Copper Base Patents (Class 148/411)
-
Publication number: 20020157741Abstract: A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 &mgr;m or less; and a 0.2% proof stress expressed by “b” of 800 N/mm2 or more. The alloy further comprises a bending radius ratio (bending radius/sheet thickness) not causing cracking as expressed by “a” by a W-bending test in a transverse direction to a rolling direction, wherein “a” and “b” satisfy a≦0.Type: ApplicationFiled: February 19, 2002Publication date: October 31, 2002Applicant: Nippon Mining & Metals Co., Ltd.Inventors: Michiharu Yamamoto, Tositeru Nonaka, Takahiro Umegaki
-
Patent number: 6406566Abstract: The present invention provides a copper-based alloy having high shape memory properties and superelasticity while maintaining an excellent workability, members such as a wire, plate, pipe, etc. made of the copper-based alloy, and methods for producing them. The copper-based alloy has a recrystallization structure substantially composed of &bgr;-single phase, and can be produced by a method comprising the steps of: forming an alloy by cold-working with a particular maximum cold-working ratio; and subjecting the cold-worked alloy to at least one solution treatment for improving a crystal orientation of the &bgr;-single phase, a quenching and an aging treatment. The maximum cold-working ratio is set so that the crystal orientation density of the &bgr;-single phase measured by an electron back scattering pattern method is 2.0 or more in a cold-working direction.Type: GrantFiled: July 10, 2000Date of Patent: June 18, 2002Inventors: Kiyohito Ishida, Ryosuke Kainuma, Yuji Sutoh
-
Publication number: 20020043307Abstract: Guide wires and catheters made from a functionally graded alloy comprising 3-10 weight % Al and 5-20 weight % Mn, the balance being substantially Cu and inevitable impurities. The functionally graded alloy is produced by forming the copper-based alloy, maintaining it at a temperature of at least 500° C. and rapidly cooling it, and then subjecting the alloy to an aging treatment by a gradient temperature heater.Type: ApplicationFiled: October 23, 2001Publication date: April 18, 2002Applicant: Kiyoshito ISHIDAInventors: Kiyohito Ishida, Yoshikazu Ishii, Ryosuke Kainuma
-
Patent number: 6197433Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).Type: GrantFiled: January 12, 2000Date of Patent: March 6, 2001Assignee: Nippon Mining & Metals Co., Ltd.Inventor: Takaaki Hatano
-
Patent number: 5702542Abstract: Metal-matrix composites and methods for producing these composites are provided. The manufacturing methods include providing a ceramic preform having a uniform distribution of ceramic particles sintered to one another. The particles include an average particle size of no greater than about 3 microns, and at least one half of the volume of the preform is occupied by porosity. The preform is then disposed into a mold and contacted by molten metal. The molten metal is then forced into the pores of the preform and permitted to solidify to form a solid metal-matrix composite. This composite is machinable with a high-speed steel (HSS) bit for greater than about 1 minute without excessive wear occurring to the bit. This invention preferably employs metal-matrixes including Al, Li, Be, Pb, He, Au, Sn, Mg, Ti, Cu, and Zn. Preferred ceramics include oxides, borides, nitrides, carbides, carbon, or a mixture thereof. Inert gas pressures of less than about 3,000 psi can be used to easily infiltrate the preforms.Type: GrantFiled: December 18, 1995Date of Patent: December 30, 1997Inventors: Alexander M. Brown, Eric M. Klier
-
Patent number: 5587259Abstract: A metal current collecting substrate for an air cathode in an electrochemical metal air cell is provided for, wherein the substrate is hardened by one of the steps of sandblasting, shotblasting, plastic deformation of the substrate below the recrystallization temperature range of the metal thereof, and heating the substrate to above the transformation temperature of the metal thereof followed by quenching the substrate below the transformation temperature of the metal thereof. Catalytically active materials, most preferably a mixture of carbon and manganese dioxide, are pressed or otherwise disposed upon the hardened substrate. The substrate is capable of being connected to electrical circuitry. Most preferably, the substrate is a metal screen that has been hardened, roughened and pitted by sandblasting before the catalytically active materials are disposed thereupon, and before the substrate is incorporated into an electrochemical metal air cell.Type: GrantFiled: March 9, 1994Date of Patent: December 24, 1996Assignee: Rayovac CorporationInventors: Robert B. Dopp, John E. Oltman, Joseph L. Passaniti
