Utilizing Capillary Attraction Patents (Class 165/104.26)
  • Patent number: 10200187
    Abstract: In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 5, 2019
    Assignee: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
    Inventors: Hui Xu, Sanjeev Gupta, Bob Ritter
  • Patent number: 10184729
    Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: January 22, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Tatsuro Miura, Tomoki Yanagida
  • Patent number: 10151542
    Abstract: According to an embodiment of the disclosure, an encapsulated phase change material (PCM) heat sink is provided. The encapsulated PCM heat sink includes a lower shell, an upper shell, an encapsulated phase change material, and an internal matrix. The internal matrix includes a space that is configured to receive the encapsulated phase change material. Thermal energy is transferrable between the encapsulated phase change material and at least one of the lower shell and the upper shell. For a particular embodiment, the upper shell is coupled to the lower shell at room temperature and room pressure.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: December 11, 2018
    Assignee: Raytheon Company
    Inventor: Adam C. Wood
  • Patent number: 10144534
    Abstract: Disclosed is a spacecraft including:—a housing defining an inner space and an outer space, the housing having a first surface and a second surface opposite the first surface; a first radiator and a second radiator supported by the first surface and the second surface, respectively, the first radiator and the second radiator each having a main inner surface, a main outer surface opposite the main inner surface and side surfaces. The spacecraft further includes a first auxiliary radiator and a first auxiliary heat-transfer device thermally connecting the first auxiliary radiator to the main inner surface of the second radiator, the first auxiliary radiator being arranged in a first portion of the outer space, the first portion being defined by the main outer surface of the first radiator and by the first planes containing the side surfaces of the first radiator.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 4, 2018
    Assignee: AIRBUS DEFENCE AND SPACE SAS
    Inventor: Fabrice Mena
  • Patent number: 10149408
    Abstract: A liquid immersion bath for an electronic device includes: a bath body that is capable of housing the electronic device, is coupled to a circulation path through which a liquid coolant which cools the electronic device immersed in the liquid coolant circulates, and includes a gas phase portion corresponding to a space free from the liquid coolant; and a container that is disposed in the gas phase portion and has a volume which changes in accordance with a pressure of the gas phase portion, wherein an inside of the container is coupled to an outside of the bath body.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: December 4, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Shinnosuke Fujiwara, Hideo Kubo
  • Patent number: 10119767
    Abstract: A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a membrane separator in fluid receiving communication with the condenser. Gas exiting the membrane separator may recirculate back to the condenser and liquid exiting the membrane separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: November 6, 2018
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Gary A. Adamson, Wei-Lin Cho
  • Patent number: 10107558
    Abstract: A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: October 23, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 10101099
    Abstract: A radiator, comprising at least one heat conductive layer with pyrolytic graphite material and an in-plane heat conductivity of at least 500 W/m·K. The radiator further comprises at least one heat emission layer that is in contact with the heat conductive layer, wherein the emission layer has an exposed surface with an emissivity of at least 0.7. The radiator is to be used in combination with a space vehicle structure, and due to its flexible character may be conformed to the particular shapes of such structure.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 16, 2018
    Assignee: Airbus Defence and Space Netherlands B.V.
