Abstract: The invention provides a method of cleaning the surface (3) of a wafer (1), comprising a hot rinse step in which the wafer (1) is at a temperature that is at least 100C higher than room temperature, the wafer (1) is rotated around an axis perpendicular to the wafer surface (3) and water is dispensed on the wafer surface (3). Thereafter a first drying step is performed in which the wafer (1) is rotated around the axis perpendicular to the wafer surface (3) and in which the humidity of the environment is such that the water on the wafer surface (3) is partially removed while the wafer surface (3) remains covered with a film of water (13). The first drying step is followed by a second drying step, which removes the film of water (13) from the wafer surface (3). The method according to the invention advantageously reduces metal ion contamination on the wafer surface (3).

Abstract: Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.

Abstract: A wafer preparation method is provided for producing a wet region and then a corresponding dry region on the wafer. Brushing produces the wet region on the wafer. As the brushing moves in a selected scan operation across the wafer, a generating operation forms a meniscus that follows the brushing and dries the wet region. The generating operation produces the meniscus at least partially surrounding the wet region scrubbed by the scrubbing. The controlled meniscus is formed by applying fluid to the surface of the wafer and simultaneously removing the fluid. The scan operations may be selected so the brushing scrubs the wet region and then the meniscus forms the dry region where the scrubbing took place. The scan operations include a radial scan, a linear scan, a spiral scan and a raster scan.

Abstract: A washer and a method of performing a spinning operation are disclosed. The washer includes a tub which stores clothes to be washed, and a motor which rotates the tub. It also includes a microprocessor which generates a pump driving signal having duty ratios to power on and off a drain pump during at least one preliminary and a main sub-cycles of a selected spinning operation. The method of performing the spinning operation includes accelerating, decelerating, and maintaining a certain speed during the at least one preliminary sub-cycle of the spinning operation. However, the main sub-cycle includes accelerating and maintaining another certain speed. According to the principles of the present invention, the washer and the method of performing the spinning operation prevent the drain pump from not only overheating but also creating power loss.

Abstract: In a substrate processing apparatus, a control section is preset to perform a chemical liquid process by use of a chemical liquid after a rinsing process by use of a rinsing liquid. The control section first executes a step of rotating a substrate at a rotational speed not lower than that used in the rinsing process and supplying the chemical liquid onto the substrate, thereby performing cleaning inside a drain cup by the chemical liquid, while discarding, through a waste line, liquid received by the drain cup. The control section then executes a step of rotating the substrate at a decreased rotational speed for the chemical liquid process and supplying the chemical liquid onto the substrate, thereby performing the chemical liquid process on the substrate, while collecting, through a collection line, liquid received by the drain cup.

Abstract: Provided is a single type substrate treating apparatus and a cleaning method the substrate treating apparatus. A cleaning process is periodically performed on a substrate support member after a series of repeated substrate treating processes is performed to remove contaminants remaining on the substrate support member and minimize thermal deformation of the substrate support member due to a high temperature chemical solution.

Abstract: Device for cleaning a gas turbine engine (2), and in particular an engine of turbofan type. The present invention further relates to a method for cleaning such a engine. The device comprises a plurality of nozzles (31, 33, 35) arranged to atomize cleaning liquid in the air stream in an air inlet (20) of the engine (2) up-stream of a fan (25) of the engine (2). According to the invention a first nozzle (31) is arranged at a position such that the cleaning liquid emanating from the first nozzle (31) impinges the surfaces of the blades (40) substantially on the pressure side (53); a second nozzle (35) is arranged at a position such that the cleaning liquid emanating from the second nozzle (35) impinges the surfaces of the blades (40) substantially on the suction side (54); and a third nozzle (33) is arranged at a position such that the cleaning liquid emanating from the third nozzle (33) passes substantially between the blades (40) and enters an inlet (23) of the core engine (203).

Abstract: Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).

Abstract: In a first aspect, a method of cleaning an edge of a wafer is provided. The method comprises providing an edge cleaning roller having a first inclined frictional surface for cleaning an edge corner of a wafer rotating within a first plane; and causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner. Numerous other aspects are provided.