-
Patent number: 5480472Abstract: A method for forming an electrical contact material comprises the steps of melting a mixture of Cu and Cr into a molten alloy, atomizing the molten alloy into fine particles to obtain alloyed particles. Cr particles in the alloyed powder disintegrate to less than 5 .mu.m in mean particle diameter. The alloyed powder is sintered thereafter and a mean particle diameter of chromium in the sintered article is fined in a range of 2 to 20 .mu.m. An electrical contact material is composed of a copper matrix and chromium particles having a mean particle diameter of 2 to 20 .mu.m. The chromium particles are homogeneously dispersed in the copper matrix.Type: GrantFiled: July 30, 1991Date of Patent: January 2, 1996Assignee: Kabushiki Kaisha MeidenshaInventors: Yasushi Noda, Nobuyuki Yoshioka, Nobutaka Suzuki, Toshimasa Fukai, Tetsuo Yoshihara, Koichi Koshiro
-
Patent number: 5445686Abstract: An Fe-Cu alloy sheet manufactured by a thin plate continuous casting method so as to be used as a material of electronic and magnetic parts. The alloy sheet has an alloy structure of high uniformity which contains 20 to 90% Cu, 1 to 10% Cr, 0 to 10% Mo, and one or more of alloying elements selected from the group consisting of Al, Sc, Y, La, Si, Ti, Zr and Hf whose amount or total amounts are not less than a calcualtion value of the following equation and not more than 10%, the balance being essentially Fe: ##EQU1## wherein .alpha.=1,.beta.=51-(%Cu) (in the case where Cu=20 to 50%),.beta.=-19 +0.4 (% Cu) (in the case where Cu=50 to 90%).Boron and/or carbon take substantially the same effects as the above-mentioned elements such as Al.Type: GrantFiled: June 1, 1994Date of Patent: August 29, 1995Assignee: Nippon Steel CorporationInventors: Yoshiyuki Ueshima, Toshiaki Mizoguchi, Kenichi Miyazawa, Satoshi Nishimura
-
Patent number: 5407499Abstract: A tubular blank made of an age-hardening copper alloy is annealed and quenched; whereupon a mandrel of the final shape and size of the interior cavity of the mold to be made is inserted; whereupon the blank is forced onto the mandrel primarily by drawing, but also rolling, forging, electrodynamically or hydrostatically shaping, or a combination thereof is considered.Type: GrantFiled: April 14, 1993Date of Patent: April 18, 1995Assignee: KM Kabelmetal A.G.Inventor: Horst Gravemann
-
Patent number: 5388319Abstract: The invention provides a method for making an organism deposit-inhibition pipe, which excels in corrosion resistance, dispenses with maintenance work, and offers no toxicity problems. A thin sheet comprising a copper alloy is wound spirally around a round bar and inserted into a resin pipe made up of an electrical insulating material. And the round bar is taken out. The obtained pipe has an inner wall which is covered with the copper thin sheet. The copper alloy has a Be content of 0.2 to 2.8% by weight, and is selected from, e.g., Be--Cu, Be--Co--Cu, Be--Co--Si--Cu and Be--Ni--Cu alloys. The beryllium-copper alloy has a remarkable antifouling effect and provides a continued liberation of copper ions.Type: GrantFiled: March 8, 1993Date of Patent: February 14, 1995Assignee: NGK Insulators, Ltd.Inventor: Shunji Inoue
-
Patent number: 5296189Abstract: Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate.Type: GrantFiled: April 28, 1992Date of Patent: March 22, 1994Assignee: International Business Machines CorporationInventors: Sung K. Kang, Sampath Purushothaman, John J. Ritsko, Jane M. Shaw, Subhash L. Shinde
-
