Abstract: A pressure sensitive adhesive film attached to a surface is cut by pulling a filament from an adhesive tape applied on to the surface through that part of the film over the tape so as to cut the film and to form a cut edge of the film. The filament is a polyester multi-fiber filament of the order of 16 tex which provides a strength to break of the order of 2 pounds force and an extension of the order of 15% under a load of 1.0 pounds force. The tape comprises a polyethylene substrate of 0.125 inch in width. The filament is extendible so that, when the tape is stretched the filament stretches with the tape and does not pull out or separate. The filament can be broken by hand and has an ability to bend to a radius of curvature of less than 0.5 inches without any stiffness in the filament.

Abstract: A re-sealable package and method which includes roll stock, a pressure sensitive label and a release member. The re-sealable package includes an outer layer laminated to an inner sealant layer. The pressure sensitive label has a first preselected shape and includes a pressure sensitive adhesive on one side. The side having the pressure sensitive layer is adhered to the inner sealant layer of the roll stock. The release member is formed in the outer layer, the release member having a second preselected shape which is smaller than the first preselected shape of the pressure sensitive label. As the release member is lifted from the pressure sensitive label, an area of the pressure sensitive adhesive is exposed to allow portions of the package to be removably adhered to the area of pressure sensitive adhesive.

Abstract: A method for the production of an elastic composite material with a textile surface. First, a laminate is produced, which has elastic cover layers and a core composed of a nonwoven fabric. Subsequently, the laminate is separated into two strips, each of which has a cover layer and an adhering layer of nonwoven fabric, by tearing open the core.

Abstract: The present disclosure provides a separator for lithium battery, particularly to a separator including a middle layer formed by a punch method. Also, a manufacturing method of the separator is provided. The separator formed by the punch method has a better heat-resistant property in an elevated temperature and features a high mechanical strength.

Abstract: A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.

Abstract: The method for manufacturing a liquid crystal display device includes carrier film feeding steps including feeding long carrier films from continuous rolls, respectively; peeling steps including folding back each of the carrier films at a front end part placed on a carrier film feed path so that the optical films are peeled off from the carrier films, respectively; and bonding steps including bonding the optical films to the viewer side and back side of a liquid crystal panel, wherein in the bonding steps, the optical films are bonded to the liquid crystal panel in such a manner that the number of times the optical film is bonded to the back side of the liquid crystal panel is greater than the number of times the optical film is bonded to the viewer side of the liquid crystal panel.

Abstract: The present invention discloses a method of splicing polarized films. The method includes steps of providing a substrate; attaching a first polarized film to the substrate; attaching a second polarized film to the substrate so that a side portion of the second polarized film is correspondingly overlapped with a side portion of the first polarized film; correspondingly cutting off the overlapped side portions of the first polarized film and the second polarized film; removing separated parts of the side portions from the first polarized film and the second polarized film; and performing a flatten treatment to the cut side portions of the first polarized film and the second polarized film. The method effectively reduces the interval between spliced polarized films so that the light leakage problem at the joint position is improved.

Abstract: A method of transferring a plurality of metal foil labels from a metal foil strip onto a continuous film liner in spaced apart juxtapositions, the method comprising placing metal foil strips onto a continuous web to form an assembly of the strips and the web, feeding the foil strip assembly through a compression roller module, and then feeding the foil strip assembly to a rotary die cutting module to cut through said metal foil strip and portions of said web to form a plurality of metal foil labels.

Abstract: The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: The method for producing a electroconductive sheet having a substrate, in particular made of paper, and an electroconductive layer include the steps of: a/ preparing a multi-layer structure with an anti-adhesive coating inserted between a plastic film and a base layer, b/ cross-laminating the multi-layer structure and the substrate, and c/ removing the plastic film and the anti-adhesive coating from the base layer. The base layer is a layer of an electroconductive material or is covered with an electroconductive layer by an additional step consisting of: d1/ depositing an electroconductive film on the base layer; or d2/ printing the base layer with at least one ink having electrical properties, with the base layer being a printable layer with a binder base of which the rate is 15% greater in dry weight in relation to the total dry matter weight of this layer.

