Utilizing Capillary Attraction Patents (Class 165/104.26)
  • Patent number: 9366482
    Abstract: Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: June 14, 2016
    Assignee: INTEL CORPORATION
    Inventors: Jin Yang, David Shia
  • Patent number: 9358915
    Abstract: A storage assembly for a vehicle includes a housing having an outlet formed at a rear end thereof, a cooling and heating cup holder installed in the housing and having a thermoelectric element attached to a side end surface thereof, a convenience device disposed to be adjacent to a side of the thermoelectric element in the housing and including a storage tray or an electrical control switch, a heat exchange pin and a blower disposed at the outlet side of the rear end of the housing, and a heat pipe having one end connected to the thermoelectric element and the other end extended to turn aside or traverse the convenience device and connected to the heat exchange pin.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: June 7, 2016
    Assignees: HYUNDAI MOTOR COMPANY, KBAUTOTECH CO., LTD.
    Inventors: Man Ju Oh, Jae Woong Kim, Jae Woo Park, Jae Hoon Kim
  • Patent number: 9315280
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 19, 2016
    Assignee: Lockheed Martin Corporation
    Inventors: Jay H. Ambrose, Rolland Holmes
  • Patent number: 9303927
    Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: April 5, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Patent number: 9291398
    Abstract: A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: March 22, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Fu-Kuei Chang
  • Patent number: 9273909
    Abstract: An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: March 1, 2016
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chun-Ming Wu
  • Patent number: 9250025
    Abstract: A heat transfer device comprising at least an aggregate of fibers or sheet of fibres (60) with internal passages and holes capable of capillary transport of liquids capable of capillary convection of coolant fluid from a heat source region (54) to heat dissipation region (56) and vice versa. A supply of coolant fluid in sufficient amount is provided to be absorbed or contained by said fibers or sheet of fibers (60) with internal passages and holes capable of capillary transport of liquids. A pressure tension member (70) comprising a strong yet resilient structure placed within said confined space and exerting pressure on said aggregate of fibers or sheet of fibers (60) with internal passages and holes capable of capillary transport of liquids against said heat source region (54) and/or heat dissipation region (57).
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: February 2, 2016
    Assignee: NEXCHIP TECHNOLOGIES
    Inventor: Jeong Hyun Lee
  • Patent number: 9242064
    Abstract: A heater wire including at least one extending component disposed thereon. The heater wire is positioned within a respiratory gas conduit.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: January 26, 2016
    Assignee: CareFusion 207, Inc.
    Inventors: Andre M. Rustad, Neil Korneff
  • Patent number: 9242288
    Abstract: A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: January 26, 2016
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Patent number: 9230878
    Abstract: An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: January 5, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Anthony E. Baker, Stephen J. Flint, Jian Meng
  • Patent number: 9205220
    Abstract: A heater wire for removing condensation from a respiratory gas conduit. The heater wire includes at least one groove disposed thereon. The heater wire is positioned in a respiratory gas conduit.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: December 8, 2015
    Assignee: CareFusion 207, Inc.
    Inventors: Neil Korneff, Christopher M Varga
  • Patent number: 9200852
    Abstract: An evaporator may include an outer enclosure and a wick within the outer enclosure. The wick may have an outer lateral side surface positioned adjacent to the outer enclosure and may comprise a plurality of circumferential grooves formed in the outer lateral side surface of the wick and a plurality of channels fluidly connected to the plurality of circumferential grooves. The evaporator may include an outer enclosure and an end cap bonded directly to the outer enclosure, contacting the wick, and having a thermal conductivity that is less than the thermal conductivity of the outer enclosure.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: December 1, 2015
    Assignee: Orbital ATK, Inc.
