Abstract: A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on the tape base material to form a sticking tape. The apparatus further includes a peeling device for peeling the sticking tape from the release liner, and a sticking device for sticking the sticking tape to a workpiece. A collecting device collects the raw sheet after being peeled off the sticking tape by the peeling device.

Abstract: A method for manufacturing a polarizer utilizes a support, which is coated with a photoresist. A carbon nanotube film is located over the photoresist, and one portion of the carbon nanotube film is submerged in the photoresist. Metal or semi-metallic particles are deposited over the carbon nanotube film and the photoresist, which is removed. The carbon nanotube film with the metal particles or semi-metallic particles is adhered to a substrate to obtain the polarizer.

Abstract: An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof. The separated semiconductor wafer and support board are collected independently.

Abstract: A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.

Abstract: A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material (4) is run, a bonding agent layer (5) is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer (6) is laminated on the surface of the bonding agent layer (5) for heating and bonding; a punching process during which the conductive layer (6) is punched in the above-described pattern on the base material (4); and a separating process during which an unnecessary portion (6b) of the conductive layer (6) is separated from the base material (4). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.

Abstract: A method of forming a temporary carrier structure is disclosed which includes forming a plurality of recesses in a carrier structure, the recesses extending to a depth that is less than a thickness of the carrier structure, forming a dissolvable material in the recesses and above a first surface of the carrier structure, securing a thin substrate above the first surface of the carrier structure using the dissolvable material to secure the thin substrate in place, performing at least one process operation on a second surface of the carrier structure to expose the dissolvable material in the recesses and contacting the exposed dissolvable material with a release agent so as to dissolve at least a portion of the dissolvable material.

Abstract: A method and device for manufacturing of electrical components on a continuous web or discrete sheets of dielectric material are disclosed. The method includes feeding, from a supply roll of a laminated web or a supply of sheets including at least one unbroken layer of conducting material laminated on a flexible backing layer of dielectrical material, the laminated web or discrete sheets to a nip between a patterned cylinder and a cooperating cylinder, to shape the conducting layer into a repeated pattern of conducting material having ridges and valleys. The method further includes removing, by mechanical machining, conducting material from the thus shaped conducting layer. The removing is performed simultaneously with the step to shape the conducting layer, and by way of the cooperating cylinder, designed as a milling cutter cylinder.

Abstract: A tape separation mechanism suction-holds a chip into which a substrate is diced that is adhesively held on a mount frame via a protective tape, and moves to place the chip in a mounting position of the substrate on a substrate holding stage. A heater heats via a head the protective tape joined to a surface of the chip at the mounting position that loses its adhesive force due to foam and expansion through heating. Thereafter, the tape separation mechanism moves upward while suction-holding the protective tape, thereby separating and removing the protective tape from the chip.

Abstract: A vehicle is wrapped by a printed adhesive film where the film is also applied over doors and other areas intended not to be covered. The film is cut at the door edge and over the area by adhesively attaching a tape having a release coating on the front surface and carrying a filament along a center of the front side. The printed film is applied over the door, the area not to be covered and the tapes and is cut along the door edge and around the area by pulling the filament from the tape so that a strip of the film at the door edge and the film over the area can be removed. The film can be stretched and pulled away from the tape for reapplying for proper fit.

Abstract: Each printed sheet product includes a core of flexible, microvoided polymer sheet material and a planar RFID assembly encoded with a unique electro/magnetic code permanently and integrally joined together with the core. The microvoided sheet material collapses around the core so the sheet product remains planar. Scoring defines one or more individual identification elements removable from a remainder of the sheet product that include at least a first element with RFID assembly but only part of the core. A separate magnetic strip storing its own unique data magnetically can be provided on the first removable element even at least partially overlying the RFID assembly for independent identification operation.

Abstract: The present invention relates to external devices for dilating nasal passageways and to the manufacture thereof. More specifically, the external nasal dilator of the present invention usually comprises a resilient sheet, an adhesive layer, and an adhesive-protecting sheet. In some embodiments of the external nasal dilator, the resilient sheet defines a groove for reducing the peel force that results from bending the dilator over the bridge of the nose. In addition to the groove or in lieu thereof, some embodiments of the external nasal dilator comprise a nasal passage region having a reduced width to reduce the peel force. Finally, the dilator can comprise a sheet of adhesive tape, which in some embodiments can provide an instant tack surface to facilitate application of the dilator.