Abstract: A metal sheet for encapsulating an organic light-emitting display device, the metal sheet including a main body, first and second adhesive layers respectively formed on both surfaces of the main body, and first and second releasing films that respectively protect the first and second adhesive layers by covering them. A portion of an outer line of the first adhesive layer passes an inner region of the second adhesive layer.

Abstract: The present disclosure relates to methods and a related systems and tools for dispensing an adhesive piece having damping qualities onto a component of a hard disk drive suspension. The adhesive piece can be commercially available layered strip sold as an adhesive layer having a first and a second liner adhered to each side. An exemplary method can cut an adhesive piece, separate the adhesive piece from a secondary liner, adhere the adhesive piece onto a component of a hard disk drive suspension, separate a primary liner from the adhesive piece, and dispose of the primary liner using a conventional gantry system. The method can be performed using a two-step operation of the gantry system.

Abstract: A process for production of a multilayer film that comprises a step in which an adhesive layer formed on a temporary base is situated along the lengthwise direction of the temporary base at a prescribed spacing and cut in such a manner that the plurality of sections which are to serve as adhesive films are partitioned from the other sections, and a step in which the adhesive films on the temporary base are moved onto a support film at a prescribed spacing along the lengthwise direction of the support film. The spacing between the adjacent adhesive films on the temporary base is different from the spacing between the adjacent adhesive films on the support film.

Abstract: An exterior film for a home appliance includes a cut portion formed by half-cutting corresponding to a see-through portion formed at an exterior part of the home appliance. After the exterior film is adhered, the cut portion is removed along with removal of a sub adhesive protection film. Accordingly, operability and productivity during manufacturing of the exterior film are improved.

Abstract: Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

Abstract: A process for forming a back-sheet assembly for a photovoltaic module having multiple solar cells with back-side electrical contacts includes providing a substrate, adhering an electrically conductive metal circuit to the substrate, adhering release pads to the metal circuit in a pattern, adhering an insulating layer to the metal circuit, forming openings in said insulating layer in a pattern over the release pads, and filling the openings with electrically conductive material that is in electrical contact with the electrically conductive metal circuit. A process for forming a photovoltaic module with this back-sheet assembly is also provided. The back-sheet assembly and photovoltaic module made with the back-sheet assembly are also provided.

Abstract: According to one embodiment, there is disclosed a method of manufacturing a semiconductor device forming a release layer on a region excluding a peripheral edge portion of a surface of a first substrate, bonding a second substrate to at least a region including the release layer of the surface of the first substrate via an adhesive layer, removing physically a peripheral edge portion of the second substrate in a manner that at least a surface of the adhesive layer right under the peripheral edge portion of the second substrate is exposed, the adhesive layer is caused to remain between the peripheral edge portion of the first substrate and the second substrate, and adhesion between the first and second substrates is maintained, and then dissolving the adhesive layer.

Abstract: A fastener and a method of making and using the fastener is provided in which the fastener includes a base having a top portion and a bottom portion. The bottom portion includes an adhesive layer portion. An elongated pliable core member is coupled to the base, with the core member having first and second ends, with at least the first end extending beyond an edge of the base. In another embodiment the base is configured to define a plurality of notches, with each notch configured to define an apex proximate the center of the base and extending with the edges toward an edge of the base and with two notches on each side of elongated pliable core member. The plurality of notches defines two sections of the base, with one section configured independently of the other section and with one section on each side of the elongated pliable core member.

Abstract: A pressure sensitive adhesive film attached to a surface is cut by pulling a filament from an adhesive tape applied on to the surface through that part of the film over the tape so as to cut the film and to form a cut edge of the film. The filament is a polyester multi-fiber filament of the order of 16 tex which provides a strength to break of the order of 2 pounds force and an extension of the order of 15% under a load of 1.0 pounds force. The tape comprises a polyethylene substrate of 0.125 inch in width. The filament is extendible so that, when the tape is stretched the filament stretches with the tape and does not pull out or separate. The filament can be broken by hand and has an ability to bend to a radius of curvature of less than 0.5 inches without any stiffness in the filament.

