Abstract: Methods and devices are provided to actively apply finish to one or more yarns in motion at speeds greater than about 3000 m/min, to achieve a finish application of 0.2 wt. % or more, and with a coefficient of variation of finish concentration of 10% or less. The devices are compact, portable and readily installed at a variety of positions on a fiber processing line. The devices of the invention contain the finish so that contamination of the surrounding areas is prevented.

Abstract: It is an object to provide a cleaning method in a CVD apparatus capable of efficiently removing a by-product such as SiO2 or Si3N4 which is adhered to and deposited on the surfaces of an inner wall, an electrode and the like in a reaction chamber at a film forming step, in which the amount of a cleaning gas to be discharged is very small, an influence on an environment such as global warming is also lessened and a cost can also be reduced.

Abstract: A process chamber is provided which includes a gate configured to align barriers with an opening of the gate and an opening of the process chamber such that the two openings are either sealed or provide an air passage to the chamber. A method is provided and includes sealing an opening of a chamber with a gate latch and exposing a topography to a first set of process steps, opening the gate latch such that an air passage is provided to the process chamber, and exposing the topography to a second set of process steps without allowing liquids within the chamber to flow through the air passage. A substrate holder comprising a clamping jaw with a lever and a support member coupled to the lever is also contemplated herein. A process chamber with a reservoir arranged above a substrate holder is also provided herein.

Abstract: A method and apparatus for controlling a temperature of a microelectronic substrate. In one embodiment, the apparatus can include a substrate support configured to engage and support the microelectronic substrate. The apparatus can further include a temperature controller having one or more thermal links coupled directly with the substrate when the substrate is supported by the substrate support. The thermal links can maintain thermal contact with the substrate when the substrate is either stationary or mobile relative to the temperature controller. The temperature controller can heat or cool different portions of the substrate at different rates with one or more of several heat transfer devices, including liquid jets, gas jets, resistive electrical elements and/or thermoelectric elements.

Abstract: It is an object of the present invention to adjust the transfer environment of a substrate in order to prevent contamination of the substrate surface by impurities. A semiconductor manufacturing apparatus comprises a load-lock chamber 1 in which substrate exchange with the outside is performed, a wafer process chamber 2 in which the wafer is subjected to a predetermined processing, and a transfer chamber 3 in which the wafer is transferred between the load-lock chamber 1 and the wafer process chamber 2. In a semiconductor manufacturing method in which this semiconductor manufacturing apparatus is used to treat a substrate, an inert gas (N2) is supplied to and exhausted from the load-lock chamber 1, the transfer chamber 3, and the wafer process chamber 2 while the substrate is being transferred from the load-lock chamber 1 to the wafer process chamber 2 through the transfer chamber 3, and the substrate transfer is carried out with a predetermined pressure maintained.

Abstract: A resonant cavity frequency sensing device is used to sense the moisture content of a substrate. Data obtained by the sensing device can be used in a feedback loop in the apparatus employing the device, to help control the operation of the apparatus in order to obtain consistent results. The sensor may employ one pair of sensing plates or an array of pairs of sensing plates to obtain data from each part of the substrate. In an illustrated embodiment, the device is used to monitor and control dip uptake in a fabric adhesive dipping process.

Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.

Abstract: This invention is a method of forming a nitride layer on at least one metal or metal alloy biomedical device, comprising: providing a vacuum chamber with at least one biomedical device positioned thereon on a worktable within the vacuum chamber; reducing the pressure in the vacuum chamber; introducing nitrogen into the vacuum chamber so that the pressure in the vacuum chamber is about 0.01 to about 10 milli-Torr; generating electrons within the vacuum chamber to form positively charged nitrogen ions; providing a negative bias to the worktable so that the positively charged nitrogen ions contact the biomedical devices under conditions such that a nitride layer forms on the at least one prosthetic device.

