Abstract: The invention relates to a cleaning method, and in particular, to a vacuum cleaning apparatus and a vacuum cleaning method thereof. A vacuum cleaning method comprising (a) positioning a dust receiver joined to one end of a vacuum suction device in the vicinity of the object of cleaning, (b) positioning a spray nozzle joined to one end of an air spray system adjacent to the object of cleaning, (c) operating the vacuum suction device, and (d) removing the foreign substances adhered to a surface of the object of cleaning by adjusting the pneumatic pressure of the air sprayed from the spray nozzle, may efficiently remove foreign substances adhered to the object of cleaning located in a narrow space.

Abstract: The present invention includes a vacuum cleaner nozzle assembly that has protective rollers that glide along the surface to be cleaned without interfering with the function of the vacuum cleaner nozzle. The nozzle comprises a tubular nozzle conduit in fluid communication with a vacuum conduit on a first end of the tubular nozzle and a nozzle mouth at the second end of the tubular nozzle opposite the first end. The nozzle conduit has a circumferential roller assembly collar attached to the outside of the tubular nozzle, the collar is formed with a plurality of radially spaced apart seats that are sized and configured to securely receive a plurality of respective balls that are rotatable inside the respective seats.

Abstract: Several techniques are disclosed to prevent dust and other particles from building up inside housings of electronic devices. These allow timely, easy and safe dust removal from the entire volume of the housing of the device without its disassembly by creating directed airflows inside of the housing. Moreover, dust is carried from the enclosure to a dust trap without allowing escape of dust from the enclosure into the ambient air. Dust removal is carried out by creating one or more directed airflows by air injection, exhausting or both air injection and air exhausting to move the dust from the enclosure to the dust trap. In some cases a sealing member is supplied to close off apertures in the enclosure that are not used in the dust collection process.

Abstract: By a method and a device for preventing corrosion on and in the region of a gas inlet nozzle during nitric acid condensation, contact of the condensing gas with the nozzle and with the surroundings of the nozzle are supposed to be minimized. This is achieved in that the gas inlet nozzle has a sleeve on the inside in the transition region to the interior of the condenser, by which sleeve a gas inlet orifice in the form of an annular gap is formed, whereby the annular space is provided with at least one feed opening for secondary air, so that an enveloping flow of secondary air is produced around the entering NO gas.

Abstract: A vacuum cleaner attachment comprising an upper tubular elongated hollow member having a first open end and a second open end, a connector, and a lower elongated hollow member having a first end and a second end, the first end adapted to fit the connector. The first open end of the upper tubular elongated hollow member is adapted to connect to an end of a vacuum cleaner hose connected to a vacuum cleaner and the second open end of the upper tubular elongated hollow member is adapted to connect to the connector. The connector comprises an elbow attachment and connects the upper tubular elongated hollow member and the lower elongated hollow member The lower elongated hollow member comprises an elongated flattened rectangular profile having a bottom surface and a top surface, the bottom surface located adjacent a floor surface when a user is operating the vacuum cleaner.

Abstract: A method for cleaning first and second filters of a suction device for cleaning purposes is provided. The suction device has a dirt collection container with a suction inlet. The dirt collection container is subjected to negative pressure via first and second suction lines, respectively, following the first and second filters. First and second closing valves close first and second external air inlets, respectively, into the first and second suction lines. For cleaning the filters, the closing valves are opened, subjecting the filters to external air on the clean space side. The dirt collection container is subjected to negative pressure via the first suction line and first filter by a first suction unit and via the second suction line and second filter by a second suction unit. The suction lines are sealed off relative to each other on the clean space side at least during the cleaning of the filters.

Abstract: Methods for fabricating a semiconductor device from a semiconductor substrate having a metal-comprising material and a disposable material are provided. In accordance with an exemplary embodiment, the method comprises providing a system for exposing the disposable material to a liquid chemistry and removing oxygen from the system. The disposable material is exposed to the liquid chemistry and is removed from the semiconductor substrate using the liquid chemistry and simultaneously the metal-comprising material is left substantially in tact.

