Abstract: A method and apparatus for cooling a heat source is disclosed. The apparatus includes a fin-diffuser including a blower integrated with fins of a diffuser. A heat spreader is coupled to the fin-diffuser. The heat spreader is configured to spread heat from a location proximate the blower to location of the fins. The apparatus spreads heat from a heat source proximate a blower of the fin-diffuser to a location away from the blower to cool the heat source.

Abstract: A method of making a fluid cooled assembly that incorporates a base that forms a partial enclosure defining an interior void space and having a top wall that has a top surface and that defines at least one opening through the top wall to the void space, the base further defining fluid entrance and exit ports into the void space, the top wall being made of material that can be friction stir welded. A lid having a size and shape substantially conformal to the opening, having a top surface and a bottom surface that defines a set of downwardly extending pins, and that is formed of a material that can be friction stir welded to the base is placed into the opening so that the lid top surface is flush with the top surface of the base top wall and friction welding the lid to the base.

Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: A power converter arrangement has two static switching element bridges that are alternatively operable and comprise static switching elements. The power converter arrangement has one housing that houses the two static switching element bridges; the housing has one cooling system for the static switching element bridges housed therein.

Abstract: A heat sink is configured to dissipate heat generated by an electronic component and protect the electronic component from Electromagnetic Interference (EMI). The heat sink comprises a base and a number of waveguides extending out from the base. A number of through holes is defined through the base. Each of the waveguides is a hollow but blind tube communicating with a through hole.

Abstract: The present relates to a heating device structure, which comprises a heat conducting member to mate with the heat dissipation fins of an electronic device. Thereby, during the packaging process of the electronic device, the effect of multi-point heating can be achieved by combining the heat conducting member and the fins. Accordingly, heating can be performed rapidly to reach the soldering temperature. Without the influence of the structure of heat dissipation fins, the heating process will not be performed at low efficiency.

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Abstract: The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.

Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.

Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules haying an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed.

Abstract: A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.

Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

Abstract: Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and dielectric liquid. The circuit package has a cover positioned over a circuit element coupled to a substrate. The cover is attached to the substrate and creates a water-tight seal around the circuit element. The circuit package further has a porous media. The dielectric liquid directly contacts the circuit element, and heat from the circuit element is transferred to the dielectric liquid. As the liquid reaches its boiling point, vapor from the liquid is passed through the porous media for further cooling.

Abstract: A method for fabricating a straight fin heat sink (50) of the type having a base (52) and a plurality of fins (54) extending from the base is disclosed. Each fm (54) of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die (20) configured to produce a heat sink (30) having a base (32) and a plurality of fins (34) attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die (20) to produce the heat sink (30); and compressing the plurality of fins (34) with a compression tool (40) so that the plurality of fins (54) extend from the base along planes generally parallel to each other.

Abstract: A member 10 for a semiconductor manufacturing apparatus includes an AlN electrostatic chuck 20, a cooling plate 30, and a cooling plate-chuck bonding layer 40. The cooling plate 30 includes first to third substrates 31 to 33, a first metal bonding layer 34 between the first and second substrates 31 and 32, a second metal bonding layer 35 between the second and third substrates 32 and 33, and a refrigerant path 36. The first to third substrates 31 to 33 are formed of a dense composite material containing SiC, Ti3 SiC2, and TiC. The metal bonding layers 34 and 35 axe formed by thermal compression bonding of the substrates 31 to 33 with an Al—Si—Mg metal bonding material interposed between the first and second substrates 31 and 32 and between the second and third substrates 32 and 33.

Abstract: There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM (400) is arranged between a heat generating component (20) and a heat conducting element (30), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces.

Abstract: A heat exchanger including a plurality of horizontally arranged tubes, headers to support the tubes and to enable a refrigerant to flow in the tubes, and a corrugated fin horizontally disposed between the tubes, wherein the corrugated fins includes a vertical fin body, flat contact parts formed at an upper part and a lower part of the fin body, the flat contact parts being in surface contact with a top and a bottom of the tubes, and curved contact parts extending from opposite ends of the flat contact parts, the curved contact parts being in surface contact with the sides of the tubes, the fin body includes drainage guides formed outside the flat contact parts in a lateral direction, and each drainage guide includes protruding parts protruding more upward and downward than the flat contact parts.

