Abstract: A baseplate for a temperature controlled substrate support assembly in a vacuum chamber includes a single cavity in an upper surface of the base plate. A cylindrical wall extends upward around an outer perimeter of the base plate to define the cavity. A cover plate arranged on the base plate above the cavity is in thermal contact with the cylindrical wall of the base plate. A plurality of thermoelectric modules is arranged within the cavity in the upper surface of the base plate in thermal contact with the cover plate and the base plate and is sealed from the vacuum chamber and maintained at atmospheric pressure. A plurality of fluid channels is arranged within the base plate below the cavity. A plurality of heat transfer pipes extends downward toward the fluid channels from an upper surface of the base plate within the cavity.

Abstract: In an electric power tool 1 including a motor 20, a cooling fan 24 for cooling the motor 20, a plurality of intake ports 11a through which outside air is introduced by use of said cooling fan 24, and a heating element 50 That generates heat, a heat sink 40 is disposed between the motor 20 and the intake port 11a. The heating element 50 is connected to the heat sink 40 through a heat pipe 30.

Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, a porous body provided inside a flow passage in which the working fluid or vapor thereof flows, and a vapor pipe to connect the evaporator and the condenser and form a loop-shaped passage together with the liquid pipe. The porous body includes a metal layer including a first bottomed hole that caves in from a first surface thereof, a second bottomed hole that caves in from a second surface thereof, opposite to the first surface, and a pore formed by and partially communicating the first and second bottomed holes. An inner wall surface of each of the first and second bottomed holes formed in the porous body has a concave shape formed by a curved surface.

Abstract: A vapor chamber has upper and lower casings and a wick structure therebetween. The upper and lower casings have upper and lower heat exchange chamber areas having multiple upper and lower surface features thereon, separated by multiple upper and lower vapor areas therebetween, respectively. The upper and lower heat exchange chamber areas are surrounded by walls, having flat rims, respectively. The height of the upper surface features is greater than the height of the lower surface features, whereby a top surface of the wick structure lies flush with the lower flat rim. The upper and lower heat exchange chamber areas form a vacuum chamber. An airtight sealed connection is formed at the flat rims of the surrounding walls of the upper and lower heat exchange chamber areas.

Abstract: A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

Abstract: A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.

Abstract: A vapor chamber heat spreader includes a condenser arranged at a top end of the vapor chamber heat spreader, an evaporator arranged at an opposite end to the condenser; and multi-level wick structures. The multi-level structures include a first planar wick arranged adjacent to the condenser, a second planar wick arranged adjacent to the evaporator, a plurality of condenser posts for supplying liquid condensed by the condenser, a plurality of evaporator posts for supply the liquid towards the evaporator, and a mesh layer. The mesh layer is arranged between the condenser posts and the evaporator posts and configured to separate the condenser posts from the evaporator posts. The mesh layer includes a plurality of vent holes. The mesh layer is a porous layer having high permeability.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

Abstract: A cooling arrangement may include a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system may be arranged. The dielectric fluid may be in heat-transferring contact with the power electronics system and may cool the power electronics system via a fluid movement. The fluid movement may be provided via acceleration forces acting on the cooling arrangement.

Abstract: A heat sink allowing a reduced thickness of an electronic device includes a housing, a wick structure, and a heat transfer fluid. The housing, comprising an upper housing and a lower housing, are opposite and form a sealed cavity. The wick structure and the heat transfer fluid are received in the cavity, the liquid absorbing heat and becoming gaseous upon reaching a certain temperature. The area of the upper housing is larger than the area of the lower housing. The upper housing forms a protrusion with respect to an edge of the lower housing. An electronic device using the heat sink is also provided.

Abstract: A heat pipe has a flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container, wherein in at least one cross section of the flat container, the wick structure contacts both of the pair of flat inner surfaces of the flat container, and both side faces of the wick structure do not contact any of the inner surfaces of the flat container, wherein the wick structure has a first wick part and a second wick part, respectively disposed in the lengthwise direction of the flat container, the second wick part being directly or indirectly connected to the first wick part and having a maximum width that is wider than a maximum width of the first wick part, and wherein the second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: An apparatus and process doubles the number of trays in a single fractionation column. A dividing wall is used to isolate a first side from a second side and fractionation on trays on each side is independent of the other. A transition vapor stream is ducted from a top of a first side to the bottom of the second side, and a transition liquid stream is ducted from a bottom of the second side to the top of the first side.

