With Means Applying Wave Energy Or Electrical Energy Directly To Work Patents (Class 156/379.6)
  • Patent number: 7985312
    Abstract: In an ultrasonic welding apparatus, ultraviolet-curable ink droplets are discharged to an upper surface of stacked sheets by means of an ink-jet head to land the ink droplets in a predetermined area on the upper surface of the sheets. The sheets, on which the ink droplets have been landed, are interposed and pressed between a welding horn and a receiving stand, while the welding horn is ultrasonically vibrated. Accordingly, the stacked sheets are welded to one another at portions opposed to the predetermined area in which the ink droplets are landed. In this way, the ultrasonic welding apparatus is provided, which makes it possible to perform the ultrasonic welding irrelevant to the shape of the area to be subjected to the welding.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: July 26, 2011
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yoichiro Shimizu, Akihiko Taniguchi, Koichiro Hara, Hirotake Nakamura
  • Publication number: 20110174434
    Abstract: A manufacturing method of coating film PLA biodegradable material and its setup using PLA biodegradable granule through drying machine to process water content before heating granule to molten on one hand and entering lamination head on the other hand through conveyer and squeezing out a thin film, then pushes lamination machine to fixed location and position lamination head between two rollers, than through lateral cylinder to control its displacement so that lamination head locates at center of two rollers, same time control rolling machine so that lamination point ascends to proper distance from outlet; while paper web or thin wood paper board surface heating through heater and enlarging pores, then using surface treatment so that pores are further enlarged to facilitate PLA thin film easy to coat film for providing fast lamination and increase yield and producing all kinds of paper containers and achieve natural degradation.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 21, 2011
    Inventor: Fu-Shih Hsiao
  • Patent number: 7976741
    Abstract: A method of manufacturing a light guide plate containing a plurality of light-guiding micro structures comprises the steps of: preparing a mold that has a concave hole formed by a plurality of light-guiding micro structures; pouring a mixture of ultraviolet curable resins and glass microbeads into the mold; attaching a carrier onto the mixture; using a rolling tool to roll the surface of the carrier, such that the mold is filled up with the mixture uniformly, while the air among the mold, the carrier and the mixture is discharged; and finally projecting the ultraviolet light onto the ultraviolet curable resin, such that the ultraviolet curable resin can be cured at the carrier and removed from the mold, so as to form a light guide plate having a plurality of light-guiding micro structures.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: July 12, 2011
    Assignee: Ichia Technologies, Inc.
    Inventors: Chih-Ho Hsu, Jian-Li Chang
  • Publication number: 20110165815
    Abstract: A laser beam irradiation apparatus irradiates a laser beam onto a sealing unit disposed between a first substrate and a second substrate so as to seal the first substrate and the second substrate. A center portion of the laser beam comprises a first beam profile having a beam intensity which increases toward a beam center portion, and a center of each of a plurality of peripheral portions of the laser beam is included in an area onto which the first beam profile is irradiated. The plurality of peripheral portions are symmetrically distributed around the first beam profile, and comprise a plurality of second beam profiles having the same beam intensities. The first beam profile and the plurality of second beam profiles are symmetrically distributed around a center point of the first beam profile and move in synchronization with one another.
    Type: Application
    Filed: December 28, 2010
    Publication date: July 7, 2011
    Applicant: SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Jung-Min Lee, Jin-Hwan Jeon
  • Publication number: 20110146913
    Abstract: An industrial fabric used in the manufacture or processing of at least one material web includes a base fabric having a board side and a machine side. The base fabric includes a plurality of spirals extending in a cross machine direction (CMD). The spirals are interconnected together with each other along adjacent peripheral edges to form a spiral link fabric. The base fabric has opposite lateral side edges extending in a machine direction (MD). One or more electrostatic control yarns are positioned within a corresponding spiral and extend in the CMD direction to the lateral side edges. A pair of conductive edge coatings are applied to at least the board side of a respective lateral side edge for a predetermined width. The conductive edge coatings and the one or more electrostatic control yarns form an electrostatic grid.
