Abstract: Disclosed herein are various waterproof membranes that may be applied to a sill surface of an opening in a building structure to waterproof that surface as well as direct water that penetrates through the opening out of the structure. Generally, one or more flexible waterproof membranes are adhesively applied to the sill surface for purposes of waterproofing that surface. Such membranes may further incorporate a back dam structure that is disposed proximate to the rearward edge of a sill plate (i.e., disposed toward the interior of the structure) to direct water towards the front edge of the sill plate (i.e., toward the outside of the structure). Further, such membranes may include wicking material on one or more surfaces to allow for directing water out of a building structure. In various arrangements, one or more flexible membranes may be utilized to create an open fronted sill pan.

Abstract: A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

Abstract: A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product.

Abstract: A multi-web single-pass converting system apparatus and method by which predetermined zones of an adhesive surface are formed on a label material web from which discrete labels are cut and transferred to a receiving flow wrap web in overlapping relation to openings cut in the flow wrap web to form a labeled flow wrap assembly for the production of labeled flexible packaging for wipe sheet products and perishable products with the label providing a resealable closure for the opening into the package.

Abstract: The process for laying a non-full width course of fiber composite tape in a part is designed to ensure that all of the scrap portion of the tape surrounding the non-full width course is deposited in the scrap area and not in the part. An extra cut is made in tape downstream of the non-full width course, between the non-full width course and next course. After the tape head attempts to lay the scrap in the scrap area in the forward direction, the tape head makes a pass in the scrap area with the tape feed and the tape head moving in the reverse direction, and the scrap is laid beginning from the portion of the tape having the extra cut, and progressing to the non-full width course. The method may be used to remove scrap from around non-full width courses having any shape.

Abstract: A laminate from which decorative films can be precisely applied to a substrate. The laminate includes a polymeric cover sheet having opposite outer and inner major surfaces. A layer of structured pressure sensitive adhesive is adhered to the inner major surface of the cover sheet. The structured pressure sensitive adhesive has a plurality of spaced passageways extending to at least one edge of the layer of structured pressure sensitive adhesive. A decorative film is adhered to the structured pressure sensitive adhesive. A second layer of pressure sensitive adhesive is adhered to the major surfaces of the decorative film opposite the layer of structured pressure sensitive adhesive. A release liner extends substantially across the second layer of pressure sensitive adhesive and a portion of the structured pressure sensitive adhesive.

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for dicing, which comprises a substrate and at least one pressure-sensitive adhesive layer disposed on at least one surface of the substrate, the substrate containing polyvinyl chloride as a primary component and a trialkyl phosphite as a thermal stabilizer of the polyvinyl chloride, and the pressure-sensitive adhesive layer containing poly(meth)acrylic acid ester as a primary component, in which the trialkyl phosphite transited from the substrate into the pressure-sensitive adhesive layer is not unevenly distributed on a surface of the pressure-sensitive adhesive layer; a method of processing a processed material using the same, and a piece of a processed material obtainable by the method.

Abstract: A method of forming printable media including providing a laminate construction which includes (1) a film coated liner having a film layer on a liner and (2) a facestock adhered with an adhesive layer to the film layer of the film coated liner. The facestock, the film layer and the adhesive layer together form a laminate facestock. The facestock is cut to the liner to form facestock cut lines defining at least in part perimeters of printable media. Areas of the liner cover backsides of the facestock cut lines and thereby hold the printable media together for a printing operation on the printable media in a printer or copier and allow the printed media to be removed from the liner after the printing operation into individual printed media.

Abstract: A web is dispensed from a roll and includes first and second bands adjoining along a fold line. A pattern of release is applied to the front side of the web along the first band, and a pattern of adhesive is applied to the front side of the web along the second band. The web is folded along the fold line to bond together the first and second bands in a laminate, and exposing back sides of the bands on opposite sides of the laminate. The second band is cut to define a removable label therein.

Abstract: First, a sheet member which is being unwound and conveyed from a winding body, and in which a conductive film is stuck on a support sheet, is stamped in such a shape that a coil portion, a frame portion defined around the coil portion, and a joining portion connecting the coil portion to the frame portion are left unstamped. Next, a protective sheet which is made sticky, is stuck onto a surface of the stamped structure where the conductive film is stuck, and then the support sheet is peeled off. Next, an insulative support sheet which is being unwound and conveyed from a winding body, is stuck onto a surface of the structure with the protective sheet stuck thereon where the stamped conductive film is stuck, and then the protective sheet is peeled off.