Abstract: A vacuum cleaner having a main separating unit, a filter, an auxiliary separating unit, a vacuum source adapted to generate an airstream, and airflow passages configured to operate in a vacuum cleaning mode and a filter cleaning mode. In the vacuum cleaning mode, the airflow passages are configured to direct the airstream through the main separating unit and then through the filter in a first direction, and the airflow substantially bypasses the auxiliary separating unit. In the filter cleaning mode, the airflow passages are configured to direct the airstream through the filter in a second direction, opposite the first direction, and then through the auxiliary separating unit. A method for operating a vacuum cleaner is also provided.

Abstract: A container rinsing system (10) has an air nozzle adapted to be positioned proximate an opening of the container and adapted to direct a supply of compressed air to the container. A vacuum member is adapted to be in communication with a vacuum source. The vacuum member is positioned around the air nozzle and adapted to vacuum foreign particles away from the container.

Abstract: An improved vacuum storage bag having assorted monitoring means and a method of using the same. The vacuum storage bag is comprised of a flexible impermeable bag that has a storage area and a storage area access opening. A valve is provided to the bag that is in fluid communication with the storage area. Resealable sealing means extend across the storage area access opening. The resealable sealing means are capable or repeatedly allowing the storage area to be selectively maintained in a substantially hermetically sealed on unsealed condition. One-time-use sealing means extend across the storage area parallel to the resealable sealing means. The vacuum storage bag further has a radio frequency identification tag that extends substantially across said storage area access opening. In an alternative embodiment of the vacuum storage bag, the radio frequency identification tag is replaced with tamper indicating means.

Abstract: To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.

Abstract: This dry cleaning method for a plasma processing apparatus is a dry cleaning method for a plasma processing apparatus that includes: a vacuum container provided with a dielectric member; a planar electrode and a high-frequency antenna that are provided outside the dielectric member; and a high-frequency power source that supplies high-frequency power to both the high-frequency antenna and the planar electrode, to thereby introduce high-frequency power into the vacuum container via the dielectric member and produce an inductively-coupled plasma, the method comprising the steps of: introducing a gas including fluorine into the vacuum container and also introducing high-frequency power into the vacuum container from the high-frequency power source, to thereby produce an inductively-coupled plasma in the gas including fluorine; and by use of the inductively-coupled plasma, removing a product including at least one of a precious metal and a ferroelectric that is adhered to the dielectric member.

Abstract: Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.

Abstract: Disclosed are cleaning solvents and cleaning methods for metallic compounds deposited on the equipment that supplies organometallic compounds to the manufacturing tool in the photovoltaic industry or the semiconductor industry. The cleaning solvents and the cleaning methods disclosed not only selectively remove the metallic compound without corroding the equipment, but also improve the ordinary cleaning process. Moreover, the cleaning solvents and the cleaning methods disclosed improve maintenance costs for the supply system because the equipment may be cleaned without being detached from the supply system.

Abstract: An in-line bagless dry vacuum cleaning appliance having a vacuum conduit within a separator tube, the vacuum conduit having spaced apart first and second vacuum suction apertures communicating with an exhaust connector; a cyclone chamber communicating with an intake connector and encompassing the first vacuum suction apertures for forming a cyclonic flow region between the central vacuum conduit and an interior wall of the separator tube; a particle receiving chamber communicating with the cyclone chamber; an axial cyclone inlet communicating between the cyclone chamber and the intake connector of the separator tube; a particle separator dividing the particle receiving chamber from the cyclone chamber and forming a first transfer gap therebetween adjacent to the interior wall of the separator tube for receiving disentrained particles into the particle receiving chamber from the cyclone chamber; and a filter between the particle receiving chamber and the second vacuum suction aperture.

Abstract: The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is processed by delivering materials to or modifying regions of the substrate.

Abstract: A dust collecting installation for collecting airborne dust adjacent to a moving web. An elongate duct extends transversely to the direction of movement of the web and is positioned adjacent to the web. The duct is shaped and positioned so as to form an opening into the duct that receives at least a proportion of a layer of dust laden air adjacent to and moving with the web surface, and dust laden air is in turn withdrawn from the duct. The duct is positioned and so shaped that air flow into the opening is augmented by a jet of air generated where the moving surface converges with and comes into contact with a surface of a roller which the web passes over and contacts.