    Type: Application
    Filed: December 23, 2009
    Publication date: June 23, 2011
    Inventor: William Harwood
  • Publication number: 20110146912
    Abstract: A multi-layer laminate media is provided on which information may be applied in machine or human readable form on a visible front surface by the output of one or more lasers, or other high intensity light source. In a preferred embodiment, the media has three layers including preferably transparent substrate, a thermochromic layer and a light absorbent layer located intermediate the media substrate and the thermochromic layer. The light absorbent layer is adapted to absorb light from the light source and convert the absorbed light into heat. The heat is immediately conducted into selected portions of the thermochromic layer which is in thermal contact with the light absorbent layer, causing portions of the thermochromic layer to change visual appearance such as color to create the desired mark. The media optimally includes obscuration materials to reduce the visibility of the light absorbent layer to the naked eye.
    Type: Application
    Filed: November 12, 2010
    Publication date: June 23, 2011
    Inventors: M. Scott Howarth, Colin P. Woodward, Neil Griffin, Sam Hyde, Roger Clarke, Richard Calusdian, Wilson B. Murray, Richard Hirst, Richard Evans, Enrique B. Schilling, Gareth Melton, Timothy Moore, David Southwood
  • Publication number: 20110146903
    Abstract: The invention relates to a laser head (11) for connecting tubular parts (1, 3, 12, 13) by the laser transmission method and to a method of connecting the tubular parts (1, 3, 12, 13) by means of the laser head (11). The laser head (11) and the method that can be performed by the laser head (11) are suitable in particular for connecting a connecting element or branching element (1) to one end of a plastic pipe (3). The laser head (11) makes simultaneous welding possible and has at least two shell parts (16) that can be radially separated from each other so that the laser head (11) can be placed around a connecting section (4) or a connecting region (15) of the tubular parts (1, 3, 12, 13). A number of laser sources (17) are arranged in the shell parts (16) in such a way that the laser beams (7) emerging from the laser sources (17) overlap at the connecting section (4) or at the connecting region (15) of the parts (1, 3, 12, 13).
    Type: Application
    Filed: August 20, 2009
    Publication date: June 23, 2011
    Applicant: LEISTER PROCESS TECHNOLOGIES
    Inventors: Erich Stauffer, Pius Barmet, Oliver Hinz, Michael Scheidt, Ulrich Gubler
  • Patent number: 7964047
    Abstract: A manufacturing method of a three-dimensional structure includes (a) placing a second porous sheet on top of a first porous sheet that has a predetermined external shape and at least part of which contains a first functional liquid, (b) bonding at least a range surrounded by a predetermined shape of the second porous sheet onto the first porous sheet, (c) processing the second porous sheet in the predetermined shape, and (d) after step (b), causing a second functional liquid to be contained in at least part of the range of the second porous sheet so that the first functional liquid and the second functional liquid are brought into contact through the first porous sheet and the second porous sheet.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: June 21, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Masaya Ishida
  • Publication number: 20110132520
    Abstract: A manual and an automatic fastening device for fastening a bonding element to a surface by means of a light-curing adhesive is disclosed. The fastening devices apply the bonding element to the surface with a specific contact pressure, before the light is irradiated onto the bonding element for curing the adhesive. As the bonding element consists of transparent material, the adhesive is cured between the fastening element and the surface.
    Type: Application
    Filed: December 6, 2010
    Publication date: June 9, 2011
    Inventor: Franz Druke
  • Patent number: 7955468
    Abstract: An infrared light source focuses infrared energy onto a work surface through the open end of a concentrator. The open end of the concentrator includes an elastomeric seal for sealably coupling the end of the concentrator directly to a work piece. Pneumatic pressure is applied through the concentrator and the seal to urge the work pieces together during the heating process to complete the weld. The method of infrared (IR) welding includes the steps of applying concentrated IR energy to at least one thermoplastic member while simultaneously applying pneumatic pressure to the work pieces for welding one member to another.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: June 7, 2011
    Assignee: Extol Inc.
    Inventors: Scott M. Beute, David A. Allen, Roger G. Miller, Jr., Mark W. Essenburg
  • Publication number: 20110123794
    Abstract: A method for manufacturing objects/materials includes selectively arranging the predetermined components in a staging area, substantially simultaneously selectively removing two or more of the selectively arranged predetermined components according to a predetermined removal plan and substantially simultaneously placing the selectively removed components, the removed components being substantially simultaneously placed at a predetermined location.
