Abstract: A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained.

Abstract: A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components.

Abstract: A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.

Abstract: An optical scanner manufacturing method includes overlapping a first substrate including a base portion region that becomes a base portion, a shaft portion region that becomes a shaft portion, and a support portion region that becomes a support portion, and a second substrate in which a frame-like concave portion, a first portion that is positioned inside the concave portion, and a frame-like second portion that is positioned outside the concave portion and has a light reflectance reduction function are formed on one surface, to bond the base portion region to the first portion and to bond the support portion region to the second portion, patterning the first substrate to form the base portion, the shaft portion, and the support portion, and cutting the second substrate from the other surface side to separate the first portion and the second portion from each other.

Abstract: A synthetic grass tile system and method are disclosed. An artificial turf tile system has a plurality of connectable tile members and a synthetic turf arrangement adhered to the tile members. The interconnected tile members, having the turf attached thereto, are cut into sections. The sections are then secured on a pallet for sale at a retail establishment. A method for producing a modular synthetic grass tile system follows the following steps: (a) providing a plurality of tile members; (b) snapping the tile members together at their edges to form a grid; and (c) adhering a sheet of synthetic turf to the top surface of the tile members.

Abstract: A device for applying at spaced positions (P1, X) over a moving web of material (S) superposed strips of a first (A) and a second (B) includes a first (10, 12) and a second (20, 22) cutting unit arranged cascading with respect to each other. Each unit includes a rotary knife (10, 20) that can be fed with the respective material (A, B) and an anvil roll (12, 22) which cooperates with the respective knife (10, 20) to cut the abovementioned strips of material (A, B). The anvil rolls (12, 22) of the two units are arranged facing each other, movable of concordant motions with respect to each other and configured in such a manner to transfer the strips of the first material (A) from the first anvil roll (12) over the second anvil roll (22) superimposing them to the strips of the second material (B). The second anvil roll (22) then provides for passing over the moving web of material (S) the strips of the first (A) and second material (B) superimposed to each other.

Abstract: A flexible pouch is having a lenticular image is provided. The lenticular image may be used to add depth or an animated effect to the aesthetic design of the flexible pouch. The lenticular layer is incorporated into the laminate of the flexible pouch. A lenticular patch is also applied to a surface of the flexible pouch. The lenticular image may be visible about the sealed portions of the flexible pouch. Since the appearance of the lenticular image will be distorted if the lenticular lens is bent or stretched, the lenticular image may be used as a stress indicator to signify portions of the flexible pouch that have been structurally compromised.

Abstract: A ribbed balsa sheet including a plurality of end-grain balsa strips arranged side-by-side to define a sheet plane, with the balsa grain oriented perpendicular to the sheet plane, and a number of reinforced resin ribs, each one of the reinforced resin ribs being arranged between an adjacent pair of the balsa strips to bond together and space apart the balsa strips.

Abstract: An elongate continuous material web is disclosed that includes a plurality of adjacent tabs arranged in a longitudinal direction of the web with connection regions between adjacent tabs. Each connection region includes three or more incisions that extend in the transverse direction of the web and are arranged in a manner such that at least one extensible connection member, extensible in the longitudinal direction of the web, is formed. At least one incision forms a side incision that travels through one longitudinal edge of the web, and at least one incision forms a further side incision that travels through the other longitudinal edge of the web. Also disclosed are a method for making such a web, a method for manufacturing a tab from such a web, a method for manufacturing an absorbent hygiene product with the help of such a web, and a cutting device to produce such a web.

Abstract: A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.

Abstract: The present disclosure relates generally to flexible laminated construction toy set and method of manufacture thereof, and more particularly to a construction set made of pieces with a bendable metal layer enclosed by two layers of a plastic mat. Two flexible think plastic mats with potentially a surface printed design are sealed around an internally deformable metal insert. Sets are sold using multiple geometry elements each having a different purpose, a different design to enhance playability.

Abstract: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.

Abstract: A process where there is deposited on a supporting substrate at least one first polymer layer and optionally at least one second polymer layer followed by treating the resulting formed layers or laminate with a laser.

