Abstract: Methods and apparatus for making flexible display devices include a supporting member main body, a mount, vacuum paths, and nipples with stoppers. The mount is disposed at the surface of the supporting member main body, and includes a plurality of grooves. A flexible mother substrate is mounted on the mount. The vacuum paths penetrate the supporting member main body so as to communicate with the grooves. One end of each of the vacuum paths communicates exteriorly of the main body through one of the nipples and is attachable to and detachable from an external vacuum source. The method and apparatus enable the flexible mother substrate to be processed without being bent or stretched and without deterioration caused by the use of an adhesive.

Abstract: Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.

Abstract: Apparatus for coating a support such as a monolithic catalyst support (5) comprises a dispenser (1) for dispensing a predetermined quantity of coating liquid, a containment (2) for the liquid and a source of vacuum (8, 9) which can be actuated to draw the entire quantity of coating liquid into the support (5). The apparatus and method are particularly useful for coating car catalysts without wastage and with increased design options.

Abstract: A wafer processing apparatus characterized by having corrosion resistant connections for its electrical connections, gas feed-through channels, recessed areas, raised areas, MESA, through-holes such as lift-pin holes, threaded bolt holes, blind holes, and the like, with the special configurations employing connectors and fillers having excellent chemical resistant properties and optimized CTEs, i.e., having a coefficient of thermal expansion (CTE) that closely matches the CTE of the base substrate layer, the electrode(s), as well as the CTE of coating layer. In one embodiment, a filler composition comprising a glass-ceramic material is employed.

Abstract: An apparatus for maintaining constant exhaust flow during processing of a semiconductor substrate is provided. For example, the apparatus may include an inlet and an outlet. The apparatus may also include a throttle valve stage coupled to the inlet. The throttle valve stage may include a throttle valve plug located within the throttle valve stage. The throttle valve plug is configured to control the amount of airflow through the throttle valve stage by modulating the distance between the throttle valve plug and faces of the throttle valve stage. The apparatus may further include a floating plunger stage coupled to the throttle valve stage. The floating plunger stage additionally includes a floating plunger. A surface of the floating plunger receives a controlled pressure which allows the floating plunger to move and vary an opening between the floating plunger and the outlet. Furthermore, the apparatus includes a guide pin.

Abstract: A method and apparatus for maintaining constant exhaust flow during processing of a semiconductor substrate is provided. For example, the apparatus may include an inlet and an outlet. Furthermore, the apparatus may include a throttle valve stage coupled to the inlet. The throttle valve stage includes a throttle valve plug located within the throttle valve stage. The throttle valve plug is configured to control the amount of airflow through the throttle valve stage by modulating the distance between the throttle valve plug and faces of the throttle valve stage. The apparatus further includes a floating plunger stage coupled to the throttle valve stage. The floating plunger stage includes a floating plunger coupled to a flexible attachment. The flexible attachment allows the floating plunger to move in a controlled manner to vary an opening between the floating plunger and the outlet.

Abstract: The embodiments fill the need to enhance electro-migration performance, provide lower metal resistivity, and improve metal-to-metal interfacial adhesion for copper interconnects by providing improved processes and systems that produce an improved metal-to-metal interface, more specifically barrier-to-copper interface. An exemplary method of preparing a substrate surface of a substrate to deposit a metallic barrier layer to line a copper interconnect structure of the substrate and to deposit a thin copper seed layer on a surface of the metallic barrier layer in an integrated system to improve electromigration performance of the copper interconnect is provided. The method includes cleaning an exposed surface of a underlying metal to remove surface metal oxide in the integrated system, wherein the underlying metal is part of a underlying interconnect electrically connected to the copper interconnect.

Abstract: The embodiments fill the need to enhance electro-migration performance, provide lower metal resistivity, and improve metal-to-metal interfacial adhesion for copper interconnects by providing improved processes and systems that produce an improved metal-to-metal interface, more specifically copper-to-cobalt-alloy interface. An exemplary method of preparing a substrate surface of a substrate to selectively deposit a thin layer of a cobalt-alloy material on a copper surface of a copper interconnect of the substrate in an integrated system to improve electromigration performance of the copper interconnect is provided. The method includes removing contaminants and metal oxides from the substrate surface in the integrated system, and reconditioning the substrate surface using a reducing environment after removing contaminants and metal oxides in the integrated system.