Abstract: A circuit substrate manufacturing method including the steps of preparing a substrate on which a metallic foil is formed in a releasable state, forming a build-up wiring on the metallic foil, obtaining a circuit member having a structure that the build-up wiring is formed on the metallic foil by releasing the metallic foil from the substrate, and exposing a lowest wiring layer of the build-up wiring by removing the metallic foil of the circuit member.

Abstract: In an adhesive tape joining method for joining an adhesive tape to a surface of an article, cutting out the adhesive tape along an outer peripheral edge of the article and, then, collecting the unnecessary adhesive tape which has been cut out, the unnecessary adhesive tape is wound and collected so as not to shrink at a cut portion of the adhesive tape in a width direction.

Abstract: A dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 ?m and the adhesive layer has an sticking temperature such that the adhesion measured when 180° peeling at 23° C. of the dicing sheet is conducted (the peeling rate is 300 mm/min) after it is applied to a silicon mirror wafer is 10 N/25 mm or more. In a dicing method using such a dicing adhesive sheet, the production yield of a diced body such as a semiconductor wafer is high, and chipping the dicing is prevented.

Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Abstract: A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 ?m or less.

Abstract: A form that incorporates either a label or card such that the form can be reliably printed on by the end user and manufactured less expensively. The integrated label form includes a top printable substrate and a liner substrate mated together by an adhesive. The top printable substrate serves at least partially as removable portions capable of being reapplied. Weakened lines of substrate may be provided to define removable portions on the top printable substrate. The form also may include a similar printable substrate mated to the other side of the liner by adhesive. Weakened lines of substrate also may formed in the second substrate to define removable portions. The integrated card form includes a printable substrate and a first and second laminate mated to the substrate and together by an adhesive. Weakened lines of substrate and first laminate define an integrated removable portion capable of being held in the form by the second laminate and easily removed manually when desired.

Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.

Abstract: A method of producing batches of micro particles includes affixing a substrate sheet to a support and cutting the substrate sheet with a laser device to define a plurality of micro particles. Before, after or during the cutting of the substrate sheet, the region of the substrate sheet defining each micro particle is marked with a code or other identifying marking using a laser device. The code or other identifying marking is unique to the particular batch of micro particles to uniquely identify that batch. The micro particles are removed from the support by a solvent. Preferably, a single laser device is used for cutting the substrate sheet and marking the micro particles. Alternatively, separate laser devices may be used for cutting the substrate sheet and marking the micro particles.

Abstract: A process for the manufacture of a label stock carrier from a multi-layer structure having a carrier strip covered on its two faces by respective first and second adhesive films designed to be cut to form a first and second series of labels respectively. The second adhesive film is temporarily separated from the carrier strip during the cutting operation on the first adhesive film to form the first series of labels. In accordance with another aspect, the labels of the first series of labels are superposed and disposed within corresponding peripheries of the second series of labels.

Abstract: There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.

Abstract: A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Abstract: An adhesive roller for detritus removal having a tubular cylindrical adhesive roll formed by a plurality of overlapping spiral wound layers. Each layer has a backing substrate and an adhesive coating on an outwardly facing side of the sheet. A cover is removably disposed around and has an inner side in contact with the outermost layer of the adhesive roll. The cover has an adhesive release coating on its inner side to reduce adhesion between the cover and the outermost layer of the adhesive roll and two longitudinally extending edges positioned closely adjacent each other when the cover is disposed around the roll. The cover is formed by overlapping spiral wound strips. Additionally, a longitudinally extending adhesive retainer strip overlies the edges of the cover to detachably secure the covers together. A pull-tab is adhesively attached to one side of the retainer strip which enables the cover to be repeatedly removed from and reattached to the adhesive roll.

Abstract: A process for dispensing pressure-sensitive adhesive laminates (3) or laminate sections from a movable primary (1) onto a movable secondary carrier band (2), the laminates (3), upon deflection of the primary band (1) around a dispenser edge (4), being detached and dispensed onto the secondary band (2), is characterized in that the primary band (1) is provided with at least one separation line or predetermined breaking line, thus subdividing it into at least two strips (5, 5?), and that the strips are individually drawn from separate sections (4?, 4?) of the dispenser edge (4).

Abstract: A card and business form assembly and method for making same. The assembly includes a printable carrier sheet having a card that is releasably attached to the sheet by a backer.

Abstract: A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in the dielectric film (14) and the substrate (12), and filling channels (16 and 18) with a filler material (20). Further, a release layer (22) is applied to dielectric film layer (14) and filler material (20), the release layer (22) having an adhesive thereon. Release layer (22) is peeled or otherwise removed from substrate (12), leaving filler material (20) formed and shaped on substrate (12), thus producing a high resolution electronic circuit on substrate (12).