Patent number: 5292477Abstract: Methods of fabricating powders of electrically conductive particles supersaturated with grain growth control additives are described. A molten admixture of an electrically conductive material and a grain growth control additive is atomized by spraying an inert atmosphere forming fine molten particles which rapidly cool to form solid particles which are supersaturated with the grain growth control additive. The supersaturated particles are heated to form an electrical conductor having grain sizes less than about 25 microns. The supersaturated particles can be combined with a binder to form an electrical conductor forming paste. Patterns of the paste can be embedded in a green ceramic which can be sintered to form a semiconductor chip packaging substrate having electrical conductors with controlled grain size.Type: GrantFiled: October 22, 1992Date of Patent: March 8, 1994Assignee: International Business Machines CorporationInventors: Dudley A. Chance, David B. Goland, Srinivasa S. N. Reddy, Subhash L. Shinde, Donald R. Wall
-
Patent number: 5257733Abstract: This invention relates to a composition of a region joining two members treated thermodynamically by a process set forth by the present invention. In accordance with one aspect of the present invention, there is provided a region comprising a solidified bead containing generally between 1.6 and 2.0% beryllium, a melt and mix zone containing generally between 0.6 and 1.8% beryllium, a recrystallized zone containing generally between 0.6 and 1.0% beryllium, and an overaged zone containing generally between 0.3 and 0.8% beryllium.Type: GrantFiled: February 19, 1993Date of Patent: November 2, 1993Assignee: Brush Wellman Inc.Inventors: William D. Spiegelberg, John O. Ratka, Clarence S. Lorenz
-
Patent number: 5256214Abstract: A method for the manufacture of a copper based alloy and the alloy produced thereby having improved mechanical properties. An alloy containing a dispersoid ingredient and a precipitating ingredient are spray cast so that during spray casting the dispersoid ingredient forms a second phase as a uniform dispersion of relatively small dispersoids. After solution treating and aging, the solid state precipitating ingredient precipitates as a third phase of a solid state precipitate.Type: GrantFiled: June 10, 1992Date of Patent: October 26, 1993Assignee: Olin CorporationInventor: Sankaranarayanan Ashok
-
Patent number: 5149499Abstract: A cooper base alloy and process having high electrical conductivity. An alloy consists of from 0.005 to 0.15% by weight Niobium, about 0.005 to 0.15% by weight Iron, 0.01 to 0.05% by weight phosphorus, and the balance copper.Type: GrantFiled: September 6, 1991Date of Patent: September 22, 1992Assignee: Poongsam CorporationInventors: Young G. Kim, Han I. Yoo, Sang K. Han, Deung Y. Lee
-
Patent number: 5085712Abstract: An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 10 in each of the iron/chromium phase and the copper phase, is prepared by continuous casting, cold-working, and aging.Type: GrantFiled: May 23, 1990Date of Patent: February 4, 1992Assignee: Nippon Steel CorporationInventors: Kunio Watanabe, Satoshi Nishimura, Kunishige Kaneko
-
Patent number: 5071494Abstract: An aged copper alloy comprising:0.15-1.0 wt % Fe,0.05-0.3 wt % P, and0.05-0.3 wt % Mg and 0.05-0.3 wt % Pbwith the balance being essentially composed of Cu.Type: GrantFiled: January 22, 1991Date of Patent: December 10, 1991Assignee: Yazaki CorporationInventors: Yasusuke Ohashi, Toshihiro Fujino, Yasuhito Taki, Tamotsu Nishijima
-
Patent number: 5026434Abstract: A process for producing a Cu-Fe-Co-Ti alloy useful as conductor elements in the electronics and connector industries. The alloy is produced in the form of a bath having a Ti/Fe+Co ratio between 0.3 and 1 and a Co/Fe ratio between 0.10 and 0.90. The molten alloy bath is deoxidized with boron, cast, homogenized, cold drawn, and subjected to a precipitation heat treatment at a temperature lower, by at most 80.degree. C., than a temperature TM leading to the maximum electric conductivity.Type: GrantFiled: June 25, 1990Date of Patent: June 25, 1991Assignee: TrefimetauxInventors: Alain Picault, Christian Gandossi, Laurent Mineau
-
Patent number: 5024815Abstract: A copper alloy comprising:(A) 0.15-1.0 wt % Fe,(B) 0.05-0.3 wt % P, and(C)(1) 0.01-0.1 wt % Ni and 0.01-0.05 wt % Si or(2) 0.01-0.1 wt % Ni and 0.005-0.05 wt % b or(3) 0.05-0.3 wt % Mg and 0.05-0.3 wt % Pb or(4) 0.01-0.1 wt % Mn and 0.005-0.05 wt % Si,with the balance being essentially composed of Cu.Type: GrantFiled: May 24, 1989Date of Patent: June 18, 1991Assignee: Yazaki CorporationInventors: Yasusuke Ohashi, Toshihiro Fujino, Yasuhito Taki, Tamotsu Nishijima