Abstract: An engine and high pressure pump are mounted onto a wheeled chassis. High pressure water is distributed to a rotating wand and nozzle assembly on the wheeled chassis so that as the chassis is moved along a linear path, high pressure water is sprayed onto an underlying surface to clean the surface. Optional diffusion plates may be used to prevent high pressure water from being sprayed directly onto the underlying surface in part of the rotational path defined by the wand and nozzle assembly.

Abstract: In a method of cleaning a rotary mixing device having a mixer portion and a driving shaft, a shield is located over at least the mixer portion. The mixing device is rotated, expelling material clinging to or trapped by the mixing portion, such as paint, from the mixer portion of the mixing device. This material is blocked or caught by the shield. In one embodiment, the shield is cylindrical in shape and has a base with an opening through which the shaft of the mixing device may extend, and an open second end leading to an interior area for containing the mixer portion of the mixing device.

Abstract: A new and useful device and method for cleaning a paint roller cover is provided. A paint roller frame has a longitudinal axis, and is supported in a manner such that the frame can spin freely about its longitudinal axis. A paint roller cover is placed on the roller frame, so that the paint roller cover extends about the longitudinal axis of the frame, and can spin with the frame about the longitudinal axis, thereby forming a frame/paint roller cover assembly that has the same longitudinal axis as the frame. A manifold is adapted to be connected to a source of cleaning fluid (e.g. water), and an array of no more than three spray nozzles are supported by the manifold.

Abstract: A substrate processing apparatus 10 includes a holding table 20 for rotatably holding a wafer W, a nozzle 40 for supplying chemical solutions L1 and L2 to the wafer W, at least one light irradiation units G1 and G2, and a pot 30 placed in the outer radius of the holding table 20for collecting the processing solutions L1 and L2 that are scattered from the wafer W. The pot 30 also includes a cover 70 that can be moved in the direction of the axis of the holding table 20so that a plurality of chemical solution collecting chambers M1 and M2 are formed in the pot by changing the position of the cover 70.

Abstract: The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.

Abstract: A coating film forming apparatus that holds a substrate upon a spin chuck and forms a coating film by supplying a chemical liquid upon a top surface of said substrate comprises: an outer cup provided detachably to surround the spin chuck; an inner cup provided detachably to surround a region underneath the substrate held upon the chuck; a cleaning nozzle configured to supply a cleaning liquid for cleaning a peripheral edge part of the substrate, such that the cleaning liquid is supplied to a peripheral part of a bottom surface of the substrate; a cutout part for nozzle mounting, the cutout part being provided to the inner cup to engage with the cleaning nozzle; and a cleaning liquid supply tube connected to the cleaning nozzle, the cleaning nozzle being detachable to the cutout part in a state in which the cleaning liquid supply tube is connected.

Abstract: A wash cycle for a clothes washer, the clothes washer having a wash zone defined within a rotating drum having an outer wall, for receiving a load of fabric. The steps include dispensing a volume of a first wash liquor to the wash zone, rotating the drum to move the fabric load toward the outer wall and recirculating the first wash liquor through the fabric load and wash zone, all during a first period of time. The fabric load is then flexed during a second period of time. The cycle continues with the steps of dispensing a volume of a second, different wash liquor to the wash zone, rotating the drum to move the fabric load toward the outer wall and recirculating the second liquor through the fabric load and wash zone during a third period of time. One of the two wash liquors is an oxidizing agent wash liquor. Then the remainder of the wash cycle is completed.

Abstract: The present invention provides a mechanism capable of removing a minute particle adhered to a fine pattern or the like without giving damages to the pattern or the like. After being installed on a device which can perform rotating operation, the high viscosity liquid is dropped on an upper surface of an object such as a photomask to be cleaned by a liquid supply part, and then the photomask is rotated to move the high viscosity liquid. During the movement of the high viscosity liquid, a particle adhered to the object such as the photomask is contained in the high viscosity liquid, and is removed. Further, the particle thus contained in the liquid is prevented from re-adhering to the object such as the photomask by controlling a zeta potential of the high viscosity liquid, and is removed from the object such as the photomask.

Abstract: A cleaning apparatus according to the present invention is provided with a brush drive mechanism which brings a brush being rotating closer to a substrate, measures electrical potentials generated on a plurality of conductor patterns formed on the substrate, by a contact and separation with/from tips of scrub materials of the brush being rotating, and controls a positioning of the brush by use of the measurement results. With the process as described above, it is possible to treat uniformly a surface to-be-cleaned for a large-sized substrate, with the cleaning brush. Consequently, it is possible to form a highly qualified transistor for liquid crystal display on the substrate having been cleaned, with enhancing yield.

