Abstract: In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a target element (56) positioned in front of the structure (52). Transducers (58, 60) are positioned at opposing ends (74, 76) of the opening (62) between the structure (52) and the target element (56). The pumping device (32) drives a jet (70) of coolant through the opening (62) toward the target element (56). The transducers (58, 60) produce output signals (84, 86) that perturb the jet (70) to control oscillation of the jet (70) in order to stabilize the jet (70) for impingement with a predetermined location (96) on the target element (56). The jet (70) uniformly spreads from the location (96) to provide cooling over a surface (100) of the target element (56).

Abstract: A cooling tower system, including a principal cooling tower; an auxiliary cooling tower for receiving a portion of the warm water flow into the main tower; a central shaft mounted vertically in the auxiliary tower; a turbine mounted on a portion of the shaft; a cooling blade mounted on the upper end of the shaft; a water jetting system delivering warm water under pressure from the main cooling tower into the auxiliary cooling tower to impart rotation to the turbine blades for imparting rotation to the cooling blade; a quantity of high efficiency film fill in that portion of the tower below the turbine for receiving the water coming off of the turbine blades; air flow produced by rotation of the cooling blade upward through the fill in order to cool the water before it is returned to the main cooling tower.

Abstract: A temperature-controlled musical instrument carrying case for storing a musical instrument is provided. The musical instrument carrying case includes an insulated outer housing and an interior storage compartment that can store the musical instrument. In addition, the musical instrument carrying case includes a temperature sensitive device, a power source, a controller, and a heat-transfer device. The temperature sensitive device provides an indication of a temperature in the interior storage compartment to the controller. Based on the indication of the temperature, the controller generates and transmits a drive signal to the heat-transfer device. The heat-transfer device receives the drive signal from the controller and, based on the drive signal, at least selectively cools the interior storage compartment.

Abstract: A mounting apparatus is provided for mounting a fan in a chassis defining an exhaust opening in an end wall thereof. The mounting apparatus includes a frame adapted to receive the fan, and be inserted into or drawn out of the chassis via the exhaust opening. The frame includes at least one resilient lock plate. The at least one resilient lock plate releasably abuts against the end wall of the chassis to prevent the frame sliding out of the chassis.

Abstract: A heat dissipation device includes a heat sink, a fan mounted on the heat sink and a fan holder mounting the fan on the heat sink. The fan holder includes a fan guard resting on the fan, a first clip and a second clip pivotably attached to the fan guard and engaged with the heat sink. The first clip includes an actuating member pivotably connecting to the fan guard and a buckling member pivotably connecting to the actuating member. The buckling member has a clasp engaging the heat sink at a locked position. The buckling member moves with a pivotal movement of the actuating member relative to the fan guard to leave the locked position and reach an unlocked position.

Abstract: A heat dissipation device includes a heat sink, a plurality of fasteners extending through the heat sink, a fan holder mounted on the heat sink and a fan secured on the fan holder. The heat sink includes multiple claws to retain the fasteners therein. The fan holder includes a hoop surrounding the heat sink and a bracket supporting the fan. A plurality of sleeves are formed on the hoop and aligned with the claws of the heat sink, to thereby guide a tool to manipulate the fasteners to secure the heat sink to a printed circuit board.

Abstract: A heat dissipation apparatus (10) includes a centrifugal blower (12) and a fin assembly (11) having a plurality of fins (111) disposed at an air outlet (129) of the centrifugal blower. The centrifugal blower includes a first tongue (130) distant from the fin assembly, and a second tongue (131) located between the first tongue and the air outlet of the blower. The second tongue has an end (132) substantially parallel to the fins of the fin assembly to guide an airflow smoothly flowing through the fins.

Abstract: A sound-abating flow disruptor quiets a PTAC refrigerant system by disturbing the airflow between an energized electric heater and an adjacent fan wheel. In some embodiments, the flow disruptor is a perforated metal plate that attenuates a whistle, which appears to be caused by vortex shedding in the confined area between the energized heater and the fan. In some cases, the heater comprises selectively energizable heating elements of various wattage. The heating elements closest to the fan wheel are the lower wattage ones to minimize the heat near the fan.