Abstract: A multi-use labeling support structure having a support structure that includes an embossed resin film made without using a coated release substance (e.g., release coatings such as silicone coatings, added waxes or release agents). The embossed resin film thereof has a sufficiently high Ra factor and reduced contact surface area so that it will allow release of an adhesive affixed element without leaving any substantial adhesive residue on the embossed surface when removed.

Abstract: A source roll having a first layer of liner paper and a second roll of two-sided adhesive is fed through a pair of rollers having six aligned rotary die cutters sized to cut through only the adhesive layer. The excess adhesive web is peeling off and removed from the process. The liner paper with spaced apart sets of six aligned adhesive dots is then laminated with a clear plastic having two sides, one uncoated and one coated, to allow the clear plastic to be easily rolled up and then unrolled, and the liner paper is peeled off and removed from the process. The material remaining having the adhesive circular dots is cut into six long strips each having six adhesive dots which can be used to display small discrete packages.

Abstract: A multi-ply, expanded content wrap label includes a base ply and an upper ply thereon with adhesive applied to the underside of a trailing end of the base ply to form a splice between the base ply and the upper side of the upper ply when the label is applied to a container.

Abstract: The present invention provides a method for manufacturing a cake decorating accessory and the decorating accessory, which is used in producing a more dramatic and attractive atmosphere at a celebratory event by displaying a congratulatory message using heat. The method includes a step (S100) of preparing a base paper (77), a step (S200) of preparing a thermo-chromatic film (80), a step (S300) of writing or drawing a desired letter or picture for congratulatory messages on the base paper (77); a step (S400) of attaching the base paper (77), and a step (S500) of attaching the thermo-chromatic film (80) over the base paper (77). The base paper (77) has a raw paper layer (76) and a first bonding agent layer (72). The thermo-chromatic film (80) has a second bonding agent layer (82), a transparent synthetic resin film layer (84) and an oil-based microcapsule ink layer (86).

Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.

Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.

Abstract: An optical display unit manufacturing method includes subjecting a sheet material having curling properties to half cutting and bonding the cut piece of the sheet material to a substrate with an adhesive interposed therebetween, while peeling off the member left uncut and can solve the problem of peeling of the cut piece of the sheet material during feeding after the half cutting in such a process, so that the cut piece of the sheet material can be bonded to the substrate in a satisfactory manner.

Abstract: A method of producing a laminated label structure that includes a region that is markable after assembly of the label structure is disclosed. The method comprises providing a strip of base material having a front face, applying a release material to a markable region of the front face for being marked after assembly of the label structure, and cutting the base material to form a first portion of a perimeter of the label structure. The method further comprises positioning a laminate material over a portion of the front face including the markable region, cutting the base material and the laminate material to form a second portion of the perimeter, cutting the laminate material substantially along a margin of the markable region without severing the base material; and peeling away from the base material a portion of the laminate material overlying the markable region of the front face.

Abstract: A manufacturing system of an optical display device in which the following can be attained in the case of bonding optical members to optical display units, respectively: an optical member to be excluded, which is, for example, an optical member judged as a defective member, can be appropriately excluded so that the optical member is not bonded onto any optical display unit and a manufacturing method of an optical display device.

Abstract: A web (36) of paper or the like has labels (42) defined therein by printing the web (36) followed by skip cutting (40) the web to define the label boundaries. The skip cutting (40) leaves the labels (42) connected to the remainder of the web (36) by breakable catch points (44). The labels (42) are rendered capable of being applied to product containers (16) by the web (36) having adhesive applied to the side opposite the printing, and the web (36) is rendered capable of being wound up by having an adhesive release coating, such as silicone, applied over the printing.