Abstract: A method for cleaning a stationary gas turbine unit during operation, wherein the unit comprises a turbine, a compressor driven by the turbine, the compressor having an inlet, an air inlet duct arranged upstream of the air inlet of the compressor, the inlet duct having a part of the duct adjoining the inlet of the compressor and having decreasing cross section in the flow direction in order to give the air flow a final velocity at the inlet to the compressor. A spray of cleaning fluid is introduced in the inlet duct. The cleaning fluid is forced through a spray nozzle with a pressure drop exceeding 120 bar to form a spray the drops of which have a mean size that is less than 150 ?m. The spray is directed substantially parallel to and in the same direction as the direction of the air flow.

Abstract: A rotisserie skewer, basket and parts cleaning assembly is provided. The assembly is located within a wash tank that includes a jet nozzle to expel a stream of fluid into said wash tank. The assembly is rotatably mounted within the wash tank and is capable of holding parts for cleaning.

Abstract: A substrate support unit supplies a swirl flow to a substrate to rotate and float the substrate from a chuck plate during a process. A process is performed while rotating and floating the substrate. Thus, the substrate is supported and rotates at a process speed while floating form the chuck plate with a non-contact manner.

Abstract: Embodiments of an apparatus and methods for heating a substrate and a sacrificial layer are generally described herein. Other embodiments may be described and claimed.

Abstract: The present invention relates to the field of washing engines, particularly using washing liquids such as water and detergent or water only, and more specifically to systems, apparatus and a mobile cart comprising such a system for collecting and treating the waste water from engine washing operations. The system comprises a collecting device for collecting waste liquid during a washing operation of the engine and a treatment device for treating waste liquid collected during said washing operation. According to an embodiment, the system is arranged on a mobile cart (50) for serving an engine (1) during a washing operation of the engine (1) comprising a chassis provided with wheels. The mobile cart also includes adjusting means (73) for adjusting the vertical position of the liquid separating means (31) and/or adjusting means for adjusting the vertical position of the liquid collecting means (302, 36) relative the engine (1).

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: Depending on the actual operating situation and the composition of the fuels used for driving the internal combustion engine, contamination of the moving blades, of the guide device and of the turbine casing parts occurs sooner or later in the exhaust gas turbine. According to the invention, a small quantity of cleaning fluid is fed continuously or cyclically into the exhaust gas flow of an exhaust gas turbine and is directed onto the components to be cleaned. The small quantity of cleaning fluid can be fed in with unchanged operation of the internal combustion engine, such that the exhaust gas turbine can be cleaned or kept clean within the entire operating range of the internal combustion engine. Fluctuations in the power output of the internal combustion engine on account of requisite cleaning of the exhaust gas turbine therefore do not occur. Furthermore, the formation of thermostress cracks in the critical turbine casing parts is largely avoided.

Abstract: In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. The process gas, which may be ozone, is entrained in the liquid via entrainment nozzles. Use of entrainment and diffusion together increases the amount of gas available for reaction at the workpiece surface, increases the reaction rate, and decreases required process times.

Abstract: A substrate immersed in pure water held inside a processing bath disposed to a cleaning unit 1 and accordingly washed, as it bears an aqueous film on its surface, is transported by a substrate transportation mechanism 3 to a spin-processing unit 2. The substrate rotates in the spin-processing unit 2, thereby adjusting the thickness of the aqueous film on the substrate surface. As the aqueous film is then frozen, the volume of the aqueous film expands, adhesion between the substrates and particles adhering to the substrate surface becomes weak, or further the particles are separated from the substrate surface. The substrate transportation mechanism 3 transports thus frozen substrate to the cleaning unit 1 from the spin-processing unit 2, and the substrate is immersed in a processing liquid held inside the processing bath. The overflowing processing liquid thaws and removes the aqueous film, and particles on the substrate surface are discharged outside the substrate.

Abstract: A fluid dispenser for use in the processing of substrates. The dispenser has a dome shaped body with a convex upper surface and has a number of conduits designed to supply fluid to the surface of a substrate at predetermined points.