Abstract: A repulpable moisture resistant poultry box having a composite structure with a fluted medium, a top backing board secured to one side of the fluted medium and a bottom backing board secured to the other side of the fluted medium. The backing boards and the fluted medium are impregnated with a hydrogenated triglyceride. The backing boards each have an outer surface coated with an emulsion of hydrogenated triglyceride and styrene acrylic to provide moisture resistance repulpable and recyclable box.

Abstract: A system and method to make stacked connector members for readily joining adjacent ends of sections of insulation tubing. Each of the stacked connector members includes a carrier member having a central opening. A layer of double-sided adhesive material is coated on each side of the carrier member, such that one side of the layer of double-sided adhesive material is able to bond to an end face of one section of insulation tubing, and the other side of the layer of double-sided adhesive material is able to bond to an end face of the second section of insulation tubing. In some embodiments, the layer of double-sided adhesive includes a scrim that acts as a reinforcing structure to keep the layer of double-sided adhesive material intact as a single body during and after application between two adjacent sections of insulation tubing.

Abstract: Methods and apparatus are provided for a monolithic multi-optical-waveguide penetrator or connector. One example apparatus generally includes a plurality of large diameter optical waveguides, each having a core and a cladding, and a body having a plurality of bores with the optical waveguides disposed therein, wherein at least a portion of the cladding of each of the optical waveguides is fused with the body, such that the apparatus is a monolithic structure. Such an apparatus provides for a cost- and space-efficient technique for feedthrough of multiple optical waveguides. Also, the body may have a large outer diameter which can be shaped into features of interest, such as connection alignment or feedthrough sealing features.

Abstract: Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.

Abstract: A method for producing an electronic component including a laminate, a circuit element provided therein, and external conductors electrically connected thereto. The method including steps of obtaining a mother laminate that has a plurality of the laminates arranged in a matrix-like state in a first direction and a second direction perpendicular thereto. The mother laminate is cut into the laminates. In the step of obtaining, the mother laminate is obtained such that the external conductors of two laminates adjacent in the first direction are joined, and circuit elements provided in the two laminates have a point-symmetrical relationship with each other. In the step of cutting, the mother laminate is cut along first cutoff lines extending in the second direction after the mother laminate is cut along second cutoff lines extending in the first direction. The external conductors are located on corresponding first cutoff lines.

Abstract: A process for production of a multilayer film that comprises a step in which an adhesive layer formed on a temporary base is situated along the lengthwise direction of the temporary base at a prescribed spacing and cut in such a manner that the plurality of sections which are to serve as adhesive films are partitioned from the other sections, and a step in which the adhesive films on the temporary base are moved onto a support film at a prescribed spacing along the lengthwise direction of the support film. The spacing between the adjacent adhesive films on the temporary base is different from the spacing between the adjacent adhesive films on the support film.

Abstract: Structures such as display structures and other electronic device structures may be shaped using water jet cutting equipment. The water jet cutting equipment may be used to produce a water jet. The water jet may be used to cut layer of material such as display layers and other structures. Water jet cutting may form edge cuts, cuts for openings in the structures, chamfers, and other features. Multiple layers may be simultaneously cut using water jet cutting. Positioning equipment may be used to control the position of a workpiece relative to a water jet nozzle. The positioning equipment may be controlled using a control unit. During water jet cutting operations, the workpiece may be trimmed, openings may be formed, and features such as chamfers may be created. A workpiece may include a cover glass, a color filter array, a thin-film transistor layer, and other display layers and device structures.