    Inventor: Bruin Benthem
  • Patent number: 10100520
    Abstract: The panel unit includes a first panel, a second panel facing the first panel with a space provided therebetween the first panel and the second panel, a partition separating the space from a surrounding space, and a switching mechanism. The switching mechanism is located in the space for allowing a change in thermal conductivity between the first panel and the second panel. The switching mechanism includes at least one connector which is thermally conductive, and is switchable between a first state in which the at least one connector is out of contact with the first panel or the second panel and a second state in which the at least one connector is in contact with both the first panel and the second panel.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: October 16, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hiroyuki Abe
  • Patent number: 10082340
    Abstract: A heat pipe structure includes a main body. The main body has a first board body, a second board body, a capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other to hold the capillary structure. The capillary structure is formed with at least one passage. One of the first and second board bodies is formed with a protrusion section protruding toward the capillary structure. The protrusion section is attached to the capillary structure in adjacency to the passage. Accordingly, the heat pipe structure has an extremely thin thickness.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: September 25, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Kuo-Chun Hsieh
  • Patent number: 10068833
    Abstract: A heat module includes a fan, a heat sink, a heat transfer member, and a plurality of connection portions. The heat transfer member includes a lower surface capable of being in thermal contact with a heat source, and an upper surface thermally connected to the heat sink, and is arranged to overlap with at least a portion of the fan in a plan view. The plurality of connection portions are arranged between the heat transfer member and the housing to define an axial gap between an upper surface of the heat transfer member and a lower surface of the lower plate portion. The heat transfer member includes a heat source contact portion arranged on a side, closer to the fan, of an end portion of the fan at which the air outlet is defined.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: September 4, 2018
    Assignee: NIDEC CORPORATION
    Inventors: Takehito Tamaoka, Koji Hatanaka, Kiyoto Ida
  • Patent number: 10066876
    Abstract: Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: September 4, 2018
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University
    Inventors: Feng Zhou, Ercan M. Dede, Mehdi Asheghi, James W. Palko, Kenneth E. Goodson
  • Patent number: 10060768
    Abstract: A measurement transducer having a sensor for converting a physical or chemical variable into an electrical signal which can be further processed, and an electronics unit proximate the sensor, for pre-processing the electrical signal and generating a measurement signal, wherein an evaluation device is connected to the receiver by an interface for transmitting the measurement signal and serves to determine a measurement value as a function of the measurement signal and output the measurement value, and so that the sensor can be operated at a relatively high temperature and the electronics unit arranged proximate the sensor, for reducing measurement noise is operable at a relatively low temperature, the electronics unit proximate the sensor, is provided with a thermal insulation with respect to the sensor and is cooled by a heat pipe, and where the evaluation device housing approximately at ambient temperature preferably serves as a heat sink.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: August 28, 2018
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stefan Klehr, Herbert Schorb, Stefan von Dosky
  • Patent number: 10062664
    Abstract: A semiconductor packaging device includes: a first chip disposed separately from the first chip on a substrate; a second chip disposed on the substrate, wherein the first chip and the second chip comprise a first heat energy producing rating and a second heat energy producing rating, respectively, the first heat energy producing rating is different from the second heat energy producing rating; and a heat sink arranged in thermal communication with the first chip and the second chip, wherein the heat sink is arranged to have a first slot configured substantially along a separation region between the first chip and the second chip.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: August 28, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Cheng-Chieh Hsieh
  • Patent number: 10054995
    Abstract: Thermal management devices and systems, and corresponding manufacturing methods are described herein. A thermal management device includes a plate having a first surface. The first surface partially defines a chamber of the thermal management device. The thermal management device also includes capillary features disposed on the plate, and walls having a first end and a second end. The walls are disposed on the plate and extend away from the first surface of the plate, at the first end, to the second end. The walls partially define the chamber of the thermal management device. The thermal management device also includes a layer of material disposed on the walls, at the second end of the wall. The layer of material partially defines the chamber.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: August 21, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Kurt Jenkins, Andrew Douglas Delano, Lincoln Ghioni, Jeffrey Taylor Stellman
  • Patent number: 10048015
    Abstract: A liquid-vapor separating type heat conductive structure includes a vapor chamber, a heat pipe, a separation plate, and a working fluid. The vapor chamber includes a housing and a cavity. The housing includes a bottom plate and an upright plate. A first capillary structure is disposed on an inner surface of the bottom plate, and a through hole is formed on the upright plate. The heat pipe includes a pipe body and a second capillary structure. The pipe body includes an open end, the open end of the pipe body is inserted and sealingly connected to the through hole. The separation plate is disposed at the open end and covers the first capillary structure and the second capillary structure, so as to form a vapor passage and a liquid passage at two sides of the separation plate respectively. The working fluid is filled inside the cavity.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: August 14, 2018
    Assignee: TAIWAN MICROLOOPS CORP.
