Abstract: A filter assembly for use with a vacuum apparatus and a hair clipper is disclosed. The assembly includes a top piece, a bottom piece, and a filter member. The top piece is formed having a generally circular perimeter with an inlet aperture located on the perimeter such that the inlet aperture is adapted for tangential acceptance of a vacuum hose. The specific arrangement of components, including the tangential position of the aperture, creates a hair collecting vortex within the assembly when a vacuum source is attached and activated.

Abstract: An object of the invention is to provide a cleaning device for a ceiling transport facility in which a plurality of locations to be cleaned can be cleaned appropriately while avoiding having insufficient suction power for the plurality of cleaning suction portions. A travelling guide portion for a transport carriage is provided on the ceiling side. The cleaning carriage that can travel along the travelling guide portion is provided with a plurality of cleaning suction portions for performing suctioning action on a plurality of locations to be cleaned in the travelling guide portion and a vacuum cleaner which is in communication with the plurality of cleaning suction portions. The plurality of cleaning suction portions are divided to a plurality of functioning units. And an interrupting device is provided for selectively permitting and preventing the communication of each of the plurality of the functioning units with the vacuum cleaner.

Abstract: A detector cleaner generally defined as a funnel structure with a preferably integrally formed wide surface area on one end, and an integrally formed narrow surface area on the opposite end, the funnel structure further having an interior void V or funnel channel where the wide area of the funnel structure is adapted to be placed over a detector to thereby completely encapsulate the detector. The narrow area of the funnel structure is adapted to be removeably connectable to a suction means (such as a vacuum machine) through a vacuum connection. Preferably, one or more angled holes are formed variously on the funnel structure so that when the suction means is engaged, the exterior air or other fluid flowing through each angled hole will dramatically enter the interior of the funnel to thereby create a significant fluid cyclone or swirling effect within the interior chamber of the funnel structure.

Abstract: Apparatus for treating a workpiece has first and second regions at least partially enclosed by a casing and in communication via a passage, and support means for a carrier holding the workpiece in the first region for treatment. Pressure difference between the regions forces the workpiece toward the carrier and guides a flow of media from the first to the second region through the passage, at least partly, to create said pressure difference. Method for treating at least one workpiece holds the workpiece by forcing it toward the carrier with a created pressure difference between two regions. Holding also guides a flow of media from the first region to the second region through the passage in order to, at least partly, create said pressure difference. The treatment may comprise blasting, rinsing or drying. The workpiece may comprise cutting inserts, electronic components, small sized machined or formed components or parts.

Abstract: Some embodiments include methods for removing an edge bead after a photoresist application. Basic solution may be applied to the edge bead and removed with a vacuum, with the basic solution having a pH of at least about 14. Some embodiments include methods of profiling coatings along peripheral regions of substrates. A nozzle may be positioned above a peripheral region and oriented to direct a basic solution downwardly toward the peripheral region. A suction port may be positioned laterally outward of the peripheral region. Basic solution may be ejected from the nozzle toward the peripheral region, with the basic solution having a pH of at least about 14 and dissolving coating along the peripheral region. A vacuum may be provided within the suction port to pull the basic solution and the dissolved coating from the peripheral region.

Abstract: A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.

Abstract: A method and composition for removing stubborn stains that includes the application of a mixture comprising alkyl dimethyl benzyl ammonium chlorides, bleach, and water. A major advantage of the method is that the composition solution is strong enough to remove stubborn stains from soft and hard surfaces and restore original appearance and scent to old fabrics, yet sufficiently mild to not damage delicate and colored fabrics or pose a threat to the person treating the stain.

Abstract: A water tank cleaning apparatus and kit of components, the apparatus utilizing a wet or dry vacuum source, an adapter having one part of a two-component separable connector with a thumb tab thereon to facilitate separation of the two-component separable connector, and a working tip element having a second part of the two-component separable connector and functional end.

Abstract: A first application of a cleaning material is made to a surface of a substrate. The cleaning material includes one or more viscoelastic materials for entrapping contaminants present on the surface of the substrate. A first application of a rinsing fluid is made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate. The first application of the rinsing fluid is also performed to leave a residual thin film of the rinsing fluid on the surface of the substrate. A second application of the cleaning material is made to the surface of the substrate having the residual thin film of rinsing fluid present thereon. A second application of the rinsing fluid is then made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate.