Abstract: A compression sleeve for being wrapped around a leg of a wearer includes adjacent flexible sleeve sections. At least one of the sleeve sections has an air bladder therein adapted to inflate for compressing a portion of the leg. A structural component is secured to the sleeve and extends generally between the flexible sleeve sections to maintain a spacing of the adjacent sleeve sections lengthwise of the leg when the sleeve is wrapped around the leg. Bladder layers are joined together to form the air bladder. The bladder is joined together at least at two weld points on opposite sides of the structural component to locate the structural component on the sleeve so as to maintain the spacing of the adjacent sleeve sections.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

Abstract: A gas separation module includes at least one inlet port, a plurality of outlet ports, and a plurality of hollow fiber membranes. Individual fibers have a feed end and a product end with a retentate interior side and a permeate exterior side. The module includes a feed tubesheet within the shell segregating the at least one inlet port and the permeate side of the fibers. The feed tubesheet includes a matrix and at least one segment joint. The segment joint separates segments of the feed tubesheet from one another. A formation method includes positioning a hollow fiber membrane material in association with at least one tubesheet segment joint and applying a matrix. The method includes forming a feed tubesheet from cured matrix and the segment joint and forming a plurality of hollow fiber membranes from the fiber material. The segment joint separates segments of the feed tubesheet from one another.

Abstract: A method of forming a composite link fitting including joining two opposed bearing supports with an inner laminate core having a longitudinal axis extending there between. Each bearing support including a bearing bore formed as an aperture, a first stepped portion, a separate second stepped portion and a recess formed therein. The recess extending toward the bearing bore between an extent of the first and second stepped portions to a recess bottom. The inner laminate core including a central elongate layer, a first outer layer and a second outer layer, with the first and second outer layers disposed on opposed first and second sides of the central elongate layer. First and second ends of the central elongate layer disposed within respective recesses. Also, the method including wrapping an outer band around the two bearing supports and the inner laminate core to form the composite link fitting.

Abstract: A seam-sealed filter in which the seam is sealed with a seam tape comprised of an expanded fluoropolymer, such as ePTFE and copolymers thereof, having a crosswise matrix modulus of greater than 1,950 psi and an enthalpy ratio of less than 0.6 is disclosed. Such seam-sealed filters are capable of undergoing greater than 50,000 pulse-jet or reverse air cleaning cycles without substantial cracking or peeling of the sealed seam. Accordingly, the seam-sealed filters in the form of bags are particularly suitable for use in reducing particulate emissions in cement baghouses and the like.

Abstract: Alight control panel is provided, comprising: a transmissive substrate; a transmissive electrically conductive layer arranged on a surface of said substrate; a transmissive dielectric layer arranged on said electrically conductive layer; a flexible roll-up blind attached to said dielectric layer, said flexible roll-up blind layer comprising a flexible electrically conductive layer and a flexible optically functional layer, said flexible layer having naturally a rolled configuration and being capable of unrolling in response to electrostatic force; and an optoelectronic device. The panel may be useful in various energy saving applications including smart windows for buildings or vehicles, e.g. providing an energy efficient light source or utilizing solar radiation for energy conversion.

Abstract: Exemplary methods of making an applique are disclosed. An exemplary method includes forming a graphic and at least one registration mark on a display side of a fabric layer. An adhesive may be applied to a non-display side of the fabric layer, and a backing carrier may be applied to the adhesive. The methods may further include cutting through the fabric layer and the adhesive, but not the backing carrier, using a cutting tool that is responsive to the at least one registration mark. Exemplary methods may also include applying a topside carrier to the display side of the fabric layer. A bond between the topside carrier and the fabric layer may be stronger than a bond between the backing carrier and the fabric layer.

Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

Abstract: A structural panel includes a closed-cell foam core formed of a metallic material; a first carbon-fiber panel bonded to a first side of the closed-cell foam core; and a second carbon-fiber panel bonded to a second side of the closed-cell foam core such that the foam core is disposed between the first carbon-fiber panel and the second carbon-fiber panel.

Abstract: Provided is a process for production of composite fine particles with heterogeneous surfaces. The process ensures a high productivity and enables a voluntary control of particle diameters. Further, the process imposes no restrictions on heterogeneous substances added for functional expression, and allows a heterogeneous substance to be encapsulated in central portions of composite fine particle spheres. A composite film obtained by laminating two or more kinds of films is cut into minute pieces, followed by melting the same to obtain spherical minute pieces. Particularly, liquid films are separately formed with two or more kinds of liquids containing polymerizable monomers. Further, two or more kinds of films can thereby be obtained through polymerization. The two or more kinds of films thus obtained are then laminated to further allow polymerization to take place, thus obtaining the composite film.

