Abstract: The ultrasonic ozone-generating unit in accordance with the present invention has an ozone-generating device, an independent seat, a sink device, an utensil-holding device and a vegetable basket. The utensil-holding device and the vegetable basket are mounted in a receiving space of the independent seat or in a sink of the sink device. An ozone gas generated by the ozone-generating device with a close-type air-pumping device capable of producing powerful ultrasonic carrier-airflow is guided into the receiving space or the sink and dissolved in water to sterilize deodorize and bleach an object to be cleansed.

Abstract: A microbubble cleaning system includes a tank in which a solution into which a product is immersed to clean the product is stored; supplying means for putting microbubbles into the solution and supplying the solution that includes the microbubbles into the tank; oil separating apparatus that collects bubbles that have risen to a surface of the solution stored in the tank as a result of cleaning the product, as well as a portion of the solution that is near the surface of the solution, in order to separate oil from the solution; generating means for generating a surface flow of the solution near the surface of the solution in order to remove the bubbles that have risen to the surface of the solution in the tank; and removing means for removing carbon dioxide from air that is used to generate the microbubbles by the supplying means.

Abstract: A system and method are provided in which a laminar flow of pressurized gas from a curved slit in a chamber is directed across a surface to propel a laminar flow of a liquid, below the laminar flow gas, across the surface to prevent surface contamination or remove contaminants from the surface. In a particular application, the system and method are employed in a self-cleaning dental mirror tool including a dental mirror attached to a handle, wherein the gas is air, the liquid is water, and the surface is the reflective surface of the dental mirror.

Abstract: A substrate processing method includes covering, in advance, the surface of a substrate with water, holding the substrate generally horizontally with the surface facing upward and rotating it in a horizontal plane, and blowing to the substrate top surface drying gas flow that is thin in area in comparison with the substrate surface, in which the water is removed from the substrate top surface by the rotation in the horizontal plane while blowing the drying gas flow, a substrate processing apparatus for implementing the above method, and a control program for use with the above method and apparatus.

Abstract: Apparatus, systems and methods for improving chemical strengthening of glass are disclosed. In one embodiment, a mechanical stress can be induced on a glass article while undergoing chemical strengthening. In another embodiment, vibrations, such as ultrasonic vibrations, can be induced during chemical strengthening of a glass article. The use of mechanical stress and/or vibrations during chemically strengthening of a glass article can enhance the effectiveness of the chemical strengthening process. Accordingly, glass articles that have undergone chemical strengthening processing are able to be not only thin but also sufficiently strong and resistant to damage. The strengthened glass articles are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).

Abstract: The present invention concerns an improved apparatus for cleaning the interior of a liquid handling probe to reduce the amount time and the volume of wash fluid required to clean the probe and minimize carryover of material between different samples. In addition to the probe, the apparatus includes one or more wash fluid reservoirs, a compressed gas supply, one or more pumps, two or more valve-controlled probe lines and a controller for opening and closing the valves and actuating the pump(s) at desired time intervals. The invention further concerns a method of cleaning a liquid handling probe using the claimed apparatus and comprising sequential steps of pumping wash fluid and compressed gas through the probe.

Abstract: A cleaning device to clean a plurality of nozzles of a surface-mount technology (SMT) includes a first cleaning container, a supporting board, a filtering member, a second cleaning container and a connection member. The first cleaning container defines a first opening in a bottom thereof. The supporting board to fix the plurality of nozzles is connected to the bottom of the first container. The filtering member is located at a bottom of the supporting board. The second cleaning container is connected to the filtering member, and operable to receive cleaning fluid. The connection member is connected the first cleaning container and the second cleaning container. Injection of air to the first cleaning container and the second cleaning container allows the cleaning fluid to circularly flow through the second cleaning container, the connection member, the first cleaning container, the supporting board, and the filtering member to clean the plurality of nozzles.