Abstract: In one embodiment, an apparatus is provided for preparing a cassette spool. The apparatus includes: a supply reel for supplying and unrolling tape material on original backing paper; at least one cutting member for cutting unrolled tape material while on original backing paper; a cutting surface defined in a plane; a pivoting path member adapted to move from a first position aligned in the plane to a second position aligned at least partially out of the plane; at least one removing member for removing uncut unrolled tape material from original backing paper; and a cassette spool for rolling up unrolled cut tape material on original backing paper. In further embodiments, methods are provided for preparing a cassette spool with cut tape material on original backing paper.

Abstract: Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.

Abstract: Printed circuit boards that include optical interconnects include a flexible optical waveguide embedded or locally attached to the board having at least one end mechanically decoupled from the board during fabrication that can be fitted with a mechanical connector. Also disclosed are processes for fabricating the circuit board.

Abstract: A transdermal reservoir patch includes a first adhesive layer, a second adhesive layer and an occlusive backing layer configured to inhibit transport of a pharmaceutical agent from the first adhesive layer to the second adhesive layer. Methods of manufacturing the transdermal reservoir patch are disclosed.

Abstract: A laminating apparatus and a laminating method for finely finishing laminate processing without performing edge processing after the laminate processing is performed to a recording medium. A laminate material having a size larger than that of the recording medium is placed to cover the recording medium, bonded with heat and pressure, and a laminate layer protruding from the recording medium is transferred to a means to be transferred to, which is arranged on an opposite plane side to a recording plane of the recording medium. When the means to be transferred to is arranged apart on the opposite plane side to the recording medium, the laminate layer is pulled into the opposite plane side to the recording medium. As a result, an edge of the laminate layer formed on the recording plane of the recording medium becomes fine, matching with an edge of the recording medium.

Abstract: Methods for fabricating analyte sensor components using IC- or MEMs-based fabrication techniques and sensors prepared therefrom. Fabrication of the analyte sensor component comprises providing an inorganic substrate having deposited thereon a release layer, a first flexible dielectric layer and a second flexible dielectric layer insulating there between electrodes, contact pads and traces connecting the electrodes and the contact pads of a plurality of sensors. Openings are provided in one of the dielectric layers over one or more of the electrodes to receive an analyte sensing membrane for the detection of an analyte of interest and for electrical connection with external electronics. The plurality of fabricated sensor components are lifted off the inorganic substrate.

Abstract: An insulating label comprising at least a layer a) of shrinkable and/or stretchable material and a further layer b) of insulating material; the layer a) exceeding at least one of the edges (4) of the layer b) in a longitudinal direction of the label (1), characterized in that the layers are mutually bound prior to application of the label (1) on a container.

Abstract: In one embodiment of the disclosure, an apparatus is provided for preparing a cassette spool. The apparatus includes: a supply reel for supplying and unrolling tape material on original backing paper; at least one cutting member for cutting unrolled tape material while on original backing paper; at least one removing member for removing uncut unrolled tape material from original backing paper; an identification member for identifying on unrolled original backing paper a start of unrolled cut tape material; and a cassette spool for rolling up unrolled cut tape material on original backing paper. In further embodiments, methods are provided for preparing a cassette spool with cut tape material on original backing paper.

Abstract: Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

Abstract: A display assembly comprises a backplane assembly comprising a plurality of spaced backplane areas, each backplane area comprising a plurality of electrodes, the backplane areas being separated by gutter areas free from electrodes; an adhesive layer overlying the plurality of spaced backplane areas; and a layer of a solid electro-optic medium overlying the adhesive layer in the plurality of spaced backplane areas. The display sub-assembly can be produced via a single lamination and severed to form a plurality of separate electro-optic displays. Processes for producing the display assembly are also described.

Abstract: A label sheet label sheet includes a transparent film support material, a pressure-sensitive adhesive layer, a release layer, a printable layer, one or more first detachment lines, and one or more second detachment lines. The transparent film support material has an inner surface and an outer surface. The pressure-sensitive adhesive layer is disposed over the transparent film support material inner surface. The release layer is disposed over the pressure-sensitive adhesive layer. The printable layer is disposed over the pressure-sensitive adhesive layer, and includes an inner surface facing the release layer and an opposing outer surface. The outer surface exhibits a roughness of 4 to 50 ?m (DIN 4768). The one or more first detachment lines extend from the printable layer outer surface and through the printable layer and the release layer, to thereby form a first sub-region.

