Abstract: An information processing apparatus allows an operator to extract temperature adjustment electrical components accommodated in two holders through a single extraction port when changing the temperature adjustment electrical components. A second holder shares a transfer pathway between an accommodation position of a first holder and an opening portion of a chassis. When the second holder moves in the direction of the opening portion, the first holder is accordingly pushed and moved. Next, the first holder is fixed to a rotating member and is moved to a position above the chassis. After the second holder is discharged to the outside of the chassis, the first holder is returned to the original position.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: A fan cover structure for a radiator assembly having a radiator and a cooling fan having a fan motor is provided. The fan cover structure includes a fan cover for surrounding the cooling fan and a support stay releasably mounted to the fan cover and secured to the radiator. The support stay securely holds the fan cover to the radiator. The support stay includes an arm and the fan cover includes a body having channel defined therein and an engagement member. The channel is dimensioned to receive a portion of the arm and the engagement member is configured to engage the arm portion and retain the arm portion in the channel.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Abstract: A centrifugal blower with a cooling function includes an impeller, a scroll casing, and an evaporator. The impeller includes a plurality of blades provided around a rotary shaft and blows out in a radially outward direction air taken in along the axial direction of the rotary shaft. The scroll casing accommodates the impeller, and has an intake port, a spiral air passage, and a discharge port. The evaporator is disposed in the air passage of the scroll casing. The evaporator includes a plurality of refrigerant passage members which are stacked in the longitudinal direction of the rotary shaft of the impeller and each of which has a refrigerant flow channel. An air-passing clearance is provided between adjacent refrigerant passage members. The centrifugal blower with a cooling function is used for a vehicle air conditioner.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: A heat exchanger having a wet side separate from a dry side for an equipment cabinet is provided. The heat exchanger includes a heat exchanger enclosure having a wet side fan and a dry side fan. The wet side fan draws air in from the external environment and routes the air through a heat exchanger core and out the heat exchanger enclosure. The dry side fan draws air in from within the equipment cabinet and routes the air through the heat exchanger core and out back into the equipment cabinet. The air from the outside acts to cool the heat exchanger core, which in turn acts to cool the air from the dry side as the air is routed through the heat exchanger core.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, heat generated by the processor may be expelled from the computing device using a fan. The fan may include an air intake over an impeller or blades which move air through an impeller portion and an air duct and out of a housing of the fan. The components of the fan may be configured in the housing to increase the area of an air intake which is not obstructed by features such as keyboards or displays in the computing device.

Abstract: A power supply includes a main body, a fan, and a mounting bracket. The main body defines an opening therein. The mounting bracket for mounting the fan is detachably mounted to the main body to cover the opening. The fan is mounted on the mounting bracket and received in the main body through the opening.

Abstract: An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board.

Abstract: A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein an air channel sidewall of the centrifugal fan has heat dissipation fins in an inner wall thereof. The heat pipe has a heat source contact section and a heat dissipation section, the heat dissipation section is in contact with an outer wall of the air channel sidewall, and the heat source contact section is in contact with a heat source.

Abstract: A condensing unit control module may be cooled using multiple methods of cooling. A first method of cooling can be used to cool the control module when a minimal or reduced amount of cooling is needed, and a second method of cooling can be used when the control module requires a larger or maximum amount of cooling. The first method of cooling may include the use of air cooling. The second method of cooling can be through working fluid cooling. The second cooling method can supplement the first cooling method as the cooling needs of the control module increase. The second cooling method can be activated based upon a temperature of a heat sink, a temperature of one or more components of the control module, operating conditions of a heat pump system, ambient conditions, and/or a temperature of the working fluid flowing throughout the heat pump system.

Abstract: An apparatus includes a server cabinet configured to receive a plurality of servers therein, and a single heat dissipation device mounted on the server cabinet and positioned outside of the plurality of servers. The heat dissipation device includes a plurality of fans, and each of the plurality of fans is configured to dissipate heat generated in the overall server cabinet.

Abstract: According to one embodiment, a television apparatus includes an exothermic component, a heat transfer mechanism, a plurality of heat releasing fins, a fan, and a deflecting member. The exothermic component is housed in a housing. The heat transfer mechanism is at least partially housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. The heat releasing fins are thermally connected to the heat releasing portion and arranged with gaps therebetween. The fan generates an air flow flowing through the gaps. The deflecting member is located at least downstream of the gaps to cover the gaps. The deflecting member deflects the air flow toward an exhaust outlet formed in the housing.

Abstract: A cooling circulation system of a server includes a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guide hoods. The first fan modules and the second fan modules are disposed on the cabinet assembly. The first fan modules blow a first airflow towards a first direction, and the second fan modules blow a second airflow towards a second direction. The air guide hoods are respectively installed on two ends of the cabinet assembly. The first airflow and the second airflow join each other through the air guide hoods, so as to form a cooling circulation loop inside the cabinet assembly.