Abstract: A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.

Abstract: A method of producing an optical film laminate includes: a first film layer forming step of cutting a first optical film having an elongated shape into first optical film pieces along cutting lines crossing the longitudinal direction of the first optical film and disposing the first optical film pieces adjacent to each other in a substantially band or strip shape; a second film layer forming step of cutting a second optical film having an elongated shape into second optical film pieces along cutting lines crossing the longitudinal direction of the second optical film and disposing the second optical film pieces adjacent to each other in a substantially band or strip shape; and a cutting step of, while holding a third film layer made of the third optical film, the first film layer and the second film layer in a laminated state, cutting them into plural optical film laminates.

Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on.

Abstract: A metal sheet for encapsulating an organic light-emitting display device, the metal sheet including a main body, first and second adhesive layers respectively formed on both surfaces of the main body, and first and second releasing films that respectively protect the first and second adhesive layers by covering them. A portion of an outer line of the first adhesive layer passes an inner region of the second adhesive layer.

Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Abstract: A method for manufacturing a printed wiring board includes fixing a lower metal foil on a support plate, forming a lower insulating layer on the lower metal foil, laminating a core metal layer on the lower insulating layer, patterning the core metal layer such that the core metal layer is formed into a core conductive layer, forming an upper insulating layer on the core conductive layer and lower insulating layer, laminating an upper metal foil on the upper insulating layer, removing the plate from the lower foil such that a core substrate including the lower metal foil, lower insulating layer, core conductive layer, upper insulating layer and upper metal foil is formed, and forming on the core substrate a buildup layer including an insulating layer and a conductive layer. The core metal layer has a thickness which is set to be greater than thicknesses of the lower and upper foils.

Abstract: One example embodiment includes a pre-cut strip of kinesiology tape. The pre-cut strip of kinesiology tape includes a fabric. The fabric includes a weave of fibers, where the fibers include an elastic fiber covered by a covering material. The fabric also includes a first end and a second end, where the second end is opposite the first end. The fabric further includes one or more rounded corners. The pre-cut strip of kinesiology tape also includes a longitudinal cut in the fabric. The longitudinal cut passes through at least a portion of the fabric and extends from the first end to a pre-determined distance from the second end. The pre-cut strip of kinesiology tape also includes adhesive on a first surface of the fabric, where the adhesive is configured to adhere the fabric to a human body.

Abstract: A method of manufacturing a packaging material comprises laminating together at least two layers of materials to form a laminated packaging material having an inner laminate structure (20) and an outer laminate structure (22), one of which (22) is translucent or transparent and the other (20) opaque. The method includes forming a score line (28) in the opaque laminate structure to define a section (26) within the opaque laminate structure which can be wholly or partially removed. The score line (28) can encircle the section to allow its removal after lamination to form a window (14, FIG. 1) in the packaging. Alternatively, the score line (328, FIG. 7) may only partially encircle the section (326, FIG. 7) such that it remains attached to the remainder of the opaque laminate structure along a line (332, FIG. 5) about which section of opaque laminate structure can be folded in the manner of a flap.

Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.

Abstract: A method for producing a patterned pressure-sensitive adhesive body includes a pattern forming step of cutting a pressure-sensitive adhesive layer in a pressure-sensitive adhesive film including a first release film and the pressure-sensitive adhesive layer laminated on one surface of the first release film so as to form a first slit in a pattern shape and an outer frame forming step of cutting the first release film and the pressure-sensitive adhesive layer so as to form a second slit in an outer frame shape surrounding the pattern shape. The second slit has a discontinuous portion in a cutting direction.

Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract: A label finishing station receives a web carrying printed images for labels arranged so there are a plurality of images formed in rows or ranks across the width of the web. The images are also arranged in longitudinal columns along the length of the web. A cutting station carries a plurality of cutter heads to cut out the plurality of labels forming each row or rank simultaneously. The web, with the label peripheries cut out, may be slit longitudinally and formed into finished rolls of labels.