Abstract: A pills counting device is provided. It comprises a tray comprising a base member and a trough member. The device also comprises a lid member mounted on the base member and being movable between two extreme positions. The device also comprises at least one port provided in the tray and/or in the lid member and adapted to be connected in fluid communication with the base member and with an air intake of a vacuum device that can be remotely controlled. When a vacuum is applied to the at least one port, an air stream is established to entrain toward the vacuum device particles that may be present on surfaces of the device. A cleaning method using the aforesaid pills counting device is also disclosed.

Abstract: Disclosed herein are devices, methods and systems for ex-situ component recovery. The ex-situ recovery can be performed by desorbing or outgassing components of a processing system in a recovery system, rather than in the processing system itself. The recovery system can include a docking station and/or a heated vacuum chamber. The heated vacuum chamber can be used to desorb or outgas components that will be located inside the processing system, while the docking station can be used to desorb or outgas components that will be connected to the processing system. The processing system components can be placed under pressure by the recovery system to desorb or outgas contaminants and remove virtual leaks. The recovery system pressure can include a vacuum roughing pump, a turbomolecular pump, and/or a cryogenic pump to apply a pressure necessary to desorb or outgas the components.

Abstract: A system and method for semiconductor processing chamber includes a housing that can cover an annular gap of a pedestal well of the semiconductor processing chamber. A cleaning nozzle is removably coupled to a compressed dry air (CDA) supply. The cleaning nozzle can inject the CDA into the pedestal well while the housing can contain a byproduct dust agitated by the injected CDA. The byproduct dust is evacuated by at least one vacuum port that is removably coupled to a vacuum source.

Abstract: A cleaning system can include a noble gas, and one or more vessels configured to convert the noble gas into a supercritical fluid, and/or receive and clean an article of manufacture with the noble gas in the supercritical fluid state. A cleaning process can include converting a noble gas into a supercritical fluid state; and cleaning an article of manufacture with the noble gas in the supercritical fluid state so as to remove one or more contaminates from the article of manufacture. A cleaning composition can include a noble gas in a supercritical fluid state, and a textile article of manufacture having one or more contaminates located in the supercritical noble gas.

Abstract: An apparatus and method for removing sediment from a waterway using a high pressure water spray and a suction line is disclosed. The high pressure water is directed through a pressure line. The high pressure water helps to suspend sediment that has settled in the waterway. Water and suspended sediment is then vacuumed up by the suction line and deposited outside the water for further treatment or disposal. The apparatus is designed to be hand-held by an individual situated in the waterway, such that great control over which specific locations within the waterway are being treated. An outlet from the pressure line is selectively moved between a first position to direct pressurized fluid against the waterway surface to be treated and a second position that enhances removal of the water with suspended sediment.

Abstract: A carrier for supporting a substrate during processing by a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening. The opening is slightly larger than the substrate such that a gap exists between the substrate and the opening. Means for reducing a size and frequency of entrance and/or exit marks on substrates is provided, the means aiding and encouraging liquid from the meniscus to evacuate the gap. A method for reducing the size and frequency of entrance and exit marks is also provided.

Abstract: The present invention relates to a method of cleaning and after treatment of optical surfaces in an irradiation unit, said irradiation unit comprising a radiation source (1, 31) emitting EUV-radiation and/or soft X-rays, a first volume (40) following said radiation source (1, 31) and containing first optical components (3, 33) with said optical surfaces, and a second volume (41) following said first volume (40) and containing second optical components (38). The method comprises at least one cleaning step in which a first gas or gas mixture is brought into contact with said optical surfaces, thereby forming volatile compounds with contaminations deposited on said optical surfaces, wherein said compounds are pumped out of the first volume (40) together with the first gas or gas mixture.