    Inventor: Chun-Hung Lin
  • Patent number: 10041745
    Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions varying according to a fractal relationship. According to one embodiment, a noise spectrum due to fluid flow is wideband. According to another embodiment, surface boundary layers are disrupted to increase heat transfer. Flow-induced vortices may be generated at non-corresponding locations of the plurality of fractally varying heat exchange elements.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: August 7, 2018
    Assignee: FRACTAL HEATSINK TECHNOLOGIES LLC
    Inventor: Alexander Poltorak
  • Patent number: 10035603
    Abstract: An aircraft provided with at least one piece of aeronautic equipment, the equipment (25) including a part intended to be arranged at a skin (27) of the aircraft and elements for heating the part, characterized in that the heating elements include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator (14) associated with functional elements (70) of the aircraft forming a heat source giving off heat during their operation and a zone in which a condensation of the heat transfer fluid can occur in the appendage to heat it, and in that outside the evaporator, the circuit in which the fluid circulates is formed by a tubular channel with an empty section.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 31, 2018
    Assignee: THALES
    Inventors: Claude Sarno, Romain Hodot
  • Patent number: 10038353
    Abstract: A dual-rotor electric rotating machine includes a stator and first and second rotors that are arranged with the stator interposed therebetween. The stator includes a stator core, at least one stator winding and a stator core support. The at least one stator winding is formed of a plurality of electric conductor segments each of which is substantially U-shaped to have a base and a pair of end portions. The electric conductor segments are received in slots of the stator core so that the end portions of the electric conductor segments are located on the same side of the stator core as the stator core support and the bases of the electric conductor segments are located on the opposite side of the stator core to the stator core support. Each corresponding pair of the end portions of the electric conductor segments are electrically connected with each other.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: July 31, 2018
    Assignee: DENSO CORPORATION
    Inventor: Shin Kusase
  • Patent number: 10036596
    Abstract: A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: July 31, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10036599
    Abstract: A thermal energy storage assembly characterized by a housing having first and second chambers characterized by first and second phase-change media, respectively, is generally provided. The housing includes first and second housing portions and a partition structure, the housing portions and the partition structure united about their peripheries via an ultrasonic weldment so as to delimit the housing chambers. The second housing chamber includes condenser and evaporator chamber portions or segments. The partition structure and the second housing portion are selectively united via ultrasonic weldment in furtherance of forming tensioning elements within same. A wicking structure and spacing element reside within the second housing chamber to aid phase-change of the second phase change media.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: July 31, 2018
    Assignee: Minco Products, Inc.
    Inventors: Russell H. Strehlow, Peter M. Bobgan
  • Patent number: 10032561
    Abstract: A heat pipe cooled capacitor includes a capacitor body having opposing first and second ends and an opening defined between the opposing ends. A first heat pipe is thermally and electrically connected to the first end of the capacitor body. A second heat pipe is positioned at least partially through the opening of the capacitor body. The second heat pipe is thermally connected to the second end of the capacitor body, and electrically isolated from the first heat pipe.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: July 24, 2018
    Assignee: ELECTRONIC CONCEPTS INC.
    Inventors: Bernard Lavene, Joseph Bond
  • Patent number: 10031564
    Abstract: An apparatus is disclosed that includes a heat pipe. The heat pipe includes a heat dissipation section arranged to dissipate heat using a fan. The heat pipe further includes a heat absorption section arranged to absorb heat from a heat source of an electronic device. The heat pipe further includes a heat dissipation medium disposed inside the heat pipe. The apparatus further includes a driving member coupled to the heat pipe and configured to drive the heat dissipation medium to flow circularly inside the heat pipe.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: July 24, 2018
    Assignee: Lenovo (Beijing) Limited
    Inventors: Zizhou Jia, Ying Sun, Zhigang Na
  • Patent number: 10018079
    Abstract: A vehicle includes an engine having an exhaust system, and a heat pipe containing a phase change material. The heat pipe has a condenser region and an evaporative region in thermal contact with the exhaust system, and defines a vapor space and a liquid space separated by a wicking layer. The vehicle has an expander, a condenser, a pump, a first heater, and a second heater in sequential fluid communication in a thermodynamic cycle containing a working fluid. The first heater is in thermal contact with exhaust gases in the exhaust system. The second heater is in thermal contact with the condenser region of the heat pipe.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: July 10, 2018
    Assignee: Ford Global Technologies, LLC
    Inventor: Shiguang Zhou
  • Patent number: 10018428
    Abstract: Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: July 10, 2018
    Assignee: Raytheon Company
    Inventors: David H. Altman, Joseph R. Wasniewski, Anurag Gupta
  • Patent number: 10012446
    Abstract: A vapor chamber includes an upper casing, a lower casing, a support member, a wick material and a working fluid. The support member is formed of a plurality of ribs connected with each other, and a plurality of surrounded spaces are formed and regularly arranged between the ribs. Each rib has an upper abutting end and a lower abutting end. By the interconnection of the upper abutting ends and the lower abutting ends of the ribs, the ribs are inclined and each has a relatively higher end and a relatively lower end, so that a plurality of subspaces are respectively formed under the body of each rib close to the upper abutting end and above the body of each rib close to the lower abutting end, and the subspaces are in communication with the surrounded spaces between the ribs.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: July 3, 2018
    Assignee: ACMECOOLS TECH. LTD.
