Abstract: An electronic display which can be mounted above a paved surface in an outdoor environment. A surface or plate is placed behind the electronic display to define a gap where cooling air can be drawn through said gap in order to cool the electronic display. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display. The density of the ribs may be varied according to the inlet and exhaust openings for the cooling air. The ribs may be placed at a higher density near the exhaust to account for the increase in temperature of the cooling air as it travels through the gap.

Abstract: An LED illumination includes a heat sink, and an LED module mounted on the heat sink. The heat sink includes a base, a receiving tube extending upwardly from a first face of the base, and a plurality of fins arranged on the first face of the base and surrounding the receiving tube. The plurality of fins extends radially and outwardly beyond an outer periphery of the base in relation to the receiving tube. A band engages and encloses the plurality of fins. A plurality of air tunnels are defined between the base, the band and the plurality of fins. The LED module is mounted on a second face of the base opposite to the first face.

Abstract: Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

Abstract: A power converter includes: a first metal member; a second metal member to be connected to the first metal member to form a space in which a coolant flows; and a heating electric component main body to be housed in a concave portion formed on the first metal member so as to project into interior of the space.

Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

Abstract: A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle ? relative to a normal to a surface of the second heatsink.

Abstract: A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.

Abstract: In an electronic control unit, high-heat-generating devices are mounted on a first surface or a second surface of a board, a heat-dissipating member is located facing the first surface of the board, and a heat-conducting member is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region of the first surface or a second limited region of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.

Abstract: A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract: Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.

Abstract: Increase in number of valves complicates the configuration and control. A temperature control apparatus for controlling a temperature of a device, includes; a heat exchange section exchanging heat with the device; a main flow path causing a fluid to flow; a sub flow path causing, to flow, a fluid having a temperature different from a temperature of the fluid flowing through the main flow path; a mixture flow path merging the fluids from the main flow path and the sub flow path and causing the merged fluids to flow to the heat exchange section; and a flow rate adjusting section adjusting an amount of a fluid flowing from the sub flow path to the mixture flow path, in relation to the fluid flowing through the main flow path.

Abstract: A cooling fin structure used in a cooler for an electric device includes a plurality of pin fins (71) arranged in a zigzag form in a coolant passage (80). Each of the pin fins (71) has a circular portion (72) having a circular cross-section, and irregularly shaped portions (73) provided contiguously on the upstream and downstream sides of the circular portion (72) as viewed in a direction of flow of the coolant. The irregularly shaped portions (73) have an outer peripheral surface (75) that is formed along a circumference (130) having a center at a center point (101) of the circular portion (72) of a pin fin (71, 71B) that is located adjacent to the pin fin (71, 71A) having the irregularly shaped portions (73), in an oblique direction relative to the direction of flow of the coolant.

Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.

Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.

Abstract: An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module.

Abstract: A method and a configuration recover thermal energy in a thermal treatment of cold-rolled steel strip in an annealing furnace. The steel strip is heated up in a protective gas atmosphere to a temperature above the recrystallization temperature, and is subjected in a first, slow cooling phase and a second, fast cooling phase to a protective gas. The temperature of the protective gas is reduced during the first phase down to an intermediate temperature and in the second phase from the intermediate temperature to a final temperature. A first heat exchanger transfers the thermal energy of the protective gas by an oil circuit and a second heat exchanger to a working medium, and which evaporates and is fed to a steam motor, which converts the thermal energy contained in the working medium into energy.

Abstract: A semiconductor module cooler supplies a cooling medium to a cooling medium jacket from outside to cool a plurality of semiconductor elements thermally connected to the cooling medium jacket through a heat sink. The cooling medium jacket has a cooling fin cooling room including an opening for inserting cooling fins, and cooling the cooling fins; a cooling medium introduction port to introduce the cooling medium; a cooling medium diffusion room to diffuse and supply the cooling medium to the cooling fin cooling room; a cooling medium diffusion wall provided in the cooling medium diffusion room in which the cooling medium diffused by the cooling medium diffusion room flows over to be introduced to the cooling fin cooling room side; a cooling medium discharge port discharging the cooling medium to the outside; and a cooling medium convergence room provided between the cooling fin cooling room and the cooling medium discharge port.

Abstract: A semiconductor device includes a transistor, a package in which the transistor is molded, a first heatsink plate, and a second heatsink plate. The first heatsink plate is bonded to a first surface of the package, and is fixed to one surface of the transistor in the package. The second heatsink plate is bonded to a second surface of the package so as to be opposed to the first heatsink plate, and is fixed to the transistor in the package. The second surface is opposite to the first surface. A bonded surface of the first heatsink plate with the plastic body includes a high stress area in which tensile stress equal to or higher than a predetermined stress value is generated. A plurality of grooves are provided in the high stress area.

Abstract: There is provided a graphite composite film including a graphite film and a metal layer formed on a surface of the graphite film, in which peeling-off of the metal layer from the graphite film is suppressed. More specifically, the graphite composite film includes a graphite film and a metal layer formed on at least one side of the graphite film, wherein the graphite film has a plurality of through holes formed therein, a metal layer is formed also inside the through holes so as to be connected to the metal layer formed on a surface of the graphite film, the metal layer inside the through holes is formed continuously from the one side to an opposite side of the graphite film, and a distance between outer diameters of the through holes is 0.6 mm or less and a ratio of an area of metal inside the through holes to an area of the graphite composite film is 1.4% or more.