Abstract: A method and apparatus for creating a design that is melded onto an underlying layer of material that is then cut out and applied onto a final surface to produce an appliqué. The design is first created using a printer to print a design onto a top layer of “puff” or other suitable cloth material. The printed design area is cut out of the top layer material and then the bottom layer, to create a two layer appliqué that resembles a traditional stitched appliqué.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

Abstract: The present invention is drawn to a process of drilling organic glasses, comprising the steps of: (a) providing a substrate of organic glass, preferably of optical grade, (b) laminating onto at least one surface of said organic glass substrate via an adhesive layer selected from the group consisting of pressure sensitive adhesives and hot melt adhesives, a thermoplastic polymer film having a thickness of at least 40 ?m and an elastic modulus of at least 3 GPa, the peel strength of the thermoplastic polymer on the organic glass substrate being higher than 1.3 N/25 mm, preferably of at least 1.5 N/25 mm, (c) drilling a hole through the substrate and polymer film by means of a drill, and (d) optionally removing the thermoplastic polymer film and adhesive.

Abstract: The present invention provides an adhesive unit for emblem, which includes: a plurality of double-faced adhesive pieces each having a shape corresponding to a shape of a respective one of a plurality of emblem pieces; a first release film attached to a face of each of the plurality of double-faced adhesive pieces to be adhered to an emblem, so that a mutual positional relationship of the plurality of double-faced adhesive pieces is maintained; and a second release film attached to the other face of each of the plurality of double-faced adhesive pieces opposite to the face to be adhered to the emblem. The present invention also provides a method of producing the adhesive unit for emblem, a jig for adhering emblem, and an emblem for adhesion.

Abstract: An ultra removable booklet with label for application to media is described. The booklet with label includes a release liner, an ultra removable adhesive layer, a paper stock layer, a booklet, an adhesive layer, and a clear plastic cover layer. The clear plastic cover layer has the adhesive layer applied to a bottom surface thereof and the bottom surface is positioned over the booklet. The booklet is positioned over the paper stock. The ultra removable adhesive layer is attached to the lower surface of the paper stock. The release liner is applied to the ultra removable adhesive layer. A process for forming an ultra removable booklet with label for application to media is also described.

Abstract: The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.

Abstract: A method of manufacturing a packaging material comprises laminating together at least two layers of materials to form a laminated packaging material having an inner laminate structure (20) and an outer laminate structure (22), one of which (22) is translucent or transparent and the other (20) opaque. The method includes forming a score line (28) in the opaque laminate structure to define a section (26) within the opaque laminate structure which can be wholly or partially removed. The score line (28) can encircle the section to allow its removal after lamination to form a window (14, FIG. 1) in the packaging. Alternatively, the score line (328, FIG. 7) may only partially encircle the section (326, FIG. 7) such that it remains attached to the remainder of the opaque laminate structure along a line (332, FIG. 5) about which section of opaque laminate structure can be folded in the manner of a flap.

Abstract: Embodiments of the invention include printed shooting targets having reactive zones and methods related to the same. In an embodiment, the invention includes a shooting target comprising a substrate. In some embodiments, a first ink layer can be disposed on the substrate. An adhesion modifying layer disposed over the substrate and/or on the first ink layer. The adhesion modifying layer can cover less than the entire surface area of the substrate and/or first ink layer. A second ink layer disposed on the adhesion modifying layer. In an embodiment, a method of making a shooting target comprising applying discrete segments of a material over a substrate to form an adhesion modifying layer, wherein the adhesion modifying layer covers less than the entire surface area of the substrate; and applying a second ink layer over the adhesion modifying layer. Other embodiments are also included herein.

Abstract: A method and apparatus for creating a design that is melded onto an underlying layer of material that is then cut out and applied onto a final surface to produce an appliqué. The design is first created using a printer to print a design onto a top layer of “puff” or other suitable cloth material. The printed design area is cut out of the top layer material and then the bottom layer, to create a two layer appliqué that resembles a traditional stitched appliqué.