Abstract: Heat dissipation apparatus for dissipating heat generated by a heat-generating component mounted to a circuit board. In one embodiment, the heat dissipation apparatus includes a thermally-conductive heat sink adapted to be placed in contact with the heat-generating component, a bracket adapted to hold the heat sink in place relative to the heat-generating component, and a single coil spring mounted to the bracket adapted to urge the heat sink into contact with the heat-generating component.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel.

Abstract: A detachable USB fan module mounting structure includes a machine case having a top opening and two guide rails at two opposite lateral sides of the top opening, a circuit board with one a USB connector accommodated in the machine case, a cover member detachably covered on the top opening of the machine case and having a coupling structure detachably coupled to the guide rails of the machine case and a bottom bracket with a fan module positioning structure to hold a USB fan module that has a power cord with a USB plug connected to the USB connector of the circuit board.

Abstract: A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device attached to the fan housing and disposed on a side of the vent for guiding airflow into the vent.

Abstract: A thermal module includes a fan device having a fan and a fan housing for covering the fan. A vent is disposed on the fan housing. The thermal module further includes an airflow guiding device installed on the fan housing in a protrudable manner and disposed on a side of the vent for guiding airflow into the vent.

Abstract: A mobile measurement device, particularly for temporary use in or on vehicles, on stationary engines, or on test benches, consists of individual components (2) that might have different working temperatures, disposed in a common housing (1). Furthermore, at least one fan (6) is provided. In order to allow a very broad range of use with regard to the outside temperature range, at the smallest and lightest possible construction, in order to guarantee simple transport and great mobility, and reliable measurements within this range, the housing (1) is structured essentially in gastight manner.

Abstract: A container data center includes a mobile container and a number of servers. The mobile container includes a main room receiving the servers, and an air shower room isolated from the main room. The air shower room includes an outer door, an inner door, a blower, and a dust absorber. The outer door connects the air shower room and is used to separate the air shower room from the outer environment. The inner door connects the air shower room and is used to separate the air shower room from the main room. The blower and the dust absorber are secured on two opposite walls of the air shower room respectively, the blower being configured for blowing air towards the dust absorber.

Abstract: An enclosure includes a chassis and an airflow guiding duct. The chassis includes a bottom plate and a rear plate connected to the bottom plate. The bottom plate defines two cutouts providing a pivot point. Two latch pieces with holes are located on the rear plate. The airflow guiding duct pivots on the bottom plate cutouts. Resilient pieces extend from each sidewall of the guiding duct. Each of the two resilient pieces is engaged in the latch holes, to secure the airflow guiding duct to the chassis. Each of the two resilient pieces is deformable to allow quick disengagement from the latch hole, to release the airflow guiding duct.

Abstract: A fixing device for fixing a fan includes a support and a number of fastening members. The fan includes two opposite sidewalls each defining a number of fixing holes. The support includes a fixing plate defining a vent area and a number of slots located around the vent area. Each fastening member includes a sleeve member and an inserting member. The sleeve member is inserted into the corresponding slot of the fixing plate and extended through the corresponding fixing hole of one of the sidewalls of the fan. The inserting member is extended through the corresponding fixing hole of the other sidewall of the fan, to engage with the sleeve. A first block protrudes from the sleeve to abut against the fixing plate. A second block protrudes from the inserting pole to abut against the other sidewall of the fan.

Abstract: An enclosure includes a housing, partition plates received in the housing, hard disk drives fixed between the partition plates, a cover fixed to the housing, a printed circuit board received in the housing and a fan assembly fixed within the housing. The housing includes a bottom plate and a pair of side plates. Each side plate has a guiding device mounted thereon. The guiding device includes a supporting element fixed to the side plate, a fixing element fixed with the printed circuit board, and a rod pivotably connecting the fixing element with the supporting element. The partition plates each have a hook, and the printed circuit board defines multiple slots corresponding to the hooks. The printed circuit board can be driven towards the partition plates by the fixing element around the supporting element so that the slots are aligned and locked with the hooks.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13).

Abstract: An electronic device includes a bottom plate, a circuit board, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall for guiding most of airflow upwards to the top of the circuit board. A number of slots is defined in the airflow guide wall, for allowing only a minimum portion of the airflow to flow underneath the circuit board.

Abstract: A power supply apparatus includes an air path extending longitudinally, a fan that blows air into the air path in a direction intersecting a longitudinal direction of the air path, and a plurality of electronic components arranged in the longitudinal direction. Each of the electronic components is cooled by air passing through the air path. With this configuration, it is possible to efficiently cool the electronic components without compromising the flexibility of arrangement of the various electronic components. Also, a dust removal operation can be readily performed without the possibility of damaging the fan.