Abstract: A device and method for cleaning a bell cup after its removal from a rotary paint atomizer. The device preferably includes an enclosure within which the bell cup is retained during the cleaning operation. Pressurized cleaning fluid is introduced into the enclosure where it flows over the bell cup and removes paint therefrom. The enclosure may be connected to the nozzle end of a paint spray gun that can be used to deliver the pressurized cleaning fluid thereto.

Abstract: An apparatus for sterilizing and disinfecting a target space by spraying a chemical including alcohol includes a spray gun to which a chemical container containing a sterilizing and disinfecting chemical including alcohol is attachable, a gas cylinder filled with a compressed carrier gas that does not react with alcohol, and a pressure reducing valve for decompressing the carrier gas discharged in a vaporized state from the gas cylinder to a predetermined pressure, and is constructed so that the pressure reducing valve and the spray gun are directly connected with a gas hose and mounted on a common truck. The sterilizing and disinfecting apparatus can operate with a simple structure requiring no power supply, and is much lighter in weight compared to conventional apparatuses.

Abstract: Disclosed is a liquid processing apparatus to perform liquid processing by supplying a processing liquid from a nozzle formed on an irrotational member to a substrate while the substrate is rotated horizontally in a state where a back surface of the substrate faces downward. The liquid processing apparatus prevents droplets from remaining on the member. The liquid processing apparatus includes a nozzle member irrotationally provided below the substrate. The nozzle member includes a processing-liquid discharge nozzle to discharge the processing liquid and a gas discharge nozzle to discharge drying gas on a top surface of the nozzle member. The processing-liquid discharge nozzle includes a processing-liquid discharge port to discharge the processing liquid toward the substrate.

Abstract: The present invention concerns a control apparatus for a washing station comprising at least one inlet (3, 4) for a first fluid, preferably water, connected to at least one selector valve (1), which is in turn connected to first hydraulic pipe means (5, 7, 9, 13, 17), provided with first venturi mixing means (11, 31), and to third hydraulic pipe means (15), the first and third hydraulic pipe means (15) being connected to at least one respective outlet (16), the apparatus being characterised in that the selector valve (1) is further connected to second hydraulic pipe means (6, 8, 10, 14, 18), provided with second venturi mixing means (12, 32), also connected to said at least one outlet (16).

Abstract: A reactor for washing sand contaminated with hydrocarbons comprises a vessel having an aperture in a bottom portion thereof. A steam cleaning device is located near a top of the vessel for receiving contaminated sand and cleaning the contaminated sand as it is introduced into the vessel. A rinsing device is positioned below the steam cleaning device for rinsing the sand with water. A sand conveying device comprising an air injection device is positioned in the bottom portion of the vessel for urging sand out of the aperture using compressed air, such that the sand is partially dewatered as the sand is urged out of the aperture.

Abstract: An apparatus for sterilizing and disinfecting a target space by spraying a chemical including alcohol includes a spray gun 4 to which a chemical container 7 containing a sterilizing and disinfecting chemical including alcohol is attachable, a gas cylinder 1 filled with a compressed carrier gas that does not react with alcohol, and a pressure reducing valve 2 for decompressing the carrier gas discharged in a vaporized state from the gas cylinder 1 to a predetermined pressure, and is constructed so that the pressure reducing valve 2 and the spray gun 4 are directly connected with a gas hose 3 and mounted on a common truck 5. The sterilizing and disinfecting apparatus can operate with a simple structure requiring no power supply, and is much lighter in weight compared to conventional apparatuses.

Abstract: The present invention provides a nozzle device comprising a substantially cylindrical nozzle body and a cup member which is arranged within the cylinder of the nozzle body and jets out fluid droplets from the tip thereof while being driven to turn, wherein two or more fluids including a detergent and a gas are mixed and jetted out of the tip of the nozzle in order to achieve sufficient cleaning of a single wafer without a re-adhesion of contamination or destruction of the pattern of the wafer. Therefore, the fluid droplets can be controlled to a smaller size than the conventional double-fluid cleaning system or high pressure jet system.