Abstract: A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.

Abstract: An aspect of the present embodiment, there is provided a method for fabricating a semiconductor device including placing a semiconductor substrate, onto which a BSG tape bonded via a supporting substrate, on a stage placed a peeling tape in a state that an adhesive surface of the peeling tape is oriented upwards and the BSG tape is oriented downwards to the stage, bonding the peeling tape onto the BSG tape in a state that the BSG tape is retained to be oriented downwards and placed on the adhesive surface of the peeling tape, drawing the peeling tape to a lower side of the stage to peel the peeling tape in a state that the peeling tape is retained to be bonded onto the BSG tape, and supporting the supporting substrate exposed from the BSG tape in the drawing of the peeling tape.

Abstract: There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.

Abstract: The present invention discloses a manufacturing method of a test strip, which comprises making a first semi-finished product and a second semi-finished product. The manufacturing process of the first semi-finished product comprises: providing a substrate, forming a plurality of electrodes on the substrate, forming a supporting layer with a plurality of channels on the substrate, and providing a reaction material to fill in the channels. The manufacturing process of the second semi-finished product comprises: providing a lid, forming a hydrophilic layer on a first surface of the lid, forming an adhesive layer on the first surface without the hydrophilic layer. Thereafter, a test strip assembly is formed by adhering the channels of the first semi-finished product to the hydrophilic layer of the second semi-finished product. Finally, a plurality of test strips are produced by cutting the test strip assembly along a first axis of the substrate.

Abstract: A method for manufacturing a sensor web. A metal foil attached to a surface of a release web is die-cut to form electrically conductive areas and conductors. A first protective film is attached to the release web so that the first protective film covers the electrically conductive areas and conductors. The release web is replaced with a backing film.

Abstract: A manufacturing system of an optical display device in which the following can be attained in the case of bonding optical members to optical display units, respectively: an optical member to be excluded, which is, for example, an optical member judged as a defective member, can be appropriately excluded so that the optical member is not bonded onto any optical display unit and a manufacturing method of an optical display device.

Abstract: An adhesive tape (10) for use in flying reel change applications comprising a double-sided adhesive tape (100) and a splitable tape (200). In order to obtain a splicing tape which provides for easy and reliable use without having to adhere it to the backside of a topmost layer of web material, at least a third self-adhesive layer (230) of the splitable tape (200) is narrower than the fixation layer (220) of the splitable tape (200), such that an essentially non-adhesive region (240) is formed on the lower surface (212) of the splitable layer (210).

Abstract: It comprises applying a mould release agent on a compaction tool (1), carrying out its curing and applying a layer with adhesive properties (2) on the mould release agent. It is characterized in that it also comprises extending an aerator blanket (4) along the layer (2) with dimensions larger than the adhesive layer (2), extending a membrane with resilient properties (5) on the entire surface of the tool (1) by applying vacuum to the membrane (5) for compacting the adhesive layer. This method reduces the number of stages required to perform the compaction and avoids the generation of waste materials thus reducing the cost of the process.

Abstract: A process for recovering rubber from a tire, the tire including a rubber tread block, steel belting, and an inner liner that serves to hold the air pressure in the tire. The bead and sidewall may be removed from the tire leaving a loop of tread material. Next, the loop is placed on a rubber-separating machine to hold the loop in place. One or more cutting blades are lowered into position at the tread portion of the tire. Once the blades are in place, the tread loop is placed in motion around the rollers. As the blades contact the steel belts, the cutting blades separate the tread rubber from the reinforced rubber at the interface between the tread rubber and the steel belts.

Abstract: Apparatus and methods are provided to allow for creation of a configured laminate of a non-woven material, to which a character strip is applied, the character strip exposed by either heat severing and removal of overlying materials, or intermittent application of overlying materials to leave the desired portions of the character strip exposed. A simultaneously formed core insert is applied to a preformed chassis web.