Abstract: A tape dispenser includes base plate, a handle, a tape reel and a cutting assembly. The cutting assembly includes a base, a cutter with a blade at an end, a shield, a shield base and a wiper plate. The shield is moved between a first position, in which the shield covers the blade of the cutter to protect users from hurt by the cutter, and a second position, in which the shield exposes the blade of the cutter to cut a tape off. The wiper plate has an elastic member with an end urging the shield toward the first position. No independent spring is included to reduce a number of elements and a cost of manufacture.

Abstract: A laminate sheet material punching method, in which a part of a cover sheet is punched from a laminate sheet material including the cover sheet which has an adhesive film formed at one surface thereof and is adhered to a recording side of a disk substrate of an optical disk via the adhesive film, a strip-off sheet adhered to a surface of the adhesive film on the cover sheet and a protective sheet adhered to the opposite surface of the cover sheet, in a shape corresponding to a shape of the recording side of the disk substrate, the laminate sheet material punching method includes the steps of: pressing a punching blade whose blade tip extends along a path corresponding to the peripheral edge of the recording side of the disk substrate, against the surface of the strip-off sheet; cutting the strip-off sheet and the cover sheet with the punching blade.

Abstract: In a method and apparatus for producing a plate-type insulation support provided with an adhesive layer for a gradient coil for a magnetic resonance device, an adhesive film forming the adhesive layer is used, which has a number of openings distributed over its surface to allow the passage of air and which is applied to the insulation support.

Abstract: A wafer protection tape cutting apparatus comprises: a chuck on which a wafer is held, the chuck being rotatable at a predetermined speed and being movable up and down; a protection tape supply unit for supplying a protection tape to be attached onto a top side of the wafer and to cover an upper part of the chuck; a light irradiation unit for irradiating light to harden a bonding agent of the protection tape, along an outer circumference part of the wafer; and a tape cutting unit for cutting the protection tape positioned at the outer circumference part of the wafer. The present invention also provides back lapping equipment having the wafer protection tape, and a wafer protection tape cutting method using the wafer protection tape cutting apparatus.

Abstract: A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.

Abstract: An automatic tape dispenser for automatically dispensing and cutting a length of adhesive tape or other spooled material having adhesive on one or both sides stored on a roll by a user operating the dispenser single-handedly is provided, the dispenser comprising a housing including a cylindrical post for loading and receiving the roll of tape, at least one drive wheel for advancing the roll of tape, means for preventing the tape from jamming, and means for safely cutting the tape comprising a pair of scissor-like blades disposed at the opening of the housing through which the tape is dispensed.

Abstract: Apparatus for applying adhesive tape to an article having first and second surfaces to be securely joined together by the adhesive tape. The apparatus includes a gripper (11) which draws tape T from a reel R. A cutter assembly (14) is operable to cut the tape T to a required length. The length of tape is held by suction on grids (16). The grids (16) are moveable to a lowered position to enable the length of tape T to be transferred to application arms (21) and thereby be positioned adjacent the first and second surfaces. Applicating heads (30) are operable to press an area of the tape onto the first and second surfaces. Relative movement between the applicating heads (30) and the surfaces cause the tape to become adhered to and join the first and second surfaces.

Abstract: Devices and methods for inflating and sealing packaging pillows from a material web are shown for consistently producing high-quality packaging pillows. A web of material is advanced past an inflation nozzle, inflated with gas, and sealed closed by a sealing element. The temperature of the sealing element is monitored using a thermocouple connection and automatically adjusted using a closed-loop system. A sealing clamp parallel to the sealing element maintains two sheets of the web in contact through the sealing step. The inflation nozzle is provided with two inflation outlets: a first outlet inserting gas longitudinally into the web of material, and a second outlet inserting gas laterally into the material. Gas input is controlled with the use of relief valves to maintain pillow quality at all stages of production.

Abstract: A process for the manufacture of veneer comprises gluing board-like, plane pieces of wood together with an adhesive to form a beam-like block of wood. The humidity content of the beam-like block of wood is increased. Veneer is cut from the beam-like block of wood and dried until the humidity content is below a fiber saturation point. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.

Abstract: In apparatus for mechanically bonding and cutting an article during assembly thereof at least a portion of the article is transported through a nip defined by first and second members. A bonding segment is disposed on one of the first and second members and a cutting segment separate from the bonding segment is also disposed on one of the first and second members. The apparatus is operable so that a portion of the article is mechanically bonded as the article passes through the nip and a portion of the article separate from the bonded portion is cut as the article passes through the nip.