Abstract: A washing machine having high pressure angled air jets that introduce air into the wash water in a stationary pressurized tub. A circular swirl flow-pattern and air pressure within the warm wash water agitates and cleans the clothes without the need for a mechanically rotated drum or detergent. Sediment from the laundry is removed from the water by drains both at the top and the bottom of the tub. At the end of the wash cycle, the high pressure air is used to drain and dehydrate the clean clothes.

Abstract: The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photoresist material from, e.g., a semiconductor wafer during semiconductor manufacturing. Methods involve implementing a pedestal for supporting a wafer, which pedestal has a low emissivity surface to reduce heat transfer by radiation.

Abstract: A cleaning method highly effectively cleans a surface of a semiconductor wafer by removing a dissolution product, produced when a surface of a semiconductor wafer is processed by a developing process that develops an exposed film formed on the semiconductor wafer by wetting the exposed film with a developer, from the surface of the semiconductor wafer. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto a central part of a rotating wafer processed by a developing process to spread the cleaning liquid in a film over the surface of the wafer. Then, the cleaning liquid pouring nozzle is shifted to create a dry area in a central part of the wafer and the wafer is rotated at 1500 rpm to expand the dry area.

Abstract: A method of cleaning pipeline pigs of a material that is to be recycled includes providing a vessel having an interior. A manifold is placed within the vessel interior, the manifold having a plurality of openings. The vessel is filled with a solvent that is capable of dissolving the material to be recycled. The pipeline pig is placed in the vessel and above the manifold. A volume of gas is bubbled into the vessel via the manifold openings. These steps are repeated with multiple pigs in sequence so that the material to be recycled is concentrated over time within the vessel. Thereafter, the material that has accumulated within the vessel is recycled. The solvent is preferably a terpene blend with an ethoxylated alcohol. The material to be recycled is preferably paraffin and/or asphaltene.

Abstract: A foam-assisted wafer-cleaning and drying method and apparatus based on forming a funnel-shaped space between the base plate of the apparatus and the wafer to be cleaned and supplying a foam cleaning liquid to the aforementioned space through the central opening of the base plate for displacing the cleaning liquid foam consisting of a plurality of bubbles from the center of the wafer toward the wafer periphery with a constant speed of movement of the bubbles provided by gradually decrease of distance from the base plate to the wafer in the radial outward direction from the center of the wafer. The nanoparticles of contaminants are caught with a surface-tension force developed by bubble meniscuses on the wafer surface.

Abstract: An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

Abstract: A contaminant-flushing machine for removing contaminants from a container, such as an engine transmission, air-conditioner coil, or transmission cooler, which includes hoses for coupling to the transmission cooler and a pump for circulating fluid through the hoses and the transmission cooler, and a fluid filter having a reduced tendency towards causing vaporization of the fluid. Also included in the contaminant-flushing machine is an automatic aeration system for injecting air into the circulating fluid at predetermined intervals. Additionally, a reverse flow piping circuit is included to permit automatic and electric manipulation of the flow direction of fluid through said transmission cooler while at the same time not altering the direction of flow of fluid through the pump. The flow reversals are repeated with a cycle of three (3) seconds in one direction followed by a flow in the other direction of one-fourth (¼) of a second, thereby creating an overall flow of fluid primarily in one reverse direction.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: A lithographic apparatus is disclosed having an in situ ozonizer, which is used to produce ozone gas, for example, by UV irradiation of an oxygen-containing gas. The thus produced ozone is dissolved in ultra-pure water by contacting the ozone with the ultra-pure water through a permeable membrane.

Abstract: The invention is an automatic no contact machine for cleaning and drying tips, air caps, retainers and cups on spray apparatus when changing liquid or when the apparatus will be idle, or to remove build up of paint on applicators that cause spits and drips on surfaces and electrostatic arcing to spray apparatus while containing and recovering cleaning effluents to an environmental standard.