Abstract: An apparatus and method are provided for applying adhesive to an outer circumference of a section of tubing. The apparatus includes opposed grippers with concave adhesive transfer areas that can be moved into surrounding relationship with the tubing. Adhesive dispensing passages communicate with the adhesive transfer areas for delivering adhesive to the tubing. Counterbores are at opposed ends of the adhesive transfer areas and communicate with a vacuum source for removing excess adhesive.

Abstract: Device for filling multiple blind holes. The invention involves a device that permits the filling of blind holes in an effective and controlled manner. It is composed of a mobile body (1) in airtight contact with the surface (10) containing the hole openings. The body (1) contains two slots, the first (2) of which is kept airtight from the exterior of the device and from the second slot (5), is separate and parallel to the direction of travel of the device, and is larger than the largest opening. The first slot exposed to the openings while moving is connected to a vacuum chamber (3), while the second slot exposed to the openings is connected to a reservoir (6) containing the product (7) to be transferred.

Abstract: A method of applying a moisture barrier seal to a fiber optic coil includes mounting a fiber optic coil in a vacuum deposition chamber, so as to expose a large exterior surface area of the fiber optic coil to an interior portion of the deposition chamber. The method further includes reducing the air pressure within the chamber to a value that is less than ambient pressure outside of the chamber. The method further includes introducing a vapor form of a non-porous material, preferably parylene, into the chamber. The vapor form of the non-porous material changes into a solid state upon contact with the fiber optic coil, so as to form a conformal coat on the fiber optic coil.

Abstract: A thin film of metal or metal compound is produced by preparing an ultrafine particle dispersion liquid by dispersing ultrafine particles at least partly made of metal into a given organic solvent, applying the ultrafine particle dispersion liquid to a substrate, drying the ultrafine particle dispersion liquid to leave metal or metal compound particles on the substrate, heating the metal or metal compound particles to join the metal or metal compound particles, and annealing the metal or metal compound particles into a thin film.

Abstract: A porous insulating layer-forming apparatus includes a solution-applying portion, a solidified layer-forming portion, a vacuum drying portion, a firing portion, and an airtight treatment portion. The solution-applying portion applies a solution in which an insulating material is dissolved, onto a workpiece. In the solidified layer-forming portion, a cooling plate cools the solution applied onto the workpiece to a temperature less than or equal to the melting point of the solvent in the solution to yield a solidified layer. In the vacuum drying portion, a decompression chamber is decompressed by a vacuum pump to vaporize the solvent in the solidified layer, thereby changing the solidified layer into a porous solidified layer. In the firing potion, the porous solidified layer is hardened by firing on a hot plate to yield a porous insulating layer.

Abstract: A process tool, preferably a spin coater, includes a set of at least three arms and an adjustable rinse nozzle. The arms lift a substrate, e.g. a semiconductor wafer, from a chuck inside the process chamber after having performed the corresponding manufacturing step, e.g. coating. The contact area between the arms and the substrate is as small as possible. The rinse nozzle dispenses a solvent liquid onto the backside of the substrate, thereby removing contaminating particles located at the area of contact between the vacuum channels of the chuck and the substrate. The set of arms rotates for a homogeneous cleaning. A gas flowing out of vacuum ports of the chuck prevents the vacuum ports from being obstructed with particles. While the substrate is being lifted, the chuck can also be cleaned by dispensing the solvent liquid onto the chuck.

Abstract: The present invention relates to a processing unit for processing a substrate, which comprises a chamber for housing the substrate and forming a hermetically closeable processing room, and an exhauster for exhausting an atmosphere in the processing room from an upper portion of the chamber to reduce a pressure in the processing room. The processing unit of the present invention includes a current plate for controlling an atmospheric current formed in the processing room when the pressure is reduced, and the chamber has a mounting table for mounting the substrate thereon, an almost cylindrical lid body with its lower face open for covering the substrate on the mounting plate from above and forming the processing room integrally with the mounting table, and a supporting member for supporting the current plate so that the current plate is parallel to the mounting plate.

Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

Abstract: An apparatus and method which is suitable for the bubble-free application of a resin to a substrate. The apparatus typically includes an airtight chamber which receives the substrate and a resin dispenser for dispensing the liquid resin onto the substrate. After a vacuum pressure is induced in the chamber, the resin is dispensed onto the substrate. Accordingly, air is substantially incapable of becoming trapped between the resin and the substrate and forming air bubbles during subsequent processing of the substrate.

Abstract: The present invention comprises a machine and method for applying chemicals with substrates in a continuous manner, as opposed to batch processes. The machine uses non-aqueous solvents as a carrier medium for the chemicals. The non-aqueous solvents are then evaporated away, leaving the chemicals on the substrates. Additionally, the non-aqueous solvents are then continuously condensed, purified and recycled through the machine.

Abstract: An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.

Abstract: A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

Abstract: The invention relates to a device for applying a coating medium to at least one partial surface of an elongated workpiece in a vacuum chamber. Said device consists of a housing (1) comprising a storage container (2) with an oblique base (3) and an air conduit opening into said base and of a deposition device that is positioned above the storage container. To ensure that the air stream exiting the vacuum chamber has a degree of purity that complies with legal requirements so that said stream can also be introduced into the working chamber, or can be used for a further coating process without any detrimental effect on the same, several sheath-type filter rods (13), which consist of borosilicate glass and are traversed by the air, are arranged downstream of the deposition device (5, 7) in the direction of flow of the air removed by suction.

Abstract: In order to suction the air boundary layer from a running web of material (1) before coating with a curtain-coater, a suction box (8) is arranged in the area of a roller (4) deflecting the web of material (1), said suction box having the following characteristics: a) the suction box (8) extends in its breadth along the axial length of the deflection roller (4); it is open towards the deflection roller (4) and attached to a suction blower, b) it has a corresponding seal (10, 11) on the inlet and the outlet sides, which form a gap (12, 13) with the web (1) and extend along the axial length of the deflection roller (4), wherein at least the end of the seal (10) on the inlet side and the beginning of the seal (11) on the outlet side are located on the deflection roller (4) in the deflection area of the web (1); c) the suction box (8) has a front-face seal (14) on each of the front faces of the deflection roller (4), which extend outside adjacent to the seal of the front face, parallel thereto and at a close dista

Abstract: A thermal physical vapor deposition apparatus includes an elongated vapor distributor disposed in a chamber held at reduced pressure, and spaced from a structure which is to receive an organic layer in forming part of an OLED. One or more detachable organic material vapor sources are disposed outside of the chamber, and a vapor transport device including a valve sealingly connects each attached vapor source to the vapor distributor. During vapor deposition of the organic layer, the structure is moved with respect to the vapor distributor to provide an organic layer of improved uniformity on the structure.

Abstract: A coating material is deposited on a substrate by vacuum or low-pressure pulsed detonation coating. A detonation chamber receives a detonable mixture containing a coating precursor. The detonable mixture is ignited to produce detonation products laden with the coating precursor. The detonation products are accelerated in a low-pressure or vacuum chamber and discharged through a nozzle into contact with a substrate situated in low pressure to produce a high quality coating.

Abstract: A curtain coater and a curtain-coating method for coating a moving web of paper or board are described. The curtain coater has an applicator nozzle for applying a coating mix to the surface of the web in the form of a continuous curtain extending uniformly over the cross-machine width of the web. In one aspect, a doctoring means located upstream (in terms of the direction of travel of the web) from the applicator nozzle substantially removes the air boundary layer traveling on the surface of the web. In another aspect, the doctoring means comprises a suction nozzle for removing the air boundary layer. In yet another aspect, a gas nozzle located downstream from the applicator nozzle sprays gas on the coating curtain in order to help apply the coating mix to the surface of the web.