Abstract: The present invention relates to a processing apparatus, such as a laminator, for performing operations involving effecting adhesive bonding on substrates.

Abstract: Plastic tubes are welded by first placing the plastic tubes across aligned tube slots in a pair of side by side tube holders. The tubes are clamped to create a fluid free area. The clamps in one of the tube holders are shifted laterally away from the other tube holders to increase the fluid free area of each tube. A cold cutting device cuts through the clamped tubes to create four stub ends. The four stub ends are heated/melted. The stub ends are realigned so that the one stub end in one holder is aligned with the other stub end of the other tube holder and the realigned stub ends are pressed into contact with each other to create a weld seam.

Abstract: A grinding unit grinds an annular convex portion formed at an outer periphery of a back face of a wafer such that the wafer has a uniform thickness. After such process, a robot arm of a transport unit transports the wafer to an inspection unit for inspecting occurrence of damage at the wafer. Then, the robot arm transports the wafer without damage to a mount frame preparation unit. Herein, the wafer is joined to a ring frame through a dicing tape, and then a protective tape is separated from a front face of the wafer. Thus, a mount frame is prepared.

Abstract: This invention relates to an end supporting plate which can be attached to both ends of cylindrical ingot. By wire saw cutting, semiconductor wafers are sliced from the ingot attached with the end supporting plates. The end supporting plate has an elongated support surface. Maximum width of the support surface along a direction perpendicular to an axial direction of the plate is smaller than the length along the axial direction. The length of the support surface is approximately similar to a diameter of the ingot to which the end support plate is to be attached, whereas maximum width of the support is smaller than the diameter of the ingot.

Abstract: An end of a sheet drawn out form a feeder is clamped by a pair of upper and lower clamping devices of two or more pairs. The sheet is drawn out from the initial position to the end position in a spread state. While the spread sheet is being tentered on pin tenters, another pair of upper and lower clamping devices at the end position is separated from each other and moved along the respective rails into the initial position. The end of the sheet drawn out from the feeder is clamped from above and below at the initial position with the upper and lower clamping devices that has returned to the initial position.

Abstract: A system for removing chips from a web is disclosed, the system having a rotationally variable speed shoe for receiving a chip, a rotationally constant speed transfer roll for receiving a portion of a web from a die and anvil system, with the shoe initially rotating at a constant speed, slowing to allow a portion of the web to rip away from the chip at a leading rotational edge of the chip, next increasing in rotational speed to allow the chip to rip away from the web at a trailing rotational edge of the chip.

Abstract: A device for manufacturing pieces of composite material by means of laying, cutting and hot forming operations comprising two same tables (11, 13) configurable with a planar upper surface (41) or with an upper surface (43) with the shape of the piece to be manufactured and means for generating a vacuum in the closed space on it; an automatic laying head (15) supported by means (19) allowing its displacement on said tables (11, 13) and a cutting head (17) associated to the same; and a tool (21), also displaceable on said tables (11, 13) including a forming membrane (25) and heating means (27). The invention also comprises a process for manufacturing pieces of composite material by means of laying, cutting and hot forming operations carried out on a same device.

Abstract: A system may include singulation of a semiconductor wafer to separate a plurality of integrated circuit die that are integrated into the semiconductor wafer; coupling of a support to an integrated circuit substrate of one of the plurality of integrated circuit die, and decoupling of the one integrated circuit die from the singulated semiconductor wafer while the support is coupled to the integrated circuit substrate. According to some embodiments, a second side of the one integrated circuit die is not touched during the coupling and the decoupling, the second side being opposite to the integrated circuit substrate.

Abstract: Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.

Abstract: The invention provides a water blocking tape for use in a variety of cable designs, such as power cable, data communications cable and telecommunications cable. A water blocking tape according to the invention includes layers of lightweight nonwoven fabric with one or more swellable water blocking compounds, such as water absorbent polymers, disposed between the layers. The nonwoven fabric layers are bonded in a pattern using an ultrasonic bonding technique. The bonding pattern helps to contain and to restrain movement of the water blocking compounds between the layers. The bonding pattern compartmentalizes the water blocking compounds to prevent pooling of the compounds and to facilitate a substantially consistent distribution of the compounds between the layers such that when a tape contacts water, the tape achieves a substantially consistent swell height.

Abstract: The invention relates to a wood-gluing system enabling the continuous production of glued pieces of lumber for panels and the like. The system includes a deck, a horizontal displacement system for advancing lumber across the deck, a braking system, a one-way clamping system and an upstream pressure system. The system may be used in conjunction with finger-jointing processes or with single pieces of lumber and may be used for the production of both furniture grade and construction grade wood products to NLGA and NGRC standards.