Abstract: Embodiments are disclosed that relate to implementing semiconductor device cooling systems that leverage awareness of regional voltage and temperature reliability risk considerations. For example, one disclosed embodiment provides a method of implementing a cooling system configured to cool an integrated circuit. The method involves first determining a heat dissipation factor that would reduce each region of the integrated circuit to a reduced temperature in order to maintain an overall failure rate. An analysis is then performed, using an insight about the relative reliability risk of elevated voltage and temperatures, to identify a region of the integrated circuit whose temperature can be permitted to rise without exceeding the overall failure rate, thereby permitting implementation of a cooling system with a reduced heat dissipation factor.

Abstract: A package for a microelectronic die (110) includes a first substrate (120) adjacent to a first surface (112) of the die, a second substrate (130) adjacent to the first substrate, and a heat spreader (140) adjacent to a second surface (111) of the die. The heat spreader makes contact with both the first substrate and the second substrate.

Abstract: An illustrative example motor control device includes a printed circuit board including electronics for motor control. At least one connector is associated with the electronics. The connector is configured for communicating at least one of control signals or power to a motor. A housing includes a first portion configured to receive the printed circuit board and cover over a first side of the printed circuit board. A second portion of the housing is configured to provide access to the at least one connector from outside of the housing. The second portion of the housing inhibits exposure of the printed circuit board to outside contaminants. A third portion of the housing is configured to cover over a second side of the printed circuit board. At least one heat transfer element on at least one of the housing or the printed circuit board facilitates heat transfer from the printed circuit board to the housing.

Abstract: An apparatus provides conductive cooling of an information handling system. The apparatus includes a panel having a vent area formed in the panel. The vent area includes a perimeter, an interior section and a plurality of ribs that extend across the interior section. The vent area further includes several openings defined by lateral spacing between the ribs. The openings extend through the panel and are configured to receive cooling airflow into the openings and to discharge cooling air flow from the openings. A conductive heat sink layer is attached to the panel. The conductive heat sink layer covers a perimeter area surrounding the vent area, with strips of the conductive heat sink layer also covering the ribs, while leaving the openings between the ribs uncovered such that the strips of the conductive heat sink layer function to conduct additional heat away from the vent area along the ribs.

Abstract: A charging gun for charging a charging seat includes a connecting line configured to deliver an electric charge from an electric source, a charging head located at one end of the connecting line, and a number of first pins. The number of first pins is surrounded by a first peripheral wall. The first peripheral wall includes at least one first protrusion protruded from an outer surface thereof. The number of first pins connects to a corresponding number of second pins of the charging seat. The charging seat includes a second peripheral wall surrounding the number of second pins. The diameter of an inner surface of the second peripheral wall is greater than the diameter of the outer surface of the first peripheral wall.

Abstract: The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.

Abstract: A device for thermal connection of an energy store to a cooling plate and/or a contact element, and a cooling plate on a contact element and/or a fluid is provided. The device for thermal connection has a first region having a first heat transfer property and at least one other region having another heat transfer property, wherein the first region and the at least one other region are arranged next to one another in relation to the heat transfer surface.

Abstract: This heat sink has bonded on one surface a member to be bonded, and has a cooling member in contact with the other surface. The heat sink is provided with a metal plate having a thermal expansion coefficient larger than that of the member to be bonded, and the metal plate is provided with a center portion where the member to be bonded is bonded, and a plurality of linear peripheral slits formed in a whirl-like radial manner such that the linear peripheral slits surround the center portion.

Abstract: An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h1; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h1, the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.

Abstract: Jet-impingement, two-phase cooling apparatuses having alternating vapor outlet channels are disclosed. In one embodiment, a cooling apparatus includes a fluid inlet channel, a jet orifice surface, and a target surface. The jet orifice surface includes an array of jet orifices. The jet orifices are arranged in rows. Coolant fluid within the fluid inlet channel flows through the array of jet orifices as impingement jets. The jet orifice surface further includes a plurality of vapor guide channels positioned between the plurality of jet orifice rows and parallel to a first axis such that the jet orifice surface is defined by alternating jet orifice rows and vapor guide channels. The target surface has a plurality of surface fins extending from a surface of the target surface and parallel to a second axis that is orthogonal to the first axis, wherein the jet orifice surface is positioned proximate the surface fins.

Abstract: A pluggable module is provided and includes a plug receptacle in which a plug is receivable, a housing coupled to the plug receptacle, a heat removal device partially disposable within the housing to assume and be movable between first and second positions and an armature. The armature is interposed between corresponding portions of the housing and the heat removal device and is configured for selective manipulation to thereby move the heat removal device from the second position to the first position. With the plug received in the plug receptacle and the heat removal device in the first position, the heat removal device forms a thermal pathway with the plug by which heat is removed from the plug.

Abstract: A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.