Abstract: An apparatus and process doubles the number of trays in a single fractionation column. A dividing wall is used to isolate a first side from a second side and fractionation on trays on each side is independent of the other. A transition vapor stream is ducted from a top of a first side to the bottom of the second side, and a transition liquid stream is ducted from a bottom of the second side to the top of the first side.

Abstract: The disclosed apparatus may include (1) a plurality of individual heatsink bases designed to interface with a plurality of removable communication modules installed on a telecommunications device, (2) a plurality of heat pipes that are thermally coupled to the individual heatsink bases, and (3) a ganged heat exchanger that is (A) mechanically coupled to the telecommunications device and (B) thermally coupled to the heat pipes. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A heat pipe has a heat receiving portion that is to be thermally connected to a heat generating member so as to absorb heat from the heat generating member. The heat pipe includes a sealed flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container. In at least one cross section of the flat container, the wick structure includes a first wick member and a second wick member disposed vertically, the wick structure also has a first wick part and a second wick part respectively disposed in the lengthwise direction of the flat container, the second wick part having a maximum width that is wider than a maximum width of the first wick part. The second wick part is disposed in the heat receiving portion of the heat pipe.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores.

Abstract: Multi-phase thermal control systems, evaporators, variable porous wick elements, heat transfer structures, and methods for their production are provided. Two-phase evaporators for use in such multi-phase thermal control systems are also provided. Two-phase evaporators incorporate a vapor plate body having there three major layers: a vapor channel network, a wick, and a liquid channel. The vapor channel network comprises a plurality of extrusions (e.g., vapor pillars) and associated channels (e.g., vapor channels) configured to allow a vapor to flow therethrough. The wick comprises a porous body configured to be disposed between the vapor channel network of and the liquid flow reservoir.

Abstract: A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.

Abstract: A phased array antenna in which a plurality of blocks each having a plurality of transmitter modules are arrayed, includes: a front plate that includes a plurality of flow paths of a refrigerant therein; and an element feeding layer that includes a plurality of antenna elements respectively connected to the transmitter modules and that is placed in close contact with one surface of the front plate. Each of the blocks includes a heat spreader that is placed in close contact with the other surface of the front plate. The transmitter modules are mounted on the heat spreader. Heat generated in the transmitter modules is transferred to the refrigerant via the heat spreader and the front plate.

Abstract: An anti-pressure structure of heat dissipation device includes a main body. The main body has a chamber and a bent section. The chamber has a top side and a bottom side. An anti-pressure member is disposed in the chamber at the bent section. A capillary structure is disposed on the bottom side of the chamber. Two sides of the anti-pressure member respectively abut against the top side of the chamber and a surface of the capillary structure. A working fluid is filled in the chamber. By means of the anti-pressure member, the internal vapor chamber with a bending R angle in the main body is prevented from deformation, contraction or damage due to bending.

Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.

Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.

Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.

Abstract: A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.

Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.

Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Abstract: An aerodynamic measurement probe comprises a part to be sited in the region of the skin of an aircraft and means for heating the part. The heating means comprise a thermodynamic loop comprising a closed circuit in which a heat-transfer fluid circulates, the closed circuit comprising an evaporator and a zone in which the heat-transfer fluid can be condensed in the appendage in order to heat it. Outside the evaporator, the circuit in which the fluid circulates is formed by a tubular duct of open cross section.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.

Abstract: Apparatus for insertion into a cavity of an object, the apparatus comprising: a first tube comprising a first end, a second end, a first cavity extending between the first end and the second end, and an aperture at the second end; a member positioned within the first cavity of the first tube and adjacent the aperture of the first tube, the member being configured to enable an action to be performed; a plug coupled to the second end of the first tube; and an actuator configured to move the first tube relative to the object between a first position in which the plug seals the member from the cavity of the object, and a second position in which the member is exposed to the cavity of the object.

Abstract: A vapor chamber includes a first panel defining an evaporation region, a thermal insulation region and a condensation region, a second panel joined to the first panel to define an enclosed accommodation space therebetween, a capillary material disposed in the accommodation space, and a working fluid. The first panel has a plurality of first bumps disposed within the accommodation space and distributed in the evaporation region, the thermal insulation region and the condensation region and abutted against the capillary material. The capillary material has a hollow portion located in the thermal insulation region to expose a part of the first bumps. The second panel has a plurality of second bumps abutted against the first bumps in the hollow portion.