Abstract: The present invention is a foam applicator system for applying foam to a tissue web. The foam applicator system comprises a foam applicator capable of applying a liquid-based composition to a tissue web. The foam applicator includes an extrusion head comprising a first nozzle bar and a second nozzle bar and having an inner surface and an outer surface. A first end of a flexible scraper is operatively associated with the first nozzle bar of the extrusion head. A second end of the flexible scraper outward from the first end of the flexible scraper. The foam applicator system may also comprise a vacuum slot positioned opposing the extrusion head with the tissue web therebetween.

Abstract: A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a resistive heating element positioned to heat air or other gases allowed to enter the process tube. The wafer carrier and heating assembly are vertically raised into a position within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively raise the temperature of the wafers.

Abstract: Using a scan coating method, a liquid film is formed on a substrate having a temperature distribution for correcting a temperature distribution of a liquid film caused by the heat of evaporation due to the volatilization of a solvent contained in the liquid film, and then the solvent is removed from the liquid film to form a coating film.

Abstract: Continuously operating furnace and method for obtaining thermal diffusion coating on the outside surface of metallic articles. The furnace is configured as a tunnel through which in succession are advanced closed containers filled with the processed articles and with powder mixture, containing diffusing specie. A chain conveyor, passing through the furnace, advances the containers along a transportation path. The furnace is provided with plurality of stopper means, capable to intermittently prevent the advancement of the containers and to retain them in discrete positions, situated along the transportation path. The containers advance in parallel being always directed perpendicularly to the transportation path and their retention in the discrete positions causes their rotation about their longitudinal axes. Continuous operation is associated with improved efficiency and capacity.

Abstract: An applicator apparatus for applying a preferably foamed treating fluid to a traveling permeable fabric, web or other substrate can include either or both of a low-pressure exhaust chamber on the opposite side of the substrate from the applicator nozzle and a flexible lip extending from either or both sides of the nozzle opening, between the nozzle and the substrate. The applicator apparatus is particularly adapted and well-suited for lightly coating or treating the surface of a fragile and fast moving substrate, without deformation or breakage of the substrate and without undesirable substrate penetration.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: An apparatus for processing a workpiece in a micro-environment includes a workpiece housing connected to a motor for rotation. The workpiece housing forms a processing chamber where one or more processing fluids are distributed across at least one face of the workpiece by centrifugal force generated during rotation of the housing. An array of workpiece housings are contained within an enclosure. A robot moves workpieces into and out of the workpiece housings.

Abstract: An air unit for the removal of excess particulate coating material that is present on products which are in a coating machine comprises, for blowing surplus particulate material off the products, at least one suction member for drawing off air, with particulate material present therein, from the coating machine, separating means for removing particulate material from the air drawn off, and circulating means for feeding at least a portion of the air drawn off to the blowing member.

Abstract: A method for transferring organic material from a flexible donor element onto a substrate to form a layer of organic material in making one or more OLED devices, includes providing the flexible donor element and the substrate in a spaced relationship within a chamber under atmospheric pressure defined by a transfer station so that the flexible donor element partitions the chamber into first and second cavities; varying the pressure differential between the first and second cavities to cause the flexible donor element to move into a contact relationship with the substrate; providing a transparent window which defines the top surface of the second cavity; and providing radiation energy through the transparent window onto the flexible donor element in contact with the substrate to cause the flexible donor element to absorb heat and transfer organic material onto the substrate.

Abstract: A spin chuck for holding a wafer to the front face of which a resist solution is supplied, a cup for housing the spin chuck and forcibly exhausting an atmosphere around the wafer by exhaust from the bottom thereof, and an air flow control plate, provided in the cup to surround the outer periphery of the wafer, for controlling an air flow in the vicinity of the wafer are provided. Accordingly, a state of special air flow at an outer edge portion of a substrate to be processed can be eliminated, thereby preventing an increase in film thickness at the outer edge portion.