Abstract: An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

Abstract: According to one embodiment, there is disclosed a method of manufacturing a semiconductor device forming a release layer on a region excluding a peripheral edge portion of a surface of a first substrate, bonding a second substrate to at least a region including the release layer of the surface of the first substrate via an adhesive layer, removing physically a peripheral edge portion of the second substrate in a manner that at least a surface of the adhesive layer right under the peripheral edge portion of the second substrate is exposed, the adhesive layer is caused to remain between the peripheral edge portion of the first substrate and the second substrate, and adhesion between the first and second substrates is maintained, and then dissolving the adhesive layer.

Abstract: Simplification of the manufacture of composite material fuselages for aircraft, as well as mass reduction of fuselage sections and space optimization inside such fuselage sections. To accomplish this, it is proposed to use stringers of a new type which have a closed transverse section, and which are thus able to be self-positioned relative to one another by being positioned edge-to-edge on a stringer supporting structure, such as the outer surface of a mandrel. The installation of the stringers in grooves of conjugate shape is by this means made unnecessary. The stringers have cut-outs located between circumferential frames, and are able to house utility systems.

Abstract: A composite stone panel can comprise a stone slab. A partially metallic panel backer is coupled to the stone slab and can further comprise a core material layer, a first interface layer disposed on a first surface of the core material layer, and a second interface layer disposed on a second surface of the core material layer opposite the first metal interface layer. The stone slab can further comprise a length greater than 1.2 meters (m), a width greater than 0.6 m, and a thickness in a range of 0.2-1.5 centimeters (cm). The core material layer can comprise a thickness greater than 3.75 millimeters and can further comprise polyethylene and optional fibers. The first and second interface layers can comprise a thickness of aluminum in a range of 0.21 millimeters (mm) to 0.30 mm. Accordingly, the composite stone panel can comprises a thickness in a range of 0.6-3.0 cm.

Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.

Abstract: A fastener and a method of making and using the fastener is provided in which the fastener includes a base having a top portion and a bottom portion. The bottom portion includes an adhesive layer portion. An elongated pliable core member is coupled to the base, with the core member having first and second ends, with at least the first end extending beyond an edge of the base. In another embodiment the base is configured to define a plurality of notches, with each notch configured to define an apex proximate the center of the base and extending with the edges toward an edge of the base and with two notches on each side of elongated pliable core member. The plurality of notches defines two sections of the base, with one section configured independently of the other section and with one section on each side of the elongated pliable core member.

Abstract: There are provided a multilayer ferrite sheet capable of performing communications in a wideband frequency, an antenna device using the same, and a manufacturing method thereof. The multilayer ferrite sheet includes: a Y-type hexaferrite layer; and a Z-type hexaferrite layer, wherein the Y-type hexaferrite and the Z-type hexaferrite are alternately laminated.

Abstract: A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.

Abstract: A disposable absorbent article comprises an outer cover, and an absorbent member attached to the skin facing side of the outer cover. The absorbent member includes an absorber. At least a crotch zone of the outer cover is subjected to a softening process for softening a material of the outer cover.

Abstract: Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: An optical device includes a connector configured to provide a hole, an optical waveguide provided with a core and a clad equipped on an outer periphery of the core and configured to have a refractive index smaller than a refractive index of the core, a first transparent member configured to make contact with a core end face of the optical waveguide, and a second transparent member configured to make contact with a hole bottom of the optical waveguide insertion hole, wherein a contact area of the second transparent member and the hole bottom of the optical waveguide insertion hole is larger than a contact area of the core and the first transparent member.

Abstract: A FRP plate and manufacturing method thereof are provided in the invention. The FRP plate comprises: a lower layer of polyester carrier film; a mixed layer located on the lower layer of polyester carrier film, which is formed by curing a melted polyester resin in which a glass fiber reinforced material is embedded; and an upper layer of polyester carrier film positioned on the mixed layer. Furthermore, a release fabric is disposed between the mixed layer and the upper layer of polyester carrier film. When the FRP plate of the invention is used, the upper layer of polyester carrier film and the release fabric are torn off so that the surface of the mixed layer is rough, therefore, the adhesion between the FRP plate and other building materials will be greatly improved, and thus the application prospect of the FRP plate is broader.