Abstract: A method for manufacturing an electrode having a collector and an electrode layer containing an active material formed on the collector is provided that includes the steps of discharging a composition for forming an electrode layer containing an active material and an organic solvent on the collector from a droplet discharge apparatus to form a film composed of the composition, reducing the pressure of an atmosphere surrounding the film within a prescribed period of time to a pressure that brings a boiling point of the organic solvent to a temperature in a range of 10° C. to 30° C., and maintaining the reduced pressure to dry and remove the organic solvent to form the electrode layer. The method can further include the step of heating the film to a temperature between 50° C. and 150° C., after the reduced pressure is maintained.

Abstract: The present invention is an apparatus and method for controlling pressure, pumping a vacuum and providing abatement for a plurality of vacuum processing chambers. The system may be used in semiconductor manufacture. Multiple vacuum processing chambers are exhausted by turbo pumps into a common abatement chamber, which is maintained at sub-atmospheric pressure by a backing pump. Pressure in the processing chambers is independently controlled. The internal volume of the abatement device provides a buffer that reduces the effect of pressure changes in one processing chamber affecting pressure in the other chambers.

Abstract: A droplet jetting applicator includes a coating unit jetting and coating droplets to a to-be-coated object; a storage space storing the to-be-coated object coated with the droplets; an exhaust section exhausting gas in the storage space; an adjustment unit adjusting an outlet flow of the gas exhausted by the exhaust section from the storage space; and a control section controlling the adjustment unit so that the outlet flow is changed in a stepwise manner.

Abstract: A processing fluid is prepared by mixing purified water and methanol as a solvent with SCCO2, and the processing fluid is brought into contact with a surface of a substrate so as to form oxide film on the surface of the substrate. In this processing fluid, SCCO2 functions as a carrier medium while —OH functional group (hydroxyl group) disperse in the SCCO2 as active chemical species. Such the highly motile and highly concentrated SCCO2 is used as a carrier medium, while the active chemical species are mixed with carrier medium. Because of this, excessive presence of active chemical species is prevented in the atmosphere in contact with the surface of the substrate. The active chemical species demonstrates superior diffusiveness, and moreover, even a small amount of solvent contains large amount of active chemical species. Therefore, the fresh active chemical species are constantly supplied to the surface of the substrate, reacting excellently with the surface of the substrate, thereby forming oxide film.

Abstract: A coating apparatus includes a cylindrical holding chamber having open ends, an opening formed in an inner surface and an inner diameter; a specimen having a curved inner surface with a radius of curvature that is equal to one half the inner diameter of the cylindrical holding chamber, the specimen having a size such that, when inserted in the opening in the inner surface of the cylindrical holding chamber, the inner surface of the cylindrical holding chamber and the curved inner surface of the specimen form a continuous surface; a counter bore formed radially outward from the opening in the inner wall of the cylindrical holding chamber; at least one evacuation hole extending from an interior of the cylindrical holding chamber through a wall of the cylindrical holding chamber to the counter bore; a flat formed on an exterior surface of the cylindrical holding chamber around the counter bore; and fastener holes formed around the counter bore and extending from the flat into the wall of the cylindrical holding

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: An apparatus for the manufacture of chemical vapor deposited domes. The apparatus has a vapor deposition chamber with a plurality of sides, a base and a top where the base has a reactant port for receiving a flow of chemical reactants. A male mandrel is joined to one of a plurality of sides of the deposition chamber such that the flow of chemical reactants in the vapor deposition chamber does not impinge on the mandrel.

Abstract: The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.

Abstract: A web to be coated travels over a deflecting roll and underneath a slot nozzle from which a curtain of a coating material falls. A suction box open toward the roll and web has upstream and downstream ends and extends full axial length of the roll. An upstream seal on the upstream side of the box is juxtaposed with the web, extends the full axial length of the roll, and has upstream and downstream edges extending transverse to the web-travel direction. A similar downstream seal is provided on the downstream side of the box juxtaposed with the web. The downstream-seal downstream edge is spaced upstream in the direction from where the curtain falls on the web. Air is withdrawn from the box between the seals to suctionally strip a boundary layer of air from the web between the seals.