    Inventor: Chi-Te Chin
  • Patent number: 10002819
    Abstract: A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion. The module lid is thermally interfaced to a die by use of a thermal interface material. The heat sink is then screwed onto a module lid, where the heat sink includes a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: June 19, 2018
    Assignee: International Business Machines Corporation
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann
  • Patent number: 9993023
    Abstract: An electronic smoking article includes a liquid supply region including liquid material and a heater-wick element operable to wick liquid material and heat the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol. The heater-wick element comprises two or more layers of electrically resistive mesh material.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: June 12, 2018
    Assignee: Altria Client Services LLC
    Inventors: Christopher S. Tucker, Geoffrey Brandon Jordan
  • Patent number: 9999157
    Abstract: A device that includes a region comprising an integrated device and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a first condenser configured to condense the fluid, where the first condenser is located in a first wall of the device, an evaporation portion coupled to the evaporator and the first condenser, and a collection portion coupled to the first condenser and the evaporator. The evaporation portion is configured to channel an evaporated fluid from the evaporator to the first condenser. The collection portion is configured to channel a condensed fluid from the first condenser to the evaporator through the help of gravity.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: June 12, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Victor Chiriac, Jorge Rosales, Jon Anderson, Stephen Molloy
  • Patent number: 9994784
    Abstract: A reactor for grinding and roasting biomass, including: a chamber interiorly delimited with internal walls; a grinder laid out inside the chamber, including a central rotary shaft rotatably mounted in the chamber and grinding elements present on the central rotary shaft for grinding against internal walls and of biomass, or lingo-cellulosic biomass, present inside the chamber; a heater for heating and maintaining by thermal conduction via the grinder the biomass present inside the chamber, at a predetermined called roasting temperature between 200° C. and 350° C., to simultaneously achieve grinding and roasting of the biomass in the chamber.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: June 12, 2018
    Assignee: Commissariat á l'ènergie atomique et aux ènergies alternatives
    Inventor: Thierry Chataing
  • Patent number: 9975639
    Abstract: A piece of aeronautic equipment intended to equip an aircraft, the equipment piece (25) including at least one part intended to be arranged at a skin (27) outside of the aircraft and heating elements for that part, which include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator and a zone in which condensation of the heat transfer fluid can occur in the appendage to heat it, outside the evaporator, the circuit in which the fluid circulates is formed by a tubular channel with an empty section, at least the part of the piece of equipment arranged outside the aircraft is made by additive manufacturing and includes a fastening base (120) for fastening on the skin of the aircraft from which support elements (130) for a Pitot tube (140) provided with lateral static pressure taps (150) extend.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 22, 2018
    Assignee: THALES
    Inventors: Romain Hodot, Claude Sarno, Frederic Martin, Adrien Desjardins, Jean-Philippe Pineau
  • Patent number: 9970714
    Abstract: Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: May 15, 2018
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Feng Zhou
  • Patent number: 9964363
    Abstract: Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: May 8, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Erin Hurbi, Joe Taylor
  • Patent number: 9968013
    Abstract: The invention relates to a switch cabinet with a cooling apparatus which has a first closed coolant circuit and a second closed coolant circuit separated fluidically from the first coolant circuit, the first coolant circuit having a refrigerating machine or a cold water set and the second coolant circuit having a heat pipe arrangement.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: May 8, 2018
    Assignee: Rittal GmbH & Co. KG
    Inventor: Juan Carlos Cacho Alonso
  • Patent number: 9964314
    Abstract: The present invention relates to a trigeneration energy supply system having improved cooling and system use efficiency. The trigeneration energy supply system according to one embodiment of the present invention can comprise: a vacuum pump; a vacuum chamber inside which a vacuum is created by the vacuum pump; a condensed water storage tank positioned higher than the vacuum chamber, and prepared so as to store condensed water formed when steam generated by evaporating water brought inside the vacuum chamber is transferred to the inside of the tank by the vacuum pump; a cooling pipeline arranged to pass through the inside of the vacuum chamber cooled during the water evaporation and prepared to deliver cool air to a cooling load; and a small hydroelectric power generation system for generating electrical power by allowing the condensed water stored in the condensed water storage tank to be poured from at least the height of the condensed water storage tank.