Abstract: The cleaning apparatus of the invention includes first and second cleaning tanks cleaning a mask with a predetermined cleaning solution, a vacuum evaporator vacuum-distilling the cleaning solution of the first and second cleaning tanks, a first cooler cooling the vacuum-distilled cleaning solution to room temperature, a first return pipe returning the cleaning solution cooled by the first cooler to the second cleaning tank, first and second rinse tanks rinsing the mask with a predetermined rinse solution, an atmospheric evaporator distilling the rinse solution of the first and second rinse tanks at atmospheric pressure, a second cooler cooling the rinse solution distilled at atmospheric pressure to room temperature, and a second return pipe returning the rinse solution cooled by the second cooler to the second rinse tank.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: An upwardly directed gradient of dropping temperatures is controllably and sustainably created in a wet treatment tank between a cooled and face down workpiece (e.g., an in-process semiconductor wafer) and a lower down heat source. A thermal fluid upwell containing thermally collapsible bubbles is directed from the heat source to the face down workpiece. In one class of embodiments, bubble collapse energies and/or bubble collapse locations are controlled so as to avoid exposing delicate features of the to-be-treated surface to damaging forces. For example, rapid collapse of the thermally collapsible bubbles is caused to occur at a predefined safe distance away from the delicate work face of the workpiece so that the delicate work face is not damaged and yet treatment effective kinetic energies are coupled from the collapsing bubbles to the work face. In one class of embodiments the wet treatment includes ultracleaning of the work face.

Abstract: A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in a drying chamber disposed over the cleaning tank. A shutter separates the cleaning tank from the drying tank. A wafer boat moves the wafer vertically between the cleaning tank and the drying tank. Nozzles for providing the cleaning solution onto the wafer are disposed at both inner sides of the drying tank. The nozzles are connected to a drying gas supply unit to alternately and periodically provide the drying gas onto the wafer.

Abstract: A cavitation cleaning system and method for using the same to remove particulate contamination from a substrate including providing at least one substrate immersed in a cleaning solution said cleaning solution contained in a cleaning solution container. The container further includes means for producing gaseous cavitation bubbles of ultrasound energy, said gaseous cavitation bubbles arranged to contact at least a portion of the at least one substrate; applying ultrasound energy to create gaseous cavitation bubbles to contact the substrate to remove adhering residual particles in a substrate surface cleaning process; and, recirculating the cleaning solution through a particulate filtering means.

Abstract: Hollow porous fibers containing adhered contaminants are cleaned to remove the contaminants by backflushing a liquid to fill the pores, and adding a flow of gas so as to form a two-phase mixture of gas and bubbles of liquid that can scrub the fibers, loosening the contaminants and allowing them to be flushed from the hollow fibers. The method is particularly useful for cleaning hemodialyzers used for dialysis and hollow fiber modules used in water treatment and separations. The two phase flow method is specifically effective in cleaning piping systems having high length to diameter (l/d) ratios.

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.

Abstract: A cleaning apparatus is provided for cleaning an inner surface of a container. A spray head is arranged for operable fluid communication with a fluid pump and has a nozzle configured to disperse liquid in a mist. A mount carries the spray head and is removably supportable on a container having an inner surface to be cleaned. When removably supported on a container, the mount supports the spray head in a position within the container where the spray head can coat the inner surface of the container with mist.

Abstract: An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the amount of reactive gas that reaches the wafer surface through the boundary layer. The apparatus and method may be used to clean a semiconductor wafer surface and/or grow an oxide layer on the wafer surface by oxidation.

Abstract: An apparatus for cleaning semiconductor wafers includes a chamber, a bubbler having a vapor generating part for generating alcohol vapor and a spray pipe for spraying the alcohol vapor into the chamber, a gas supply nozzle for spraying gas into the chamber to dry the wafers, a liquid supply nozzle for supplying cleaning liquid into the chamber and a discharge system. The spray pipe of the bubbler has a liquid retention portion that keeps condensate of the alcohol vapor from issuing into the chamber. The gas supply nozzle has a spray outlet configured to spray the same amount of the drying gas onto all of the wafers in the chamber. The liquid supply nozzle has liquid supply openings only in a side portion thereof so that liquid alcohol will not become trapped therein.