Abstract: The invention relates to a method for applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this case, the adhesive layer, with the aid of an adhesive film which is entirely composed of precurable adhesive, is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is finally used further in the semiconductor device into which the thinned semiconductor chip is to be incorporated.

Abstract: A continuous manufacturing system is provided for producing an intermediate web assembly having a series of regularly occurring preprinted segments that are disposed on a surface of the web. The segments are initially produced in a sheet form which is prepared by rendering high quality images in discrete areas representative of the portions to be subsequently separated to form the segments. The individual segments are cut from the sheet and then are provided to a placer mechanism that sequentially places the segments individually on the web to create an intermittently laminated web assembly.

Abstract: An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.

Abstract: A cutting method and a cutting apparatus are provided which are capable of cutting a film without causing the cracking of a hard thin film or the deformation and/or property change of the layer beneath the hard thin film. The cutting apparatus includes: a conveying device that conveys a layered film including a base material and an inorganic film being a surface layer harder than the base material; a laminating section that attaches a laminate film to a predetermined cutting position of the inorganic film of the traveling layered film; a cutting section that cuts the layered film to which the laminate film is attached along the predetermined cutting position from the side opposite to the laminate film together with the laminate film; and a detaching section that detaches the laminate film after the cutting from the layered film.

Abstract: A device and a method for bonding a tape, by which a tape member may be preferably bonded to a work piece, and simplified processing, reduced cost, and improved bonding strength may be realized.

Abstract: An auxiliary substrate 20 is overlapped onto a thin substrate 11, and substrate 11 and auxiliary substrate 20 are covered with an organic film 12. Thereafter, a scintillator 13 is formed on a scintillator forming portion 12A of organic film 12 that corresponds to substrate 11. Here, since thickness is added to substrate 11 by auxiliary substrate 20, the warping of substrate 11 is prevented and scintillator 13 is formed uniformly.

Abstract: A lamination system comprises a lamina supply to supply a first web comprising lamina sheets or patches, a substrate supply to supply a second web having defined substrates to be laminated, and a separation station where lamina sheets or patches from the first web are laminated to the defined substrates. The substrate is preferably a card, such as an identification card, a credit card, or other CR80 size card. The sheets or patches are approximately the same size as the substrates, and the sheets or patches are subjected to heat and/or pressure to cause them to bond to the substrates.

Abstract: A tape bonding device for bonding a tape member to a work piece: having a rubber sheet on the upper surface of which the work piece is mounted, a first vacuum chamber located on the side of the upper surface of the rubber sheet, a second vacuum chamber located on the side of the lower surface of the rubber sheet, a holding member which holds the rubber sheet without coming and going of the air between a first and a second vacuum chambers and, a tape holding unit which holds the tape member in a stretched state, and locates the tape member in the upper portion of the work piece, a first sucking unit which performs vacuum suction of a first vacuum chamber, a first air introducing unit which introduces the air into the first vacuum chamber, a second sucking unit which performs vacuum suction of a second vacuum chamber, a second air introducing unit which introduces the air into the second vacuum chamber.

Abstract: A method for making a microstructure includes: providing a film (100) on a release liner (110); feeding the film through a cutting plotter (10); cutting the film with a knife blade (34) of the cutting plotter to form a microstructure pattern; peeling the microstructure pattern from the release liner; and transferring the microstructure pattern to a substrate (170). The cutting plotter for making microstructures includes a knife head with a knife blade disposed adjacent a feed mechanism (20), a motor (42) and control system coupled to the knife head for selectively moving the knife head in relation to the film, and the control system and the knife head having an addressable positioning resolution less than approximately 10 ?m.

