.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: August 18, 2009
    Assignee: Kao Corporation
    Inventor: Hiroyuki Yoshida
  • Patent number: 7569205
    Abstract: In certain embodiments, a method of processing detonation nanodiamonds to fractionate the detonation nanodiamonds involves, in order forming a combination of detonation nanodiamonds and a solvent, said solvent containing at least approximately 10% DMSO (v/v), applying a dispersive technique to said combination, subjecting said combination to a procedure that causes nanodiamond particles of a first size range to be substantially spatially separated from nanodiamonds of a second size range, and collecting said nanodiamonds of said first size range essentially free of said second size range. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: August 4, 2009
    Assignee: International Technology Center
    Inventors: Suzanne Ani Ciftan Hens, Scott L. Wallen, Olga Alexander Shenderova
  • Publication number: 20090191325
    Abstract: The invention provides a surface active ingredient composition, which includes a base liquid including water which has dispersed therein in percentages by volume: Sodium Chloride 1 to 3% Magnesium 1 to 2% Calcium 1 to 2% Potassium 1 to 2% Sulphate 1 to 2% Carbon 0.5 to 1% Nitrate 1 to 2% and Phosphate 1 to 2% sodium chloride dissolved in the base liquid; and sodium alkyl ether sulphate dissolved in the base liquid, with the portion of the base liquid to sodium chloride and sodium alkyl ether sulphate being between 1:1:1.5 and 1:1:5. The invention further provides a process for producing same and uses thereof.
    Type: Application
    Filed: May 28, 2007
    Publication date: July 30, 2009
    Applicant: MARINE 3 TECHNOLOGIES H0LDINGS (PTY) LTD. SUITE8, PANAORAMA OFFICE ESTATE
    Inventor: Andries Du Plessis
  • Publication number: 20090176685
    Abstract: Corrosion inhibiting composition for use in aqueous or semi-aqueous stripping, cleaning, abrasive lapping and abrasive slurry compositions that form 5, 6, 7, or 8-membered chelating rings with a base metal together with a film forming polymeric chelation agent. Optionally there is included an oxygen scavenger.
    Type: Application
    Filed: May 17, 2005
    Publication date: July 9, 2009
    Inventor: Irl E. Ward
  • Patent number: 7553345
    Abstract: A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: June 30, 2009
    Assignee: KAO Corporation
    Inventors: Hiroaki Kitayama, Shigeo Fujii
  • Publication number: 20090162308
    Abstract: The use of 2,4?-dimethylpropiophenone as a fragrance substance is described, preferably as a fragrance substance for imparting, modifying and/or reinforcing one, two, three or all the odor notes floral, rosy, rose oxide-like and herbal-like, preferably both of the odor notes rose oxide-like and herbal-like.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 25, 2009
    Applicant: SYMRISE GmbH & Co. KG
    Inventors: Walter Kuhn, Stefan Lambrecht, Johannes Panten, Wilhelm Wiedmann
  • Patent number: 7550020
    Abstract: A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle diameter of not less than 1.0 ?m. A chemical mechanical polishing method comprises polishing an insulating film by the use of the chemical mechanical polishing aqueous dispersion. By the use of the chemical mechanical polishing aqueous dispersion, occurrence of polishing scratches can be suppressed without lowering a removal rate.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: June 23, 2009
    Assignee: JSR Corporation
    Inventors: Norihiko Ikeda, Kazuo Nishimoto, Masayuki Hattori, Nobuo Kawahashi
  • Patent number: 7547335
    Abstract: A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the metal polishing composition into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: June 16, 2009
    Assignee: FUJIFILM Corporation
    Inventors: Hiroyuki Seki, Katsuhiro Yamashita, Tomohiko Akatsuka, Tadashi Inaba
  • Patent number: 7541323
    Abstract: A composition for simultaneously cleaning and waxing non-porous surfaces without the need for additional rinsing of the treated surface with water, has a pH of from about 6 to about 7 and contains by weight: (a) from about 0.04 to about 0.12% of an acrylic-based polymer, wherein the acrylic-based polymer is a hydrophobically modified, crosslinked polyacrylate powder which has been crosslinked with a polyalkenyl polyether or is an acrylic polymer containing acid groups and which dissolves and swells immediately when neutralized with an alkali salt (b) from about 0.5 to about 5.0% of a silicone blend composed of: (i) from about 70 to about 95% of a first polydiorganosiloxane fluid having a viscosity of from about 0.65 to about 60,000 centistokes at 25° C., and (ii) from about 5 to about 30% of a polydiorganosiloxane fluid mixture having a viscosity of from about 500 to about 2000 centistokes at 25° C.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: June 2, 2009
    Assignee: The Clorox Company
    Inventor: Ashot Serobian
  • Patent number: 7534277
    Abstract: Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: May 19, 2009
    Assignee: Cheil Industries, Inc.