    Inventors: Edward J. Kroliczek, Dmitry Khrustalev, Michael J. Morgan
  • Patent number: 9188398
    Abstract: A generally planar, conformable evaporative structure, particularly for incorporation in a garment or an item of personal protective equipment as part of a system to cool the wearer's body, includes an envelope of substantially impermeable, flexible material containing: a layer of flexible wick material disposed adjacent to a major face of the envelope and adapted to hold a working fluid in liquid phase for evaporation by heat conducted through the envelope; a layer of flexible, breathable fabric in parallel with the layer of wick material; and an array of flexible ribs such as open helical coils within the layer of breathable fabric adapted to maintain pathways for the flow of working fluid in vapor phase towards a condensation zone.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: November 17, 2015
    Assignee: QINETIQ LIMITED
    Inventors: Robert Anthony Freeman, Rajinder Singh
  • Patent number: 9184363
    Abstract: Disclosed is a generator. The generator in accordance with an embodiment of the present invention includes: a thermoelectric element, which creates an electromotive force by using a temperature difference between a high-temperature portion and a low-temperature portion; a heat source, which is thermally coupled to the high-temperature portion and transfers heat to the high-temperature portion; and a vibrating capillary-shaped heat-pipe, which has a working fluid injected therein, is thermally coupled to the low-temperature portion, and discharges heat of the low-temperature portion. The generator in accordance with the present invention can increase an efficiency of power generation using the thermoelectric element by employing a highly exothermic vibrating capillary-shaped heat-pipe to maintain the temperature difference required for power generation.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: November 10, 2015
    Assignee: Icepipe Corporation
    Inventor: Sang-Cheol Lee
  • Patent number: 9179577
    Abstract: Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: November 3, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventor: Seok Hwan Moon
  • Patent number: 9175912
    Abstract: Methods for fabricating heat pipes and heat pipes therefrom are provided. The heat pipe (400) includes a heat pipe body (402) having an inner cavity (408), and a wick structure (404) disposed in the inner cavity. The wick structure includes a first woven mesh layer (410) and a second woven mesh layer (412) disposed on the first woven mesh layer. In the heat pipe, the first woven mesh layer is a first weave pattern of thermally conductive fibers (103) having a first warp direction (W3 or W4) and the second woven mesh layer is a second weave pattern of thermally conductive fibers (105) having a second warp direction (W5 or W6). The second woven mesh layer is disposed on the first woven mesh layer such that the first and the second warp directions are rotationally offset by an inter-layer warp offset angle (?i).
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: November 3, 2015
    Assignee: Harris Corporation
    Inventor: Mark A. Trautman
  • Patent number: 9170058
    Abstract: A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: October 27, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chun-Ming Wu
  • Patent number: 9163883
    Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: October 20, 2015
    Assignee: KEVLIN THERMAL TECHNOLOGIES, INC.
    Inventors: Ronggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen-Hau Cheng, George P. Peterson
  • Patent number: 9146058
    Abstract: A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The condensing unit includes a thermal capacitance device and a condenser integrated with the thermal capacitance device. Methods of forming a thermal storage unit include preparing a honeycomb core to receive a phase change material, metallurgically bonding end pieces to the core, to thermally link the end pieces to the core, and bonding the end pieces together to form a seal for holding the phase change material within the core.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: September 29, 2015
    Assignee: ORBITAL ATK, INC.
    Inventors: David C. Bugby, Edward J. Kroliczek, Jessica Maria Kester
  • Patent number: 9103602
    Abstract: A two-phase heat transfer system includes an evaporator, a condenser, a vapor line, and a liquid return line. The evaporator includes a liquid inlet, a vapor outlet, and a capillary wick having a first surface adjacent the liquid inlet and a second surface adjacent the vapor outlet. The condenser includes a vapor inlet and a liquid outlet. The vapor line provides fluid communication between the vapor outlet and the vapor inlet. The liquid return line provides fluid communication between the liquid outlet and the liquid inlet. The wick is substantially free of back-conduction of energy from the second surface to the first surface due to an increase in a conduction path from the second surface to the first surface and due to suppression of nucleation of a working fluid from the second surface to the first surface to promote liquid superheat tolerance in the wick.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: August 11, 2015
    Assignee: Orbital ATK, Inc.
    Inventors: Edward J. Kroliczek, Kimberly R. Wrenn, David A. Wolf, Sr.
  • Patent number: 9097470
    Abstract: An internal liquid separating hood-type condensation head exchange tube, comprising an external heat exchange tube and an internal liquid separating hood disposed in the cavity of the external heat exchange tube and coaxial with the external heat exchange tube. The internal liquid separating hood is a hollow tube with a plurality of micropores or gaps distributed on a wall surface. The condensate formed during the heat exchange is pumped to the internal liquid separating hood in time under the effect of surface tension of the liquid via the micropores or gaps, and then is discharged from the heat exchange tube by the internal liquid separating hood. Vapor is retained to flow in the annular region between the external heat exchange tube and the internal liquid separating hood, so the inner wall of the external heat exchange tube comes into contact with the vapor to the greatest extent.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: August 4, 2015
    Assignee: NORTH CHINA ELECTRIC POWER UNIVERSITY
    Inventors: Hongxia Chen, Jinliang Xu, Wei Wang
  • Patent number: 9074824
    Abstract: A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: July 7, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Chun-Ming Wu
  • Patent number: 9061382
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: June 23, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Robert E. Simons
  • Patent number: 9052147
    Abstract: A loop heat pipe structure includes an evaporator and a first pipe. The evaporator has a first chamber, a first wick layer, and a bottom. The first wick layer is provided in the first chamber. The first pipe includes a first inlet and a first outlet communicably connected to the evaporator. The first inlet internally defines a second chamber communicable with the first wick layer. By providing the second chamber outside the evaporator, the evaporator can have a reduced overall height without creating very high vapor pressure in the evaporator, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: June 9, 2015
    Assignee: Asia Vital Components (Shen Zhen) Co., Ltd.