Abstract: Apparatus for coating a support such as a monolithic catalyst support (5) comprises a dispenser (1) for dispensing a predetermined quantity of coating liquid, a containment (2) for the liquid and a source of vacuum (8, 9) which can be actuated to draw the entire quantity of coating liquid into the support (5). The apparatus and method are particularly useful for coating car catalysts without wastage and with increased design options.

Abstract: In a pressure infiltrating apparatus 20 according to the invention, an upper end of an inlet side orifice 23 in the drawing is formed to take a tapered convex shape and a lower end of an insertion hole of an intermediate orifice 25 in the drawing is formed to take a concave shape having a diameter gradually increased corresponding to the convex shape of the inlet side orifice 23. Consequently, a space A between the inlet side orifice 23 and the intermediate orifice 25 is set to be small without damaging the fluidity of a molten metal 11 between the inlet side orifice 23 and the intermediate orifice 25 in a bath container 22.

Abstract: Proposed is an apparatus for the spray treatment of printed circuit boards. It has conveyor means for conveying the printed circuit boards (2) with a horizontally oriented PCB surface plane. Provided above the plane of conveyance (7) is a nozzle device (16) for spraying the top surface (13) of the printed circuit boards (2) with a liquid treatment medium. The apparatus is equipped with a suction device (26) that permits the sprayed-on treatment medium to be suctioned off from the top surface (13) of the printed circuit boards (2) during the spray process. In this manner the treatment medium is prevented from backing up, and a high-quality treatment process is ensured.

Abstract: A blast unit for sending air from the top of a processing chamber to the bottom thereof and an exhaust pipe for exhausting gas from the bottom of the processing chamber are provided. Concomitantly with a change in pressure in the processing chamber, intervals of a slit damper and/or the degree of opening of a damper is controlled by a controller and thus a blast amount or an exhaust amount is controlled, thereby maintaining the pressure in the processing chamber almost constant.

Abstract: A coating material is deposited on a substrate by vacuum or low-pressure pulsed detonation coating. A detonation chamber receives a detonable mixture containing a coating precursor. The detonable mixture is ignited to produce detonation products laden with the coating precursor. The detonation products are accelerated in a low-pressure or vacuum chamber and discharged through a nozzle into contact with a substrate situated in low pressure to produce a high quality coating.

Abstract: A closed container composed of a lid body and a lower container are provided in a cover body, and a supply pipe for nitrogen gas is connected to the cover body. A light source unit including UV lamps in the lid body is provided to face a mounting table in the closed container, and a gas supply path for HMDS gas is provided on the outer side from the light source unit. The inside of the cover body is first brought to a nitrogen atmosphere, a wafer is irradiated with ultraviolet rays with the lid body of the closed container opened to perform cleaning. Subsequently, the lid body is closed and the HMDS gas is introduced into the closed container to perform hydrophobic processing for the wafer. This removes deposits such as organic substances adhering to the wafer W through the irradiation with the ultraviolet rays, thereby improving coating properties of a resist solution.

Abstract: A method of forming a thin polycrystalline silicon film and a thin film forming apparatus allowing inexpensive formation of a thin polycrystalline silicon film at a relatively low temperature with high productivity. More specifically, a method of forming a thin polycrystalline silicon film and a thin film forming apparatus in which a state of plasma is controlled to achieve an emission intensity ratio of hydrogen atom radicals (H&bgr;) of one or more to the emission intensity of SiH* radicals in the plasma.

Abstract: A metallization module for applying a metal layer on the screen of a CRT faceplate panel is described. The metallization module comprises a vacuum chamber having sidewalls, a base, an adaptor plate, and a lid. The adaptor plate is positioned between the lid and the sidewalls of the metallization module. Evacuation of the vacuum chamber causes atmospheric pressure to act against the outside surface of the lid, forming an airtight seal between the lid, the adaptor plate, and the top lip of the sidewalls. A plurality adjustable rods in conjunction with the adaptor plate are used to support the faceplate panel within the metallization module.