-
Patent number: 5017250Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.Type: GrantFiled: July 26, 1989Date of Patent: May 21, 1991Assignee: Olin CorporationInventor: Sankaranarayanan Ashok
-
Patent number: 4986856Abstract: A fine copper wire for electronic instruments is disclosed which comprises 0.05 to 10 ppm in total amount of either one or not less than two kinds of Ti, Zr, V, Hf, Cr, Ca, Mg, Y and rare-earth elements, 1 to 30 ppm of oxygen and the remainder of Cu. A method of manufacturing therefor is described wherein the hot rolling is given to the ingot obtained by melting and casting in a nonoxidative atmosphere or in vacuum, then stretch processing and at least once or more times of intermediate annealing are repeated to finish to a fixed diameter of wire, and thereafter annealing is carried out under nonoxidative or reducible atmosphere to obtain desired mechanical characteristics.Type: GrantFiled: September 14, 1989Date of Patent: January 22, 1991Assignees: The Furukawa Electric Co., Ltd., Furukawa Special Metal Co., Ltd.Inventors: Toru Tanigawa, Masaaki Kurihara, Yasuji Fujii, Toshiaki Inaba
-
Patent number: 4869758Abstract: An iron/copper/chromium alloy material for a high-strength lead frame or pin grid array, which comprises 20 to 90% by weight of Cu and 2.5 to 12% by weight of Cr, with the balance being mainly iron, and which has an average grain size number of at least 10 in each of the iron/chromium phase and the copper phase, is prepared by continuous casting, cold-working, and aging.Type: GrantFiled: May 25, 1988Date of Patent: September 26, 1989Assignee: Nippon Steel CorporationInventors: Kunio Watanabe, Satoshi Nishimura, Kunishige Kaneko
-
Patent number: 4838959Abstract: A method for processing a copper alloy wherein the alloy comprises from 0.2-1.0% beryllium, 1.4-2.2% nickel or cobalt and remainder copper. Said method comprising one or more processing steps and characterized in that said steps conclude with cold working the alloy to an area reduction of at least 99% followed by a batch annealing at a temperature of 750.degree.-950.degree. F. for a period of 1-4 hours.Type: GrantFiled: November 16, 1987Date of Patent: June 13, 1989Assignee: Hudson International ConductorsInventor: Tom Inagaki
-
Patent number: 4818283Abstract: A process for producing a dispersion hardened copper alloy includes admixing to a copper melt from 0.3 to 15 weight % of molybdenum to provide a mixture which is a melt; superheating the mixture to a temperature ranging from about 200.degree. C. to about 1000.degree. C. above the melting point of coper to provide a superheated melt; and subjecting the superheated melt to very rapid solidification at a cooling rate ranging from 104.degree. to 106.degree. C./sec. The above process produces dipsersion hardened copper alloy comprising copper and from 1 to 15 weight % of molybdenum which is present in the dispersion hardened copper alloy as particles having a diameter of less than 0.1 .mu.m embedded in the copper matrix. Such dispersion hardened copper alloys are useful for providing electrical conductors which are subjected to elevated temperatures, such as for providing spot welding electrodes, particularly for welding of zinc-galvanized sheet metal.Type: GrantFiled: October 16, 1987Date of Patent: April 4, 1989Assignee: Battelle-Institut e.V.Inventors: Karl-Heinz Grunthaler, Dieter Langbein, Fehmi Nilmen, Heinrich Winter
-
Patent number: 4755235Abstract: An electrically conductive copper alloy material for such as electric wires is disclosed whose grain size number is adjusted to be not less than 7 (JIS G 0551) which corresponds substantially to ASTM E112 by making an ingot of a copper alloy containing Cr and/or Zr, hot-working it to a wire of suitable diameter, and repeatedly annealing and cold-working it. A method for manufacturing such material is also disclosed.Type: GrantFiled: March 17, 1986Date of Patent: July 5, 1988Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Seika Matidori, Masato Sakai
-