Abstract: A substrate is placed on a plurality of support pins within an opening of a carrier, such that a gap exists between the radial perimeter of the substrate and the carrier. The substrate and carrier are passed in a linear direction through a meniscus generated between respective faces of upper and lower proximity heads. Each of the upper and lower proximity heads includes a plurality of meniscus nozzles configured to supply liquid to the meniscus. A plurality of vacuum ports are formed on the respective face of each of the upper and lower proximity heads and are arranged to completely surround the plurality of meniscus nozzles. Liquid of the meniscus is evacuated from the gap between the radial perimeter of the substrate and the carrier so as to reduce a size and a frequency of at least one of entrance or exit marks on the substrate.

Abstract: A debris collecting system comprises a debris collecting assembly including an air-flow generating device and a debris body. The system further comprises an intermediate debris collecting container connected to the debris collecting assembly such that the collected debris is by-passing the debris body of the assembly.

Abstract: A method for processing a substrate is provided. The method includes generating a controlled meniscus using a proximity head. The proximity head has a face in close proximity to a surface of the substrate, and the face includes a substantially flat surface. The controlled meniscus is generated by delivering a chemical to the meniscus through discrete nozzles formed in the face of the proximity head. The method includes moving the proximity head over the substrate so that an area of contact between the meniscus and the surface of the substrate moves from a first location to a second location on the substrate. The moving of the proximity head causes a chemical remainder to be left behind on the surface of the substrate at the first location. The chemical remainder being a layer of the chemical from the meniscus that adheres to the surface of the substrate.

Abstract: The present invention is a dust elimination attachment device used in combination with a container and a vacuum hose that includes a two pronged tubular body with a top and a bottom with two sides, a securing loop disposed on the top of the tubular body to receive and secure the vacuum hose and a pair of open ended prongs to receive an edge of the container disposed on the bottom of tubular body. The prongs are utilized to receive an edge of the container to secure the device and the vacuum hose to the container. There is also a method for using a dust elimination attachment device in combination with a container and a vacuum hose.

Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

Abstract: A vacuum cleaner attachment and a method of control of the vacuum cleaner attachment are described. The vacuum cleaner attachment comprises an ultraviolet light source to irradiate and disinfect various cleaning surfaces. Various embodiments of the attachment include one or more safety features concerning activation, enabling, and disabling of the ultraviolet light source based on various parameters such as distance between the attachment and a cleaning surface, time that such a distance is greater than a predetermined time period, and temperature of the ultraviolet light source in order to enable safe and effective operation of the attachment.

Abstract: The invention concerns a device (1) for wetting a medical equipment component (20) with a liquid medium (M), having a dispenser (10) for applying the liquid medium (M) to a section (200) of the component (20) that is to be wetted. A device of this type is characterized by a suction device (12) for drawing off at least a portion of the liquid medium (M) from the section (200) of the component (20) that is to be wetted. The invention furthermore concerns a method for wetting a component. In this manner, a device and a method for wetting a component with a liquid medium is created, with which a wetting procedure can be executed in an at least partially automated manner, at least partially reducing the risk thereby of blockage at the opening of the component as a result of too much liquid being applied.

Abstract: A lid 81 included in a processing vessel 30 is held by a simple mechanism to prevent the leakage of an atmosphere in a processing space 83 formed in the processing vessel 30 into an environmental space. A low-pressure space 84 surrounds the processing space 83 formed in the processing vessel 30. The processing vessel 30 is provided with a first sealing member 101 sealing a joint between a part of a vessel body 80 and a part of the lid 81 to separate the low-pressure apace 84 from the processing space 83, and a second sealing member 102 sealing a joint between a part of the vessel body 80 and a part of the lid 81 on the outer side of the first sealing member 101 to separate the low-pressure space from an external space surrounding the processing vessel 30.

Abstract: Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes are disclosed. A representative method includes exposing a semiconductor workpiece to a vapor, with the semiconductor workpiece having an opening extending from a first surface of the workpiece through the workpiece to a second surface facing opposite from the first surface. The opening can include a contaminant, and the method can further include drawing the vapor and the contaminant through at least a portion of the opening and away from the second surface of the semiconductor workpiece.

Abstract: A method of using a processing system that is operable to deposit liquid and to remove liquid by way of negative pressure. The method includes arranging a device to have at least one of the liquid deposited thereon by the processing system and the liquid removed therefrom by the processing system. The device has a sensor portion disposed thereon. The sensor portion can provide a sensor signal based on pressure related to the at least one of the liquid being deposited thereon by the processing system and the liquid being removed therefrom by the processing system. The method further includes performing at least one of depositing, by the processing system, the liquid onto the device and removing the liquid, by the processing system, from the device. The method still further includes providing the sensor signal, by the sensor portion, based on the pressure related to the at least one of the liquid being deposited onto the device and the liquid being removed from the device.