Abstract: A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink and a fan holder connecting the heat sink with the fan. The fan includes a blade assembly and a frame enclosing the blade assembly. The fan holder includes a supporting portion engaging with the heat sink. A connecting plate extends upwardly from an edge of the supporting portion. A ridge extends angulately and downwardly from an inner surface of the connecting plate. An operating plate extends downwardly from a bottom end of the connecting plate. The operating plate is pressed inwardly or pulled outwardly to make the ridge of the connecting plate space from or engage with the frame of the fan.

Abstract: A centrifugal condenser in an engine has a stacked arrangement of interleaved plates surrounding a central core. Exhaust steam from the engine is directed through interior cavities of the plates while external cooling air from intake blowers circulates over outer surfaces of the plates to cool the plates and condense the steam on the opposite inner side of the plates. The water condensation is returned to a collection pan or sump for subsequent use in the engine.

Abstract: A fluid cooling device embodied as a modular unit includes a drive motor (10) driving a ventilation wheel (12) and a fluid pump (14) that supplies a first type of fluid into a fluid system, and leads to a heat exchanger (22) from which the fluid is redirected into the fluid system in a tempered manner. A second fluid pump (32) is used to extract a second type of fluid from the reservoir (30) and to supply the second type of fluid to a second fluid system, from which the second type of liquid is redirected towards the reservoir (30) in a guiding manner via the first heat exchanger (22) and the second heat exchanger (24). The second fluid pump enables different tempering operations to be carried out for separate fluid systems, using only one fluid cooling device.

Abstract: A cooling plant for cooling one or more switch cabinets. According to this invention, a large heat exchanger or several small heat exchangers operating in parallel are housed in a heat exchanger cabinet, wherein an inner space of the heat exchanger cabinet is coupled to a central air-conditioning device supplying cold air to a double bottom by an air inlet in the cabinet bottom and an air outlet of the double bottom. The cold air fed to the heat exchanger cabinet goes through the large heat exchanger or the small heat exchangers and cools the coolant flowing therein. The water supply and the water return of the large heat exchanger or the small heat exchangers are connected to the feed line and the return line of the switch cabinets that are to be cooled. This simple construction makes it possible to easily adapt the efficiency of cooling and the capacity to the variable number of switch cabinets.

Abstract: A user-operated air-flow regulating device includes a radiator enhancer and an enhancer extension situated adjacent to existing radiator fins of an existing baseboard radiator and oriented at an end-to-end pattern. The device further includes a mechanism for directing and displacing ambient air along a first travel path into respective cavities of the radiator enhancer and the enhancer extension. The enhancer extension includes an elongated fan and a coupling attached to one end thereof. Such a coupling is removably conjoined to a portion of the ambient air directing and displacing mechanism such that the ambient air is separately directed along the first travel path and thereafter displaced along the second travel path in each of the radiator enhancer and enhancer extension respectively. The user-operated air-flow regulating device further includes a mechanism for channeling the ambient air along a third travel path leading obliquely away from the second travel path.

Abstract: A system air fans integrated control apparatus for a computer system which has a plurality of heat sources and a plurality of air fans corresponding to the heat sources includes a plurality of detection units to detect the heat sources and output a plurality of temperature alteration parameter signals, a signal integration and determination circuit to receive and interpret the temperature alteration parameter signals to determine a rotation speed regulation signal, and an air fan driving circuit which is linked to the signal integration and determination circuit and an external driving power source. Upon receiving the rotation speed regulation signal the driving power of the external driving power source to the air fans is regulated synchronously. Thereby multiple heat sources are detected at the same time and multiple air fans are integrated to perform heat dissipating to reduce accumulating heat in the system environment.

Abstract: An air conditioner has: a casing 20 having an air inlet 21 and an air outlet 22; a heater 53 disposed in the casing 20 and heating air having flowed through the air inlet 21 into the casing 20; holders 54 and 55 holding the heater 53 and fitted to the casing 20; and a spacer 59 in contact with the heater 53 and disposed between the holders 54 and 55 and the heater 53. At least one of the heat-resistance and the flame-retardance of the spacer 59 is higher than that of the holders 54 and 55.