    Inventors: Jun Xiang, Xiao-Xiang Zhou
  • Publication number: 20150136363
    Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.
    Type: Application
    Filed: January 20, 2014
    Publication date: May 21, 2015
    Inventor: Tsung-Hsien Huang
  • Publication number: 20150138830
    Abstract: The present invention provides a heat dissipation pipe loop and a backlight module using the heat dissipation pipe loop. The heat dissipation pipe loop includes: a first evaporator section (2), a second evaporator section (4) arranged opposite to the first evaporator section (2), a first pipe (6), a second pipe (8) arranged opposite to the first pipe (6), and a heat dissipation liquid arranged in the first pipe (6) and the second pipe (8). The first pipe (6) includes a first gas pipe (62) connected to the first evaporator section (2), a first condenser pipe (64) connected to the first gas pipe (62), and a first liquid pipe (66) connected to the first condenser pipe (64) and the second evaporator section (4). The second pipe (8) includes a second gas pipe (82) connected to the second evaporator section (4), a second condenser pipe (84) connected to the second gas pipe (82), and a second liquid pipe (86) connected to the second condenser pipe (84) and the first evaporator section (2).
    Type: Application
    Filed: November 28, 2013
    Publication date: May 21, 2015
    Inventor: Gang Yu
  • Patent number: 9033027
    Abstract: A heat transfer device including a container in which a heat-transfer fluid circulates in a closed loop. The heat transfer fluid is capable of undergoing an increase in volume on solidifying. The container further contains particles suspended in the heat-transfer fluid. At least some of the particles are compressible under the pressure of the fluid, as the fluid is solidifying, so as to at least partially compensate for the increase in volume of the fluid upon solidifying.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 19, 2015
    Assignee: THALES
    Inventors: Christian Tantolin, Claude Sarno
  • Publication number: 20150129177
    Abstract: A plate heat pipe includes a hollow housing formed in a plate shape and a flat-plate type capillary structure. The flat-plate type capillary structure includes a capillary boundary part and a plurality of primary capillary transportation parts; wherein the capillary boundary part is surroundingly arranged at the periphery of a vaporization portion of the plate heat pipe, and a hollow vapor flowing zone is defined between the capillary boundary part and the vaporization portion. Each of the primary capillary transportation parts is disposed in the vapor flowing zone and extended from the capillary boundary part to the vaporization portion so as to be respectively gathered on the vaporization portion.
    Type: Application
    Filed: December 6, 2013
    Publication date: May 14, 2015
    Inventor: Hao PAI
  • Patent number: 9027347
    Abstract: A solar collector (26) includes: an outer tube (64) of circular cross-section, closed at one of its ends, an absorption layer (52) arranged inside the outer tube (64), for absorbing solar radiation (Rs), and a heat pipe (56) including a hot part (58) laid out inside the outer tube (64), a cold part (60) arranged outside the outer tube (64), and a reservoir (62) containing a heat pipe fluid (63) and extending over the hot part (58) and the cold part (60). The outer tube (64) is hermetically closed around the heat pipe (56) at the other of its ends, a vacuum being formed inside said outer tube (64). For the hot part (58) of the heat pipe (56), the reservoir (62) is applied at least locally against the absorption layer (52).
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: May 12, 2015
    Assignees: Sophia Antipolis Energie Developpement, Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Jean-Antoine Gruss, Christian Lenôtre, Alain Marechal, Didier Rossi, Michel Wohrer
  • Publication number: 20150124399
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Application
    Filed: February 26, 2014
    Publication date: May 7, 2015
    Applicant: ACER INCORPORATED
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20150122463
    Abstract: A heat exchanger is described and which includes a heat exchanger portion defining a multiplicity of internal passageways, and wherein at least one of the passageways is defined in part by a wicking structure; and a source of ammonia refrigerant which is supplied to the internal passageways of the heat exchanger portion, and wherein substantial equal amounts of liquid refrigerant are supplied to each of the passageways defined by the heat exchanger portion.