Abstract: A vacuum chamber assembly comprises a floor plate, an upper plate, plural props standing on the floor plate to support the upper plate, and side plates closing side opening portions between the props. First connected portions between the floor plate and the props and second connected portions between the upper plate and the props are fixed by screws. Circumferential edge portions of the side opening portions are provided with installation grooves, respectively. A gasket includes side surface sealing portions installed in the installation grooves formed on the circumferential edge portions of the side opening portions, respectively, and connection sealing portions for sealing the first connected portions and the second connected portions. The side plates are fixed to the circumferential edge portions to close the side opening portions via the side surface sealing portions of the gasket, respectively.

Abstract: Disclosed relates to a method for CVD comprises steps of injecting a purge gas, which doesn't either dissolve or generate byproducts by itself, into a reaction chamber where substrates are located; and supplying a source material of vapor phase participating directly in forming a film on the substrates to an inside of the reaction chamber, thus forming a protective curtain in the inside of the reaction chamber by a mutual diffusion-suppressing action between the purge gas and source material.

Abstract: Apparatus and method for treating by injecting a fluid treatment material into porous structures such as those formed from concrete, brick, stone, marble, and wood. The apparatus includes an applicator head having an inner chamber and an outer chamber surrounding the inner chamber both of which chambers are connected with a vacuum source. The inner chamber is also connected with a source of pressurized liquid treatment material. The method is for treating such porous structures and includes the steps of engaging the structures with the applicator head, drawing a vacuum on at least the outer chamber to secure the applicator head to the structure, and supplying the pressurized liquid treatment material to the inner chamber to impregnate the structure to be treated.

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: The coating apparatus and method enable the coating liquid having been scraped-off to be reused without doing any one of the fluid adjusting treatment and the filtering treatment, while maintaining the features of the scraping-off type of extrusion coater, which is suitable for obtaining a uniform and extremely thin coating film. The coating head is provided with two slits: a coating slit and a recovering slit, and the excessive coating liquid having been discharged through the coating slit and applied to the web is scraped-off and recovered through the recovering slit.

Abstract: A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

Abstract: A vacuum pump system (10; 36; 46) for pumping gas from an enclosure (12) comprises: a vacuum pump unit (14) having a pump inlet (16) connectable with an outlet (18) of such an enclosure and a pump outlet (20) for exhausting gas; and a chamber (22; 50) selectively connectable with the pump inlet and the pump outlet, such that, in use, in a first state gas can be pumped from the chamber to the pump inlet by the vacuum pump unit and in a second state gas can be evacuated from the pump outlet to the chamber to reduce pressure at the pump outlet. A method of controlling the vacuum pump system (10; 36; 46) comprises a first step of pumping gas from the chamber to the pump inlet using the vacuum pump unit and a second step of allowing gas to be evacuated from the pump outlet to the chamber to reduce pressure at the pump outlet.

Abstract: A reaction apparatus including: a main body having a reaction chamber with an upper opening thereof, a lid hinge, and a lid combined to the lid hinge, rotationally opening and closing the upper opening; a lifting member having a first end part separated from a rotation axis of the lid and rotatably combined with the lid, and a second end part rotatably combined to the main body, that moves in opening and closing directions; and a driver activating the lifting member. With this configuration, the present invention provides a reaction apparatus, with a lid that is opened and closed readily, and in which the lid parallelly contacts a sealing member, and thereby creating a vacuum in the reaction chamber with ease.

Abstract: In a method and an apparatus for curtain coating of a moved substrate like a paper web substrate is moved below a liquid supply means providing a single or multilayer liquid coating in the form of a free-falling curtain impinging the substrate at a dynamic wetting line and a blade or air shield located upstream of the dynamic wetting line with respect to the moving direction of the substrate. The dynamic wetting line of the coating curtain on the substrate or web is oriented generally perpendicular to the moving direction of the substrate or web, providing substantially the same air pressure over an essential part of the coating curtain on its front and back side with respect to the moving direction of the substrate and providing a first supply air flow upstream to the wetting line.

Abstract: A vacuum painting head to paint objects, including a container having an inlet aperture and an outlet aperture for the object to be painted, wherein the outlet aperture has a transverse section substantially equal to that of the object to be painted, wherein a suction pump is provided to create inside the container a determinate depression with respect to atmospheric pressure, and wherein paint is continuously introduced into the container. A stopper element is inserted into one of the apertures and is selectively movable to move away from or closer to the other aperture to open or close it.