    Inventors: Hyun Soo Roh, Tae Won Park, Kill Sung Lee, In Kyung Lee
  • Publication number: 20090114117
    Abstract: A leveling agent for water-based floor polishes which contains a nonionic surfactant, characterized in that the nonionic surfactant is at least one member selected from the group consisting of compounds represented by the general formula (1): R1—C(R2)H—CH2O—(C2H4O)m(C3H6O)n—H [wherein R1 represents C4-10 alkyl; R2 represents C6-12 alkyl; m is an integer of 1 to 10; n is an integer of 0 to 6; and the ethylene oxide unit(s) and the propylene oxide unit(s) are bonded in any desired sequence, i.e., in either block or random arrangement] and compounds represented by the general formula (II): R3O—(C2H4O)p(C3H6O)q—H [wherein R3 represents at least one residue of one or more aliphatic alcohols selected among 3,5,5-trimethylhexanol, isooctyl alcohol, isodecyl alcohol, isoundecyl alcohol, and isotridecyl alcohol; p is an integer of 0 to 8 and q is an integer of 0 to 8, provided that p+q is an integer of 2 to 8; and the ethylene oxide unit(s) and the propylene oxide unit(s) are bonded in any desired sequence, i.e.
    Type: Application
    Filed: August 25, 2004
    Publication date: May 7, 2009
    Applicant: Toho Chemical Industry Co., Ltd.
    Inventors: Takashi Tokuue, Tetsuya Sayama, Yasunori Terunuma, Mikio Akimoto, Haruyoshi Miyauchi
  • Patent number: 7524346
    Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: April 28, 2009
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Robert J. Small, Zhefei J. Chen
  • Patent number: 7524347
    Abstract: The invention provides a polishing composition comprising fumed alumina, alpha alumina, silica, a nonionic surfactant, a metal chelating organic acid, and a liquid carrier. The invention further provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, and abrading at least a portion of the substrate to polish the substrate.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: April 28, 2009
    Assignee: Cabot Microelectronics Corporation
    Inventors: Tao Sun, Robert Medsker
  • Publication number: 20090092556
    Abstract: Provided are azeotrope-like compositions comprising difluoromethane and trifluoroiodomethane and uses thereof, including use in refrigerant compositions, refrigeration systems, blowing agent compositions, and aerosol propellants.
    Type: Application
    Filed: December 15, 2008
    Publication date: April 9, 2009
    Applicant: Honeywell International Inc.
    Inventors: Rajiv R. Singh, Hang T. Pham, David P. Wilson
  • Patent number: 7513920
    Abstract: A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface and comprising at least one activator selected from ions or compounds of Cu, Fe, Mn, Ti, or mixtures thereof disposed on said surface, wherein at least a portion of said surface comprises a stabilizer. Preferred activators are selected from inorganic oxygen-containing compounds of B, W, Al, and P, for example borate, tungstate, aluminate, and phosphate. The activators are preferably ions of Cu or Fe. Surprisingly, as little as 0.2 ppm and 12 ppm of activator is useful, if the activator-containing particles are suspended in the fluid as a slurry. Advantageously, certain organic acids, and especially dihydroxy enolic acids, are included in an amount less than about 4000 ppm. Advantageously, activator is coated onto abrasive particles after the particles have been coated with stabilizer.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: April 7, 2009
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Junaid Ahmed Siddiqui, Robert J. Small, Daniel Hernandez Castillo
  • Patent number: 7503963
    Abstract: A water in oil emulsion wax composition composed of natural and synthetic waxes, surfactants, suspending agents, and aluminum oxide particles of high purity of 0.20 micrometer or less containing no magnesium oxide and being agglomerate free together with a aliphatic hydrocarbon solvent producing a wax having cleaning properties and an enhanced high gloss surface from a single application.