    Type: Application
    Filed: January 12, 2015
    Publication date: May 7, 2015
    Applicant: Colmac Coil Manufacturing, Inc.
    Inventor: Bruce I. Nelson
  • Publication number: 20150122462
    Abstract: A slim-type heat pipe includes a tube, being hollow and flat; and a wick structure, longitudinally disposed in the tube, having an attachment side attached on a local portion of an inner side of the tube and a formation side opposite to the attachment side, and a vapor passage formed between the formation side and the inner side of the tube. The wick structure is provided with grooves radially around the inner side of the tube. The attachment side is attached on the grooves. Depth of the groove is less than 30% of thickness of a wall of the tube.
    Type: Application
    Filed: December 10, 2013
    Publication date: May 7, 2015
    Inventor: Hao PAI
  • Patent number: 9021698
    Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: May 5, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Publication number: 20150114605
    Abstract: A capillary-driven heat transfer device is adapted to extract heat from a heat source and release this heat to a cold source using a two-phase working fluid. The device includes an evaporator having a microporous mass performing capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inner chamber and an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, a liquid communication circuit, and a non-return device arranged between the inner chamber of the reservoir and the microporous mass of the evaporator, and arranged to prevent liquid present in the evaporator from moving to the inner chamber of the reservoir.
    Type: Application
    Filed: September 12, 2012
    Publication date: April 30, 2015
    Applicant: EURO HEAT PIPES
    Inventor: Vincent Dupont
  • Publication number: 20150114607
    Abstract: A circuit includes an evaporator receiving heat from a hot body; a condenser transmits heat to a cold body, a working fluid flows through a first conduit in vapour phase from the evaporator to the condenser, and flows through a second conduit in liquid phase, from the condenser to the evaporator. A first evaporator portion is in fluid communication with the second conduit and acts as a compensation chamber. A second evaporator portion is in fluid communication with the first conduit and contains the vapour phase. A porous wick moves the working fluid from the first evaporator portion to the second evaporator portion. A first flow controller interrupts or allows flow when fluid temperature in the elevator is respectively lower or higher than a first threshold. A second flow controller interrupts or allows flow when the temperature in the condenser is respectively higher or lower than a second threshold.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventor: Antonio MOSCATELLI
  • Publication number: 20150114603
    Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body being hollow and flat, and a capillary structure disposed in the tube body and shaped as a thin plate. The capillary structure has a first adhering surface attaching on a partial portion of an inner wall of the tube body, a forming surface opposite to the first adhering surface, and a second adhering surface forming at one side between the first adhering surface and the forming surface. The second adhering surface is attached on the inner wall so that a vapor channel is formed between the forming surface and the inner wall; wherein the forming surface elongates along a longitudinal direction of the vapor channel, and is tapered to form an inclined interface between the capillary structure and the vapor channel as a capillary transmission surface.
    Type: Application
    Filed: December 31, 2013
    Publication date: April 30, 2015
    Inventor: Hao PAI
  • Publication number: 20150114604
    Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body which is hollow and flat, and a capillary structure which is in the tube body and is shaped as a thin plate. The capillary structure has an adhering surface attached on a partial portion of an inner wall of the tube body, and a forming surface corresponding to the adhering surface. A vapor channel formed between the forming surface and the inner wall of the tube body; wherein the forming surface further includes an abutting surface elongated along a longitudinal direction of the vapor channel and at least one capillary transmission surface extending from a side of the abutting surface to connect to the adhering surface the steam channel, and the capillary transmission surface is gradually inclined between the adhering surface and the abutting surface.
    Type: Application
    Filed: February 14, 2014
    Publication date: April 30, 2015
    Inventor: Hao PAI
  • Publication number: 20150114606
    Abstract: A heat exchanger which including a metal exchange surface having a plurality of upward extending walls forming channels between the walls. The channels are between about 5 and about 500 um in width and the walls are between about 50 and about 1000 um in height. At least one reservoir communicates with the channels and a refrigerant is position in the reservoir, the refrigerant having a boiling point of at least about 50° C. A cover is positioned above the exchange surface such that refrigerant is returned to the exchange surface.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 30, 2015
    Inventor: Leland Weiss
  • Patent number: 9013869
    Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: April 21, 2015
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Gregory Tice
  • Publication number: 20150101783
    Abstract: A thermal conductor with an ultra-thin flat wick structure (2) includes a hollow shell (1) having a flat shape, and a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (1), wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and an elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).