Abstract: A heat dissipation case is used to dissipate heat of electronic equipment and contains: a body. The body includes a receiving chamber for receiving electronic equipment and a dissipation groove defined thereon and corresponding to the receiving chamber, wherein the metal plate and the dissipating piece are stacked in the dissipation groove, and electronic equipment is received in the receiving chamber and contacts with the dissipating piece so as to dissipates heat of the electronic equipment. The metal plate has a peripheral side retained in the body. The peripheral side of the metal plate extends into the metal plate completely, and an area of the metal plate is larger than that of the dissipating piece.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Abstract: A light fixture includes a heat dissipating structure, an electronics assembly, and a bolt for attaching the heat dissipating structure to an external panel. The heat dissipating structure includes a first side having multiple outwardly extending projection regions and a socket, for receiving a light source, is formed in an apex of each projection region. A second side of the heat dissipating structure includes a heat sink formed in an internal cavity of each projection region. The heat sink includes fins in contact with and radially arranged about an outer surface of the socket. The electronics assembly is located at the first side of the heat dissipating structure. The bolt includes a passage through which wiring from an external source is routed to the electronics assembly. The electronics assembly includes wires routed through channels in each of the projection regions that electrically interconnect the light sources to the electronics assembly.

Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.

Abstract: The add-on heat sink includes an elongate base having a plurality of fins extending from a surface thereof. A magnetic layer is disposed on the bottom of the base, which permits the add-on heat sink to be installed on any ferromagnetic heated surface. The magnetic layer is composed of either a polymer matrix having a plurality of thermally conductive structural components and a plurality of magnetic particles dispersed therein, or a thermally conductive polymer having magnetic particles dispersed therein. Alternatively, if the heated surface is not ferromagnetic, the heat sink may be magnetically attached by adhesively attaching mating magnetic and ferromagnetic pads to the heat sink and to the heated surface. This configuration allows the add-on heat sink to be installed with minimal footprint. Optionally, a fan may be magnetically attached to the heat sink to cool the heated surface by both conduction and convection.

Abstract: Retainers are described that comprise at least one center body component comprising a plurality of center body troughs, and at least one compatible component comprising a plurality of compatible troughs, wherein at least part of the plurality of the compatible troughs couple with at least part of the plurality of center body troughs. In addition, thermal displacement devices are described that incorporate at least one retainers and at least one additional component, wherein the at least one retainer is coupled at least in part to the at least one additional component through a contact area or a substrate, surface or combination thereof, wherein the at least one retainer is coupled with the substrate, surface or combination thereof through a contact area.

Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.

Abstract: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

Abstract: A heat radiation plate includes a depressed portion into which thermally-conductive resin that transfers heat of an electronic component to the heat radiation plate is poured, and a plurality of check portions configured to be provided to the depressed portion and with an upper surface portion and a lower surface portion stepwise at positions lower than an outer edge portion of the depressed portion and higher than a bottom surface portion of the depressed portion so that a liquid level of the thermally-conductive resin is visually checkable, wherein when the thermally-conductive resin is normally filled in the depressed portion, each of the lower surface portions of the plurality of check portions is covered with the thermally-conductive resin and each of the upper surface portions of the plurality of check portions is exposed without being covered with the thermally-conductive resin.

Abstract: A heat sink includes a base and a number of fins mounted parallelly on the base. Each fin defines a number of vents, and two heat dissipating pieces protrude from opposite sides of each vent. The heat dissipating pieces of each vent cooperatively bounds an opening communicating with the corresponding vent. The number of openings of each fin is aligned with the number of openings of the other fins. The aligned openings of the number of fins cooperatively define a number of first air channels perpendicular to the number of fins. The number of heat dissipating pieces bound a number of second air channels parallel to the number of fins.

Abstract: A heat transfer device is described. In one or more implementations, a heat transfer device includes a heat sink and a thermal storage enclosure disposed proximal to at least a portion of the heat sink. The thermal storage enclosure configured to be disposed proximal to a heat-generating component of a device. The thermal storage enclosure includes a phase change material configured to have a melting temperature that is below a temperature at which a cooling fan of the device is set to operate to cool the heat-generating device.

Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).

Abstract: A battery pack and a heatsink frame, the battery pack including a heatsink member; a plurality of battery cells; the battery cells being disposed in the heatsink member; and a fixing member, the fixing member fixing the battery cells to the heatsink member, wherein the heatsink member includes a heatsink plate having a first surface and a second surface opposite to the first surface, a plurality of heatsink walls disposed on the first surface of the heatsink plate, and a plurality of heatsink fins disposed on the second surface of the heatsink plate.

Abstract: Cooling assemblies and power electronics modules having multiple-level porosity structures with both a micro- and macro-level porosity are disclosed. In one embodiment, a cooling assembly includes a jet impingement assembly including a fluid inlet channel fluidly coupled an array of orifices provided in a jet plate, and a heat transfer substrate having a surface. The heat transfer substrate is spaced apart from the jet plate. A first array of metal fibers is bonded to the surface of the heat transfer substrate in a first direction, and a second array of metal fibers is bonded to the first array of metal fibers in a second direction. Each metal fiber of the first array of metal fibers and the second array of metal fibers includes a plurality of metal particles defining a micro-porosity. The first array of metal fibers and the second array of metal fibers define a macro-porosity.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The chip stack further includes a thermal interface material pad between the first chip and the second chip. The thermal interface material pad comprises a plurality of nanotubes containing a magnetic material, aligned parallel to mating surfaces of the first chip and the second chip, wherein a hydrophobic tail of oleic acid is wrapped around each one of the plurality of nanotubes and a hydrophilic acid head of the oleic acid is attached to the magnetic material.