Abstract: A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.

Abstract: An apparatus for direct or indirect application of a liquid or pasty medium onto a traveling material web includes at least one rotatable backing roll wrapped in part by the material web and supporting a side of the material web near the backing roll. The backing roll surface and the material web form a cuneiformly tapering entrance gore and an exit gore. At least one applicator opposes the backing roll and coats a side of the material web away from the backing roll with the medium, and/or further treats the coated material web side. A boundary layer stripper is arranged, in relation to the direction of rotation of the backing roll, before the applicator. The boundary layer stripper removes an air boundary layer entrained by the backing roll and/or the material web. The air boundary layer stripper is arranged in the entrance gore between the backing roll surface and the side of the material web near the backing roll.

Abstract: A method for coating flat substrates with a liquid, the method comprising: pressurizing liquid within a coat head wherein the liquid has a viscosity of at least thirty centipoises; forming a meniscus of liquid at an orifice in the coat head; contacting the meniscus of the liquid to the substrate; and moving the meniscus relative to the substrate. A system for coating a flat substrate with liquid, the system comprising: a coat head filled with liquid by capillary action, wherein the viscosity of the liquid is at least thirty centipoises; a pressurizer of the liquid that forms a meniscus at an orifice in the coat head; a contacter of the meniscus to the substrate; and a mover of the meniscus relative to the substrate.

Abstract: The present invention relates to an apparatus and process for producing a thin organic film on a substrate using an ultrasonic nozzle to produce a cloud of micro-droplets in a vacuum chamber. The micro-droplets move turbulently within the vacuum chamber, isotropically impacting and adhering to the surface of the substrate. The resulting product has a smooth, continuous, conformal, and uniform organic thin film, when the critical process parameters of micro-droplet size, shot size, vacuum chamber pressure, and timing are well-controlled, and defects such as “orange peel” effect and webbing are avoided. The apparatus includes an improved ultrasonic nozzle assembly that comprises vacuum sealing and a separate, independent passageway for introducing a directed purging gas.

Abstract: The present invention includes a current plate which is arranged above a substrate in a chamber. A pressure inside the chamber is reduced by exhaust means and drying processing is performed on, for example, a coating solution on the substrate. On a peripheral portion of an underneath surface of the current plate, formed is a ring-shaped protrusion corresponding to a peripheral portion of the substrate. A protruding portion of a coating solution at the peripheral portion of the substrate is made flat by air current generated when the pressure is reduced, and consequently a coating film with a uniform film thickness as a whole is formed on the substrate.

Abstract: An apparatus for applying liquid or pasty application medium, in particular aqueous pigment suspension, to one or both sides of a moving material web, especially to a paper or board web, during its production and/or finishing. The invention provides for the vacuum generating device to be assigned to that side of the material web which faces away from the application medium curtain, at least to the region of incidence of the application medium on the material web.

Abstract: This substrate processing device is identical to a wafer cleaning device 5 for cleaning a wafer W, which includes a supply nozzle 34 for supplying APM and the pure water, a spin chuck 31 for carrying the wafer W and a container 31 for accommodating the spin chuck 31. The container 30 includes an inner processing chamber 42 and an outer processing chamber 43 and is constructed so as to be movable up and down to the spin chuck 31. A first drainage line 50 is connected to the inner processing chamber 42 to discharge APM and the interior atmosphere, while a second drainage line 51 is connected to the outer processing chamber 43 to discharge pure water and the interior atmosphere. With the connection of the first drainage line 50, the wafer cleaning device 5 is adapted so that the supply nozzle 34 supplies APM to a surface of the wafer W again. Therefore, it is possible to reuse this processing liquid advantageously and additionally, an exhaust displacement can be reduced.