Abstract: A power module includes a substrate DMB (Direct Metal Bonded). A novel bridging DMB is surface mounted to the substrate DMB along with power semiconductor device dice. The top metal layer of the bridging DMB has one or more islands to which bonding wires can connect. In one example, an electrical path extends from a module terminal, through a first bonding wire and to a first location on a strip-shaped island, through the island to a second location, and from the second location and through a second bonding wire. The strip-shaped island of the bridging DMB serves as a section of the overall electrical path. Another bonding wire of a separate electrical path passes transversely over the strip-shaped island without any wire crossing any other wire. Use of the bridging DMB promotes bonding wire mechanical strength as well as heat sinking from bonding wires down to the substrate DMB.

Abstract: This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.

Abstract: Example packaging of microelectronics and example methods of manufacturing the same are provided herein. The packaging can enable and/or improve the use of the microelectronics in a downhole, high temperature and/or high pressure setting. The microelectronics packaging can include double-sided active components, heat sinks, and/or three-dimensional stacking of dies.

Abstract: A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to the board, to the object to be cooled and a second rotary position to guide a cooling air, flowing from a second direction to the board, to the object to be cooled, and an arm to be movably attached to the board and also to be rotatably coupled to a rotary end of the baffle plate to displace the baffle plate to the first rotary position and the second rotary position with movement.

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract: A heat sink apparatus is disclosed. The apparatus comprises a base unit for use with an electronic component operable to make contact with a heat generating source, wherein the heat generating source is affixed to a printed circuit board. It also comprises a top unit wherein the top unit of the heat sink is rotatively coupled to the base unit, and wherein a slot forms in between the top unit and the base unit when the top unit is coupled to the base unit. Finally it comprises a heat pipe, wherein the heat pipe is received through the slot and held tightly therein, and wherein the heat pipe is operable to dissipate heat transferred through the base unit away from the heat generating source.

Abstract: The present invention provides a heat-dissipating device including a heat sink and a heat pipe. The heat sink has an end surface provided with a trough. The trough has an open side and a closed side. The heat pipe has a heat-absorbing surface and a heat-conducting surface corresponding to the open side and the closed side respectively. The heat-conducting surface and the heat-absorbing surface are not brought into contact with the heat sink. The heat is directly absorbed by the heat pipe and then conducted to the heat sink for dissipation. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.

Abstract: In a power module according to the present invention, a copper layer composed of copper or a copper alloy is provided at a surface of a circuit layer onto which a semiconductor element is bonded, and a solder layer formed by using a solder material is formed between the circuit layer and the semiconductor element. An alloy layer containing Sn as a main component, 0.5% by mass or more and 10% by mass or less of Ni, and 30% by mass or more and 40% by mass or less of Cu is formed at the interface between the solder layer and the circuit layer, the thickness of the alloy layer is set to be within a range of 2 ?m or more and 20 ?m or less, and a thermal resistance increase rate is less than 10% after loading a power cycles 100,000 times under a condition where an energization time is 5 seconds and a temperature difference is 80° C. in a power cycle test.

Abstract: A method is provided for heat transfer from a surface to a fluid. The method includes directing a first fluid flow towards the surface in a first direction and directing a second fluid flow towards the surface in a second direction. The first and second fluid flows cooperate to cool the surface.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment.

Abstract: An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.

Abstract: The principles described herein provide a server device having a cooling system that provides an efficient cooling of server device components. The cooling system can include a radiator block having air passageways that are oriented substantially orthogonal to the initial airflow path direction. In addition, the server device can include one or more baffles that create an airflow path that passes through the radiator block multiple times. Moreover, the server device can include various additional features that provide convenient access to electronic components within the server device without diminishing the effectiveness of the cooling system.

Abstract: An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner.

Abstract: The present invention provides methods for uniform growth of nanostructures such as nanotubes (e.g., carbon nanotubes) on the surface of a substrate, wherein the long axes of the nanostructures may be substantially aligned. The nanostructures may be further processed for use in various applications, such as composite materials. For example, a set of aligned nanostructures may be formed and transferred, either in bulk or to another surface, to another material to enhance the properties of the material. In some cases, the nanostructures may enhance the mechanical properties of a material, for example, providing mechanical reinforcement at an interface between two materials or plies. In some cases, the nanostructures may enhance thermal and/or electronic properties of a material. The present invention also provides systems and methods for growth of nanostructures, including batch processes and continuous processes.

Abstract: According to one embodiment, an electronic device includes a first substrate, a second substrate, an electronic component and a first shield. The first substrate includes a first surface, a second surface, and an aperture. The second substrate includes a third surface fixed to the second surface. The electronic component is mounted on the third surface, passes through the aperture and protrudes from the first surface. The first shield includes a first portion facing the component protruding from the first surface, and second portions which extend from the first portion, are fixed to the first surface and face corner portions of the third surface respectively.

Abstract: An electronics system includes a main circuit board; main circuitry located on the main circuit board; a carrier board located on top of the main circuit board; an integrated circuit (IC) located on the carrier board, wherein the IC is electrically connected to the main circuitry on the main circuit board; and a layer of adhesive located between the carrier board and the main circuit board.