Abstract: Methods of applying tape to a surface. An embodiment of the invention provides a method of applying a tape to a surface, comprising the steps of: providing a tape, wherein the tape includes a tape backing and an adhesive on the tape backing, and wherein the tape is on a liner; cutting the tape to provide a first length of tape, a second length of tape, and a removable portion of the tape located between the first length of tape and the second length of tape wherein a portion of the first end of the removable portion is cut at an angle oblique to the length of the tape; removing the removable portion of the tape from the liner; separating the first length of tape from the liner; and applying the first length of tape to a surface.

Abstract: Polymeric multilayer optical films, and laminate bodies that include such films, are cut or subdivided into one or more discrete pieces by removably applying a first and second liner to opposed major surfaces of the multilayer optical film. Laser radiation is then directed at the multilayer optical film through the first liner in such a way as to produce cut lines that define a plurality of pieces of the first liner and of the multilayer optical film. Thereafter, the plurality of pieces of the first liner are removed from the plurality of pieces of the multilayer optical film while the pieces of multilayer optical film are supported by the second liner. Application of the first liner to the multilayer optical film can be accomplished with electrostatics.

Abstract: A form that incorporates either a label or card such that the form can be reliably printed on by the end user and manufactured less expensively. The integrated label form includes a top printable substrate and a liner substrate mated together by an adhesive. The top printable substrate serves at least partially as removable portions capable of being reapplied. Weakened lines of substrate may be provided to define removable portions on the top printable substrate. The form also may include a similar printable substrate mated to the other side of the liner by adhesive. Weakened lines of substrate also may formed in the second substrate to define removable portions. The integrated card form includes a printable substrate and a first and second laminate mated to the substrate and together by an adhesive. Weakened lines of substrate and first laminate define an integrated removable portion capable of being held in the form by the second laminate and easily removed manually when desired.

Abstract: A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet 1. The adhesive agent layer 3 and a substrate are then aligned and the semiconductor wafer and the substrate are adhered via the adhesive agent layer 3 to avoid defects caused by fluidity of an under filling material.

Abstract: A method and material for covering exposed insulation surfaces to protect them from moisture and other environmental factors. The covering typically includes a first, exposed layer of a metal-containing foil, a second layer of a metal-containing foil, a layer of a polymer disposed between the first two layers of foil, a third layer of a metal-containing foil, and a second layer of polymer disposed between the second and third layers of foil. A layer of a pressure sensitive adhesive is applied to one of the exposed layers of foil, and the pressure sensitive adhesive layer is covered with a release liner prior to application. The foil provides the necessary moisture and weather seal while the polymer provides the necessary strength and puncture resistance. The overall thickness of the laminate typically is less than 100 microns, permitting it to be easily cut and manipulated at the job site while providing an effective, long lasting weather seal.

Abstract: A manufacturing process in which a plurality of fluid jetting apparatuses are formed includes forming and sequentially adhering a heat driving part, a membrane and a nozzle part, respectively. The fluid jetting apparatuses are completed as a wafer unit by forming the nozzle part by forming a nozzle plate on a substrate of a wafer by a spinning process; forming jetting fluid barriers on the nozzle plate by the spinning process; forming jetting fluid chambers in the jetting fluid barriers; forming nozzles in the nozzle plate; and separating the substrate from the nozzle plate after the nozzle part and the membrane are adhered to each other. The forming jetting fluid chambers is accomplished by a process of wet etching, and the forming nozzles is accomplished by a treating apparatus of a laser beam or by a process of reactive ion etching.

Abstract: A low density polyethylene film layer is extrusion coated on densified bleached kraft paper liner to form a film-coated liner sheet. A facestock sheet is adhered with a layer of hot melt adhesive to the film layer to form a laminate sheet web, which is rolled on a roll. The facestock sheet, the film layer and the adhesive layer together define a laminate feedstock. The roll is transported to and loaded on a press with the liner side up. One (or both) edge(s) of the web is (are) crushed with a calendering die to form thin lead-in edge(s). The web is die cut on the bottom face, up through the laminate facestock, but not through the paper liner, to form the perimeters of a grid of blank business cards or other printable media, with a waste paper frame of the laminate facestock encircling the grid. The web is then die cut from the top through the paper liner and to but not through the laminate facestock, to form liner strips covering the back face of the laminate facestock.