Patent number: 4727002Abstract: A wire having a tensile strength of at least 95 psi and conductivity of at least 60 percent IACS is provided. The wire is manufactured from a precipitation hardenable alloy, the alloy consisting essentially of about 0.38 percent beryllium, 1.66 percent nickel or cobalt and the remainder copper. The manufacture comprises one or more processing steps concluding with cold working the alloy to a wire and an area reduction of at least 99 percent.Type: GrantFiled: June 2, 1986Date of Patent: February 23, 1988Assignee: Hudson Wire CompanyInventor: Tom Inagaki
-
Patent number: 4724013Abstract: This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and cobalt, e.g., about 0.2% to about 0.5% beryllium and about 0.2% to about 1% or about 1.5% or about 2% cobalt, which imparts to these alloys a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength by the process of solution annealing, cold working at least about 50% or at least about 70% or 90% or more and age hardening.Type: GrantFiled: November 5, 1985Date of Patent: February 9, 1988Assignee: Brush Wellman, Inc.Inventors: Nathan L. Church, W. Raymond Cribb, John C. Harkness
-
Patent number: 4704253Abstract: A copper alloy for use in the manufacture of a radiator fin contains 10 to 150 ppm of tellurium and 20 to 110 ppm of phosphorus, both by weight, as well as copper and unavoidable impurities.Type: GrantFiled: January 8, 1986Date of Patent: November 3, 1987Inventors: Shinsuke Yamasaki, Hajime Izumimori
-
Patent number: 4666795Abstract: In construction of a clad material for ornamental use such as eyeglass frames and watch bands, use of age-hardenable alloy sheath followed by age-hardening enables production of product with light weight, high mechanical strength, excellent workability and good fit to brazing and plating.Type: GrantFiled: May 23, 1985Date of Patent: May 19, 1987Assignee: Nippon Gakki Seizo Kabushiki KaishaInventors: Kazuo Kurahashi, Nobutoshi Onodera
-
Patent number: 4640723Abstract: A lead frame consists of a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium and having a precipitate with a grain size of 0.5 to 50 .mu.m distributed therein at a rate of 1,000 to 10,000 grains/mm.sup.2. The lead frame is manufactured by casting a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium by continuous casting, and performing rolling, a solution treatment, a cold working, and an age-hardening. The lead frame has an excellent bonding performance with an Au wire, hardness and bending strength, and is inexpensive.Type: GrantFiled: December 20, 1983Date of Patent: February 3, 1987Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Shinzo Sugai, Shigemi Yamane, Takashi Kuze
-
Patent number: 4606889Abstract: Disclosed is a moderate electrical conductivity copper alloy containing titanium and beryllium wherein the ratio of titanium to beryllium is about 10:1. The alloy has an outstanding combination of useful engineering properties: mechanical strength, physical characteristics and good fabricability. A typical alloy contains, in weight percent, about 2.3 titanium, 0.2 beryllium and the balance copper plus normal impurities found in alloys of this class.Type: GrantFiled: November 7, 1985Date of Patent: August 19, 1986Assignee: Cabot CorporationInventors: Sherwood Goldstein, Paul J. Scherbner, deceased
-
Patent number: 4599119Abstract: An age-hardening copper titanium alloy containing 2 to 6% by weight of titanium, and composed of a substantially fully solution heat-treated structure having an average crystal grain size not exceeding 25 microns. When the alloy is cold-rolled after its solution heat treatment, its elongation in the rolling direction and that in a direction perpendicular thereto have a difference of within 20% therebetween, and its bend radius to thickness ratios in those two directions are substantially equal to each other.Type: GrantFiled: November 13, 1984Date of Patent: July 8, 1986Assignee: NGK Insulators, Ltd.Inventors: Kazuo Ikushima, Yoshio Itoh, Toshiaki Ishihara
-