    Type: Application
    Filed: July 24, 2009
    Publication date: May 26, 2011
    Applicant: CORNELL UNIVERSITY
    Inventors: Jonathan D. Hiller, Hod Lipson
  • Publication number: 20110117202
    Abstract: Methods and systems for producing a change in a medium. A first method and system (1) place in a vicinity of the medium at least one upconverter including a gas for plasma ignition, with the upconverter being configured, upon exposure to initiation energy, to generate light for emission into the medium, and (2) apply the initiation energy from an energy source including the first wavelength ?1 to the medium, wherein the emitted light directly or indirectly produces the change in the medium. A second method and system (1) place in a vicinity of the medium an agent receptive to microwave radiation or radiofrequency radiation, and (2) apply as an initiation energy the microwave radiation or radiofrequency radiation by which the agent directly or indirectly generates emitted light in the infrared, visible, or ultraviolet range to produce at least one of physical and biological changes in the medium.
    Type: Application
    Filed: November 10, 2010
    Publication date: May 19, 2011
    Applicants: Immunolight, LLC, Duke University
    Inventors: Frederic A. Bourke, JR., Zakaryae Fathi, Ian Nicholas Stanton, Michael J. Therien, Paul Rath Stauffer, Paolo MacCarini, Katherine Sarah Hansen, Diane Renee Fels, Cory Robert Wyatt, Mark Wesley Dewhirst
  • Patent number: 7931063
    Abstract: A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: April 26, 2011
    Assignee: Alien Technology Corporation
    Inventors: Gordon S. W. Craig, Kenneth D. Schatz, Mark A. Hadley, Paul S. Drzaic
  • Publication number: 20110091389
    Abstract: Techniques are generally described for particles with a surface including an adhesion material. The adhesion material may be selectively activated in response to radiation. The particles may be distributed proximate to a target through a fluid system. Radiation may be emitted toward the target causing the adhesion material to activate. The activated adhesive material on the surface of the particles may adhere to the target providing a fiducial mark or reference point. The fiducial mark may be visible through a medical imaging technique. In some examples, the particles may be nanoparticles. In some examples, the radiation may be infrared radiation.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventor: EZEKIEL KRUGLICK
  • Patent number: 7918261
    Abstract: An apparatus for assembling a lens module includes a UV light source and a pressing device. The lens modules each having a first component, a second component and UV curable adhesive applied between the first and second components. The UV light source is configured for emitting UV light toward the UV curable adhesive. The pressing device is configured for pressing the first components against the second components. A method for assembling a lens module is also included in the invention.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: April 5, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Hsin-Ho Lee
  • Patent number: 7918954
    Abstract: An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: April 5, 2011
    Assignee: Corning Incorporated
    Inventors: Jeffrey Michael Amsden, James Joseph Bernas, John Joseph Costello, III, Margaret Helen Gentile, Mark Andrew Stocker, Lu Zhang
  • Publication number: 20110073259
    Abstract: An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.
    Type: Application
    Filed: December 2, 2010
    Publication date: March 31, 2011
    Inventors: Jeffrey Michael Amsden, James Joseph Bernas, John Joseph Costello, III, Margaret Helen Gentile, Mark Andrew Stocker, Lu Zhang
  • Publication number: 20110076434
    Abstract: An adhesive tape that bonds components through thermal fusion based on induction heating, a mobile terminal including the same, and a manufacturing method and apparatus of the mobile terminal are disclosed. The mobile terminal includes a nonmetal case forming an external appearance of the mobile terminal, a nonmetal member bonded to the case, and an adhesive tape for bonding the member to the case. The adhesive tape includes a metal sheet configured to be high-frequency induction heated and thermal fusion tape parts stacked on opposite main surfaces of the metal sheet such that the thermal fusion tape parts can be thermally fused to the case and the member by the heated metal sheet.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 31, 2011
    Inventors: Donghyuk CHO, Minho Park, Youngmin Kim
  • Patent number: 7914725
    Abstract: A plastic end disk for a hollow-cylindrical filter element has an end face plastic layer and a neighboring plastic layer. The end face plastic layer is transparent for infrared radiation. The neighboring plastic layer is absorbent for infrared radiation. The plastic end disk is connected to a folded filter medium in that the end face plastic layer is trans-irradiated with an infrared radiation source, wherein the infrared radiation is absorbed in the neighboring plastic layer so that a portion of the neighboring plastic layer and a portion of the end face plastic layer are completely melted. The infrared radiation source is removed and the filter medium is pressed into a melted area of the end face plastic layer. The filter medium is secured in the pressed-in position in the end face plastic layer until a fixed connection of filter medium and end face plastic layer has been formed.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: March 29, 2011
    Assignee: Mann+Hummel GmbH
    Inventor: Anton Kreiner
  • Publication number: 20110052879
    Abstract: The invention concerns a device for encapsulating an element within a microcavity made on a support (10), this device comprising an encapsulating membrane (12) capable of forming at least one part of the microcavity, characterized in that the device comprises at least one arm which mechanically attaches the membrane to the support, this arm being capable of bending so as to shift the membrane between: an open position in which the membrane overhangs the element to be encapsulated and its periphery defines an aperture extending around the element to be encapsulated, and a shut position in which the periphery of the encapsulation membrane rests on the support to obstruct this aperture.