Abstract: Parallel-aligned core layers are formed by patterning a core sheet laminated on a base plate, and a clad/core bonded body is formed by laminating a cladding sheet. The base plate is peeled from one surface of the clad/core bonded body and a dicing tape is pasted on the other surface of the clad/core bonded body. An inclined surface is formed by bevel-cutting both end portions of the core layers. Clad/core bonded pieces are formed by straight-cutting the cladding sheet between core layers and on an outside of outermost core layers. A mask is disposed on the clad/core bonded pieces, and then a metal film is formed on the inclined surface. The clad/core bonded pieces are separated individually by peeling the pieces from the dicing tape after the mask is removed. The clad/core bonded piece is brought into contact with the liquid adhesive coated on a circuit substrate and aligned thereon. Then, the liquid adhesive is cured.

Abstract: A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process S2, two sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process S3, the protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.

Abstract: A form that incorporates either a label or card such that the form can be reliably printed on by the end user and manufactured less expensively. The integrated label form includes a top printable substrate and a liner substrate mated together by an adhesive. The top printable substrate serves at least partially as removable portions capable of being reapplied. Weakened lines of substrate may be provided to define removable portions on the top printable substrate. The form also may include a similar printable substrate mated to the other side of the liner by adhesive. Weakened lines of substrate also may formed in the second substrate to define removable portions. The integrated card form includes a printable substrate and a first and second laminate mated to the substrate and together by an adhesive. Weakened lines of substrate and first laminate define an integrated removable portion capable of being held in the form by the second laminate and easily removed manually when desired.

Abstract: An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip chips. The UV curable tape has an adhesive strength. The strip of flip chip arrays is molded with a mold film. The molded strip of flip chip array is irradiated using UV radiation. In another embodiment, a double functional tape is mounted to backside of a wafer. The double functional tape includes a binding tape and a ultraviolet (UV) curable tape having an adhesive strength. The wafer is singulated into die. The die is attached to a substrate strip to form a strip of array of flip chips. The strip is molded with a mold film. The molded strip is irradiated using UV radiation.

Abstract: In the present invention, a sheet is disposed inside a material that is the target for forming a recess, the sheet having a first physical property that is different from a physical property of the material and having a planar shape identical to the planar shape of a recess to be formed. Then, the material is cut in a depth direction from a first surface of the material using a cutting tool. At this time, a physical property of a deepest part of the cut portion is detected using a detector, and cutting in the depth direction is terminated when the property is equal to the first physical property. The material is cut also in a horizontal direction that is substantially parallel to the first surface to form a groove, thereby dividing the first surface into a first region having a shape identical to the planar shape, and a into second region that is the other region. Lastly, the material between the sheet and the first surface in the first region is peeled off.

Abstract: The invention relates to a panel (1), preferably floor panel comprising a decorative layer (4) with a decorative pattern a support layer (3) for supporting the decorative layer and a carrier (2) for supporting the support layer (3) and the decorative layer (4) wherein the support layer (3) is arranged at least partially between the decorative layer (4) and the carrier (2) wherein the decorative layer (4) is at least partially absent, preferably removed, such that the support layer (3) is visible.

Abstract: The invention relates to a method and a device (12, 13) for producing a multi-layered three-dimensional component (14). In a first step, a layered geometrical structure is formed, said structure consisting of at least two webs (16) of an at least high temperatures-resistant material. In a second step, an at least partly material connection is produced between the individual webs of the entire layered structure by means of at least one thermal treatment.

Abstract: Printed articles are disclosed, where the article includes a transparent film, the film comprising a first side coated with a pressure-sensitive acrylate adhesive; and a second side printed with an image. The printed image can be produced with a digital or flexographic printed. Also disclosed are systems and methods for producing printed articles.

Abstract: A method of forming printable media using a laminate sheet construction which includes a film-coated liner sheet and a laminate facestock. A facestock sheet, a film layer and an adhesive layer together form the laminate facestock. The laminate facestock is cut through to the liner sheet to form facestock cut lines defining at least in part perimeters of printable media, such as rectangular business cards. An outer face of the liner sheet is cut through to form liner-sheet cut lines defining a plurality of liner sheet strips on a back side of the laminate facestock. The laminate sheet construction is sheeted into a plurality of sheets, each of the sheets includes a plurality of the printable media and at least one of the liner sheet strips. The sheets are fed through a printer or copier, desired indicia is printed on the media and the printed media then separated from the liner sheet strips of the sheet.