Abstract: Improved label printing and applying apparatus (10) is provided which includes an improved digital printing assembly (12) having a rotatable impression drum (18) presenting an outer surface (20), as well as at least one digital print head (22) adjacent the drum outer surface. The overall apparatus (10) also includes a downstream label cutting and application assembly (14) having an adhesive applicator (32), laser cutter (40) and a label applying device. In use, a web (16) traverses the drum (18) with essentially no relative movement between the web (16) and drum surface (20), and the print head(s) (22) are actuated to form images on the web (16), which may be identical or varied. Thereafter, the printed web passes into and through the assembly (14) where adhesive is applied, the individual images are laser cut, and the labels are thereupon applied to products (54).

Abstract: Improved web printing and handling apparatus (10, 84, 88) is provided which includes an improved digital printing assembly (12) having a bidrectionally rotatable impression drum (18) presenting an outer surface (20), as well as at least one digital print head (22) adjacent the drum outer surface. The overall apparatus (10, 84, 88) also has a downstream web cutting and handling assembly (14) with an adhesive applicator (32), laser cutter (40) and image collection assembly (44). In use, a web (16) traverses the drum (18) with essentially no relative movement between the web (16) and drum surface (20), and the print head(s) (22) are actuated to form individual images on the web (16). Thereafter, the printed web passes into and through the assembly (14) where adhesive is applied and the individual images are laser cut and collected using assembly (44).

Abstract: A tape applicator. A preferred embodiment of the invention provides a tape applicator having a tape head, a x-axis actuator for moving the tape head in the x-axis direction, and a y-axis actuator for moving the tape head in the y-axis direction. The tape head preferably includes: i) a base; ii) a tape roll holder attached to the base; iii) a tape application roller attached to the base for applying the tape to a surface; iv) a cutter attached to the base for cutting tape to form a removeable portion of a tape; and v) a remover attached to the base for removing the removeable portion of the tape. The present invention also relates to methods of applying tape to a surface.

Abstract: Ultraremovable adhesive is applied to a paper sheet to form therewith a liner sheet and the liner sheet is laminated to a cardstock sheet to form a laminate cardstock. The cardstock sheet is then die cut therethrough, but not through the liner sheet, to form cardstock cut lines that define at least in part perimeters of business cards (or other printable media). The outer face of the liner sheet is then die cut therethrough, but not through the cardstock sheet, to form liner sheet strips on a back side of the cardstock sheet. Some of the strips define cover strips covering some of the cardstock cut lines, and others of the strips define waste strips. The waste strips are then matrix removed from the back of the cardstock sheet. The resulting business card sheet construction is then fed through a printer or copier by the user and the desired indicia printed on the front sides of the business cards, while the cover strips hold the cards together as a unit sheet construction.

Abstract: A label product such as a coupon is adhered to a release liner using a temporary adhesive. A layer of pressure sensitive laminate film, preferably transparent, is applied over the coupon, extending beyond the outer edges of the coupon so that the laminate is also adhered to the release liner. When the release liner is removed, the laminate can be applied directly to a product, without the base label common in conventional label products.

Abstract: An apparatus and method to fabricate a photosensitive drum for an image forming apparatus. The apparatus includes a photosensitive belt supply roll and a double-sided tape supply roll; a bonding unit to bond a photosensitive belt and a double-sided tape together; a cutting unit to cut the bonded photosensitive belt and double-sided tape at a predetermined length from a double-sided tape cover; a rotating unit to rotate the cut photosensitive belt and double-sided tape around a rotary drum having a predetermined size; and a winding unit to wind the double-sided tape cover which is separated from the photosensitive belt and the double-sided tape. An inexpensive photosensitive belt is wound on a large-sized rotary drum by applying tension. Thus, it is possible to mass-produce the photosensitive drum at a low cost.

Abstract: A method and apparatus for improved cutting of an object is provided. The object can take the form of many different structures including thin formations that require cutting precision, support, and dimensional control. In accordance with one example embodiment of the present invention, the method of cutting a member uses a laser and begins with the step of providing a template removably adhered to the member. The laser then projects through the template, without intersecting with the template, to cut the member and manufacture the desired formation. The laser does not intersect with, and therefore does not cut, the template structure and cause excess laser cutting dust.

Abstract: Method and apparatus for removing at least one waste area of a face layer, which includes graphic or product area(s) and waste area(s), from a laminate composed of a face layer removably adhering to a backing layer, to leave at least one product area of the face layer in place on the backing layer, the method including: applying adhesive on portions of the waste area(s); temporarily adhering the laminate to a carrier surface using the adhesive; and separating the laminate from the carrier surface with the waste area(s) remaining on the carrier surface. One preferred embodiment of the invention includes a carrier web enabling continuous or near continuous operation.

Abstract: A waste peeling apparatus for separating the waste part of a continuous web material where a peeling member is positioned skewed to the direction of travel of the web.