    Type: Application
    Filed: August 31, 2010
    Publication date: March 3, 2011
    Applicant: Commissariat a I'energie atomique et aux energies alternatives
    Inventors: Thierry Hilt, Xavier Baillin
  • Publication number: 20110045732
    Abstract: There are executed a coating or attaching process for coating or attaching a grease-like or gel-like material onto a surface of a sealing substrate on a sealed space side and a drying process for drying the grease-like or gel-like material coated or attached onto the sealing substrate. Then, there is executed a laminating process of sealing the peripheral edge portion between the sealing substrate and the element formation substrate by a sealing agent such as an adhesive in such a state that the surface of the sealing substrate onto which the grease-like or gel-like material is coated or attached and the surface of the element formation substrate on which an organic EL element is formed are opposed to each other.
    Type: Application
    Filed: April 28, 2009
    Publication date: February 24, 2011
    Applicant: Yamagata Promotional Organization for Industrial Technology
    Inventors: Joji Suzuki, Fujio Kajikawa, Takashi Kawai
  • Patent number: 7886802
    Abstract: Apparatus and method for applying thermal energy to a sealing member. Electrical current is applied to a heating assembly to generate thermal energy, and a heat conductor transfers the generated thermal energy to a seal member adjacent a housing. The heating assembly is configured to substantially prevent a magnetic field generated by the applied electrical current from extending to the housing.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: February 15, 2011
    Assignee: Maxtor Corporation
    Inventor: Peter M. Martino
  • Patent number: 7886796
    Abstract: A chip bonding tool, related apparatus and a method thereof. The chip bonding tool includes a pressing block, through which a laser beam passes, for pressing a semiconductor chip; and a projection disposed under the pressing block, through which the laser beam passes, onto which the semiconductor chip is sucked, which spaces the pressing block from the semiconductor chip.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: February 15, 2011
    Assignee: Samsung Techwin Co., Ltd.
    Inventor: Ji-Tae Ok
  • Publication number: 20110030891
    Abstract: A method of laminating a photovoltaic module may include placing an interlayer in contact with a substrate, heating the interlayer with a source of infrared radiation and pressing the interlayer and the substrate together in a vacuum laminator.
    Type: Application
    Filed: August 10, 2010
    Publication date: February 10, 2011
    Applicant: First Solar, Inc.
    Inventors: Wenlai Feng, Brian E. Cohen
  • Publication number: 20110017391
    Abstract: A wafer holding table that suction-holds a wafer of a mount frame moves downward below a frame holding table when a joining roller passes over an exposed portion of an adhesive tape between the wafer W and the ring frame f. Here, the exposed portion of the adhesive tape inclines obliquely downward, thereby joining the adhesive tape to the mount frame.
    Type: Application
    Filed: July 2, 2010
    Publication date: January 27, 2011
    Inventors: Masayuki Yamamoto, Chouhei Okuno
  • Publication number: 20110011528
    Abstract: A method for fabricating a conductive plate includes providing a base substrate and a conductive material that includes a plurality of nanounits. The conductive material is placed on the base substrate, where a portion of the conductive material placed on the base substrate is removed.