Abstract: An electronic device with a cooling system includes an enclosure. A first electronic component and a second electronic component in parallel are received in the enclosure. Air inlets are defined in a front board of the enclosure to receive cool air. A first flow of the cool air passes through a main airflow path to cool the first electronic component and the second electronic component. A second flow of the cool air passes through an auxiliary airflow path to cool the second electronic component. The main airflow path and the auxiliary airflow path are separated by a clapboard. The cool air heated by the first and second electronic components is then exhausted through the air outlets defined in a back board of the enclosure.

Abstract: A heat dissipation device includes a heat sink (10) and a blower (50) for generating an airflow to the heat sink. The blower includes a housing (60) and at least one plate (63a, 63b) extending outwardly from the housing. The housing forms a contacting surface (610, 620) abutting a side of the heat sink. The plate includes an inner surface (630) abutting another side of the heat sink. A groove (69) is defined in a junction of the housing and the plate, and thus the contacting surface of the housing and the inner surface of the plate are planar-shaped to avoid interference between the housing of the blower and the heat sink. The groove has chamfer angles R therein. The housing is made by plastic injection molding or die casting.

Abstract: An electronic device includes a first electronic component, a second electronic component adjacent to the first electronic component, a heat sink arranged on the first electronic component to absorb heat therefrom, an axial fan mounted on the heat sink for generating an airflow to the heat sink, and a guiding member. The axial fan includes a frame and an impeller received in the frame. A cutout is defined in the frame facing the second electronic component. The guiding member is arranged between the axial fan and the second electronic component for guiding a part of the airflow escaping from the frame via the cutout to the second electronic component.

Abstract: A cellular cooling part includes a number at least one movable part, that can be the removable flap or movable cover for a fan. The fan, for example, can be moved or opened to expose it. A flap can also be opened. In addition, different covering structures can be used.

Abstract: A system (50) includes a material layer (52) having an opening (62) extending through it and a pumping device (54) positioned behind the layer (52). A target element (56) is positioned in front of the material layer (52). In a partial cooling mode (124), the pumping device (54) drives a jet (134) of coolant through the opening (62) toward the target (56). Transducers (58, 60), positioned at opposing ends of the opening (62), produce output signals (130, 132) that perturb the jet (134) to partially control its oscillation. The jet (134) spreads from a location (96) on the target element (56) in one direction (142) to provide uniform cooling over a portion (126) of the target element (56) in the direction (142), and the jet (134) non-uniformly spreads in another direction (144) to provide non-uniform cooling over a portion (128) of the target element (56) in the other direction (144).

Abstract: A fan structure mainly comprises a fan wheel, a circuit board and a stator. The fan wheel comprising a hub and a plurality of blades is disposed at a fan wheel-disposing area of the circuit board. The fan wheel-disposing area comprises a first disposition area corresponding to the hub and a second disposition area corresponding to the blades. The fan wheel is smaller than the circuit board in size. The stator is disposed at the fan wheel-disposing area, coupled to the fan wheel and electrically connected with a fan-driving circuit of the circuit board.

Abstract: A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Abstract: Disclosed herein is an eco-friendly high-efficiency heat exchanger for exchanging indoor air with outdoor air. The heat exchanger includes a housing which defines a main body of the heat exchanger and has on both sides thereof an indoor air inlet for introducing the indoor air into the housing and an indoor air outlet for discharging the indoor air from the housing. A first plate is inserted into the housing, and has a thin sheet and a protrusion which is provided along an edge of the thin sheet in such a way as to protrude out and is open at predetermined positions on the protrusion to provide an entrance and an exit. A second plate is placed on the upper or lower portion of the first plate, and has a thin sheet and a plurality of protrusions which protrude along the length of the thin sheet in parallel. Here, a plurality of first and second plates is alternately layered.

Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Abstract: A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing and disposed on a side of the vent for guiding airflow into the vent.