Abstract: A solvent flush cleaning system for a paint supply system. The cleaning system includes an air injection system that injects air directly into the pumping chambers of the solvent pump to entrain air within the solvent. The cleaning system preferably includes a dedicated double diaphragm pump that circulates the solvent. The air injection system preferably includes a pair of injection valves that cooperate to selectively supply pressurized air to each pumping chamber. The air injection system further includes an actuation assembly that times the injection valves so that pressurized air is supplied to each pumping chamber as that chamber expands. The actuation assembly includes actuation valves that are operated by pressure within the air chambers of the pump. When pressure builds in one air chamber, it opens the corresponding actuation valve, which in turn actuates the injection valve causing pressurized air to be supplied to the opposite pumping chamber.

Abstract: Provided is a cleaning apparatus having a fluid mixing nozzle, the cleaning apparatus having a fluid mixing nozzle, the cleaning apparatus for cleaning a glass plate used in the manufacture of a flat-panel display and which mixes a cleaning fluid with a gas and sprays the mixture uniformly on the entire surface of a glass plate, thereby providing superior cleaning effects with a minimum amount of cleaning fluid. The fluid mixing nozzle includes a nozzle in the shape of a rectangle, which mixes a cleaning fluid and a pressured gas and sprays a mixture on the flat-panel display. By tightening the nozzle in a direction of the short axis of the nozzle with use of streamlined structures at a predetermined interval, it is possible to prevent a gap of the nozzle from being elastically deformed.

Abstract: Disclosed is a method and device for collecting particulate contaminants removed using a CO2 decontamination medium from an early step of a decontamination process. The device removes particulate contaminants from a contaminated subject by a decontamination stream, and simultaneously forms another stream for collecting such contaminants into a collecting filter, thus preventing such contaminants from diffusing into the atmosphere. The device forms streams between the nozzles and the surface of the contaminated subject to readily move the nozzles along the surface of the subject without frictional resistance, to reduce the sense of fatigue of the operator.

Abstract: A contaminant-flushing machine for removing contaminants from a container, such as an engine transmission, air-conditioner coil, or transmission cooler, which includes hoses for coupling to the transmission cooler and a pump for circulating fluid through the hoses and the transmission cooler, and a fluid filter having a reduced tendency towards causing vaporization of the fluid. Also included in the contaminant-flushing machine is an automatic aeration system for injecting air into the circulating fluid at predetermined intervals. Additionally, a reverse flow piping circuit is included to permit automatic and electric manipulation of the flow direction of fluid through said transmission cooler while at the same time not altering the direction of flow of fluid through the pump. The flow reversals are repeated with a cycle of three (3) seconds in one direction followed by a flow in the other direction of one-fourth (¼) of a second, thereby creating an overall flow of fluid primarily in one reverse direction.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: A micro device in which a functional element can be moved between an operating position and a waiting position by the displacement of support means coupled to a substrate. The micro device has a cantilever structure in which one end of support means is made a fixed one fixed to the substrate and the other end to which an active element is provided is made a free end. A spring portion is provided to at least part of the support means, and thus the active element can be greatly displaced by a small stress.

Abstract: The present invention is an apparatus for storing and delivering a low vapor pressure process chemical to a process tool for semiconductor fabrication, comprising: a) a bulk container for storing the process chemical; b) a process container for delivering the process chemical to the process tool; c) a first manifold for delivering process chemical from the bulk container to the process container; d) a solvent container containing a quantity of solvent, and; e) a second manifold for delivering the process chemical from the process container to a process tool. A process for using the apparatus is also contemplated.

Abstract: A reprocessing unit for the reprocessing of a device having internal passageways by applying a fluid at a plurality of pressures to the internal passageways of the device to permit reuse of the device in a clean environment, the reprocessing unit including a pressure differentiation device for receiving a fluid having a single input pressure, the pressure differentiation device having first and second pressure control fittings for providing first and second differing pressure outputs in accordance with the single input pressure. Also included are tubing for transmitting the fluid at the first and second differing pressures from the pressure differentiation device to the internal passageways whereby the internal passageways are reprocessed with the transmitted fluid at the first and second differing pressures and the internal passageways are reprocessed at differing pressures in accordance with the single input pressure.