    Type: Application
    Filed: July 5, 2010
    Publication date: January 20, 2011
    Applicants: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD., CHIMEI INNOLUX CORPORATION
    Inventors: JEAH-SHENG WU, JIA-SHYONG CHENG, PO-SHENG SHIH, CHIH-HAN CHAO, CHEN FENG
  • Publication number: 20100330776
    Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Inventors: Steven M. Zuniga, Robert D. Tolles, Derek G. Aqui, Andrew J. Nagengast, Anthony J. Senn, Keenan Leon Guerrero
  • Patent number: 7849900
    Abstract: During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: December 14, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Saburo Miyamoto, Yasuji Kaneshima, Masayuki Yamamoto
  • Publication number: 20100307676
    Abstract: A method and apparatus for laser welding two members made of thermoplastic resin material whereby high welding strength can be achieved and strength variations can be reduced. A first member 2 comprised of a transmissive thermoplastic resin that transmits a laser beam is brought into contact with a second member 3 comprised of an absorptive thermoplastic resin that absorbs a laser beam. Contact surfaces 4 are melted with a laser beam so as to join the two members. At least the contact surfaces 4 of the two members are pre-heated by a pre-heating means 20 at a temperature lower than the melting temperature of the contact surfaces. The contact surfaces 4 are then irradiated with a laser beam R generated by a laser beam generator 10 that is shone from the side of the first member so as to melt at least one of the contact surfaces of the two members.
    Type: Application
    Filed: August 20, 2010
    Publication date: December 9, 2010
    Inventors: Toshio Watanabe, Katsuhiko Nakajima, Hideo Nakamura, Hiroshi Mori, Susumu Fujita, Mitsunobu Nakatani
  • Patent number: 7833367
    Abstract: A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: November 16, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Masaru Irie
  • Patent number: 7832443
    Abstract: A surface treatment apparatus for printed sheets that is capable of preventing radiation of UV rays onto printed sheets when out of use including a varnishing section for applying UV cure resin varnish on a printed sheet; a cylinder for conveying a printed sheet with the UV cure resin varnish applied thereon at the varnishing section; a film pressing part for pressing a transfer film onto a printed sheet on the cylinder; and a UV radiation part for curing UV cure resin varnish of a printed sheet onto which the transfer film is being pressed by the film pressing part. The UV radiation part is positioned close to the cylinder when the film pressing part is positioned close to the impression cylinder; and the UV radiation part is positioned away from the cylinder when the film pressing part is positioned away from the cylinder.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: November 16, 2010
    Assignee: Ryobi Ltd
    Inventors: Katsushi Hirokawa, Takahiko Nakamura, Hiroyoshi Kuwahara, Yoshifumi Mitsunari
  • Publication number: 20100276078
    Abstract: It is provided that a method and a system for manufacturing an optical display device, which make it possible to bond an optical member and an optical display unit together with a certain degree of cleanliness maintained. The method for manufacturing an optical display device including an optical display unit (W) and an optical member (11, 12) bonded to the optical display unit (W), which includes a bonding step for bonding the optical member (11, 12) to the optical display unit (W) in an environment with an airflow.
    Type: Application
    Filed: December 4, 2008
    Publication date: November 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuo Kitada, Satoru Koshio, Takuya Nakazono, Tomokazu Yura
  • Publication number: 20100266810
    Abstract: A method for forming an electronic circuit disposes a plurality of magnets onto a flux plate to form a magnetic platen. A substrate package is formed using the magnetic platen and, stacked against the magnetic platen, a non-magnetic carrier and a substrate layer, with a bonding material sandwiched between the carrier and the substrate layer, and with the carrier layer disposed nearest the magnetic platen. A fused wafer stack is formed by heating the substrate package to adhere the substrate layer to the carrier. The fused wafer stack is removed from the magnetic platen and the circuit fabricated on the substrate layer.
    Type: Application
    Filed: April 16, 2009
    Publication date: October 21, 2010
    Inventors: John Claude Boutet, Timothy John Tredwell
  • Publication number: 20100252186
    Abstract: The present invention relates to methods and apparatuses for assembling substrates with functional blocks, using a printhead to deliver individual functional blocks to the appropriate locations on the substrates. In an embodiment, the functional block releasing mechanism comprises a heat source to provide thermal energy and a light source to provide photon energy, wherein the heat source and the light source enable releasing individual functional blocks from the reservoir for positioning on the substrate. The heat source can comprise an array of heating elements, such as thin film heating elements, which can provide localized heating to individual elements, thus enabling releasing individual functional blocks. The light source can comprise a laser beam and a moving mechanism to move the laser beam to the individual functional blocks.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 7, 2010
    Applicant: TEREPAC
    Inventor: Jayna Sheats
  • Publication number: 20100243170
    Abstract: A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.