Patent number: 4589930Abstract: A casting metal mold made of a copper alloy consisting essentially of 0.01 to 3 wt % of zirconium, 0.03 to 5 wt % of titanium and, as required, 0.03 to 2 wt % of chromium and the balance substantially copper, the copper alloy having a structure in which precipitate phase consisting of compound of copper and at least one of zirconium, titanium and chromium exists, and having a Brinell hardness between H.sub.B 100 to H.sub.B 500 and an electric conductivity between 20 and 80% in terms of IACS. This metal mold suffers only small deformation during casting and, hence, less liable to cause run-out of the melt. The casting obtained by this metal mold, therefore, has no or only slight fins.Type: GrantFiled: February 29, 1984Date of Patent: May 20, 1986Assignee: Hitachi, Ltd.Inventor: Yozo Kumagai
-
Patent number: 4565586Abstract: This invention is directed to the treatment of copper beryllium alloys, and to articles and parts made therefrom, containing special small amounts of beryllium and cobalt, e.g., about 0.05% to about 0.5% beryllium and about 0.05% to about 2% cobalt, which imparts to these alloys a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength by the process of solution annealing, cold working at least about 50% or at least about 70% or 90% or more and age hardening.Type: GrantFiled: June 22, 1984Date of Patent: January 21, 1986Assignee: Brush Wellman Inc.Inventors: Nathan L. Church, W. Raymond Cribb, John C. Harkness
-
Patent number: 4551187Abstract: This invention is directed to age hardenable copper beryllium alloys, and to articles and parts made therefrom, which contain special small amounts of beryllium and cobalt; e.g., about 0.2% to about 0.5% beryllium and about 0.2% to about 0.4% cobalt, which, when finished by solution treating, cold working at least about 50% or at least about 70% and age hardening have a superior combination of stress relaxation resistance, formability, ductility, conductivity and strength.Type: GrantFiled: June 8, 1984Date of Patent: November 5, 1985Assignee: Brush Wellman Inc.Inventors: Nathan L. Church, W. Raymond Cribb, John C. Harkness
-
Patent number: 4533412Abstract: A method for enhancing the strength and hardness properties of a starting copper alloy having a matrix structure which has been cold worked and heat treated. The method includes the step of additional cold working followed by additional heat treating to increase the strength of the alloy without significantly affecting the electrical conductivity of the alloy. The method produces a strong and highly conductive material suitable for use as a field magnet which must experience high operational stress while carrying large current loads. The starting alloy may be a copper-beryllium-nickel alloy.Type: GrantFiled: September 30, 1982Date of Patent: August 6, 1985Assignee: FDX Patents Holding Company, N.V.Inventor: Abraham I. Rotem
-
Patent number: 4522784Abstract: In the production of alloys, particularly Al alloys, by a continuous casting process a supplementary alloy stream is continuously fed into a main metal stream running to the casting mould. The supplementary alloy stream preferably amounts to 1-20% of the main metal stream and has a liquidus temperature above the temperature of the main metal stream so that on contact with the main metal stream, intermetallic phases are precipitated very rapidly as a result of the high chill rates.This mode of casting reduces the risk of coarse primary particles when casting alloys of high alloying element content. The supplementary alloy stream need not be based on the same metal as the main metal stream. The method is considered suitable for the addition of various metals, such as Zr, Mn, Cu, Fe, to aluminium and aluminium alloys to overcome a variety of difficulties and to produce alloy products of improved properties.Type: GrantFiled: April 27, 1983Date of Patent: June 11, 1985Assignee: Alcan International LimitedInventors: Philip G. Enright, Ian R. Hughes, Richard M. Jordan
-
Patent number: 4395295Abstract: A process for improving the fatigue strength and fatigue life of a substantially single phase copper-aluminum-silicon alloy is described. The process comprises cold working the copper alloy from about 75% to about 98% and heating the alloy at a temperature of about 200.degree. C. to about 350.degree. C. for a time period of at least about 5 minutes.Type: GrantFiled: May 28, 1982Date of Patent: July 26, 1983Assignee: Olin CorporationInventor: Eugene Shapiro