Abstract: Provided is a process and apparatus characterized by a gas distribution plate in which a gas supply manifold directs gas bubbles from the bottom of a process tank upward and between wafers contained in a cassette and supported therewithin. This improved method and apparatus is used for effectively stripping photoresist from the larger semiconductor wafers having dense top conductive patterns with protuberant sidewalls. The method provides a scrubbing action that is parallel to the device array being formed on the wafer's surface. Broadly stated, the method of a chemical action on large substrates supported adjacent respective edge portions thereof in a carrier includes submerging the carrier and substrates supported thereby in a process tank containing a liquid chemical, and a gas distribution plate disposed on the bottom of the tank for directing gas bubbles upward and parallel to the surfaces of each substrate contained in the carrier to ensure that a uniform chemical action occurs.

Abstract: A shield for a plug valve is provided to prevent debris from hindering the movement of moving components of the plug valve. The shield prevents larger sized debris from accumulating at an opening in a wall in which the plug valve is mounted, the wall defining a confined space, such as the interior of a vessel, at least in part. The shield encloses but is spaced from the plug valve and a device is located within a space between the shield and the plug valve for directing a purging gas through the space to sweep away or purge smaller sized debris from the space.

Abstract: A method and biological cleaning system are provided for cleaning substrate surfaces of oils and/or greases using a biological cleaning system which utilizes a pre-treatment bath and/or post-treatment bath as part of the cleaning system. The pre-treatment and/or post-treatment baths are compatible with the biological cleaning bath and during operation of the system, the used pre-treatment and/or post-treatment baths are recycled to the biological cleaning solution for biodegradation. A system is provided in which none of the pre-treatment, post-treatment or biological cleaning baths need expensive waste disposal. Replenishment pre-treatment and/or post-treatment baths as well as biological cleaning baths are added as needed to the biological cleaning system. Other treatment baths may be added directly to the biological cleaning bath with or without pre- or post-treatment for specific purposes such as a detergent phosphating bath used in the biological cleaning tank to provide a cleaned phosphated part.

Abstract: A novel chemistry, system and application technique reduces contamination of semiconductor wafers and similar substrates and enhances and expedites processing. A stream of liquid chemical is applied to the workpiece surface. Ozone is delivered either into the liquid process stream or into the process environment. The ozone is preferably generated by a high capacity ozone generator. The chemical stream is provided in the form of a liquid or vapor. A boundary layer liquid or vapor forms on the workpiece surface. The thickness of the boundary layer is controlled. The chemical stream may include ammonium hydroxide for simultaneous particle and organic removal, another chemical to raise the pH of the solution, or other chemical additives designed to accomplish one or more specific cleaning steps.

Abstract: A method for the reprocessing of a device having internal passageways by applying a fluid at a plurality of pressures to the internal passageways of the device to permit reuse of the device in a clean environment includes applying a fluid having a single input pressure to a pressure differentiation device having first and second pressure control fittings for providing first and second differing pressure outputs in accordance with the single input pressure and transmitting the fluid at the first and second differing pressures from the pressure differentiation device to the internal passageways. The internal passageways are reprocessed with the transmitted fluid at the first and second differing pressures, whereby the internal passageways are reprocessed at differing pressures in accordance with the single input pressure.

Abstract: A semiconductor device production method that is used to uniformly and efficiently reduce metal oxides produced on metal (copper, for example) which forms electrodes or wirings on a semiconductor device. An object to be treated on which copper oxides are produced is put into a process chamber and is heated by a heater to a predetermined temperature. Then carboxylic acid stored in a storage tank is vaporized by a carburetor. The vaporized carboxylic acid, together with carrier gas, is introduced into the process chamber via a treating gas feed pipe to reduce the copper oxides produced on the object to be treated to metal copper. As a result, metal oxides can be reduced uniformly without making the surfaces of electrodes or wirings irregular. Moreover, in this case, carbon dioxide and water are both produced in a gaseous state. This prevents impurities from remaining on the surface of copper.