    Type: Grant
    Filed: December 6, 2004
    Date of Patent: March 17, 2009
    Assignee: Ashland Licensing And Intellectual Property LLC
    Inventors: Elsie A. Jordan, Wen-Chen Su, Hida Hasinovic, Michael A. Dituro, Frances E. Lockwood
  • Patent number: 7503964
    Abstract: A solvent based paste wax polish composition for metallic, plastic, and painted surfaces containing a blend of synthetic and natural waxes, a blend of silicone fluids, blend of solvents, zinc oxide nanoparticles UV agent having a particle size of 100 nanometers or less, alumina nanoparticles polishing agent having a particle size of 200 nanometers or less, and hydrophobically modified silica nanoparticles of 50 nanometers or less producing a polish having cleaning properties and an enhanced high glossed finish from a single application while exhibiting reduced white dry polish residue during the waxing process.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: March 17, 2009
    Assignee: Ashland Licensing and Intellectual Property, LLC
    Inventor: Hida Hasinovic
  • Patent number: 7491252
    Abstract: A chemical mechanical planarization solution is useful for removing tantalum barrier materials. The solution includes by weight percent 0 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal and 0 to 20 complexing agent for the nonferrous metal, 0.01 to 12 tantalum removal agent selected from the group consisting of formamidine, formamidine salts, formamidine derivatives, guanidine derivatives, guanidine salts and mixtures thereof, 0 to 5 abrasive, 0 to 15 total particles selected from the group consisting of polymeric particles and polymer-coated coated particles and balance water. The solution has a tantalum nitride to TEOS selectivity of at least 3 to 1 as measured with a microporous polyurethane polishing pad pressure measure normal to a wafer less than 20.7 kPa.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: February 17, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Jinru Bian
  • Publication number: 20090042997
    Abstract: Compounds of formula (I) and formula (III): wherein A is —F or —CF3; Rf is independently C1-C6 perfluorinated linear or branched alkyl optionally interrupted by one or more oxygens; Ro is a linear or branched aliphatic group of about 10 to about 100 carbon atoms, interrupted by about 5 to about 50 ether oxygens, wherein the ratio of ether oxygen to carbon atoms is about 1:2 to about 1:3; and wherein each carbon atom has at most one ether oxygen atom bonded to it, and covalent bonding between ether oxygen atoms is absent; m is an integer of 1 to 3; Y?m is an anionic radical selected from the group consisting of halide, C1-C6 carboxylate, carbonate, hydrocarbonate, sulfate, hydrosulfate, C1-C6 sulfonate, phosphate, hydrophosphate, and dihydrophosphate. Further embodiments include methods of lowering surface tension of a medium comprising contacting the medium with a composition of formula (I), (III), or a mixture thereof.
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Inventor: THOMAS FOO
  • Publication number: 20090038504
    Abstract: A polishing slurry is disclosed, which is to be used for polishing an ionic material, the polishing slurry including a dispersant which is to form a nonionic adsorbing layer on a surface of the ionic material. The dispersant may be selected by separately preparing first and second solutions containing first and second different dispersants, immersing test pieces each made of said ionic material into the first and second solutions, respectively, comparing a step between an etched portion and a non-etched portion of the test piece immersed in the first solution with a step between an etched portion and a non-etched portion of the test piece immersed in the second solution, and selecting the dispersant used in the solution in which the test piece having the smaller step is immersed.