Abstract: A web is dispensed from a roll and includes first and second bands adjoining along a fold line. A pattern of release is applied to the front side of the web along the first band, and a pattern of adhesive is applied to the front side of the web along the second band. The web is folded along the fold line to bond together the first and second bands in a laminate, and exposing back sides of the bands on opposite sides of the laminate. The second band is cut to define a removable label therein.

Abstract: A semiconductor manufacturing apparatus includes: a peeling mechanism to peel a pressure sensitive adhesive (PSA) tape from a semiconductor wafer constituted by a plurality of semiconductor chips which are separated therefrom, the semiconductor wafer having an element formation surface to form an element thereon and a rear surface opposite to the element formation surface, the PSA tape adhering to the element formation surface of the semiconductor wafer, each of the semiconductor chips having an adhesive layer formed on the rear surface; wherein the peeling mechanism has a sucking section which have a porous member to hold the semiconductor wafer by suction, the porous member being segmented into at least two sucking areas in the direction in which the PSA tape is peeled.

Abstract: A process and device for manufacturing a primary unit pack of a wafer. A laminate comprising a carrier sheet and an active substance film is cross-cut at a predetermined length, detached from the carrier sheet, guided between two packaging material webs and, conveyed to a sealing station along with the packaging material webs. The packaging material webs are sealed to form a bag that is separated from the webs. The process includes detaching the carrier sheet from the active substance film, pulling the carrier sheet forward over the predetermined length of the wafer, simultaneously guiding the active substance film, which has been detached from the carrier sheet, without mechanical stress, the front end being between the packaging material webs which are in a resting condition, and is received and fixed by packaging material webs and transversely cut to form a wafer.

Abstract: A vacuum forming machine and a method of manufacturing a duplex twin-sheet element from two continuous webs of thermoplastic material conveyed in parallel by means of a twin-sheet frame provided therebetween, which is adapted to be loaded by means of a tensioning frame for creating closed machine chambers with the material web sections to be shaped, provides for the aspect that the twin-sheet frame is provided with a front frame section in the front along the conveying direction of said material webs, which frame section can be removed for de-moulding said twin-sheet element. The material webs are conveyed in a cycled operation when the twin-sheet frame is not loaded and open in the conveying direction, and for forming a twin-sheet element, the twin-sheet frame is closed and loaded by the tensioning frame.

Abstract: A label applicator for cutting labels to be applied to objects such as newspapers, letters, or flat mailpieces. The label applicator includes a movable blade and a fixed blade for cutting a label from label material fed through the label applicator. The fixed blade may be located on a cutting assembly via registration pins. The label applicator may include a paddle for applying the label to an object. The applicator may be incorporated into a mail processing system and controlled by various controllers.

Abstract: A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11a; and (b) cutting a portion of the plate 11a with the protective layer 12a formed thereon other than an outer edge portion of the protective layer 12a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.

Abstract: A sheet slitter winder that uses a sheet slitter to slit a wide sheet into a plurality of sheets of predetermined width, and winders to wind the slit sheets onto winding cores. Touch rollers contact the winding rolls. Temporary sheet-holding means have a sheet-retaining plate that can be contacted with and separated from the touch rollers and can temporarily hold a slit sheet against an outside peripheral surface of a touch roller at a point upstream of a point of contact between a touch roller and a roll. Cutting means are used to cut widthwise across the slit sheets thus held in place.

Abstract: Machine for manufacturing mesh bags from a continuous roll of tubular mesh, and for filling and closing said mesh bags, which comprise an expansion device which is perimetric to the tubular mesh, the core expander of which is equipped with a vertical aperture which, as if it were a slot, traverses said core expander and connects the two frontal faces thereof and extends from its base to an intermediate point, for which the core expander adopts an inverted “U” shape, the machine also being fitted with preventive welding means, adapted for partially welding the two frontal faces of the tubular mesh and, as the case may be, the adjoining laminates of thermally weldable material through the aperture of the core expander; a traction device which drags a section of the tubular mesh provided with a bottom; conveyor means; and second and third filling and closing stations, respectively, both being arranged linearly.