Abstract: Methods for processing substrates in dual chamber processing systems comprising first and second process chambers that share resources may include performing a first internal chamber clean in each of the first process chamber and the second process chamber; and subsequently processing a substrate in one of the first process chamber or the second process chamber by: providing a substrate to one of the first process chamber or the second process chamber; providing a process gas to the first process chamber and the second process chamber; forming a plasma in only the one of the first process chamber or the second process chamber having the substrate contained therein; and providing an inert gas to the first process chamber and the second process chamber via one or more channels formed in a surface of respective substrate supports disposed in the first process chamber and the second process chamber while processing the substrate.

Abstract: The present invention includes apparatuses, systems, and methods for the safe and efficient removal of materials from tanks. An apparatus is provided that includes a chassis and a remotely controllable articulating vacuum assembly attached to the chassis. The vacuum assembly has at least two joints and is configured to remove material from an interior portion of the vessel.

Abstract: The invention relates to a cleaning method in which from a vacuum coating chamber (3) of a coating installation (1) for the coating of substrates (2) with alkali- or alkaline earth-metals, residues of alkali- or alkaline earth-metals are removed. For this purpose into the chamber (3) a gas from the group of N2, O2 or air is introduced, which reacts with the alkali- or alkaline earth-metals to form the corresponding solid compounds. Water can additionally be introduced into the vacuum coating chamber (3). After the alkali- or alkaline earth-metals have reacted with the gas, the corresponding solid compound is removed from the vacuum coating chamber.

Abstract: Example embodiments of the invention include a cleaning system having both daily cleaning tasks and periodic cleaning tasks for cleaning and dusting a room. By utilizing less inventory and more biocompatible, “bio-safe” products than traditional systems, embodiments of the cleaning system requires less tools yet, allows its users to combine cleaning processes in a time-saving feature. The invention further includes the use of an inventive cleaning brush apparatus for which allows dirt and dust to be swept into gaps between rows of bristles, which are attached to a handle via metal rails. Accordingly, dust is concurrently collected into a row of suction holes without requiring separate steps to sweep and collect the dust. As such, the spacing of the inner and outer bristles allows for dust to be trapped in the gaps rather than permanently dispersing into the breathing air.

Abstract: A substrate is processed in a process chamber comprising a substrate support having a receiving surface for receiving a substrate so that a front surface of the substrate is exposed within the chamber. An energized process gas is used to process the front surface of the substrate. A peripheral edge of the backside surface of the substrate is cleaned by raising the substrate above the receiving surface of the substrate support to a raised position, and exposing the backside surface of the substrate to an energized cleaning gas.

Abstract: A method for using a film formation apparatus for a semiconductor process includes setting an idling state where a reaction chamber of the film formation apparatus accommodates no product target substrate therein, and then, performing a purging process of removing a contaminant present in an inner surface of the reaction chamber by causing radicals to act on the inner surface of the reaction chamber. The radicals are generated by activating a purging process gas containing oxygen and hydrogen as elements.

Abstract: A method for the continuous vacuum cleaning of a substrate, characterized in that: a species is chosen that has a low sputtering efficiency and is chemically active with regard to the soiling matter; using at least one linear ion source, a plasma is generated from a gas mixture comprising predominantly the species having a low sputtering efficiency, especially one based on oxygen; and at least one surface portion of the substrate is subjected to the plasma so that said ionized species at least partly eliminates, by chemical reaction, the soiling matter possibly adsorbed or located on the surface portion.

Abstract: A hydro-infusion wet/dry debris containment system unit and an adaptor are described. The unit comprises at least one canister, debris intake system, filter, tank, electric motor assembly, fill port, and exhaust port. The unit further comprises an ionic generator. The adaptor comprises at least one debris intake system and reservoir. The debris intake system comprises a debris inlet port, an expansion chamber, a fluid collar, a fluid inlet, and a debris outlet port. The fluid collar comprises a plurality of orifices that generate a curtain of water. The fluid inlet comprises at least one regulator. Debris sucked into the debris inlet port is lifted by a venturi effect caused by airflow across the smoothly varying inner diameter of the inlet port lumen wall and expands in the expansion chamber as it flows through the fluid collar and particulates are encapsulated by the curtain of water.