Abstract: In coating with two slits of a coating slit and a recovering slit, by optimizing the slit clearance of the coating slit and the recovering slit, a coating layer with a very small and even thickness can be obtained. In a coating apparatus in which after a coating liquid is applied to a web to excess through the coating slit, a desired amount of coating liquid is applied to the web by scraping off an excess of coating liquid with a recovering slit, there is provided a slit clearance adjusting device for adjusting the slit clearance of the recovering slit.

Abstract: Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).

Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C?N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.

Abstract: In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.

Abstract: This invention makes it possible to make even films composed of at least silicon and germanium with gradient germanium ratio along a film thickness direction thereof for a short deposition time. A temperature controller 61 controls a heater 2 so that temperature of wafers W will be changed from low (e.g. 400° C.) to high (e.g. 700° C.) by alternately repeating temperature changing process to heat up the wafers W and temperature regulating process when temperature of the wafers W does not change as much as that of the temperature changing process for a specific amount of time. While a gas controller 62 provides a reactive gas into a reaction tube 1 during the temperature regulating process, it controls a valve 31 to stop it during the temperature changing process.

Abstract: A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the mid-stream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.

Abstract: Plasma processing equipment includes a process, a cover covering the top of the process chamber, a wafer chuck disposed in the process chamber, a pressure regulating system including a pressure regulating plate situated at the bottom surface of the cover, and an elevating mechanism for adjusting the position of the pressure regulating plate, and a measuring device including at least one visual display for use in calibrating the pressure regulating system.

Abstract: A device for applying a coating medium to at least one partial surface of an elongated workpiece in a vacuum chamber. The device includes a housing (1) having a storage container (2) with an oblique base (3) and an air conduit opening into the base and of a deposition device that is positioned above the storage container. To ensure that the air stream exiting the vacuum chamber has a degree of purity that complies with legal requirements so that the stream can also be introduced into the working chamber, or can be used for a further coating process without any detrimental effect on the same, several sheath-type filter rods (13), which consist of borosilicate glass and are traversed by the air, are arranged downstream of the deposition device (5,7) in the direction of flow of the air removed by suction.

Abstract: A method for the application of liquid through viscid medium onto the surface of a pre-dried material web including the steps of applying a viscid medium to at least one side of the material web, routing the material web through a press nip and supporting the material web substantially without free draw.

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: An apparatus for applying liquid or pasty application medium, in particular aqueous pigment suspension, to one or both sides of a moving material web, especially to a paper or board web, during its production and/or finishing. The invention provides for the vacuum generating device to be assigned to that side of the material web which faces away from the application medium curtain, at least to the region of incidence of the application medium on the material web.

Abstract: A process tool, preferably a spin coater, includes a set of at least three arms and an adjustable rinse nozzle. The arms lift a substrate, e.g. a semiconductor wafer, from a chuck inside the process chamber after having performed the corresponding manufacturing step, e.g. coating. The contact area between the arms and the substrate is as small as possible. The rinse nozzle dispenses a solvent liquid onto the backside of the substrate, thereby removing contaminating particles located at the area of contact between the vacuum channels of the chuck and the substrate. The set of arms rotates for a homogeneous cleaning. A gas flowing out of vacuum ports of the chuck prevents the vacuum ports from being obstructed with particles. While the substrate is being lifted, the chuck can also be cleaned by dispensing the solvent liquid onto the chuck.

Abstract: The present apparatus includes a casing (1) having a gas introduction opening (3) for introducing a gas into the casing and a gas discharge opening (5) for discharging the gas from the casing, a gas circulating tube passage (8) communicating with the casing for effecting circulation of the gas, a circulating fan (11) for effecting circulation of the gas in the casing through the gas circulating tube passage, and a valve (6, 7) switchable between a position for conducting the introducing and discharging of the gas into and from the casing through the gas introduction opening and the gas discharge opening and a position for effecting circulation of the gas in the casing through the gas circulating tube passage. The apparatus further includes a trap (10), a filter (4) and a heat exchanger (9) for conducting a desired treatment with respect to the circulated gas, such as removal of particles.

Abstract: Apparatus for spraying a coating onto the outside of a pipe includes a body for mounting on a pipe to be coated. A spray gun is mounted on the body such that it can move relative to the body to spray coating completely around the periphery of the pipe. The apparatus may include only a single spray gun which is able to travel in a 360 degree range of motion around the periphery of the pipe. The apparatus is particularty suited to coating girth welds of a pipeline.