    Type: Grant
    Filed: January 20, 2014
    Date of Patent: May 8, 2018
    Assignee: Korea Institute of Energy Research
    Inventors: Yong Hoon Im, Jae Yong Lee, Dong Hyun Lee
  • Patent number: 9958214
    Abstract: A capillary-driven heat transfer device, adapted to extract heat from a heat source and to release this heat to a cold source by means of a two-phase working fluid, includes an evaporator, having a microporous mass adapted to perform capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, and a liquid communication circuit connecting the outlet of the condenser to the reservoir and to the inlet of the evaporator. The reservoir includes multiple separate volumes that remain in fluid communication.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: May 1, 2018
    Assignee: EURO HEAT PIPES
    Inventor: Vincent Dupont
  • Patent number: 9953895
    Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: April 24, 2018
    Assignees: STMICROELECTRONICS SA, STMICROELECTRONICS (CROLLES 2) SAS
    Inventors: Pascal Ancey, Simon Gousseau, Olga Kokshagina
  • Patent number: 9945613
    Abstract: Systems and methods are presented for efficient heating during production of corundum. One embodiment takes the form of a system for processing corundum including a first furnace and a second furnace. The first and second furnaces are sequentially arranged and heat from the first furnace is subsequently used to heat the second furnace.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: April 17, 2018
    Assignee: APPLE INC.
    Inventors: Christopher D. Prest, Dale N. Memering
  • Patent number: 9943992
    Abstract: An apparatus may comprise a tool capable of holding a part during curing of the part, and a passive temperature control system. The passive temperature control system may have a phase change material selected as having a phase change temperature that may be capable of controlling heat generated by the part during curing of the part held by the tool.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: April 17, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Karl M. Nelson, Geoffrey Allen Butler
  • Patent number: 9938024
    Abstract: An object redirection system may generate a high-resolution three-dimensional map of a surface of a target. Based on the map, the system may identify locations on the target's surface and direct energetic pulses toward the target at the locations. The system may continuously update the map of the target and continue emitting pulses at the target with reference to the map in order to achieve a desired velocity of the target within a desired timeframe.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 10, 2018
    Assignee: Board of Trustees of the University of Alabama, for and on behalf of the University of Alabama in Huntsville
    Inventor: Richard Fork
  • Patent number: 9933212
    Abstract: A heat pipe having a wick structure for efficiently returning working fluid to an evaporating portion is provided. The heat pipe comprises a container 2 sealed at its both ends, a working fluid encapsulated in the container, and a wick structure 10 covering an inner face of the container. The wick structure 10 includes a porous wick 11 of a sintered metal powder, and a fiber wick 12 buried in the porous wick. A capillary pressure of the fiber wick 12 is weaker than that of the porous wick 11, and a pressure loss of the fiber wick 12 is smaller than that of the porous wick 11.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: April 3, 2018
    Assignee: FUJIKURA LTD.
    Inventors: Thanhlong Phan, Yuji Saito, Masataka Mochizuki
  • Patent number: 9921004
    Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: March 20, 2018
    Assignee: KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ryan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
  • Patent number: 9909814
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: March 6, 2018
    Assignee: KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 9897392
    Abstract: A heat conduction device and a manufacturing method thereof are provided. The heat conduction device includes a first plate, a second plate and a capillary structure. The first plate is connected opposite to the second plate. The capillary structure is formed on space between the first plate and the second plate. A vapor channel is formed on a region of the space outside the capillary structure.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 20, 2018
    Assignee: YEH-CHIANG TECHNOLOGY CORP.