Abstract: The present invention provides a method of cleaning optical surfaces in an irradiation unit in order to remove contaminations deposited on said optical surfaces. The method includes a cleaning step in which a first gas or gas mixture is brought into contact with said optical surfaces thereby forming a volatile compound with a first portion of said contaminations. In an operation pause of the irradiation unit prior to the cleaning step, a pretreatment step is performed, in which a second gas or gas mixture is brought into contact with said optical surfaces. Said second gas or gas mixture is selected to react with a second portion of said contaminations different from said first portion to form a reaction product, which is able to form a volatile compound with said first gas or gas mixture.

Abstract: The present invention discloses a method for the removal of a number of molecular contaminants from surfaces within a device. A purge gas containing oxygen and/or water is introduced into the interior of the device, contacting at least a portion of the interior surfaces. A contaminated purge gas is produced by transferring a portion of the contamination from the interior surfaces into the purge gas. The contaminated purge gas is removed from the device and the process is continued until the contaminant concentration in the contaminated purge gas is below a predetermined level.

Abstract: An improved deck cleaning tool includes a rigid blade with a sharply angled front end and adapted to dislodge debris build-up commonly found between planks of outdoor decks is supported by a plate having an aperture connected to a rigid and hollow conduit having a handle at its distal end. The distal end further adapts to couple to a common shop or wet/dry vacuum cleaner.

Abstract: A fuel system of a burner of a gas turbine and to a method for flushing a section of a fuel system of a burner of a gas turbine is provided. The method includes providing a feed line for feeding liquid fuel from a fuel source to the burner, providing a first and a second connection point to the feed line, providing a medium at the first connection point and generating a vacuum at the second connection point such that the fuel which is situated in the section between the two connection points is sucked out through the second connection point.

Abstract: A method for cleaning the interior surfaces of a fuel storage tank. The first step of the method is to extract a material sample from the bottom of the fuel tank to determine how thoroughly the tank must be cleaned. The clean fuel is then removed from the tank and is stored in a holding tank. Loose and liquid contaminants are then vacuumed out of the tank. Next, a self-propelled spray nozzle, a sprayer tube, and a rotating spray nozzle, each of which is connected to a pressurized water supply line, are successively lowered into the fuel tank and are used to scour the various interior surfaces of the tank with pressurized water while wash water and loosened contaminants are simultaneously vacuumed out of the tank. The interior of the tank is then dried, and the clean fuel stored in the holding tank is pumped back into the fuel tank.

Abstract: A cover tube concentric about a pressure tube at the opposite end.

Abstract: In order to produce a cleaning device for cleaning a workpiece including a suction apparatus for sucking out impurities from an interior of the work piece wherein the suction apparatus has a particularly large suction effect, it is proposed that the suction apparatus at least one vacuum tank, at least one evacuation device for evacuating the vacuum tank, at least one ventilation line for connecting the vacuum tank to the workpiece and at least one blocking device for blocking off the connection between the vacuum tank and the workpiece.

Abstract: A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

Abstract: A method for processing a substrate is provided. The method includes generating a controlled meniscus using a proximity head. The proximity head has a face in close proximity to a surface of the substrate, and the face includes a substantially flat surface. The controlled meniscus is generated by delivering a chemical to the meniscus through discrete nozzles formed in the face of the proximity head. The method includes moving the proximity head over the substrate so that an area of contact between the meniscus and the surface of the substrate moves from a first location to a second location on the substrate. The moving of the proximity head causes a chemical remainder to be left behind on the surface of the substrate at the first location. The chemical remainder being a layer of the chemical from the meniscus that adheres to the surface of the substrate.

Abstract: A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Abstract: A method for cleaning a deposition chamber includes the following steps. A steam treatment is carried out on the deposition chamber to remove a contaminant in the deposition chamber by a steam. Then, a vacuum treatment is carried out on the deposition chamber to pump the steam containing the contaminant out of the deposition chamber. A time ratio of the steam treatment to the vacuum treatment is smaller than or equal to 0.65.