Abstract: A cleaning device may include a solution tank configured to store cleaning solution. The solution tank may include an inlet and an outlet. The cleaning device may include at least one discharge line filter in fluid communication with the solution tank and a pump having a pump intake and a pump discharge. The pump may be configured to direct cleaning solution from the solution tank outlet through the at least one discharge line filter. The cleaning device may include a cleaning head in fluid communication with the pump discharge and a bypass line in fluid communication with the pump discharge and the inlet. The bypass line may be configured to divert cleaning solution received from the pump discharge away from the cleaning head and toward the solution tank.

Abstract: A remote-controlled, autonomous, or semi-autonomous vacuum cleaner for raised floor environments comprises a vacuum cleaner especially configured to clean tight, hard-to-reach areas, such as the space between the floor and the raised panels of a raised access floor system and a control module for remotely operating the vacuum cleaner.

Abstract: A method of cleaning dirt and debris from surfaces using a cleaning device, such as a vacuum cleaner. The cleaning device has a handle unit which is attached to the body of the cleaning device adjacent a filter compartment. The handle unit has a handle portion that is spaced from the filter compartment to allow a user to place his or her hand through the space and grasp the handle portion and thereby carry the cleaning device using only the handle unit. The handle unit can also be detached from the body of the cleaning device, and then later re-attached, via lockable mating connecting elements.

Abstract: The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus.

Abstract: An industrial vacuum system which is contained in a portable container having a bottom and an open end and includes an extension unit having a first end operatively connected to the portable container and a second end that is selectively extendable away from the container, a collection unit rotatively coupled to first ends of the extension unit, a transportation unit coupling the extension unit to the container, the transportation unit having one end rotatively coupled to the end of the extension unit the transportation unit including a plurality of wheel units, and a trolley guidance unit having a rail attached to the bottom of the container and engaging the wheels of the wheel unit.

Abstract: A container rinsing system has a nozzle adapted to be positioned proximate an opening of the container and adapted to direct a supply of air in any orientation to the container. A vacuum member is positioned around the air nozzle and adapted to vacuum foreign particles away from the container. A system comprises an air source and a manifold having a manifold inlet, an ionization unit, and a plurality of manifold outlets along with a plurality of air nozzles. Each nozzle has a nozzle inlet, a nozzle outlet, and a nozzle passageway extending between the nozzle inlet and the nozzle outlet. The ionization unit is placed within the manifold, and the plurality of nozzles are located on the plurality of manifold outlets such that during operation air is ionized before entering the nozzles. The ionized air is used to clean containers.

Abstract: A method of cleaning a turbo pump is described. The turbo pump is coupled with a CVD chamber of depositing a material and thus accumulates the material therein. The method includes switching off the turbo pump and using another pump to pump a reactive gas, which can react with the material to form gaseous products, through the turbo pump. Thereby, the turbo pump is cleaned up and is prevented from being a particle source in subsequent CVD operations.

Abstract: A method for removing a hardened photoresist from a semiconductor substrate. An example method for removing a hardened photoresist layer from a substrate comprising a low-? dielectric material preserving the characteristics of the low-?dielectric material includes: a)—providing a substrate comprising a hardened photoresist layer and a low-? dielectric material at least partially exposed; b)—forming C?C double bonds in the hardened photoresist by exposing the hardened photoresist to UV radiation having a wavelength between 200 nm and 300 nm in vacuum or in an inert atmosphere; c)—breaking the C?C double bonds formed in step b) by reacting the hardened photoresist with ozone (O3) or a mixture of ozone (O3) and oxygen (O2) thereby fragmenting the hardened photoresist; and d)—removing the fragmented photoresist obtained in step c) by wet processing with cleaning chemistries.

Abstract: There is provided a liquid processing apparatus including a rotation unit configured to hold the target substrate and rotate the target substrate around a vertical axis; a processing solution supply nozzle configured to supply the processing solution to the surface of the target substrate being rotated; a first gas supply unit configured to form a downward flow of a first gas that flows over the entire surface of the target substrate and is introduced into a cup in order to form a processing atmosphere suitable for a liquid process to be performed; and a second gas supply unit configured to form a downward flow of a second gas different from the first gas in a region outside the downward flow of the first gas. The first gas supply unit and the second gas supply unit are provided at a ceiling portion of the housing serving as the processing space.