Abstract: A method of fabricating a composite material part such as a link. The method comprises the successive operations of applying reinforcing fiber layers (14a, 14b, 14c) that are braided around a mandrel over all or part of the length of the mandrel, the layers being superposed one on another. The method includes a step of cutting an intermediate reinforcing fiber layer (14a, 14b, 14c) after it has been applied, a step of withdrawing a cut portion prior to applying the following braided layer (14b, 14c), thereby locally building up an extra thickness of reinforcing layers on each portion of the cut layer that has remained in place, the extra thickness constituting local reinforcement of the part. Resin is subsequently injected into the various braided layers prior to the resin being polymerized in order to prepare a blank. The method applies in particular to the field of aviation.

Abstract: An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.

Abstract: A method of manufacturing a cut-out sintered ceramic sheet having a complex shape and a cut-out sintered ceramic sheet made according to the method, the method including forming a ceramic green sheet, sintering the formed ceramic green sheet, adhering a plastic resin film onto which adhesive is applied on at least one surface of the sintered ceramic sheet, and shearing the sintered ceramic sheet.

Abstract: A method of manufacturing a cut-out sintered ceramic sheet including forming a ceramic green sheet, sintering the formed ceramic green sheet, adhering a plastic resin film onto which adhesive is applied on at least one surface of the sintered ceramic sheet, and shearing the sintered ceramic sheet.

Abstract: A water-disintegrable absorbent article adapted to be easily peeled off the wearer's undergarment after use. A pantiliner has a topsheet lying on a body side of the wearer, a backsheet and a liquid-absorbent body interposed between the top- and backsheets. The backsheet may be formed of a water-disintegrable fibrous nonwoven fabric of which the component fibers have an orientation extending in a longitudinal direction. On a non-body side, first adhesive regions adapted to be attached to the wearer's undergarment and second adhesive regions allocated on both outer sides in a transverse direction of the first adhesive regions so as to be spaced in the transverse direction from the first adhesive regions. The first adhesive regions include front first adhesive regions, rear first adhesive regions and central first adhesive regions allocated between the front and rear first adhesive regions spaced apart from each other in the longitudinal direction.

Abstract: A method for producing an elastically stretchable laminate having at least three layers, the method including the steps of: a) producing a first laminate having a first non-elastic fibrous nonwoven web and an elastic film; b) activating the first laminate by incremental stretching in at least one activation direction to render the first laminate elastically stretchable; c) stretching the activated first laminate to 10-200% in the activation direction; and d) laminating the stretched first laminate to a second non-elastic nonwoven web. An elastically stretchable laminate produced in accordance with the method is also disclosed.

Abstract: A method of producing an optical film laminate includes: a first film layer forming step of cutting a first optical film having an elongated shape into first optical film pieces along cutting lines crossing the longitudinal direction of the first optical film and disposing the first optical film pieces adjacent to each other in a substantially band or strip shape; a second film layer forming step of cutting a second optical film having an elongated shape into second optical film pieces along cutting lines crossing the longitudinal direction of the second optical film and disposing the second optical film pieces adjacent to each other in a substantially band or strip shape; and a cutting step of, while holding a third film layer made of the third optical film, the first film layer and the second film layer in a laminated state, cutting them into plural optical film laminates.

Abstract: A method for manufacturing an acoustic wave device includes: adhering wafer-shaped first and second piezoelectric substrates to a front face of a first and second adhesive sheet respectively and dividing the first and the second piezoelectric substrates into rectangles; adhering a third and fourth adhesive sheet to the first and second piezoelectric substrates respectively and moving at least one divided portions of the first and second piezoelectric substrates selectively to the third and fourth adhesive sheet respectively; moving the first piezoelectric substrate on the first adhesive sheet to the fourth adhesive sheet; and moving the second piezoelectric substrate on the second adhesive sheet to the third adhesive sheet.