Abstract: The process for making a picture frame having printed border artwork on a transparent front panel with irregular outer and inner edges and having an attached rear panel having a picture frame folding stand therein. The process includes the printing of border art on a sheet of a material having a covered pressure sensitive adhesive backing and attaching it to the front panel. The front panel is then laser cut along the computer marked cut path to cut along the outside and inside edges of the printed border artwork while cutting a window therein. The cutout window is removed and a thin transparent polymer sheet is attached thereover. A picture frame back is cut with a foldout stand and is attached to the front panel to form the picture frame.

Abstract: Provided is a protection film bonding method and a protection film bonding apparatus that improves productivity for bonding the protection film onto one surface of a silicon wafer. A carrier film is separated from a three-layer film having a reinforcement film, and is provided on front and rear surfaces of a protection film, to provide a two-layer film. This two-layer film is bonded onto the front surface of the silicon wafer, the reinforcement film is removed from the two-layer film and the protection film is trimmed. An apparatus consists of a supply unit, separation and take-up unit that separates the carrier film from the three-layer film, an assigning and separation unit, a joint unit that joins the two-layer film onto the silicon wafer, and a peel-off unit, that removes the reinforcement film while separating it from the two-layer film.

Abstract: A window decal form is suitable for laser printing and enables ready installation of a decal to the inside of a vehicle window or the like. The window decal form construction includes a liner sheet having a front side and a back side. An adhesive release coating is disposed on the back side of the liner sheet framing a decal area. The decal area and the adhesive release coating define a label area. The label is affixed to the back side of the liner sheet covering the label area via a permanent adhesive. The decal area on the front side of the liner sheet is die cut such that the decal area is removed when the label is peeled from the back side of the liner sheet.

Abstract: The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body.

Abstract: The present invention provides an adhesive tape for laminating a first substrate to a second substrate, wherein the adhesive tape includes a carrier having on a first major surface a first adhesive layer and having on a second major surface opposite to the first major surface in the order given a non-tacky polymer layer and a second adhesive layer, wherein the adhesive tape is capable of being adhered to the first substrate by the first adhesive layer and to the second substrate by the second adhesive layer. The adhesive tape is capable of delamination between the carrier and the non-tacky polymer layer when the first and second substrate are peeled away from each other so as to leave the carrier on the first substrate and the non-tacky polymer layer on the second substrate with a major surface of the non-tacky polymer layer or the carrier. The non-tacky polymer layer and carrier are not co-extruded layers.

Abstract: A device for laminating labels disposed upon a continuous strip of liner. The device includes a plurality of spindle structures for supplying a continuous strip of protective film and the continuous strip of liner to a laminating structure, which adheres the continuous strip of protective film to the continuous strip of liner over the labels disposed thereon to form a single continuous strip of laminated liner. The laminating structure has a drive wheel with a plurality of teeth arranged upon the surface of the drive wheel so as to engage a plurality of tractor feed holes formed into the continuous strip of the laminated liner. The drive wheel rotates to bring the continuous strip of laminated liner into contact with a plurality of laminate cutting blades that rotate in registration with the drive wheel so as to cut the protective film in registration with the labels disposed upon the strip of liner.

Abstract: A lamination method, which is a method in which a dry resist film, formed by providing a color resist layer on a base film, is cut based upon the length of a substrate in the feeding direction, and press-bonded onto the substrate, and then the color resist layer is transferred onto the substrate by separating the base film, is provided with the following steps: in the cutting process, cutting the film so that the rear end of the dry resist film, after the press-bonding, extrudes from the rear end of the substrate by a predetermined width; and cutting the dry resist film again at a position inside the rear end of the substrate prior to separating the base film after the dry resist film has been press-bonded so as to eliminate the portion of the dry resist film extruding from the substrate.

Abstract: A die bonding sheet sticking apparatus and a method of sticking a die bonding sheet which, in the production of small electronic components, for example, semiconductor chips, effect sticking to a back surface of wafer a die bonding sheet capable of functioning not only as a protective tape at the time of dicing but also as an adhesive for die bonding at the time of die bonding of semiconductor chips after dicing onto a lead frame.

Abstract: A friction lining for use in the clutch plate of a friction clutch or a multiple wrap brake band for use in an automatic transmission is obtained by adhesively securing one side of a friction generating second layer to one side of a metallic first layer. The necessary incisions in the form of cuts, slots or slits are made from the exposed side of the second layer in a direction toward the exposed side of the first layer by resorting to one or more high-energy streams, such as laser beams, electron beams or liquid jets. Each incision can be made in one or more stages by a single stream or by a series of successively applied streams.