Abstract: A method and system for manufacturing a consolidated cellulosic article having first and second surfaces of a desired contour, a uniform density and variable caliper and basis weight are disclosed. The method and system employ a primary press having first and second similarly contoured platens to consolidate a mat of cellulosic material and a binding agent to a softboard having first level of density with first and second opposed sides of similar contour. A removal tool is then employed to remove cellulosic material from one or both of the first and second sides in a planar fashion. The resulting mat is then compressed a second time by a secondary press having first and second platens corresponding in shape to a higher density level while maintaining a substantially uniform caliper and basis weight.

Abstract: The invention provides a tape dispenser system, apparatus, and method for dispensing strips of tape used for masking or tacking. The tape dispenser includes a frame, attachment/securement means, a quick release locking expandable tape hub expansion member mechanism for removably securing a tape roll to the expandable tape hub, and a user preference adaptable tape cutter assemblage for easily accommodating left-handed and right-handed users. The cutter assembly of the invention includes at least one heavy duty blade for increased ease of cutting a plurality of types of tapes.

Abstract: An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member 28 is placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member 28. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.

Abstract: An apparatus for breaking a perforation of a moving web includes a web conveyor adapted to move a web in a machine direction, wherein the web has at least one perforation, and at least one breaking member moveable between a first position and a second position. The at least one breaking member is adapted to be positioned remote from the at least one perforation at the first position and is adapted to be positioned adjacent the at least one perforation at the second position. A tensioning device is adapted to sufficiently tension the web against the at least one breaking member such that the at least one perforation is broken. A system and method for breaking a perforation of a moving web is also provided.

Abstract: An apparatus is arranged to successively make plastic bags each of which has a shape of circumference. The apparatus comprises web feeding means by which a web material is intermittently fed for a length along a longitudinal feeding path. The web material comprises two or more layers of plastic film. Web cutting means is disposed along the feeding path. The web cutting means has a shape corresponding completely or incompletely to the shape of circumference of plastic bag so that the web material can be cut into the shape of circumference of plastic bag by the web cutting means whenever the web material is intermittently fed and temporarily stopped, to successively make the plastic bags with a waste kept continuous. The web cutting means comprises partially cutting means. The plastic bag has an upstream edge along which the web material is partially cut by the partially cutting means so that the plastic bag can be kept connected with the waste at the upstream edge of plastic bag.

Abstract: An apparatus is provided for connecting ends of wires. Ends of wires (a, a?) to be connected are placed linearly on a base plate (11). An adhesive tape (t) is placed on an auxiliary plate (12) near the base plate (11). A movable plate (33) then is moved transverse to the wires (a, a?) to roll the wires (a, a?) onto the tape (t) and to wind the tape (t) around the wires (a, a?). The movable plate (33) then is moved back after winding of the tape (t) to untwist the wires (a, a?).

Abstract: Two pieces of weatherstripping are spliced together by cutting a defined amount of a sealing element from a first piece of weatherstripping leaving an exposed backing, then overlapping a second piece of weatherstripping over the exposed portion of backing of the first piece of weatherstripping, and then ultrasonically welding the backing of the first piece of weatherstripping to the backing of the second piece of weatherstripping.

Abstract: Devices and methods for inflating and sealing packaging pillows from a material web are shown for consistently producing high-quality packaging pillows. A web of material is advanced past an inflation nozzle, inflated with gas, and sealed closed by a sealing element. The temperature of the sealing element is monitored using a thermocouple connection and automatically adjusted using a closed-loop system. A sealing clamp parallel to the sealing element maintains two sheets of the web in contact through the sealing step. The inflation nozzle is provided with two inflation outlets: a first outlet inserting gas longitudinally into the web of material, and a second outlet inserting gas laterally into the material. Gas input is controlled with the use of relief valves to maintain pillow quality at all stages of production.

Abstract: A machine for the manufacture of inflated plastic dunnage and other fluid filled units is disclosed. In a disclosed and pictured dunnage embodiment, the machine includes a hollow shaft rotatably mounted on a frame. In the preferred embodiment the shaft is solid. With either embodiment a drive is operably connected to the shaft for causing the shaft to rotate about its axis and a drum mounted on the shaft to rotate with the shaft. The drum is in the form of a pair of closely spaced discs having perimetral, cylindrically contoured sealing surfaces for support and, in cooperation with driven metal belts, transport of a web being formed into dunnage units. Sets of heating and cooling shoes having spaced arcuate surfaces are complementally positioned adjacent the drum surfaces with the cooling shoes downstream from the heating shoes in the direction of dunnage formation rotation. A nozzle is mounted generally tangentially of the drum at a location midway between the discs.

