Abstract: An aluminum alloy composite material for brazing has a core member made of an aluminum alloy, Al-Si filler member and a cladding member made of an aluminum alloy. Mg contained in the aluminum alloy of the core member is restricted to within 0.2% or less by weight. The aluminum alloy of the cladding member essentially consists of 0.3% to 2.5% by weight of Mg. During brazing, the core member serves to restrain the diffusion of Si from the filler member clad on one surface of the core member and the diffusion of Mg from the cladding member clad on the opposite surface of the core member.

Abstract: Solder flux compositions and pastes made therefrom, consisting essentially of solder metal powder, an amount of non-corrosive water soluble flux, said water soluble flux comprising a mixture of 2 non-corrosive water-soluble components, one of which is a non-halogenated amine, preferably triethanolamine and the other of which is an organic moiety with a polar group, preferably GAFAC RE-610.

Abstract: A low residue soldering flux contains a non-subliming dibasic acid mixture of by weight about 15-30% succinic acid, 40-63% glutaric acid and 10-30% adipic acid, e.g., in a volatilizable organic solvent, formed as a rosin-containing or rosin-free flux. The dibasic acid mixture is capable of volatilizing during heat soldering to leave a soldered product (e.g., an electronic circuit board) essentially free from corrosion-promoting ionic residue. This eliminates the need for a residue-removing washing step.

Abstract: A water soluble soldering flux is shown which includes gum arabic, modified polysaccharides and other natural resins as the carrier, an organic activator and water. The carrier provides a tacky, yet fluid medium capable of holding precisely aligned electrical components during solder reflow and allows aqueous removal of the flux after reflow. The flux composition can be used to solder precisely aligned integrated circuit chips onto a circuit board.

Abstract: A water-soluble soldering flux and paste solder using the flux are disclosed, the flux comprising, as a main fluxing agent, a resinous reaction product of at least one carboxyl-containing compound having 8 or less carbon atoms, selected from the group consisting of monocarboxylic acids, polycarboxylic acids, and hydroxy-carboxylic acids with tris-(2,3-epoxypropyl)-isocyanurate.

Abstract: A composition for brazing aluminum or aluminum alloy characterized in that said composition contains aluminum alloy powder for brazing and thermoplastic acryl-based resin binder which is so volatile as to volatilize before being carbonized at a brazing temperature and said resin binder of 0.1 to 50 parts is used for aluminum alloy powder of 100 parts. When this technological idea was applied to brazing with a brazing material of aluminum alloy powder such as, for example, Al-Si, a preferable result of brazing could be obtained.

Abstract: To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.

Abstract: A new and improved solder tinning paste composition suitable for use as an underlay for metallic solder when solder filling base metal braze joints to facilitate formation of the solder joint between the base metals. The paste composition comprises substantially pure tin powder, suspending agent, inorganic based flux and solvent. Optionally, the paste composition may comprise a deoxidizing agent, a soil removing agent and a surfactant.The solder tinning paste exhibits enhanced flowing and wetting characteristics and a lower melting point. In another aspect thereof, the present invention provides a process for formulating the foregoing solder paste composition.

Abstract: A ceramic flux for welding low-alloy steels contains calcined magnesite, synthetic slag containing two thirds of CaF.sub.2 and one third of Al.sub.2 O.sub.3, a component containing at least 95% of Al.sub.2 O.sub.3 in the alpha form, wollastonite, marble, barium fluoride, ferrotitanium, ferroboron, sodium silicate.The ratio of the total content of calcined magnesite, two thirds of synthetic slag and one half of wollastonite to the total content of the component containing at least 95% of Al.sub.2 O.sub.3 in the alpha form, one third of synthetic slag, one half of woolastonite and two thirds of sodium silicate ranging from 1.30 to 1.43 and the ratio of titanium to boron ranging from 11.2 to 30.1.

Abstract: An improved solder paste composition suitable for screen or stencil printing with a capability for low ionic contamination after soldering comprising a metal or metal alloy powder, a carrier, and stannous fluoride.

Abstract: In order to avoid the undesirable formation of flux residues when soldering electronic components, as in the production of printed circuit assemblies, there is used, as the solvent for a non-corrosive flux material, a mixture composed of a major proportion by weight of a monohydric alcohol and a minor proportion by weight of a water-immiscible polyalkylene glycol dialkyl or diaryl ether.