Abstract: In an apparatus and method for removing a photoresist structure from a substrate, a chamber for receiving the substrate includes a showerhead for uniformly distributing a mixture of water vapor and ozone gas onto the substrate. The showerhead includes a first space having walls and configured to receive the water vapor, and a second space connected to the first space so that the water vapor is supplied to and partially condensed into liquid water on one or more walls of the first space. Ozone gas and water vapor without liquid water may be supplied to the second space to form the mixture therein. The showerhead may be heated to vaporize the liquid water on a given surface of the first space.

Abstract: A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of the wafer. The ozone and HF vapor may be delivered sequentially, or may be mixed with one another before entering the process chamber. The ozone oxidizes the silicon surface of the wafer, while the HF vapor etches the oxidized silicon away from the wafer. The etched oxidized silicon is then removed from the process chamber. As a result, the wafer is thinned, which aids in preventing heat build-up in the wafer, and also makes the wafer easier to handle and cheaper to package. In alternative embodiments, HF may be delivered into the process chamber as an anhydrous gas or in aqueous form.

Abstract: A substrate cleaning device comprises a chamber for cleaning a substrate; a substrate support installed in the chamber providing a surface for supporting the substrate during cleaning thereof; at least one cleaning solution supply outlet for spraying a cleaning solution onto a surface of the substrate; a vibration force generator for supplying a vibratory action; a vibration force generating shaft which receives said vibratory action from the vibration force generator so that said vibration force generating shaft vibrates for agitating the cleaning solution on the substrate; and a vibration force distributor for preventing a vibration force from being concentrated on a portion of the substrate below the vibration force generating shaft.

Abstract: An apparatus and a method for cleaning a wafer are described. A chamber has a substrate support. A nozzle is disposed above the substrate support to spray de-ionized water droplets. The nozzle is coupled to a source of de-ionized water and a source of nitrogen. The nozzle is configured to mix the de-ionized water and the nitrogen outside the nozzle to have independent flow rate control of the two fluids for an optimized atomization in terms of spray uniformity in droplet size and velocity distributions. The nozzle to wafer distance can be adjusted and tuned to have an optimized jet spray for efficiently removing particles or contaminants from a surface of a wafer without causing any feature damage.

Abstract: The invention relates to a method of cleaning tubes, in which the tube is at least partially filled with a cleaning medium, wherein a cleaning medium is atomized, in which case the droplets of cleaning medium are accelerated, at least in part, essentially in the direction of a center axis of the tube.

Abstract: The portable, compact, silverware-only washing apparatus is disclosed. The apparatus is manufactured so as to easily mount on top of a kitchen countertop or to be easily portable to other locales. The appliance is designed so as to not be connected to a water supply within a home or apartment, but rather rely upon the user to pour in water in a manner similar to a home coffee maker. The device includes a motor and pump assembly to spray pressurized water and detergent against the silverware loaded therein and automatically drain the water and waste after completion of the washing cycle The appliance is configured with a specialized basket for holding the silverware in individualized compartments.

Abstract: Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzle 35 to form a water film 51 on the wafer W. Owing to the presence of the water film 51, the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.

Abstract: Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.

Abstract: Apparatus removes contaminants from edge areas of a wafer by spinning the wafer. Nozzles spray or jet fluid onto both the first and second sides of the wafer, near the edge of the wafer. Typically the spray or jet is at an acute angle to the wafer surface. Contaminants are removed and re-deposition of removed contaminants is reduced or avoided. The nozzle locations and angles may be varied to change the areas on the wafer cleaned by the sprays or jets.

Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter placement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.

Abstract: An industrial parts washer includes a stand adapted to support a part, a chamber selectively moveable from a first position clear of the part to a second position engaging the stand where the chamber forms a closed volume encapsulating the part. A nozzle is positioned within the chamber to supply pressurized fluid for cleaning the part. The industrial parts washer may include a washing station positioned adjacent a drying station where each of the washing and drying stations include chambers selectively moveable to enclose the part.

Abstract: An apparatus for wafer cleaning includes an enclosure. A stage is within the enclosure. At least one first wall is within the enclosure, around the stage. A plate is within the enclosure and above the stage, operable to enclose a first region between the stage and the first wall. The apparatus further includes an exhauster fluidly coupled to the first region between the stage and the first wall.