    Type: Application
    Filed: June 8, 2010
    Publication date: September 30, 2010
    Applicant: THE BOEING COMPANY
    Inventors: Mark S. Wilenski, Arvid J. Berg
  • Publication number: 20100212821
    Abstract: Disclosed are methods, systems, machines and products, including a method for producing foil relief. The method includes placing a foil on a curable adhesive deposited on a substrate when the curable adhesive is substantially non-tacky, and applying energy to the adhesive deposited on the substrate while pressing the foil to the adhesive to cause the adhesive to become tacky and to adhere to the foil. The adhesive becomes substantially fully cured prior to completion of the pressing of the foil to the adhesive deposited on the substrate. In some embodiments, the method may further include pre-curing the curable adhesive prior to placing the foil on the adhesive to initiate the curing process of the adhesive and manipulate a viscosity level of the adhesive, with the pre-cured adhesive remaining substantially non-tacky. The curable adhesive includes one or more of, for example, a radical type adhesive and/or a cationic adhesive.
    Type: Application
    Filed: March 10, 2010
    Publication date: August 26, 2010
    Applicant: Scodix, Ltd.
    Inventors: Eli Grinberg, Kobi Bar
  • Publication number: 20100206487
    Abstract: The present invention solves the problem that a connecting portion between a horn and a vibration transmission rod has a tendency to get damaged and the problem associated with the structure in which a chip is attached to an end of the vibration transmission rod, which occur with the known ultrasonic vibration welder. A vibration transmission rod has an end surface serving as a vibration-and-pressure application surface, and a polygonal cross section. The vibration transmission rod is disposed at an end of a horn in such a manner that they vibrate together. The vibration transmission rod and a mass are formed separately. The mass applies pressure to a projection formed at a nodal point of the vibration transmission rod.
    Type: Application
    Filed: July 23, 2008
    Publication date: August 19, 2010
    Applicant: Branson Ultrasonics Corporation
    Inventors: Masayoshi Arai, Shigetomi Morita
  • Publication number: 20100207698
    Abstract: The invention provides a method and an apparatus for manufacturing a glass-sealed package, whereby anodic bonding of a pair of wafers is ensured over substantially the whole area of the wafers, and whereby a vacuum is ensured inside the cavity during the anodic bonding of the wafers. The invention also provides an oscillator having such characteristics. The manufacturing method of a glass-sealed package includes the step of anodically bonding a pair of wafers by applying voltage to positions corresponding to circumferential portions of the wafers stacked in layers, and the step of dividing the pair of anodically bonded wafers into individual pieces. A through hole is formed at a central portion of at least one of the wafers, and the anodic bonding of the wafers is made by applying voltage using a plurality of electrodes disposed at the positions corresponding to the circumferential portions of the wafers.
    Type: Application
    Filed: February 5, 2010
    Publication date: August 19, 2010
    Inventor: Yoshihisa Tange
  • Publication number: 20100193119
    Abstract: An apparatus for attaching a handle to a container includes a handle supply mechanism configured to supply one or more handles in an open configuration; a container conveyance mechanism configured to provide a container to a handle application location; and a handle applicator configured to attach or connect a handle that supplied initially in an open configuration to a portion of a container. In an embodiment, a heater is included that is configured to provide energy/heat to at least a portion of the one or more handles prior to application. In other embodiments, handles are supplied for application at an elevated temperature. Methods for attaching a handle to containers are also disclosed.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 5, 2010
    Applicant: Plastipak Packaging, Inc.
    Inventor: Duane Kenneth Lach
  • Publication number: 20100181023
    Abstract: A production layout for an LCD is provided. The production layout for an LCD includes a bonding part operable to bond a pair of substrates for the LCD with a sealant and a hardening part operable to harden the sealant. The hardening part includes an ion provider operable to supply ions to the substrates during a hardening process of the sealant. The production layout further includes a transfer unit that loads and unloads the bonded substrates. Footprint and tact time for manufacturing the LCD may be reduced. Electrostatic removal effect of the bonded substrates may improve.