Abstract: Eutectic solder, including a combination of tin, lead and silver is doped by the addition of copper to substantially improve its effectiveness in soldering printed wiring cards which have been screen printed with conductors and mounting pads for components, with a low temperature, thick film cermet copper conductor. The addition of the copper substantially improves wetting and increases long term solder joint reliability.

Abstract: A brazing process is disclosed for joining two or more metal parts. The metal parts are brazed by interposing between the parts to be joined a brazing paste composed of a homogeneous microcrystalline rapidly solidified alloy powder having a composition consisting essentially of about 15 to 40 weight percent copper, 0 to 32 weight percent zinc, 0 to 24 weight percent cadmium, 0 to 3 weight percent nickel and 0 to 10 weight percent tin, the balance being silver and incidental impurities, and a phase structure such that the largest dimension of any precipitated phase ranges from about 0.01 to 0.1 micrometer, heating the powder to melt the powder, and thereafter cooling the parts to produce a brazed product. The brazing process can be carried out at lower temperatures as compared to prior art processes employing conventional BAg-alloy powders.

Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

Abstract: A brazing paste consists of a liquid vehicle containing finely dispersed brazing alloy powder therein. The liquid vehicle consists of hydroxylpropylcellulose and 1,2-propanediol.

Abstract: The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements.

Abstract: A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating. The use of such a solder paste in a reducing atmosphere results in no hazardous chemical by-products and, because the solder is handled in the form of a paste, is compatible with electrical components requiring precise dimensional tolerances.

Abstract: A chloride based galvanizing flux containing at least zinc chloride, ammonium chloride and a rare earth chloride. The rare earth chloride comprises between substantially 500 parts per million and substantially 10% by weight of said flux.

Abstract: A metallic powder which is formed by the extrusion, from multiple microscopic nozzle holes, of molten metal, which while falling and cooling changes shape from a droplet to a generally spherical shape and then solidifies, this microscopic metallic powder (around 20-90 .mu.m in size for example) having non-curved sections in parts of the generally curved surface and being suitable as solder.

Abstract: The instant flux and paste containing same are for brazing aluminum material. The flux consists essentially of a particulate blend of aluminum fluoride, potassium fluoride, and cesium chloride, or rubidium chloride or a mixture of cesium chloride and rubidium chloride, the fluorides being complexed with each other or not complexed or being a mixture of the complexed and not complexed fluorides. Lithium fluoride, preferably complexed with the other fluorides, is an optional ingredient. The weight fraction of the total fluorides is between about 1/10 and about 9/10, and the A1F.sub.3 -KF weight ratio is between about 4:1 to about 0.4:1.

Abstract: A soldering flux composition comprising a water-soluble oil-in-water emulsion paste in turn comprising(a) an oil, type material(b) an emulsifier,(c) water, and(d) a fluxing agent comprising an inorganic or organic halogen compound capable of removing oxide from a metal surface to be soldered.

Abstract: Chromium free cleaning compositions for cleaning aluminum and aluminum alloy surfaces comprisingA. from 0.2-4 g/l ferric ion andB. sufficient sulfuric and/or nitric acid to produce a pH of 2 or less.The invention also relates to compositions containing from 0.001-0.5 g/l of fluoride ions.

Abstract: A water-soluble solder paste consisting essentially of solder powder, water-soluble organic activator and polyethylene glycol vehicle.

Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilize a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

Abstract: A welding aid includes a particular carbon-based weld spatter adhesion inhibitor, and a particulate calcium-based adjuvant mixed with the inhibitor. The mixture is capable of being applied to a metal surface to be welded, thereby to inhibit adhesion of weld spatters to the metal surface on welding of the metal surface.

Abstract: In chromium-free aqueous acidic washing solutions for cleaning the surfaces of aluminum and aluminum-alloy particles, so as to remove therefrom smut and lubricating oil left on the surfaces thereof after metal forming operations, which solutions contain from 0.2 to 4 g/l ferric ion and sufficient sulfuric and/or nitric acid to impart a pH of 2 or less to the solutionh (and which optionally may also contain fluoride ions up to a concentration of 0.5 g/l) there is provided a method of controlling the effectiveness of the washing solution in which the ferric ion concentration therein is monitored, conveniently by the oxidation-reduction potential of the washing solution, as shown in FIG. 3, and is controlled within the desired limits by adding when appropriate suitable amounts of oxidant capable of oxidizing ferrous ions to ferric ions and, separately or in conjunction therewith, a replenisher containing a source of iron ions.