Abstract: A transit container, such as a rack-mount style container, includes a temperature control system for maintaining a desired temperature within the container such that any cargo within the container remains operational at selected times and possibly in selected locations. The temperature control system includes support or mounting brackets, a temperature control assembly, shock isolation devices for shock attenuation of the temperature control assembly, exhaust assemblies that include exhaust fans and exhaust/intake louvers, and a mounting plate attachable to a lid of the transit container. The temperature control assembly and the aforementioned components may be arranged to have a low-height profile or envelope, which in turn permits the temperature control system to be located in a cavity or chamber of the lid.

Abstract: An indoor unit of an air conditioner is provided. The indoor unit has an improved airflow structure, for a rapid air conditioning of the room, a user's convenience, and an efficiency of the air conditioner.

Abstract: A heat dissipation device for a heat-generating electronic component includes a heat sink (10) and a fan (20) mounted on a lateral side of the heat sink. The heat sink defines a plurality of channels (162) therein. A fan holder (30) is rotatably mounted on the heat sink. The fan is fixedly mounted on the fan holder and faces towards the channels of the heat sink. An airflow generated by the fan flows through the channels of the fan. When the fan holder rotates with respect to the heat sink, an airflow direction of the fan is changed accordingly.

Abstract: In a bulldozer, a radiator module is separated from an engine and is disposed on the rear of the bulldozer. Louver plates on the upper portion of a grill are installed so as to cover the outside of the radiator module and point in a substantially horizontal direction. Louver plates on the lower portion of the grill point diagonally upward.

Abstract: Heat exchangers and related methods, e.g., methods of reducing heat from a load, are disclosed. In some embodiments, a device includes a stationary element defining a cavity, a movable element, and a first heat pipe in fluid communication with the cavity defined by the stationary element.

Abstract: A heat dissipation device includes a heat sink and a helical heat pipe assembly. The heat sink includes a hollow cylindrical body and a number of fins extending inwardly from an inner surface of the body to an axis of the body. The helical heat pipe assembly is wrapped on an outer surface of the body and helically extends along an axial direction of the body.

Abstract: A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws.

Abstract: A heat sink device for a display card includes a heat sink, the heat sink having a base and a plurality of heat-dissipating fins on the base, the base having two hooks respectively beside two lateral sides of the groove; a heat-dissipating fan, having a blade wheel and a power wire for the blade wheel, the blade wheel being on the base and the power wire being inside the groove of the base; and a fastener, having two engagement parts respectively corresponding to the hooks, wherein the fastener covers the groove so as to position the power wire by means of engagement of the hooks with the engagement parts. Therefore, the power wire of the heat-dissipating fan can be properly arranged on the heat sink.

Abstract: According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section.

Abstract: A disk array apparatus includes a plurality of disk drives arranged in at least one disk drive line in a direction of an airflow, at least one shield plate, a housing containing the disk drives and the at least one shield plate therein, and flow passages arranged between an upper surface of the disk drives and an inner wall of the housing for enabling the airflow to pass through. The at least one shield plate is arranged between at least two of the disk drives of the at least one disk drive line for controlling the airflow on a downstream side of the flow passages.

Abstract: The cooling module (2) is provided in particular for the internal cooling of a medical device (20) and is constructed as an assembled unit, with a coolant conveyed in a primary-side coolant circuit, with an air-water heat exchanger (8), with a ventilator (6) for generating a secondary-side airstream for cooling using the air-water heat exchanger (8), and with a controller (18A, 18B) for controlling the operation of the cooling module (2), wherein at least a major part of the controller is integrated in the ventilator (6) as a partial control unit (18A). The partitioning of the controller achieves an efficient use of space within the cooling module (2) in such a way that an optimal use of space is obtained in a restricted assembly space for the cooling module (2), and the air-water heat exchanger (8) can be made comparatively large.

Abstract: According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe which thermally connects the first heat emitter with the heat sink, a second heat pipe, and a fan unit which cools the heat sink and the second heat pipe. The second heat pipe has a first end portion which is thermally connected to the second heat emitter, and a second end portion which is located near the heat sink.

