Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser and has a first pipe wall and a second pipe wall which is opposed to the first pipe wall; a porous body which is provided in the liquid pipe and is configured to guide the working fluid condensed by the condenser to the evaporator; a flow channel which is a space that is formed in the liquid pipe and guides the working fluid condensed by the condenser to the evaporator; and a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe. The porous body is disposed to be in contact with the first pipe wall.

Abstract: A cooling member includes refrigerant, an absorbing member absorbing the refrigerant, an enclosing member including flexible sheet members, that are connected to each other and enclosing the refrigerant and the absorbing member in a sealed state, and a heat releasing section configured to receive heat from the enclosing member and release the heat to an outside.

Abstract: An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.

Abstract: Embodiments described herein disclose a vapor chamber including a thermally-conductive evaporator wall, a thermally-conductive condenser wall and a volume therebetween defining a vapor core for transporting a vapor of a working fluid from the evaporator wall to the condenser wall. The outer surfaces of the evaporator wall and the condenser wall are configured to be in thermal contact with a plurality of heat sources and a heat sink respectively. The vapor chamber further includes a porous wick structure for holding and pumping the working fluid towards the plurality of heat sources. The wick structure comprises an evaporator-feeding wick having an inner surface in thermal contact with an inner surface of the evaporator wall. The evaporator-feeding wick comprises a first region having a higher permeability than at least a second region to form a permeability gradient, such that the working fluid has a uniform flow to the plurality of heat sources.

Abstract: A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.

Abstract: An electric motor (1) is provided, preferably an internal rotor motor, having a housing (3) which is enclosed on all sides, except for a bushing for a drive shaft (2). A stator (5) is arranged in the housing, and is connected to a wall (3a) of the housing (3) in a thermally-conductive manner, wherein, externally to the wall (3a), a plurality of projections (6) are provided, which are oriented essentially parallel to the drive shaft (2), and wherein, externally to the housing (3), a fan wheel (8) is arranged on the drive shaft (2), the vanes (8a) of which, upon a rotation of the drive shaft (2), considered longitudinally to said drive shaft (2), pass over at least one region, in which region the projections (6) are arranged, such that a cooling air stream (KLS) is generated along the projections (6).

Abstract: A loop-type heat pipe includes: an evaporator; a condenser; a liquid pipe; and a vapor pipe. The evaporator is formed by layered metal layers that include: a first outermost metal layer; a second outermost metal layer; and an inner layer. The inner layer includes: a first metal layer adjacent to the first outermost metal layer; and a second metal layer adjacent to the second outermost metal layer. At least one space and a porous member are provided in the inner layer. The first metal layer is formed with a first bottomed groove. The second metal layer is formed with a second bottomed groove. One end of the space corresponds to a portion of the first metal layer where the first bottomed groove is formed. The other end of the space corresponds to a portion of the second metal layer where the second bottomed groove is formed.

Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.

Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.

Abstract: A vapor chamber that includes a housing defining an internal space, a first pillar arranged in the internal space of the housing to support the housing from the internal space, a working medium enclosed in the internal space of the housing, and a wick arranged in the internal space of the housing, the wick having a portion of a first main surface thereof supported by the first pillar so as to be spaced from the housing, and a thickness of the wick is partially different along a cross-section thereof.

Abstract: A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.

Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.

Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.

Abstract: The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.

Abstract: A passive heat exchanger includes an evaporator section including a heat exchange surface formed complementary to a surface of a gas turbine engine component to be cooled. The heat exchange surface is configured to be thermally coupled in conductive contact to the component surface. The heat exchanger further includes a condenser section coupled in passive convective flow communication with the evaporator section, and a working fluid contained within the evaporator section and the condenser section and configured to passively convect heat from the evaporator section to the condenser section.

Abstract: A circuit card assembly (CCA) is disclosed. In embodiments, the CCA includes a printed circuit board (PCB) comprising a series of adjacent substrate layers. Evaporator layers include an evaporator surface thermally connected to CCA components and capable of absorbing heat therefrom. A series of wall layers include apertures collectively defining an integrated vapor chamber extending between the evaporator layers and condenser layers including a condenser surface opposite the evaporator surface. A working fluid within the vapor chamber is boiled by heat transferred from the evaporator surface and re-condenses at the condenser surface, which transfers heat from the working fluid. The re-condensed working fluid is transitioned back to the evaporator surface via capillary wick structures within the internal surfaces of vapor chamber.

Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

Abstract: An image forming system includes an image forming unit configured to form a toner image on a recording material; a fixing device configured to fix the toner image on the recording material on which the toner image is formed by the image forming unit; a first cooling unit capable of cooling the recording material passing through the fixing device; a second cooling unit capable of cooling the recording material passing through the first cooling unit; and a control unit configured to carry out control so that during execution of an image forming job, the image forming job is stopped when both the first cooling unit and the second cooling unit are out of order and is continued when only one of the first cooling unit and the second cooling unit is out of order.

Abstract: Methods for preparing a heat pipe are provided. The methods may include forming a metal foam on a surface of a first metal sheet using a slurry, placing the first metal sheet on a second metal sheet, and bonding outer portions of the first and second metal sheets. The surface of the first metal sheet faces the second metal sheet.

Abstract: A liquid pipe has a flow path provided in a stacked body of a plurality of metal layers. The plurality of metal layers includes a first metal layer configuring an upper wall surface of the flow path, a second metal layer configuring a lower wall surface of the flow path, and an intermediate metal layer stacked between the first metal layer and the second metal layer and configuring right and left wall surfaces of the flow path. The porous body includes a first porous body having first and second bottomed holes and fine pores provided in the first metal layer, and a second porous body having first and second bottomed holes and fine pores provided in the second metal layer. The porous body is not provided in the intermediate metal layer.

Abstract: A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.

Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to liquefy the operating fluid, a liquid pipe configured to interconnect the evaporator and the condenser, a steam pipe configured to interconnect the evaporator and the condenser and to form a loop together with the liquid pipe, a porous body provided in the liquid pipe and configured to retain therein the liquid operating fluid, and a solid columnar support provided in the liquid pipe and configured to guide the operating fluid liquefied by the condenser to the porous body. At least one first groove is formed at a side surface of the columnar support.

Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.

Abstract: A vapor chamber excellent in productivity, reduction of a number of components, and capable of preventing reduction in area of a cavity section while reducing a space of an outer periphery of the cavity section in which a working fluid is sealed is provided. An example vapor chamber has a container in which a cavity section is formed by stacked plate-shaped members, a working fluid that is sealed in the cavity section, and a wick structure accommodated in the cavity section.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: Embodiments of the invention relate to vaporizer systems including two-phase heat transfer devices for vaporizing liquids and methods of using the same.

Abstract: A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.

Abstract: A loop heat pipe includes a metal layer stack of outermost metal layers and intermediate metal layers. The metal layer stack includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe connecting the evaporator to the condenser, and a liquid pipe connecting the condenser to the evaporator. The vapor pipe includes two pipe walls defining a flow passage of the vapor pipe and joint beams arranged at different positions along the flow passage. Each of the joint beams joins the two pipe walls to each other. Each of the intermediate metal layers includes one of the joint beams. Each of the joint beams includes a side surface that is inclined.

Abstract: A cooling device includes an evaporator. The evaporator includes a housing having a reserver, a wick and a groove member having a plurality of vapor flow channels through which the working fluid changed in phase from the liquid phase to the vapor phase flows. The groove member is constituted by alternately stacking two or more first metal plates coupled to the wick and two or more second metal plates disposed at a larger distance from the wick than that of the first metal plate. One vapor flow channels is formed between the first metal plates adjacent to each other at the wick side of the groove member. A dimension along the first direction is larger than a dimension along the second direction in a cross-sectional surface of the vapor flow channel when viewing the groove member along a direction perpendicular to both the first direction and the second direction.

Abstract: A polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber, a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and a plurality of housing wall spacers, such as support posts, extending between the two housing walls to maintain the two housing walls in a spaced-apart configuration with the working fluid chamber extending in between is provided. Also described is a polymer-based heat transfer device comprising a polymer-based housing having housing walls defining a working fluid chamber and a porous structure extending in the working fluid chamber from at least one of the two opposed ones of the housing walls, and heat-conductive metal or ceramic-based foam contacting at least one of the housing walls. A process for manufacturing the polymer-based heat transfer device is provided.

Abstract: A heat insulating structure body comprising: a container which includes a first plate-like body, a second plate-like body facing the first plate-like body, a partition plate for dividing a space between the first plate-like body and the second plate-like body, a first cavity part formed by the first plate-like body and the partition plate, and a second cavity part formed by the second plate-like body and the partition plate, wherein a wick structure body and a working fluid are sealed in the second cavity part.

Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.