Abstract: A process chamber is provided which includes a gate configured to align barriers with an opening of the gate and an opening of the process chamber such that the two openings are either sealed or provide an air passage to the chamber. A method is provided and includes sealing an opening of a chamber with a gate latch and exposing a topography to a first set of process steps, opening the gate latch such that an air passage is provided to the process chamber, and exposing the topography to a second set of process steps without allowing liquids within the chamber to flow through the air passage. A substrate holder comprising a clamping jaw with a lever and a support member coupled to the lever is also contemplated herein. A process chamber with a reservoir arranged above a substrate holder is also provided herein.

Abstract: To achieve a uniform coating of a substrate, with an apparatus and a method for coating substrates, according to which the substrate is supported on a substrate holder in such a way that a substrate surface that is to be coated is exposed, and the substrate is rotated together with the substrate holder, a cover can be secured to the substrate holder and together with the substrate holder forms a sealed chamber for the substrate.

Abstract: An apparatus and method which is suitable for the bubble-free application of a resin to a substrate. The apparatus typically includes an airtight chamber which receives the substrate and a resin dispenser for dispensing the liquid resin onto the substrate. After a vacuum pressure is induced in the chamber, the resin is dispensed onto the substrate. Accordingly, air is substantially incapable of becoming trapped between the resin and the substrate and forming air bubbles during subsequent processing of the substrate.

Abstract: A vacuum/purge operation of a loadlock chamber prevents an eddy phenomenon from occurring in the chamber and thereby prevents wafers from being polluted and damaged by particles in the chamber. A vacuum pump for providing the loadlock chamber with vacuum pressure, and a gas supply for providing the chamber with purge gas are connected to the loadlock chamber by an exhaust line and a gas supply line, respectively. At least one control valve is installed in each of the lines. At the time the state of pressure in the loadlock chamber is to be changed, the loadlock chamber is provided with both the vacuum pressure and the purge gas at rates that are inter-dependent to establish a flow of gases towards and into the exhaust line. Then, the supplying of one of the vacuum pressure and the purge gas is gradually reduced and cut off.

Abstract: An apparatus for electroless spray deposition of a metal layer on a substrate, e.g., a Co shunt or barrier layer on a Cu layer on a semiconductor wafer, includes a processing chamber to hold the substrate, the processing chamber including at least one section movable between an open position to allow the substrate to be introduced into and removed from the processing chamber and a closed position to seal the processing chamber to allow for pressurization of the processing chamber. The processing chamber has an inlet to provide pressurizing gas, an exhaust line to exhaust pressurizing gas, a pressure regulator to regulate pressure there-within, and a sprayer to spray an electroless plating solution onto the substrate. A method for electroless spray deposition includes providing the in a processing chamber, sealing the processing chamber, pressurizing the processing chamber, regulating the pressure, and spraying an electroless plating solution onto the substrate.

Abstract: A method and apparatus for protecting electrical power transmissions systems that may or may not be energized. A two part resin composition acting as a dielectric material is distributed on electrical power systems at a location close to the transmissions systems. The dielectric material has dielectric properties suitable for protecting the desired areas in the solid form and that allow for safe application in the liquid form. The dielectric material can be distributed before installation of the electric lines or can be retrofitted to existing installations.

Abstract: A coating apparatus coats a liquid material on a substrate in a coating chamber. A first liquid supply system that supplies the liquid material is provided in the coating chamber. A second liquid supply system is provided in the first liquid supply system that supplies a liquid that cleans or that deactivates the liquid material remaining in the coating chamber and/or in the first liquid supply system. A coating apparatus, a thin film forming method, a thin film forming apparatus, a semiconductor device manufacturing method, an electro-optic device, and an electronic instrument are provided that enable a high performance thin film with few defects and with a high degree of reproducibility to be obtained, that allow maintenance of the apparatus to be performed efficiently and safely, and that enable a thin film to be formed at low cost.

Abstract: Methods and devices are provided to actively apply finish to one or more yarns in motion at speeds greater than about 3000 m/min, to achieve a finish application of 0.2 wt. % or more, and with a coefficient of variation of finish concentration of 10% or less. The devices are compact, portable and readily installed at a variety of positions on a fiber processing line. The devices of the invention contain the finish so that contamination of the surrounding areas is prevented.