Abstract: An apparatus for printing and applying tape. A preferred embodiment of the invention provides an apparatus that includes a printer for printing on tape, a tape puller that pulls the printed tape out from the printer, and an applicator that applies the printed tape to an object. The present invention also generally relates to methods of printing and applying tape to objects.

Abstract: A substrate processing apparatus includes a frame, first and second supply rolls and a substrate processing assembly including a resiliently deformable structure configured to apply pressure to the first and second supply rolls to perform a substrate processing operation. A method for processing a substrate includes providing first and second supply rolls rotatably mounted to the substrate processing apparatus, wherein at least one of the first and second supply rolls has pressure-sensitive adhesive provided thereon. The selected substrate is enabled to be fed in a substrate receiving opening with the first and the second substrates positioned on opposing sides thereof. The first and second substrates are advanced through the substrate receiving opening. A resiliently deformable structure deforms to apply pressure to the selected substrate and the first and second substrates as they are advanced through the substrate receiving opening, thereby bonding the adhesive to the selected substrate.

Abstract: A protective hand covering for adhering to the user's hand. Pressure-sensitive adhesive is applied to the back surface of a sheet of thin flexible film, which is shaped to cover a protected area of the users hand. The pressure-sensitive adhesive provides a sufficiently strong bond to prevent the hand covering from being inadvertently dislodged, but a sufficiently weak bond to allow the hand covering to be removed without injuring the user. The film is sufficiently impervious to contaminates to prevent the transfer of contaminates from the substance or object being handled to the user and vice versa.

Abstract: An apparatus for manufacturing fiberglass-reinforced sheet is shown as including a feed mechanism feeding a sheet, whereby the sheet forms the upper mold surface for the fiberglass-reinforced sheets. The fed sheet moves longitudinally through a gel coating sprayer, and through applicators to apply resin in fiberglass. An automatic roller mechanism rolls the fiberglass strands into the resin and an automatic pressure mechanism applies pressure to wooden sheets placed on top of the fiberglass strands to form continuously fed completed sheet.

Abstract: A cutter apparatus (20), comprises a rotary cutter (26) having an axis of rotation (28) and an outer peripheral, [circumferential] rim surface (30). A cutter array having at least one cutter die (32) can be located on the rim surface (30), and the cutter die (32) can have a die perimeter (34) and a die height (36). A resilient, primary insert (38) can be joined to the rotary cutter (26), and can be located within the die perimeter (34) operatively adjacent to said die perimeter (34). The primary insert (38) can have a primary-insert perimeter (40), and an operatively high-resistance to deformation.

Abstract: A system and method for rupturing an encapsulated adhesive in a sheet media uses an activator unit. This unit can include one or more of the following: a pressure roller, a pair of pressure rollers, an activator blade, a set of rotatable discs or a series of sets of rotatable discs. A sheet media having an encapsulated adhesive is fed past the activator unit in the system and method whereby the capsules will be ruptured. A feeder, label printer, cutter and label applicator can also be provided in this system.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: A label applicator for cutting labels to be applied to objects such as newspapers, letters, or flat mailpieces. The label applicator includes a movable blade and a fixed blade for cutting a label from label material fed through the label applicator. The fixed blade may be located on a cutting assembly via registration pins. The label applicator may include a paddle for applying the label to an object. The applicator may be incorporated into a mail processing system and controlled by various controllers.

Abstract: A device and method for producing individual folded labels having miter folded tabs includes a first cutting station for partially cutting the ribbon of labels to form a tab at each edge of the ribbon of labels and an interior base cut. The ribbon of label remains intact at a pair of connection points separating the tabs. The tabs are folded at an angle to produce a miter fold at a folding station. A second cutting station ultrasonically cuts the miter folded ribbon of labels along the connection points to subdivide the ribbon of labels into separate, individual folded labels.

Abstract: A method is disclosed for securing a flexible covering about a frame having a peripheral edge and at least one corner. A portion of the flexible covering is folded over the peripheral edge of the frame at or about the corner and an excess portion of the covering is provided. Ultrasonic welding is used to create a seam of contacting portions of the flexible covering. In an embodiment, the excess portion of the flexible covering is removed in connection with the welding operation. An apparatus for securing a flexible covering about a frame is also provided.

Abstract: A device for placing a ply on a substrate surface includes a vacuum manifold assembly configured for attachment to a vacuum source and a substrate seal configured to provide a substantially gas impermeable interface with the substrate surface. This device further includes a ply seal configured to provide a substantially gas impermeable interface with the ply. In this manner, vacuum applied to the vacuum manifold assembly depressurizes an area between the ply and the substrate surface.