    Type: Application
    Filed: October 15, 2013
    Publication date: April 16, 2015
    Inventor: Hao PAI
  • Publication number: 20150103486
    Abstract: To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module. The phase change module 300 includes a jacket case 312 attached with an evaporator surface 311 with the evaporator surface 311 being arranged on a heat generating body, a radiator case 321 attached with cooling fins (radiator) 322 arranged at a position departing from the heat generating body, and a connecting plate 330 that connects the jacket case 312 and the radiator case 321, in which holes are bored in the connecting plate 330 at a position where the jacket case 312 and the radiator case 321 overlap.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 16, 2015
    Inventors: Yoshihiro KONDOU, Fumio TAKEDA, Shigemasa SATO, Shigeyasu TSUBAKI, Takayuki FUJIMOTO
  • Publication number: 20150101784
    Abstract: A heat pipe with an ultra-thin flat wick structure includes a shell and a wick structure disposed in the shell. The wick structure includes heat exchange zones and at least one liquid channel connected between the heat exchange zones which are divided into an evaporation portion and a condensation portion. Each of the heat exchange zones has a plane and a pressing surface opposite to the plane. A plurality of elongated concave surfaces are spacedly arranged on the pressing surface such that a respective steam channel is formed via each of the concave surfaces in the shell and a respective elongated wick structure connection is formed between each concave surface and the plane. Cut-out zones are formed at two sides of the liquid channel between the heat exchange zones in the shell.
    Type: Application
    Filed: October 15, 2013
    Publication date: April 16, 2015
    Inventor: Hao PAI
  • Patent number: 9004113
    Abstract: A pipe having variable cross section and including a working core pipe, capillary pipes or sheets, an outer pipe, a connection support, and a cavity. The capillary pipes or sheets are attached to an external surface of the working core pipe. The connection support connects the working core pipe and the outer pipe. The cavity is formed between the working core pipe and the outer pipe and has variable cross section.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: April 14, 2015
    Inventor: Liming Fu
  • Patent number: 8997840
    Abstract: A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: April 7, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 8997839
    Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 7, 2015
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Hsiu-Wei Yang, Ming-Tai Weng
  • Publication number: 20150090428
    Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: General Electric Company
    Inventors: Shakti Singh Chauhan, Joo Han Kim, William Harold King, Pramod Chamarthy, Tao Deng
  • Publication number: 20150083371
    Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 26, 2015
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Kuo-Chun Hsieh, Chuan-Chin Huang
  • Publication number: 20150083373
    Abstract: A capillary-driven heat transfer device, adapted to extract heat from a heat source and to release this heat to a cold source by means of a two-phase working fluid, includes an evaporator, having a microporous mass adapted to perform capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inlet and/or outlet port, a vapor communication circuit connecting the outlet of the evaporator to the inlet of the condenser, and a liquid communication circuit connecting the outlet of the condenser to the reservoir and to the inlet of the evaporator. The reservoir includes multiple separate volumes that remain in fluid communication.
    Type: Application
    Filed: September 12, 2012
    Publication date: March 26, 2015
    Applicant: EURO HEAT PIPES
    Inventor: Vincent Dupont
  • Publication number: 20150083372
    Abstract: A heat dissipation unit includes a housing and a heat pipe. The housing has a chamber in which a working fluid is contained. Multiple support posts and multiple fixing members are disposed in the chamber. The heat pipe has a heat absorption section positioned in the chamber of the housing and securely supported by the fixing members, and a heat dissipation section extending from the heat absorption section through the housing and positioned outside the chamber of the housing.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 26, 2015
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Hsiu-Wei Yang
  • Publication number: 20150083361
    Abstract: A heat transfer system including a first heat exchange assembly, a second heat exchange assembly, and a heat transfer circuit interconnecting the first and second heat exchange assemblies, the circuit incorporating a working fluid to transfer heat between the first and second heat exchange assemblies. The heat transfer circuit preferably takes the form of a closed loop heat-pipe system. The heat transfer system is operative in a first mode where the working fluid is at or below a threshold pressure and in a second mode where the working fluid is at a higher pressure than the threshold pressure. A pressure regulating device is also provided to increase the pressure of the working fluid above the threshold pressure to effect change of operation of the heat transfer system from the first mode to the second mode. Optionally the pressure regulating device is a pressure vessel having at least one heat transfer surface.
    Type: Application
    Filed: December 13, 2012
    Publication date: March 26, 2015
    Applicant: Empire Technology Development, LLC
    Inventors: John Gal, Robert Kery