    Type: Application
    Filed: February 17, 2010
    Publication date: July 22, 2010
    Applicant: LG Display Co., Ltd.
    Inventor: Jae Ho Shin
  • Publication number: 20100181006
    Abstract: Process for manufacturing a composite block of closed geometry, in the form of a continuous ring, based on reinforcing fibres and on a cross-linkable resin, by continuously winding in superposition a predetermined number Nc of layers of a tape of the reinforcing fibres embedded in a matrix based on a composition comprising the cross-linkable resin, the method comprising, from the upstream end downstream, the steps of: producing a rectilinear arrangement (12) of reinforcing fibres (11), and conveying this arrangement in a feed direction (F); degassing the arrangement of fibres (12) under the action of a vacuum (13); after degassing, impregnating the arrangement of fibres (12) with the resin composition in the liquid state (17); passing the pre-preg thus obtained through a die (20) to impose on the per-preg the shape of a tape (21) consisting of the reinforcing fibres (11) in their liquid resin matrix (17), the thickness (Er) of the tape being between 0.1 mm and 0.
    Type: Application
    Filed: December 13, 2007
    Publication date: July 22, 2010
    Applicant: MICHELIN RECHERCHE ET TECHNIQUE S.A.
    Inventors: Antonio Delfino, Jean-Paul Meraldi
  • Publication number: 20100154989
    Abstract: A method for manufacturing a head-gimbal assembly. The head-gimbal assembly includes a head-slider bonded to a suspension. The method includes placing the head-slider and the suspension in a superposed manner with a photo-thermosetting adhesive applied between the head-slider and the suspension. The method also includes heating the suspension from a side of the suspension opposite to a side of the suspension in contact with the photo-thermosetting adhesive with a heated gas-stream. In addition, the method includes irradiating the photo-thermosetting adhesive with light at least partly in a time period during which the suspension is heated by the gas-stream.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 24, 2010
    Inventors: Hideto IMAI, Tatsumi Tsuchiya, Eiki Oosawa, Naoki Suzuki
  • Publication number: 20100151251
    Abstract: A method and a plant (1) for the production of a membrane body (10) that is flexible and able to assume a given shape under load; the membrane body being provided with at least one pair of flexible sheets (9) mutually coupled through an adhesive layer (14) positioned between mutually facing respective faces (16) of the sheets (9); the method comprising a step of die casting a portion (11) of given extension of the membrane body (10) to determine adhesion between the faces (16) and to form at least one sheath (22) with an external tubular portion of a respective cable (20); the step of die casting the portion (11) being achievable by thermal activation of the adhesive layer (14) in a static manner.
    Type: Application
    Filed: May 23, 2008
    Publication date: June 17, 2010
    Applicant: VELERIA MARCO HOLM S.R.L.
    Inventors: PeirCarlo MOLTA, Davide Innocenti
  • Publication number: 20100084088
    Abstract: This mask includes: a substrate in which an aperture is formed; a mask member which, along with being formed with a plurality of through holes, is joined to the substrate in correspondence to the aperture; and spacers which hold the substrate and the mask member with a predetermined gap between them.
    Type: Application
    Filed: December 3, 2009
    Publication date: April 8, 2010
    Applicant: Seiko Epson Corporation
    Inventor: Makoto Nakadate
  • Patent number: 7691217
    Abstract: A process for manufacturing a tire includes providing an elastomeric layer on an outer surface of a toroidal support, manufacturing the tire on the toroidal support provided with the elastomeric layer, introducing the tire supported on the toroidal support into a moulding cavity, introducing a fluid under pressure into a space defined between the toroidal support and an inner surface of the tire in order to press an outer surface of the tire against walls of the moulding cavity, and curing the tire. The elastomeric layer forms an inner circumferential surface of the tire. The process further includes causing an electrical current to flow in at least one heating element provided to the outer surface of the toroidal support so as to obtain at least partial precuring of the elastomeric layer. A toroidal support for carrying out the process is also disclosed.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 6, 2010
    Assignee: Pirelli Pneumatici S.p.A.