    Inventor: Tai-Kuang Wang
  • Patent number: 9879924
    Abstract: A heat switch includes a heat sink, a coolant tube, and an actuator. The coolant tube is movable with respect to the heat sink. The actuator couples between the heat sink and the coolant tube and configured to move the coolant tube between a first position and a second position. Heat flow from the coolant tube into the heat sink is greater in the second position than in the first position for enhanced heat transfer from the coolant tube.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: January 30, 2018
    Assignee: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: Gregory Quinn, Mark A. Zaffetti, James R. O'Coin
  • Patent number: 9880595
    Abstract: The present invention is notably directed to a cooling device, e.g., for computer hardware. The device comprises a deformable, outer chamber, having at least one thermally conducting section, the latter suited for thermally contacting a heat source of a computer hardware. The outer chamber is deformable upon a pressure increase therein. The cooling device further comprises at least one inner chamber nested in the outer chamber, the inner chamber expandable in volume upon a pressure increase therein. The invention is further directed to a computer hardware apparatus comprising such a cooling device, or stacks of such cooling devices paired with respective set of electronic components.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: January 30, 2018
    Assignee: International Business Machines Corporation
    Inventors: Thomas Brunschwiler, Ingmar Meijer, Bruno Michel, Stephan Paredes, Gerd Schlottig
  • Patent number: 9865365
    Abstract: Disclosed is a decay heat removal system for cooling the decay heat of a reactor core and the spent fuel. The decay heat removal system including: a first heat pipe which is placed in an upper plenum of the reactor vessel and arranged in upward and downward directions corresponding to a position of an insertion hole formed on a top of the nuclear fuel assemblies; a control rod drive mechanism which is connected to an upper portion of the first heat pipe and drives the first heat pipe to move up and down so that the first heat pipe can be selectively inserted in a control rod insertion hole of the reactor core arranged in the nuclear reactor vessel; and a second heat pipe which is coupled to and in close contact with a bottom surface of the reactor vessel and removes the decay heat generated in the reactor core.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: January 9, 2018
    Assignee: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: In Cheol Bang, Ji Hyun Kim, Seong Dae Park, Sarah Kang, Han Seo, Kyoung-Mo Kim, Sung Bo Moon, Seok Bin Seo, In Guk Kim, Yeong Shin Jeong, Hyo Heo
  • Patent number: 9867316
    Abstract: A cooling apparatus is provided for a switchgear. The switchgear has one or more primary contacts constructed and arranged to connect to a terminal of a circuit breaker. The cooling apparatus includes an evaporator constructed and arranged to be associated with each primary contact. A condenser is located at a higher elevation than the evaporator. Fluid conduit structure fluidly connects the evaporator with the condenser. A portion of the fluid conduit structure defines a busbar tube electrically connected with an associated primary contact and defining a busbar of the switchgear. Working fluid is in the evaporator so as to be heated to a vapor state, with the fluid conduit structure being constructed and arranged to transfer the vapor to the condenser and to passively return condensed working fluid back to the evaporator for cooling the at least one primary contact and the associated busbar tube.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: January 9, 2018
    Assignee: ABB Schweiz AG
    Inventors: Patrik Kaufmann, Tilo Buehler, Gabriel Schuler, Peter Unternaehrer
  • Patent number: 9859574
    Abstract: A compressed air cooling apparatus of a fuel cell system is provided that includes i) a heat absorber installed at a first part of an air supplying system which supplies compressed air of a first compressed by an air compressor to a fuel cell stack, ii) a heat radiator installed at a second part of a stack cooling system which cools a coolant circulating to the fuel cell stack, iii) a heat pipe which connects the heat absorber and the heat radiator and is filled with the refrigerant therein, wherein the heat absorber is disposed at a lower position than the heat radiator for the refrigerant to flow from the heat radiator to the heat absorber.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: January 2, 2018
    Assignee: Hyundai Motor Company
    Inventors: Yong Gyu Noh, Minkyu Lee, Sekwon Jung
  • Patent number: 9849993
    Abstract: An aircraft provided with at least two pieces of aeronautic equipment, a first piece of equipment (25) including a part intended to be arranged at a skin (27) of the aircraft and elements for heating the part, characterized in that the heating elements include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator (14) associated with functional elements (80) of the second piece of equipment (81) of the aircraft forming a heat source giving off heat during their operation and a zone in which a condensation of the heat transfer fluid can occur in the appendage to heat it, and in that outside the evaporator (14), the circuit in which the fluid circulates is formed by a tubular channel with an empty section.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: December 26, 2017
    Assignee: THALES
    Inventors: Claude Sarno, Romain Hodot