Abstract: A method for cleaning a diffusion barrier over a gate dielectric of a metal-gate transistor over a substrate is provided. The method includes cleaning the diffusion barrier with a first solution including at least one surfactant. The amount of the surfactant of the first solution is about a critical micelle concentration (CMC) or more. The diffusion barrier is cleaned with a second solution. The second solution has a physical force to remove particles over the diffusion barrier. The second solution is substantially free from interacting with the diffusion barrier.

Abstract: A method for drying workpieces includes immersing the workpieces in a liquid bath, raising the workpieces with a first holder until a central opening of the workpieces is visible above liquid surface, then using a dry second holder rod inserted through said central opening to continue raising process. Due to this, a drying portion of the workpiece is not held by a wet holding mechanism.

Abstract: The present invention is generally directed to a system, device and method for removing a layer of sediment formed on the bottom of a pond. A submersible vacuum unit associated with in-line import and export sections made from at least 2 inch diameter tubing is supported by a single ski or wheel that is in contact with the pond bottom surface, with a flexible hose connected to the export and directed outside the pond for disposal or filtering of suctioned water. In certain embodiments, leaf /debris bagging mechanisms or mulching mechanisms are employed to facilitate removal of large debris from pond bottoms, while fine silt material is contained in a region and suctioned off the bottom surface.

Abstract: A wafer is substantially discharged in a load lock upon removal from a processing system and prior to storing in a storage compartment. The discharge helps to separate some electrostatically charge particles from the wafers. The particles may be also by creating turbulence inside the load lock during venting and/or purging cycles. These particle removal operations can be performed without significant impact to the overall process throughput.

Abstract: A plurality of reagent dispensing tips (15) are inserted through frustoconical openings (28) in a cover (16) of a cleaning chamber in the form of intersecting axial bores (14) and sprayed with wash fluid from spray passages (34) in the peripheral wall (20) of the cover (16). Wash fluid from the spray passages (34) and flowing through the reagent dispensing tips (15), if hollow, can be drained from the cleaning chamber through a drain port (42). Air is drawn through the frustoconical openings (28) around the reagent dispensing tips (15) into the cleaning chamber, through filter element (64) and from a waste chamber (50) by a vacuum source (78) to remove wash fluid from and otherwise dry the reagent dispensing tips (15).

Abstract: A method for processing a substrate includes an operation of positioning a surface of a head proximate to a surface of the substrate. The surface of the head has a length and a plurality of ports that are configured in rows along the length of the head. Each row of ports can deliver a fluid to the surface of the substrate or deliver a vacuum to remove the fluid from the surface of the substrate. The method also includes an operation of controlling delivery of the fluid to one or more selected rows and delivery of the vacuum to one or more selected rows so that at least one meniscus is formed whose width depends on a desired exposure time of the meniscus to the surface of the substrate for a particular speed of relative movement between the head and the substrate.

Abstract: A cleaning method that can prevent abnormal wear of an O-ring. A cleaning gas containing at least oxygen gas is supplied to the interior of a chamber in which a substrate is accommodated, and radio-frequency voltage is applied to the interior of the chamber to produce oxygen radicals from the cleaning gas. When the amount of deposit produced in the chamber in plasma processing is larger than a predetermined amount, the amount of fluorine radicals in the chamber is increased, and when the amount of the deposit is smaller than the predetermined amount, the amount of fluorine radicals in the chamber is decreased.

Abstract: The embodiments of the present invention provide methods for cleaning patterned substrates with fine features. The methods for cleaning patterned substrate have advantages in cleaning patterned substrates with fine features without substantially damaging the features by using the cleaning materials described. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).

Abstract: Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.

Abstract: A foreign matter removal method that removes foreign matter attached to a surface of a substrate having been subjected to predetermined processing. An edge of a rotating substrate mounted on a mounting stage is irradiated with misalignment measurement laser light. The misalignment measurement laser light other than the laser light blocked by the edge of the substrate is received, and power thereof is detected. The amount of misalignment of the substrate is calculated based on the detected power of the misalignment measurement laser light and a detected rotation angle of the rotating substrate. The misalignment of the substrate is corrected for based on the calculated amount of misalignment. After that, foreign matter removal laser light is irradiated, and a process gas that is to react with the foreign matter is jetted to the edge of the substrate. Consequently, the foreign matter attached to the substrate is decomposed and removed.