    Type: Application
    Filed: October 13, 2008
    Publication date: February 12, 2009
    Applicant: Kabushiki Kaisha TOPCON
    Inventor: Hiroshi KUROSAWA
  • Publication number: 20090042996
    Abstract: A surfactant of formula 1 (Rf-A)a-Q-([B]k—R)b??Formula 1 wherein a and b are each independently 1 or 2; Rf is a linear or branched perfluoroalkyl radical having from 2 to about 20 carbon atoms, optionally interrupted with at least one oxygen; R is a C1 to C20 linear, branched or cyclic alkyl, or a C6 to C10 aryl; B is —(CH2CHR1O)x—, k is 0 or 1, x is 1 to about 20, A is —(CH2)m[(CHR1CH2O)]s—[(CH2)m(CH)tCHOH(CH2)m]e—, wherein each m is independently 0 to 3, s is 0 to about 30, t is 0 or 1, and e is 0 or 1, R1 is H or CH3, Q is: —OP(O)(O?M+)(O)—, —O—, —S—(CH2)m—C(O)—O—, —SO2—O— —CH2CH2O—C(O)CH2C(OH)(V)CH2C(O)O—; —(CH2CH2O)xCH2CH(OH)—(CH2CH2O)x—(CH2)m—Si[OSi(R2)3]2—, —SO2NR2—, —(CH2CH2O)zC(O)CH(SO3?M+)CH2C(O)(OCH2CH2)z— wherein z is 1 to about 15, or a bond when s is a positive integer, V is —C(O)OR3 and R3 is H, CH3 or Rf; R2 is C1 to C4 alkyl, and M+ is a Group 1 metal or an ammonium (NHxR2y)+ cation wherein x+y=4, and R2 is C1 to C4 alkyl, provided that when Q is —OP(O)(O?M+)(O)— or when Q is —(
    Type: Application
    Filed: August 6, 2007
    Publication date: February 12, 2009
    Inventors: Charles Kenneth Taylor, Michael Joseph Michalczyk, Erick Jose Acosta
  • Patent number: 7470295
    Abstract: Disclosed herein is a polishing slurry for chemical mechanical polishing. The polishing slurry comprises polishing particles, which have a particle size distribution including separated fine and large polishing particle peaks. The polishing slurry also comprises polishing particles, which have a median size of 50-150 nm. The present invention provides the slurry having an optimum polishing particle size, in which the polishing particle size is controlled and which is useful to produce semiconductors having fine design rules by changing the production conditions of the slurry. The present invention also provides the polishing slurry and a method of producing the same, in which a desirable CMP removal rate is assured and scratches are suppressed by controlling a polishing particle size distribution, and a method of polishing a substrate.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: December 30, 2008
    Assignees: K.C. Tech Co., Ltd., IUCF-HYU
    Inventors: Dae Hyung Kim, Seok Min Hong, Jae Hyun Jeon, Ho Seong Kim, Hyun Soo Park, Un Gyu Paik, Jae Gun Park, Yong Kuk Kim
  • Patent number: 7459419
    Abstract: A single step rub-on, rub-off combination cleaning and waxing CD and DVD restoration method and composition particularly suited for repairing damaged and dirty reflective coatings.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: December 2, 2008
    Inventor: Leslie C. Anderson
  • Patent number: 7431758
    Abstract: The production method for cerium oxide particles of the present invention is a method of producing a cerium oxide particle by heating a cerium compound from a normal temperature to a temperature range of 400° C. to 1200° C., and comprises at least a temperature raising stage of a temperature rise speed of 2° C./hour to 60° C./hour, or proceeds via a stage of heating while supplying a humidified gas in a temperature raising process. By the method of the present invention, a cerium oxide powder whose particle diameter distribution of primary particles is narrow can be obtained. An aqueous cerium oxide slurry produced from the powder enables an improvement in the productivity and a reduction in the cost of a polishing step, because if it is used as an abrasive a high-quality polished face is obtained without deteriorating the polishing speed. The aqueous cerium oxide slurry of the present invention is particularly useful as an abrasive for final finish of a substrate whose main component is silica.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: October 7, 2008
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Isao Ota, Kenji Tanimoto, Noriyuki Takakuma
  • Patent number: 7431867
    Abstract: Nanosized semiconductor particles of a core/shell structure is disclosed, wherein the particles each comprise a core and a shell and exhibit an average particle size of not more than 100 nm and a coefficient of variation in core size distribution of not more than 30%.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: October 7, 2008
    Assignee: Konica Minolta Medical & Graphic, Inc.