Abstract: A heat exchanger includes fins arranged in parallel with each other with a predetermined spacing along the rotational axis direction of a blower. Heat exchanger tubes are inserted into the fins to form rows along a longitudinal direction of the fins connected to each other along the airflow direction, to form refrigerant channels. A branch portion is provided to connection portions of the heat exchanger tubes to increase or decrease the number of paths in the refrigerant channels. Refrigerant flows through each of the refrigerant channels passing through paths mutually different at least at one portion between the refrigerant inlet and the refrigerant outlets, flows along one direction from the windward-side row to the leeward-side row, or from the leeward-side row to the windward-side row in the airflow direction, in sequence between rows. One-path portion is provided in the most windward-side row heat exchanger tubes.

Abstract: Apparatus for applying thermotherapy to a part of the human or animal body comprising an applicator having a flexible enclosure in which thermal energy transfer fluid can circulate, a connector for connecting the applicator to a control system, an interface layer for providing a thermally conductive interface between the flexible enclosure and a treatment site and, an electrically conductive supporting layer for supporting the interface layer and capable of being energised by an electrical signal from the control system to improve the thermal conductivity of the interface layer. The apparatus also includes a valve unit for connecting the applicator to a control system, a heat exchanger for cooling a thermal energy transfer fluid and a control system for controlling the application of thermotherapy.

Abstract: A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board.

Abstract: A centrifugal fan, which equally maintains air-blowing capacities of both inlets regardless of different suction resistances of both inlets due to a driving device, and an air conditioner having the centrifugal fan. The centrifugal fan includes a rotary plate; first blades disposed at the edge of one surface of the rotary plate; and second blades disposed at the edge of the other surface of the rotary plate, and having a larger outer diameter than the outer diameter of the first blades. Thus, although a large flow resistance is generated at one inlet of the centrifugal fan due to the driving device, air-blowing capacities of both inlets are maintained equally.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.

Abstract: The invention discloses an electronic apparatus and a fan module thereof. The fan module includes a base, an impeller, a liquid container, an atomizing device and a cover. The impeller is provided in the base. The liquid container is placed at the center of the impeller, and the liquid container contains a liquid. The atomizing device is disposed on the liquid container, and the atomizing device can atomize the liquid to form a mist to spray in order to absorb the heat in the electronic apparatus. The cover covers the base and forms an air outlet with the base. Furthermore, the cover has an air inlet. When the impeller rotates, the blade of the impeller drives airflow mixed the heated mist to enter into the base through the air inlet of the cover, and to exit from the base through the air outlet.

Abstract: Disclosed is a cooling apparatus including a heat sink, a blower mechanism, an opening member, and a movement mechanism. The blower mechanism has a blower opening that has a predetermined area and is opposed to the heat sink. The opening member has a first opening that has an area smaller than the area of the blower opening. The movement mechanism moves the opening member so that switching between a first state and a second state is performed. The first state is a state in which the first opening is disposed between the blower opening and the heat sink, and the second state is a state in which the first opening is removed from between the blower opening and the heat sink.

Abstract: A transit container, such as a rack-mount style container, includes a temperature control system for maintaining a desired temperature within the container such that any cargo within the container remains operational at selected times and possibly in selected locations. The temperature control system includes support or mounting brackets, a temperature control assembly, shock isolation devices for shock attenuation of the temperature control assembly, exhaust assemblies that include exhaust fans and exhaust/intake louvers, and a mounting plate attachable to a lid of the transit container. The temperature control assembly and the aforementioned components may be arranged to have a low-height profile or envelope, which in turn permits the temperature control system to be located in a cavity or chamber of the lid.

Abstract: Provided is an apparatus and a system. The apparatus, in one embodiment, includes a chassis having one or more slots configured to hold circuit boards and a plenum coupled to the chassis. The apparatus, in this embodiment, further includes a fan assembly coupled to the plenum and configured to provide an airflow therethrough, and servo dampers associated with the one or more slots and configured to allocate a portion of the airflow to associated air paths.

Abstract: A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.