Abstract: A gold solder matching 14 karat yellow gold. The solder is typically employed in jewelry repair and is comprised of discrete particles of gold alloy and a flux to which a small amount of water is added to provide a fluid, liquid-like, easily worked solder. The gold alloy consists essentially of about 45% silver, about 20% copper, about 25% gold and about 10% brass.

Abstract: Soldering composition incorporating a flux, characterized in that as flux at least one compound is employed with the general formula ##STR1## in which n is a number from 0 to 6, all groups R.sub.1 to R.sub.6 are identical or different aryl groups, of which at least one carries a COOR.sub.7 substituent, in which R.sub.7 represents hydrogen, an alkyl or aryl group with a maximum of 12 carbon atoms, and in which R.sub.1 and R.sub.2 can be one and the same aryl group, thus forming a cyclic compound.

Abstract: A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.

Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

Abstract: A fluxing agent for soldering, e.g. of electronic components, characterized by consisting of a solution comprising 1-15, preferably 2-12% by weight of nonionic surface active agent and/or another substance with similar capacity to form liquid crystals in the fluxing agent film, 1-80, preferably 1-10% by weight of water, and volatile solvent, preferably at least 70% by weight, and minor quantities of activators which are capable of reacting with impurities on the surfaces subjected to soldering, such as halides and carboxylic acids, and preferably with a weight ratio of nonionic surface active agent to water of 1:8 to 5:1 and especially 0.5:1 to 2:1, and a process for soldering using said fluxing agent.

Abstract: Fine cobalt or nickel powder is produced by hydrogen reduction of a sulfate solution in the presence of a base and a strong reductant such as a metal borohydride wherein the base is added stagewise to the solution with the initial addition of base being sufficient to insure an essentially neutral pH at the time of reductant addition.

Abstract: A flux for submerged-arc welding comprising a balanced combination of calcium fluoride, alumina, zirconia, cryolite, magnetite, manganese metal, nickel-niobium alloy, chromium-molybdenum alloy and alkali metal silicate binder.

Abstract: A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.

Abstract: A solder paste contains solder plated copper spheres in addition to particulate solder and flux. The paste can be used to solder leadless component carriers or the like to printed circuit boards., After melting the solder, the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.

Abstract: Chromium free cleaning compositions for cleaning aluminum and aluminum alloy surfaces comprisingA. from 0.2-4 g/l ferric ion andB. sufficient sulfuric and/or nitric acid to produce a pH of 2 or less.The invention also relates to compositions containing from 0.001-0.5 g/l of fluoride ions.

Abstract: Metal filler compositions based on manganese and nickel for the welding of cast iron are disclosed. The filler composition preferably contains about 15 to 50% manganese and 15 to 35% nickel. The filler compositions may be incorporated into a welding rod for Shielded Metal Arc (SMA) or into the welding wire for Gas Metal Arc (GMA) welding or added as metal powders in Flux Cored Arc (FCA) or submerged Arc (SA) welding. The compositions are particularly useful for welding gray and ductile (nodular) cast irons.

Abstract: Weld bead analysis and electrode capable of producing same, which in multiple pass welding of thick steel plates, results in fine grain structure and high impact strength. The analysis includes as necessary ingredients, titanium, nitrogen and chromiumwith a maximum limitation on auminum, if present. The electrode contains titanium and chromium. The welding is in air and the titanium picks up nitrogen from the air and carries it into the weld bead as micro particulates of titanium nitride, which forms nucleation points for commencing fine grain growth.

Abstract: A method of joining metal surfaces is provided which comprises contacting the metal surfaces with a zinc-based composition and joining the metal surfaces, the zinc-based composition comprising, by weight:from about 0.1 to about 4 percent copper;from about 0.1 to about 1 percent nickel;from about 0.01 to less than 0.5 percent aluminum;0 to about 0.5 percent chromium;0 to about 0.5 percent titanium; and the remainder being zinc is also provided. The composition is useful for coating metal surfaces, particularly metals formed of or containing copper.The above composition and method may be used with or without a flux. Particularly beneficial results are obtained when a flux having a composition comprising, by weight:from about 5 to about 70 percent ZnCl.sub.2 ;from about 1 to about 28 percent NH.sub.4 Cl;from about 0.1 to about 10 percent SnCl.sub.2 ;from about 0 to about 10 percent HCl;from about 0 to about 10 percent Li.sub.2 B.sub.4 O.sub.7 ;from about 0 to about 5 percent MgBr.sub.