Abstract: A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough.

Abstract: An air-cooled heat exchanger includes a casing, a first heat-exchanging core, a second heat-exchanging core, a first internal driving device, a second internal driving device and an external driving device. The first internal driving device is used for driving a first internally-circulated airflow to flow along a first internal circulation path. The second internal driving device is used for driving a second internally-circulated airflow to flow along a second internal circulation path. The external driving device is used for driving a first externally-circulated airflow to flow along a first external circulation path and driving a second externally-circulated airflow to flow along a second external circulation path. The first heat-exchanging core is configured to perform heat exchange between the first internally-circulated airflow and the first externally-circulated airflow.

Abstract: A fluid compression system is disclosed having a hermetically-sealed housing with at least a motor and a compressor arranged therein. The motor may drive both the compressor and a blower configured to circulate a cooling gas throughout the housing and thereby cool the motor and accompanying radial bearings. The cooling gas may be cooled in a gas-to-gas heat exchanger fluidly coupled to the blower and configured to receive a flow of process gas to cool the cooling gas. The process gas may be the suction process gas for the compressor, or the compressed process gas as discharged from the compressor.

Abstract: An electronic device includes: a chassis for housing an electronic unit; and a hold member capable of holding to a fan unit blowing air toward the electronic unit and attachable to and detachable from a plurality of positions of the chassis.

Abstract: In an evaporator that constitutes part of a vehicular air conditioning apparatus, first fins having louvers therein are arranged between first and second tubes. Together therewith, a second fin, which does not have any louvers therein, is provided at a boundary portion between a first cooling section, which faces toward a first front passage through which air from a first blower unit flows, and a second cooling section, which faces toward a first rear passage through which air from a second blower unit flows. In addition, air is supplied to the interior of a casing from the first blower unit and is cooled by the first cooling section, which is partitioned by the second fin, whereas air supplied from the second blower unit passes through the second cooling section, which is partitioned from the first cooling section by the second fin.

Abstract: An electronic apparatus includes a heat sink for mounting a heating element, a cooling fan for supplying an airstream to the heat sink, and a housing for storing the heat sink and the cooling fan. The housing and the heat sink are equipped with a projection engaged with a hole of a flange of the cooling fan, and the cooling fan is sandwiched by the housing and the heat sink.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A fan duct assembly is provided for a vehicle having an engine-driven main cooling fan. The fan duct assembly includes a hollow housing and a pair of duct members which communicate with the housing and extend from the housing and laterally in side directions. An auxiliary cooling unit is received in the housing. A pair of auxiliary fans is received in the housing. Each fan is positioned between the auxiliary cooling unit and a respective one of the duet members. The hollow housing and the duct members are positioned in front of the main cooling fan. The hollow housing is positioned above a fan drive for driving the main cooling fan. Each of the fans draws air from a different direction.

Abstract: An oil cooler for a motorcycle includes a heat exchanger residing within a primary drive between an engine pulley and a clutch pulley. A fan within the primary drive pushes or pulls air through the heat exchanger. The fan may be electrically or mechanically operated and mounted to one of a base plate or a cover plate of the primary drive. Alternatively, the fan may be formed as a mechanical portion of one of the primary drive components. Vectoring blades may assist in directing an air flow within the primary drive to the heat exchanger, and vents may be formed in the cover plate for air intake and/or exhaust.

Abstract: A cooling apparatus comprising an impeller, a housing that encloses the impeller, an inlet opening formed between the hosing and impeller and a projection formed on the housing that extends from the housing towards the impeller.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.

Abstract: An exemplary electronic device includes a cover, a motherboard and a driving module both disposed at an inner side of the cover, an electronic component fixed on the motherboard, and a fan duct mounted on the motherboard and covering the electronic component. The driving module has a rotating shaft for supportively driving an optical disk rotating. The fan duct guides hot air therein toward the driving module.

Abstract: A rackable server system includes a rack, a fan assembly mounted to a rear of the rack, and a number of server units slidably mounted in the rack. The fan assembly includes a frame defining a number of air passages, a number of door plates mounted to the frame and correspondingly arranged in the passages, and a number of fans fixed to a rear of the frame. The air passages are correspondingly aligned with the fans. The server units are correspondingly aligned with the air passages and resist against the door plates to pivot the door plates, thereby uncovering the air passages.

Abstract: A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and supported by the support portion, and a payload pivotably orientable with respect to the support portion by the gimbal assembly. The support portion alone or collectively with the gimbal assembly may define a chamber in which the electronic component is disposed. The support portion may include a forced-air device configured to drive flow of external air through the channel, thereby removing heat transferred to the channel from the electronic component.