Abstract: There is provided a method for exchanging an atmosphere of a vacuum chamber of a processing apparatus configured to process a substrate under a vacuum environment. The method includes the steps of holding the substrate using a holding unit provided in the vacuum chamber, and exchanging the atmosphere of the vacuum chamber through exhaustion or air supply, wherein the exchanging step maintains a pressure of the vacuum chamber in a range between 10 Pa and 10000 Pa for a period between 10 seconds and 600 seconds while controlling a temperature of a dust collection unit provided in the vacuum chamber lower than a temperature of the substrate.

Abstract: A system is disclosed. The system includes a fluid reservoir containing a volume of fluid, a bell housing that forms a chamber, a workpiece having a first surface portion and a second surface portion, and a pressure manipulating sub-system in fluid communication with the chamber of the bell housing. The bell housing is arranged relative to the fluid reservoir such that a lower end of the bell housing is at least partially submerged in the fluid thereby sealing the chamber of the bell housing from atmosphere. The bell housing is arranged relative to the fluid reservoir such that the second surface portion of the workpiece is disposed within the chamber of the bell housing that is sealed from atmosphere. A method is also disclosed. An apparatus is also disclosed.

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract: A vacuum cleaner includes a drive unit configured to generate a suction air stream, a vacuum attachment, a separator device disposed between the vacuum attachment and the drive unit and a control unit. The control unit is configured to influence an input power to the drive unit as a manipulated variable so as to control the suction power at the vacuum attachment as the controlled variable. The suction power at the vacuum attachment is controllable at a predefined level.

Abstract: The present invention relates to hydrocarbon extraction method and apparatus therefor.

Abstract: Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

Abstract: A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete holes connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.

Abstract: Devices, including a wash ring assembly, and methods are provided for the removal of excess fluid or solids from the exterior or interior of a probe used to transfer fluids, for instance, in an automated assay device. Typically, a probe is used to aspirate and dispense a sample fluid material such as whole blood or a reagent. The devices and methods provided herein are useful for removing excess fluid from the exterior or interior of the probe so as to prevent dripping and cross-contamination between samples or reagents. It is also contemplated that, utilizing the devices and methods provided herein, washing and/or drying can be performed simultaneously as the probe is in motion, aspirating a sample and/or dispensing a sample.

Abstract: In the printer, after ink is discharged from nozzle openings by making a closed space area, formed by bringing a cap into contact with a recording head, enter into a negative pressure state due to negative pressure accumulated in a discharge flow path by driving a pump, when making the negative pressure state of the closed space area be subjected to a pressure change in a direction of coming to an atmospheric pressure state, after the air flows into the closed space area by making a second opening and closing valve provided at an inflow flow path which makes the closed space area and an aerial space communicate with each other be in an opened state, the inflow of the air into the closed space area through the inflow flow path is stopped in a state where negative pressure remains in the closed space area.

Abstract: A resist removing device 1 functions to remove a resist from a substrate while preventing occurrence of popping phenomenon and at the same time attains reduction in cost of energy for the resist removing and has a simplified constitution. The resist removing device 1 is equipped with a chamber 2 for containing therein a substrate 16 (for example, a substrate having a high-doze ion implanted resist), and with a pressure below the atmospheric pressure, the chamber 2 is fed with ozone gas, unsaturated hydrocarbons and water vapor. The ozone gas may be an ultra-high concentrated ozone gas that is produced by subjecting an ozone containing gas to a liquefaction-separation with the aid of a vapor pressure difference and then vaporizing the liquefied ozone. For cleaning the substrate 16 thus treated, it is preferable to use ultra-pure water. The chamber 2 is equipped with a susceptor 15 for holding the substrate 16. The susceptor 15 is heated to a temperature of 100° C. or below.

Abstract: Equipment is realized which is capable of increasing the frequency of use of a deposition mask of an organic EL element and the recycle of an adhesive agent by efficiently cleaning the deposition mask with little damage and efficiently collecting the adhesive agent. A pulse laser is irradiated to a deposition mask to separate the deposition agent from the deposition mask. The separated deposition agent is sucked by a suction nozzle, and the deposition agent is separated from air by a cyclone and deposited on a bottom of the cyclone. Thereafter, a first valve is opened to collect the deposition agent in a deposition agent collection section. Then a second valve is opened to move the deposition agent to a deposition agent refining section to be refined. A third valve is opened to store the refined deposition agent in a deposition agent storage section. The deposition mask may be cleaned without being damaged to collect the deposition agent with high efficiency.