Abstract: A thermal conditioning assembly includes a casing having a first casing portion, a second casing portion and a partition intermediate the casing portions, peripheries of each of the casing portions and the partition united so as to delimit hermetically sealed first and second casing chambers. The first chamber is characterized by the first casing portion and a first surface of the partition and includes a phase change media and wicking structure, heat spreading from a heat source adjacent thereto thusly effectuated. The second chamber, characterized by the second casing portion and a second surface of the partition, dissipates heat from the first chamber. Segments of the second casing portion and the partition are selectively united so as to form one or more baffles which delimit coolant channels. The second chamber includes first and second coolant connectors for coolant ingress and egress in furtherance of circulating coolant through the second chamber via said coolant channels.

Abstract: An electrical connector cage assembly includes a connector casing, a heat-dissipating structure, and a light-guiding part. The heat-dissipating structure is disposed on an outer side wall of the connector casing and includes a base portion and a plurality of fins protruding from the base portion and extending parallel to each other and the base portion. One of the fins protrudes relative to the base portion longer than another one, so that an accommodating space is formed above the shorter fin and extends parallel to the fins. The light-guiding part is disposed above the heat-dissipating structure. A light-guiding rod body of the light-guiding part is accommodated in the accommodating space. An electrical connector uses the electrical connector cage assembly. An electronic apparatus includes the electrical connector and an apparatus casing. A light-output portion of the light-guiding part is disposed toward a light-permeable structure of a panel of the apparatus casing.

Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.

Abstract: A sensor system for attaching a sensor set-up to a vehicle, including the sensor set-up having a housing and a sensor; a connecting assembly mountable to the vehicle, the sensor set-up being fastened to the connecting assembly, the sensor set-up being adjustable by at least one degree of freedom with respect to the connecting assembly; and at least one heat pipe, which connects the sensor set-up and the connecting assembly in a thermally conductive manner.

Abstract: The present application relates to an active radiator with omnidirectional air convection and a stage lighting fixture using the same. The active radiator includes a radiator body provided with heat dissipation channels and a heat transfer assembly which is at least partially transversely arranged inside the radiator body and in form of an integrity therewith. The present application of simple structure and convenient in use can achieve efficient heat dissipation through omnidirectional active heat dissipation of the stage lighting fixture, and can also reduce overall costs and is easy to install.

Abstract: Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.

Abstract: A process for manufacturing a semiconductor device and the resulting structure are presented. In an embodiment a source/drain region is grown. Once grown, the source/drain region is reshaped in order to remove facets. The reshaping may be performed using an etching process whereby a lateral etch rate of the source/drain region is larger than a vertical etch rate of the source/drain region.

Abstract: Described herein are systems and methods for the generation of electric current and/or electric potential utilizing micro- or nano-channels and capillary flow, including fluidic or microfluidic batteries and electrochemical cells. The provided systems and methods use capillary force to promote fluid flow through micro- and nano-fluidic channels by evaporating fluid at one terminus of the channel, and the resulting fluid flow generates electric potential and or current. Advantageously, the described systems and methods remove the need for pressurized vessels or external pumps, increasing net energy generation and decreasing complexity and size of potential fluidic batteries.

Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Abstract: A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.

Abstract: A heat dissipation unit includes a main body and a mesh body. The main body has an upper plate and a lower plate. The upper and lower plates are correspondingly overlapped and mated with each other to together define an airtight chamber. A working fluid is contained in the airtight chamber. One face of the lower plate, which faces the airtight chamber, is formed with a capillary structure by means of laser processing. The mesh body is attached to the face of the lower plate with the capillary structure. By means of the mesh body, the liquid working fluid backflow efficiency of the capillary structure can be enhanced and the water content of the internal evaporation section of the heat dissipation unit can be increased to avoid dry burn.

Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

Abstract: An apparatus, system and method to remove purified vapor from a contaminated fluid using energy. The apparatus comprises an inlet wherein contaminated fluid flows in the apparatus through the inlet; at least two outlets wherein a first outlet exits purified vapor and a second outlet wherein contaminated fluid with a portion removed as purified vapor exits the apparatus; an energy source that causes the contaminated fluid to heat to a temperature wherein at least a portion of the contaminated fluid is converted to purified vapor; at least two different flow paths from at least one inlet to the first outlet and second outlet, the first and second flow paths flow through at least a portion of the apparatus wherein differences causes the lighter purified vapor to take a different path than the heavier contaminated with the purified vapor exiting the first outlet and the contaminated fluid exiting the second outlet.

Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.