Abstract: A porous aluminum heat exchanger including: a porous aluminum body in which aluminum substrates are sintered each other; and a bulk body, which is an aluminum bulk body made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, and pores of the porous aluminum body are configured to form flow channels of a heat medium.

Abstract: The instant disclosure relates to a flat heat pipe structure, which includes a flat tubing and a support member. The flat tubing has two opposed main walls and two opposed connecting walls connected thereto. The main and connecting walls cooperatively define an internal space. The inner surfaces of the flat tubing are covered with a capillary structure. The support member is disposed in the internal space of the flat tubing and has at least one support arm. The support arm extends in the longitudinal direction of the flat tubing. The support arm has two opposed surfaces abutting to the capillary structure of the main walls.

Abstract: A heat pipe that includes a pipe casing, a porous wick, and sealing members. Both end portions of the pipe casing are sealed by the sealing members, respectively. The sealing members each comprise a first metal foil and an intermetallic compound phase. The inside of the pipe casing is filled with a working fluid. The porous wick generates capillarity for the working fluid by a plurality of pores. The porous wick is provided inside the pipe casing. As a result, the pipe casing and the porous wick form a cavity extending in a longitudinal direction of the pipe casing. The porous wick comprises first metal grains, second metal grains, and an intermetallic compound phase.

Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Abstract: A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.

Abstract: A support form defining a longitudinal axis is provided. The support form includes a first section, a second substantially solid section, and at least one flow feature form. The first section includes a plurality of unit cells of a first material joined together to form a lattice. The second section includes a second material and surrounds the first section. The at least one flow feature form is defined in the second section and is configured to generate a flow feature on a heat exchanger tube formed by plating the support form.

Abstract: A cartridge for use in an aerosol-generating system is provided, including a liquid storage portion including a housing configured to hold a liquid aerosol-forming substrate, the liquid storage portion including at least two parts in fluid communication with each other; a first part of the liquid storage portion including a heater assembly, a first capillary material, provided in contact with the heater assembly, and a second capillary material in contact with the first capillary material and spaced apart from the heater assembly by the first capillary material; and a second part of the liquid storage portion including a container configured to hold the liquid aerosol-forming substrate in liquid form to supply the liquid to the second capillary material.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.

Abstract: A propulsion assembly includes an engine surrounded by a nacelle, structure for draining the fluids from the engine and structure for guiding said fluids to a retention box. The retention box is arranged outside the engine and has a cavity for storing drained fluids. The retention box is fixed to a cowling of the nacelle and supported thereby.

Abstract: A sandwich panel heat pipe with a three-dimensional ordered open-cellular micro-truss core and a method creating the same. In one embodiment, the sandwich panel heat pipe includes a first face sheet, a second face sheet, the three-dimensional ordered open-cellular micro-truss core between the first face sheet and the second face sheet, and a working fluid in the ordered open-cellular micro-truss core. Here, the three-dimensional ordered open-cellular micro-truss core includes a vapor region and a liquid region, the vapor region is for transporting a vapor phase portion of the working fluid to the liquid region, and the liquid region is for transporting a liquid phase portion of the working fluid to the vapor region.

Abstract: A heat transfer device, and methods and systems using such devices, including a major surface wall forming a bottom side of the device; a first hermetic chamber of a first design and with the surface wall forming a bottom wall of the first vapor chamber; a second hermetic chamber of a second design, positioned adjacent to the first chamber along a length of the first surface wall, and with the surface wall forming a bottom wall of the second vapor chamber. The first chamber includes a first heat transfer medium and a first wick arranged to transport the first heat transfer medium to an evaporator region of the first chamber. The second chamber includes a second heat transfer medium and a second wick arranged to transport the second heat transfer medium to an evaporator region of the second chamber.

Abstract: A heat pipe is divided into an evaporation section, an insulation section and a condensation section. The insulation section includes a pipe section and a liquid delivery structure. The pipe section has a top wall and a bottom wall. The liquid delivery structure is a solid structure and in contact with the top and bottom walls of the pipe section. The liquid delivery structure and the top and bottom walls of the pipe section form a vapor channel. The liquid delivery structure is divided into a center portion and an outer layer, and the center portion has a porosity greater than the porosity of the outer layer. The outer layer is coupled to the center portion, and the center portion and the vapor channel are spaced from one another, so as to achieve the liquid and vapor isolation and improve the heat conducting effect of the heat pipe.