    Inventors: Hisatake Okada, Kazuya Tsukada, Naoko Furusawa
  • Patent number: 7429367
    Abstract: Provided are methods for manufacturing improved cerium oxide abrasives suitable for forming slurry compositions suitable for CMP processes. The cerium oxide abrasives are produced by the heat treatment of a mixture of a cerium precursor compound under conditions that produce primary cerium oxide particles that are incorporated in larger secondary abrasive particles. The structure of the primary cerium oxide particles and/or the presence of incompletely oxidized cerium within the secondary abrasive particle tend to reduce its mechanical strength, thereby reducing the likelihood of damaging a substrate surface during a CMP process utilizing such abrasives.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: September 30, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Jun Lee, Jae Hyun So, Kyoung Moon Kang, Nam Soo Kim
  • Patent number: 7427587
    Abstract: A cleaning and polishing composition contains mineral spirits, a first abrasive component of particles having a median size in a range of 1-4 microns, a second abrasive component of particles having a median size in a range of 15-30 microns and a fatty acid. The composition is a free flowing liquid having the viscosity of mineral spirits and has the ability to provide a long lasting finish. After cleaning and polishing an aluminum surface and after several weeks of rough use, the surface may be washed and looks like a newly polished surface. A preferred composition is 85-90% mineral spirits, balance stearic acid and aluminum oxide. The median particle size of the abrasive is less than about six microns and a sizeable fraction is below one micron.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: September 23, 2008
    Inventor: Gordon K. Crissey
  • Patent number: 7427305
    Abstract: This invention relates to a method of making selected oxidizers or other free radical-producing compounds become more effective chemical etchants and/or oxidizers for CMP activities by promoting the formation of the free radicals in a CMP composition with one or more activators. The activator comprises iron, copper or combinations thereof. The activator coated abrasive is particularly effective as it brings the activator in close proximity to the targeted material on the substrate surface, and thus facilitates or accelerates the removal reaction substantially at the site of the targeted material. The activator reacts with the per-type oxidizer to form at least one oxygen-containing free radical. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced by this method.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: September 23, 2008
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Brandon Shane Scott, Robert J. Small
  • Patent number: 7416680
    Abstract: A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant adsorbed and/or precipitated onto a surface of the colloidal particles and/or substrate. The surfactant has a hydrophobic section that forms a steric hindrance barrier and substantially prevents contaminates, including colloidal particles, from bonding to the substrate surface. The slurry is applied to the surface of the substrate while a pad mechanically rubs the surface. Subsequent cleaning with standard soap solutions removes substantially all remaining contamination from the substrate surface. In an exemplary embodiment, the slurry is used to superfinish a glass disk substrate to a surface roughness of less than 2 ?, with substantially no surface contamination as seen by atomic force microscopy (AFM) after standard soap cleaning steps.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: August 26, 2008
    Assignee: International Business Machines Corporation
    Inventors: Frederick Paul Benning, James A. Hagan, Steven L. Maynard, David C. Paurus, Douglas Howard Piltingsrud, Jon Edward Podolske
  • Patent number: 7404831
    Abstract: An abrasive composite, a method for making the abrasive composite, and a polishing apparatus using the abrasive composite are disclosed. The abrasive composite includes a matrix and a plurality of nano-particles distributed therein. The nano-particles are made of at least nano carbon sphere particles and fullerene particles. A ratio by weight of the nano carbon sphere particles to the fullerene particles is advantageously in the range from about 1:2 to about 1:1. The fullerenes are preferably C60 fullerenes. The abrasive composite further includes an amount of diamond particles admixed in the matrix, for improving hardness of the abrasive composite so as to accelerate polishing rate. The abrasive composite is preferably in a form of pellets. The pellets have an average grain size in the range from about 10 nanometers to about 200 nanometers.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: July 29, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Ga-Lane Chen
  • Patent number: 7399348