Abstract: An apparatus for simultaneously rinsing and drying front and back surfaces of a workpiece comprises a chuck adapted to spin the workpiece, a plurality of posts coupled to the chuck and adapted to support the workpiece, and first and second mechanical arms. The first mechanical arm is adapted to be positioned between the chuck and the workpiece, and to sweep along at least part of the workpiece back surface. The first mechanical arm comprises at least a first rinsing liquid nozzle, and a first tensioactive vapor nozzle. The second mechanical arm is adapted to be positioned adjacent to the workpiece front surface, and to sweep along at least part of the workpiece front surface. The second mechanical arm comprises at least a second rinsing liquid nozzle, and a second tensioactive vapor nozzle.

Abstract: A process for removing the coating layers from finished golf balls is disclosed herein. The process involves soaking the golf balls in a removal solution and then subjecting the golf balls to ultrasonic treatment in order to remove a coating layer, an indicia and/or a paint layer.

Abstract: A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.

Abstract: A workpiece processor has a process chamber for holding a liquid. A sonic element, such as a megasonic transducer, is positioned to provide sonic energy into the liquid. A workpiece holder is moveable from a first position, wherein a workpiece is held immersed in the liquid, for sonic processing, to a second position where the workpiece is generally aligned with spray nozzles. Process liquids and gases may be sprayed or otherwise provided onto the workpiece, optionally while the workpiece is rotating within the process chamber. A process chamber gas or vapor exhaust assembly prevents escape of process gases or vapors from the processor. The processor can provide both sonic processing, as well as liquid and/or gas chemical processing.

Abstract: A cartridge filter 7 is vertically movably placed in a processing vessel 1 having a cylindrical profile. An ultrasonic washer 55 is fitted to the lateral wall 3a of the spray casing of the processing vessel 1. Washing liquid 56 is injected into the processing vessel 1 and the filter 7 is moved downward and immersed in the washing liquid 56. The washer 55 is activated under this condition to wash the filter 7. Since the washer 55 is arranged near the filter 7, the ultrasonic oscillation is easily transmitted to the filter 7 to efficiently remove the foreign objects adhering to the filter 7. Thus, with this arrangement, it is possible to wash the filter 7 in the processing vessel 1 without removing the filter 7 from a fluidized bed apparatus. In a filter washing apparatus 101, a cartridge filter 103 is contained in a processing vessel 102 and immersed in washing liquid 110.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: After rinsing, while rotating a substrate, a front layer part of a rinsing liquid (DIW) adhering to a substrate surface is drained and removed from the substrate surface. This is followed by supply to the substrate surface of a liquid mixture which is obtained by mixing IPA and DIW together. Since a majority of the rinsing liquid on the substrate surface is removed off from the substrate surface, even when micro patterns are formed on the substrate surface, the liquid mixture replaces the liquid component adhering to the gaps between the patterns. Further, the IPA concentration in the liquid mixture supplied to the substrate surface is set to 50% or below.

Abstract: A produce cleaning machine provides baskets for holding large and small produce items and water sprayers for directing water jets onto the produce from above and below. One basket is motorized to rotate to more evenly clean the produce, while a further basket can be rolled in and out of the machine to make loading and unloading easier. The force of the spray is adjustable and the rotational speed of the motor is as well to provide for special handling of the produce. Rotation after cleaning is used to help dry the produce, and ultraviolet emission is used to sanitize the produce.

Abstract: The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. In a specific embodiment, the process is performed for removing a silicon oxide film formed on a silicon wafer. The process includes three subsequently performed steps, in which (1) diluted hydrofluoric acid (DHF), (2) DHF and de-ionized water (DIW), (3) DIW are supplied, respectively, onto a rotating wafer. Transition from step (1) to step (2) is done immediately before the hydrophilic silicon oxide film is dissolved to expose the underlying hydrophobic silicon layer.

Abstract: A system and method to clean the pellicle frame and adhesive ring of a photomask reticle are described. One embodiment includes a cover that isolates the photomasks from the pellicle frame. The reticle is secured between a spin chuck and the cover so that the photomasks are isolated and protected from solvents used in a cleaning process. With the reticle secured to the spin chuck, the spin chuck is rotated under a pressurized spray of solvent. The solvent, which is caustic to the photomasks, removes the contaminants from the adhesive ring. After the exposed areas are cleaned, the cover is removed and foreign material from photomasks are removed using less invasive solvents and methods.