    Inventors: Pierangelo Misani, Guido Riva, Cèline Almonacil
  • Patent number: 7686904
    Abstract: This invention generally pertains to self propagating high temperature synthesis or combustion synthesis as a way of bonding materials. The present invention provides methods and an apparatus for bonding, preferably carbon-carbon composite materials, by combustion synthesis. Generally, the invention involves providing at least two carbon-carbon composite parts to be bonded and interspersing a combustion synthesis material in between the parts with each part in contact with the combustion synthesis material. The combustion synthesis material is then ignited, which initiates the combustion synthesis reaction. Typically, a ceramic material is formed which immediately freezes, bonding the parts together.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: March 30, 2010
    Assignee: Honeywell International Inc.
    Inventors: Slawomir T. Fryska, Mark C. James, Mark L. LaForest, Allen H. Simpson, Barry P. Soos
  • Patent number: 7686913
    Abstract: A production layout for an LCD is provided. The production layout for an LCD includes a bonding part operable to bond a pair of substrates for the LCD with a sealant and a hardening part operable to harden the sealant. The hardening part includes an ion provider operable to supply ions to the substrates during a hardening process of the sealant. The production layout further includes a transfer unit that loads and unloads the bonded substrates. Footprint and tact time for manufacturing the LCD may be reduced. Electrostatic removal effect of the bonded substrates may improve.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: March 30, 2010
    Assignee: LG Display Co., Ltd.
    Inventor: Jae Ho Shin
  • Publication number: 20100051168
    Abstract: The present invention relates to an apparatus for curing a liner of a pipeline where the liner includes a resin which is curable by exposure to electromagnetic radiation of a specific wavelength or a specific wavelength range. The apparatus comprises a housing defining opposite first and second ends, an outer wall of a substantially cylindrical configuration, and an inner wall defining a substantially unobstructed through-going passage extending longitudinally through the housing between the first and second ends, and further comprises a pair of power supply wires for the supply of electrical power to the apparatus and extending from the first end of the housing, and a plurality of LED's irradiating electromagnetic radiation of the specific wavelength or the specific wavelength range. The plurality of LED's is positioned and substantially evenly distributed at the outer wall of the housing, and is connected through an electronic circuit to the pair of power supply wires.
    Type: Application
    Filed: February 19, 2008
    Publication date: March 4, 2010
    Inventors: Ole Moeskjaer, Bent S. Rasmussen, Peter T. Lystbaek
  • Publication number: 20100043964
    Abstract: A bonding method and a bonding apparatus whereby the uniformity of an adhesive layer during application is ensured and variation of the adhesive layer during manufacture can be suppressed. The bonding apparatus includes: a first spin coating device 1 for applying an adhesive B1 onto one surface of a first substrate P1; a second spin coating device 2 for applying an adhesive B2 to one surface of a second substrate P2 more thickly than the adhesive B1 on the first substrate; a pre-irradiation unit 4 for provisionally curing the adhesive B2 on the second substrate P2; a bonding unit 5 for bonding together the surface of the first substrate P1 to which the adhesive B1 has been applied and the surface of the second substrate P2 to which the adhesive B2 has been applied; and a post-irradiation unit 6 which cures the adhesive B1 and B2 between the first substrate P1 and the second substrate P2.
    Type: Application
    Filed: September 20, 2007
    Publication date: February 25, 2010
    Inventor: Haruka Narita
  • Publication number: 20100047587
    Abstract: A method for joining two substances and device for joining two substances are suited for practical use and significantly reduce the difficulty of accurately forming the focal formation position of an ultrashort pulse laser in a case of joining substances with use of a nonlinear absorption phenomenon, as well as a joined body and a manufacturing method for the for the same. Provided is a method for joining two substances by causing a nonlinear absorption phenomenon to occur with use of an ultrashort pulse laser beam. Among the two substances, a first substance that is positioned on a side on which the ultrashort pulse laser beam is incident is composed of a transparent material, and the two substances are joined by generating, at a joining face of the two substances, a filament area that is generated by a self-focusing effect of the ultrashort pulse laser beam in the first substance.
    Type: Application
    Filed: September 21, 2007
    Publication date: February 25, 2010
    Applicant: OSAKA UNIVERSITY
    Inventors: Kazuyoshi Itoh, Takayuki Tamaki