    Abstract: The invention provides low surface tension surfactants based on amino alcohol and also provides for their use in aqueous coating formulations, said surfactants being preparable by reacting at least one secondary amine of formula (I): with at least one diepoxide of formula (IV): and/or with at least one triepoxide of formula (IV): in essentially equivalent amounts of amine hydrogen atoms and epoxide groups.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: July 15, 2008
    Assignee: Goldschmidt GmbH
    Inventors: Gaetano Blanda, Ingrid Eiβmann, Kathrin Lehmann, Heike Lüther, Stefan Silber, Philipp Tomuschat
  • Patent number: 7399738
    Abstract: A composition for simultaneously cleaning and waxing non-porous surfaces without the need for additional rinsing of the treated surface with water, has a pH of from about 6 to about 7 and contains by weight: (a) from about 0.04 to about 0.12% of an acrylic-based polymer, wherein the acrylic-based polymer is a hydrophobically modified, crosslinked polyacrylate powder which has been crosslinked with a polyalkenyl polyether or is an acrylic polymer containing acid groups and which dissolves and swells immediately when neutralized with an alkali salt (b) from about 0.5 to about 5.0% of a silicone blend composed of: (i) from about 70 to about 95% of a first polydiorganosiloxane fluid having a viscosity of from about 0.65 to about 60,000 centistokes at 25° C., and (ii) from about 5 to about 30% of a polydiorganosiloxane fluid mixture having a viscosity of from about 500 to about 2000 centistokes at 25° C.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: July 15, 2008
    Assignee: The Clorox Company
    Inventor: Ashot Serobian
  • Patent number: 7393401
    Abstract: A water based spray wax composition containing a microemulsion of a cationic wax nanoparticles, a quaternary silicone compound and zinc oxide nanoparticles providing long lasting protection of paint, glass, and metal, plastic, rubber, or elastomeric trim surfaces. The use of microemulsions or nanometer sized particles in the primary ingredients provides a transparent spray wax composition, which provides excellent coverage due to a significantly larger surface area, due to the nanoparticles used in the formulation. It also enables the wax particles to penetrate and fill small cracks and crevices for improved appearance, and durability of the spray wax properties.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: July 1, 2008
    Assignee: Ashland Licensing and Intellectual Property, LLC
    Inventors: Hida Hasinovic, Tara Weinmann
  • Patent number: 7384871
    Abstract: The present invention provides an aqueous composition useful for polishing nonferrous metal interconnects on a semiconductor wafer comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.01 to 5% by weight copolymer of acrylic acid and methacrylic acid, and balance water, wherein the copolymer of acrylic acid and methacrylic acid has a monomer ratio (acrylic acid/methacrylic acid) in the range of 1:30 to 30:1 and the copolymer has a molecular weight in the range of 1K to 1000K.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: June 10, 2008
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Francis J. Kelley, John Quanci, Joseph K. So, Hongyu Wang
  • Patent number: 7381250
    Abstract: The present invention provides a liquid protectant composition composed of a cationic microemulsion of a natural wax (carnauba wax) nanometer sized particles and zinc oxide nanometer sized particles in combination with a quaternary siloxane compound. The protectant composition of the present invention cleans, protects preserves and enhances the appearances of leather or vinyl surfaces used for covering items in the home or in vehicles. The product is easy to apply to both smooth and textured surfaces and has a transparent appearance. The product dries quickly and does not leave an oily residue. Utilization of nano technology to select components having nano sized particles provides a uniform deposition of the product leaving a thin film having exceptional protection properties. Unlike conventional protectants, the invention of the instant composition dries quickly and leaves no oily residue behind.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: June 3, 2008
    Assignee: Ashland Licensing and Intellectual Property, LLC (ALIP)
    Inventors: Hida Hasinovic, Tara Weinmann
  • Patent number: 7381231
    Abstract: Finishing composition substantially free of non-volatile silicone materials and comprises a mixture of abrasive particles and an emulsion, which comprises water, a volatile siloxane, and a lubricant.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: June 3, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Richard S. Smith, Lowell W. Holland
  • Patent number: 7381249
    Abstract: A wax composition for application to a wet surfaces utilizing a polymeric emulsion with a cross-linked copolymer of acrylic acid and C10-30 alkyl acrylate whereby upon application to the surface to be waxed the hydrophilic portion of the polymer instantly collapses releasing the oil phase and providing immediate coverage of the application surface forming a film upon drying, and buffing the waxed surface with an absorbent material leaves a protective coating of wax of the surface which does not easily re-emulsify or wash off when further exposed to water.