Abstract: A water soluble solder flux particularly suitable for use as a fusing fluid in condensation soldering operations has been developed. The invention involves the use of such flux in condensation soldering as well as the flux, per se. The novel flux comprises a water soluble flux vehicle comprising a resinated polyethylene oxide (polyene), together with at least one flux activator selected from a water soluble organic acid activator and a water soluble halide containing activator, and a solvent which is water soluble.

Abstract: An agglomerated submerged arc welding flux which offers the advantages of an agglomerated flux, namely lower cost, increased impact strength, greater formulation flexibility and operator appeal while, in other respects, performing like a fused flux, namely providing: high speed; high penetration; and low bead profile characteristics. The flux contains relatively large amounts of calcium oxide and titanium dioxide as essential ingredients together with other known fluxing ingredients in lesser amounts.

Abstract: An agglomerated submerged arc welding flux which results in low weld metal oxygen and the concomitant high impact values while retaining the good welding characteristics of the lower basicity (acid) fluxes such as welding at higher speeds on various joint configurations with less undercutting and slag entrapment along with good slag removal. The flux contains high percentages of calcium fluoride and aluminum oxide in combination with other ingredients having a limited amount of available oxygen and sufficient acid components to lower the basicity index of the flux below 1.25. Additionally, no potent deoxidizers such as magnesium, titanium or aluminum are required.

Abstract: A brazing flux having a composition corresponding to 0 (not inclusive) to 62 mol % of potassium fluoride, 2 to 74 (not inclusive) mol % of cesium fluoride and 26 to 67 mol % of aluminum fluoride, said flux including potassium and cesium as fluoro-aluminum-complexes and not including free cesium fluoride and potassium fluoride, thus having a melting starting point within the range of 440.degree.-580.degree. C.

Abstract: A fluorescent solder paste mixture comprising a fluorescent pigment dispersed in a solder paste is disclosed. The solder paste comprises solder fragments dispersed in a solder flux. A method for making the solder paste mixture and a method for using the solder paste mixture to make a fluorescent solder joint between an electrical component and a circuit board are also disclosed. Use of the fluorescent solder paste mixture facilitates automatic and manual inspection of circuit boards during and after assembly.

Abstract: A filler containing easily oxidizable elements such as aluminum, titanium, zirconium, rare earth metals as well as a powder combination containing fluorides and carbonates is used for fusion welding steel, nickel and cobalt alloys and corresponding castings containing easily oxidizable elements. The ratio of the dry weight of all fluorides to the dry weight of the alkaline earth carbonates in the powder combination is at least 2.2:1.

Abstract: A welding flux binder and welding flux comprising the reaction product of a hydrolyzed and polymerized organometallic compound selected from the group consisting of metal alkoxides including tetraalkylorthosilicate, tetraalkylorthotitanate, tetraalkylorthozirconate and trialkylaluminate, metal esters, and metal oxalates. The organometallic compound is hydrolyzed and then polymerized to form a gel glass phase. Alkali and alkaline earth salts are added to stabilize and reduce the viscosity of the gel. The resulting welding flux binder and flux are non-hygroscopic and have a high fired strength.

Abstract: A soldering composition containing at least 85% and less than 90% by weight of finely divided solder metal and a minor portion of a vehicle for the solder metal, consisting essentially of a rosin-type flux, a thickening agent and a minor portion, about 2 to about 7%, of a fluorinated tertiary alkylamine, particularly a perfluorotrihexyl amine. During vapor-phase soldering, the amine component is washed from the solder composition, leaving solder metal, rosin-type flux and thickening agent, in the remaining composition, the composition at this stage containing about 90% solder metal, and yielding dense solder joints, essentially no solder balls, and minimal residue.

Abstract: A solder composition containing a small amount of aluminum added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate aluminum, by weight of the solder metal.

Abstract: A solder composition containing a small amount of gold added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate gold, by weight of the solder metal.

Abstract: A method of brazing an aluminum material. At least a portion of the material is brought into contact with a coating solution containing cesium and fluorine ions, whereby a chemically coated flux layer composed of cesium fluoroaluminate or a mixture thereof with aluminum fluoride is formed on the surface of the material. Then, the material is heated and joined to another material with a brazing alloy.