Abstract: Disclosed herein are devices, methods and systems for ex-situ component recovery. The ex-situ recovery can be performed by desorbing or outgassing components of a processing system in a recovery system, rather than in the processing system itself. The recovery system can include a docking station and/or a heated vacuum chamber. The heated vacuum chamber can be used to desorb or outgas components that will be located inside the processing system, while the docking station can be used to desorb or outgas components that will be connected to the processing system. The processing system components can be placed under pressure by the recovery system to desorb or outgas contaminants and remove virtual leaks. The recovery system pressure can include a vacuum roughing pump, a turbomolecular pump, and/or a cryogenic pump to apply a pressure necessary to desorb or outgas the components.

Abstract: The invention relates to a method and a device for cleaning the door of a coke oven, said door comprising a sealing edge and a membrane that is attached to the door panel of the coke oven. According to said method, cleaning tools comprising jet nozzles, which are supplied with a flow medium at high pressure, are situated and displaced back and forth in the region between the sealing edge and the door panel of the coke oven, in such a way that the interior surface of the membrane and the sealing edge are cleaned. The coke oven door is cleaned directly after the coke oven chamber is opened, by at least one jet nozzle element, which is supplied with compressed air and is displaced along the sealing edges. The jet nozzles are oriented in such a way that the air hits the surface to be cleaned at an acute angle.

Abstract: A film removing device includes an approach stage having a flat approach part having a surface substantially flush with the surface of a substrate supported on a support member. The flat approach part faces a first side surface of the substrate at a corner of the substrate where the first side surface and a second side surface of the substrate join. A film removing nozzle spouts a solvent toward a peripheral part of the substrate and sucks a solution while being moved along the second side surface and the approach stage. A gas is spouted into a gap between the flat approach part and the corner of the substrate so that the gas flows through the gap toward the second side surface.

Abstract: Disclosed are an apparatus for cleaning a camera module, including: a housing in which a camera module, the object to be cleaned, is received, an opening/closing unit that opens/closes the housing, and an air suction unit that is connected to the housing and discharges air in the housing to the outside, and a method for cleaning the camera module. The apparatus and the method for cleaning the camera module remove the fine foreign substances of the camera in such a manner that the instantaneous velocity of air supplied to the camera module is increased by receiving the camera module, the object to be cleaned, in a negative pressure state, and breaking the negative pressure state, thereby making it possible to clean the complicated and narrow inside of the camera module, and generates vibration to the supplied air using the opening/closing unit that is rapidly and repeatedly opened/closed, thereby making it possible to more effectively remove the fine foreign substances.

Abstract: A method for purifying used antifreeze is disclosed. An antifreeze recycling systems uses a simple-distillation apparatus adapted to distill clean antifreeze from used antifreeze. A novel scraper blade is used in the simple-distillation apparatus. Also, antifreeze recycling methods that minimize waste and generate nontoxic, landfillable waste are provided. An antifreeze product produced by the present method, and a nontoxic, landfillable sludge product produced by the present method, are disclosed.

Abstract: A vacuum cleaner includes a variable speed suction motor and an illuminatable motor speed indicator having plural lights arranged in a circular pattern or annular ring pattern, for example around a motor speed control switch. A control unit includes an indicator controller and a motor controller that respectively control the illuminatable indicator and the motor, based on inputs from the motor speed control switch and optionally at least one sensor that senses operating conditions of the vacuum cleaner. The lights are successively activated and deactivated to create a visible light spot that appears to rotate around the circular or annular ring pattern at a light rotation rate related to and indicative of the motor rotation speed. Thereby the indicator allows the vacuum suction power to be visually monitored.

Abstract: In one embodiment, a method of cleaning a semiconductor manufacturing apparatus includes supplying a cleaning gas for removing a deposition film deposited on an inside wall of a treatment chamber through a supply pipe of the treatment chamber so that a supply amount of the cleaning gas from the supply pipe per unit time is greater than an exhaust amount of the cleaning gas from an exhaust pipe of the treatment chamber per unit time. The method further includes supplying an inert gas to fill the supply pipe with the inert gas.