    Type: Grant
    Filed: June 9, 2006
    Date of Patent: June 3, 2008
    Assignee: Ashland Licensing and Intellectual Property, LLC (ALIP)
    Inventors: Hida Hasinovic, Elsie A. Jordan
  • Patent number: 7378381
    Abstract: To provide a floor coating composition and floor coating composition additive. It is possible to improve the leveling performance, mopping performance, and other properties of a floor coating composition over those obtained with a conventional tributoxyethyl phosphate leveling agent by adding to a floor coating composition 1) a (C7-C10) aliphatic monocarboxylic acid monoester of a diol, or 2) a (C7-C10) aliphatic monocarboxylic acid monoester or diester of a triol.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: May 27, 2008
    Assignee: Rohm and Haas Company
    Inventors: Zenichi Arai, Jun Iizuka, Tomoaki Ogata, Shigeo Ueda
  • Patent number: 7374592
    Abstract: A polish composition for metallic surfaces containing a polish and abrasive alumina nanoparticles in a water in oil emulsion composition composed of surfactants, suspending agents, and aluminum oxide particles of high purity of 200 nanometers or less having a median particle diameter of 0.24 microns together with an aliphatic hydrocarbon solvent producing a polish having cleaning properties and an enhanced high glossed surface from a single application.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: May 20, 2008
    Assignee: Ashland Licensing and Intellectual Property, LLC (ALIP)
    Inventors: Hida Hasinovic, Tara Weinmann
  • Patent number: 7364600
    Abstract: Disclosed herein is a polishing slurry and a method of producing the same. The polishing slurry has high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer used in CMP of an STI process which is essential to produce ultra highly integrated semiconductors having a design rule of 256 mega D-RAM or more, for example, a design rule of 0.13 ?m or less. A method and a device for pre-treating polishing particles, a dispersing device and a method of operating the dispersing device, a method of adding a chemical additive and an amount added, and a device for transferring samples are properly employed to produce a high performance nano ceria slurry essential to CMP for a process of producing ultra highly integrated semiconductors of 0.13 ?m or less, particularly, the STI process.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: April 29, 2008
    Assignees: K.C. Tech Co., Ltd., IUCF-HYU
    Inventors: Dae Hyeong Kim, Seok Min Hong, Jae Hyun Jeon, Ho Seong Kim, Hyun Soo Park, Un Gyu Paik, Jae Gun Park, Yong Kuk Kim
  • Patent number: 7365101
    Abstract: A dispersion of pyrogenically produced cerium oxide, which does not contain any particles larger than 1 ?m, is produced by dispersing a pyrogenically produced cerium oxide in water by means of a dissolver, centrifuging it, separating the supernatant from the bottom product, and again dispersing the supernatant by means of ultrasound. The dispersion can be used for chemical-mechanical polishing (CMP).
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: April 29, 2008
    Assignee: Degussa AG
    Inventors: Michael Kröll, Günther Michael, Rainer Hahn, Stipan Katusic, Stefan Heberer, Ralph Brandes
  • Patent number: 7364667
    Abstract: A CMP slurry comprising polishing abrasives containing mixture abrasives of silica and alumina is used. In CMP using the slurry comprising mixture abrasives of silica and alumina as polishing abrasives, a down force-dependency of a polishing rate is high and an increase in dishing can be effectively suppressed.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: April 29, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Gaku Minamihaba, Hiroyuki Yano