Abstract: Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally conductive fin, and sintered metal particles bonded to the metal mesh and the surface of the thermally conductive fin. The metal mesh defines a macro-level porosity, and the sintered metal particles define a micro-level porosity. In another embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface of the heat transfer substrate, and sintered metal particles bonded to the surface of the thermally conductive fin. An average diameter of the sintered metal particles increases from a base of the thermally conductive fin to a top of the thermally conductive fin.

Abstract: A substrate is surface treated using a composition for forming a film that comprises (A) an organoalkoxysilane, (B) an organopolysiloxane having a silicon-bonded hydrogen atom, and (C) a condensation reaction catalyst. This composition for forming a film can form a highly hydrophobic water repellent film provided with sufficient water shedding performance. It is possible to provide a highly hydrophobic substrate such as a heat dissipating body.

Abstract: There is provided an apparatus for heat dissipation and a method for fabricating the apparatus for heat dissipation. The apparatus for heat dissipation is for either single or two phase heat exchange, depending on a construction of the apparatus. A channel of the apparatus is defined by the joined bent first ends of each of a plurality of fins of the apparatus.

Abstract: A heat dissipating component includes a plurality of heat absorbers each provided for a corresponding one of a plurality of electronic components and to absorb heat from the corresponding one of the plurality of electronic components, and a heat dissipator thermally connected to the plurality of heat absorbers and to dissipate the heat absorbed by the plurality of heat absorbers. The heat dissipating component may he incorporated in an electronic device.

Abstract: A heat conductivity improving agent which can provide high heat conductivity to a resin. The heat conductivity improving agent comprises a magnesium hydroxide particle having a thickness of 10 nm to 0.2 ?m and an aspect ratio (long diameter/thickness) measured by a SEM method of not less than 10.

Abstract: A thermally conductive composite element is particularly suited for use in a surface heating system or in a surface cooling system. The composite element has at least one main part which contains expanded graphite and at least one flat textile structure disposed on one face of the main part. The textile structure is connected to the face of the main part by an inorganic adhesive.

Abstract: An enclosure includes a casing, a heat dispersion layer, and a cover glass. The casing includes an outer surface. The heat dispersion layer is covered on the outer surface. The cover glass is covered on a side of the heat dispersion layer facing away from the casing, and a part of the heat dispersion layer is exposed to air from the cover glass. The heat dispersion layer has a larger heat dispersion area than the casing.

Abstract: A protective cover for a portable electronic device includes a substrate and a heat dissipation unit assembled to the second surface. The substrate includes a metal part and a plastic part combined with the metal part. The metal part includes a first surface and an opposite second surface. The plastic part defines a receiving space for receiving the portable electronic device. When the portable electronic device is received in the receiving space, the heat dissipation unit contacts with the portable electronic device and transmits heat of the portable electronic device to the metal part so that the heat is dissipated by the metal part.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Abstract: A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.

Abstract: Vertically oriented carbon nanotubes (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., <700° C.) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, A CNT TIM that consist of CNT arrays directly and simultaneously synthesized on both sides of various types of foil has been fabricated. The TIM is insertable and allows temperature sensitive and/or rough substrates to be interfaced by highly conductive and conformable CNT arrays. The use of foil, including substrates fabricated from carbon (CNT woven arrays, exfoliated graphite sheets, bucky paper, and the like) is disclosed.

Abstract: Heat in a drive system including a motor and a drive is removed using heat pipes in heat exchanging contact with the motor and the drive. The heat conducting element have at least one portion for receiving heat from the motor or the drive, and another portion to transfer heat to a heat exchange device that is spaced from the motor and drive. The heat conducting element may be a heat pipe or a heat spreader element.

Abstract: In an embodiment, a thermal interface material (TIM) is provided. The TIM comprises first and a second layers of a first transition metal, and a third layer including a plurality of carbon nanotubes supported in a flexible polymer matrix and a second transition metal coupled to sidewalls of carbon nanotubes. The first and second metal layers are in contact with first and second ends of carbon nanotube. The TIM further comprises fourth and fifth layers of an alloy material coupled to the first and second metal layers, respectively. The carbon nanotube based TIM including the layers with transition metal allow improved heat transfer from an integrated circuit die to a heat spreader.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.