Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

Abstract: This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.

Abstract: A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

Abstract: A traction battery assembly for a vehicle is provided. The traction battery assembly may include a plurality of battery cells and a thermal plate positioned beneath the battery cells. The thermal plate may be configured for thermal communication with the plurality of battery cells. The thermal plate may define a plurality of multi-pass channel configurations, each corresponding to one of the battery cells. The multi-pass channel configurations may each include a channel inlet and channel outlet on opposite side portions of the thermal plate. The multi-pass channel configurations may each be configured to direct thermal fluid flowing therein to an outlet port of the thermal plate without directing fluid to the channel inlet of another channel configuration.

Abstract: A multiple joint robot includes a movable body, a motor for generating power to actuate the movable body, a motor housing for accommodating the motor, and a cooling structure for dissipating heat generated from the motor. The cooling structure includes a heat conductor in the motor housing, and the heat conductor forms a heat conductive path for transmitting heat from the motor to the motor housing. The heat conductor has a first surface in contact with a heat generating surface of the motor and a second surface in contact with an inner surface of the motor housing. A position of the heat conductor can be adjusted to form the heat conductive path by sliding the first surface and/or the second surface along the opposed heat generating surface or inner surface. The heat conductor includes a metal plate.

Abstract: A gas cooling system for an electronic display is disclosed herein. A closed loop of circulating gas is preferably positioned to surround the electronic display. An open loop of cooling air preferably travels along the rear surface of the electronic display. In an exemplary embodiment the cooling air does not mix with the circulating gas. Heat may be transferred from the circulating gas to the cooling air in order to cool the display.

Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.

Abstract: The present invention relates to a core-sheath particle for use as filler for feeder compositions for the production of feeders, comprising (a) a carrier core which has a size within a range of from 30 ?m to 500 ?m and consists of a material which is maximally resistant up to a temperature of 1400° C. and does not contain any polystyrene, (b) a sheath which encloses the core and consists of or comprises (b1) particles having a D 50 value for the particle size of at most 15 ?m, which are resistant up to a temperature of at least 1500° C., and (b2) a binder which binds the particles to one another and to the carrier core, the core-sheath particle being resistant up to a temperature of at least 1450° C.

Abstract: A semiconductor structure includes a semiconductor substrate and a pad. The pad is on a top surface of the semiconductor substrate. The semiconductor structure further includes a circuit board and a bump. The circuit board has a contact area corresponding to the pad on the top surface of the semiconductor substrate, and the bump is between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface.

Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electrical component, a rectifying member, and a casing. The casing houses the heat exchanger, blower, electrical component, and rectifying member. The casing has a vent that vents air upward. The electrical component controls driving of an actuator, and includes a heat-generating part and a heat sink. The heat sink is installed on the heat-generating part, and has a heat-radiating fin. The rectifying member extends along a vertical direction, and covers the heat-radiating fin, and rectifies flow of air. An air inlet is formed on a lower part, and an air outlet on an upper part of the rectifying member. A first air flow path is formed inside the rectifying member. An air flow generated by the blower passes through the first air flow path. The heat-radiating fin is positioned in the first air flow path.

Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.

Abstract: A heat sink retainer unit includes a buckle body, a retainer member, an elastic member and a handle. The elastic member is disposed in the buckle body and fitted on the retainer member. The retainer member is passed through the buckle body from a lower side thereof. A top end of the retainer member is positioned above the buckle body. The handle is positioned above the buckle body and pivotally connected with the top end of the retainer member. By means of operating the handle, the retainer member can be moved up and down, whereby the elastic member can apply elastic force to the buckle body.

Abstract: An image display device is provided that efficiently cools a display and internal circuit components thereof. The image display device includes a display for displaying visual information, circuit components spaced apart from a rear side of the display, a fan installed on the rear side of the display that generates an airflow from one side of the display to the other side of the display so as to cool the display and the circuit components, and an airflow distribution device facing the fan to selectively distribute the airflow generated by the fan towards the display and the circuit components based on temperatures of the display and the circuit components.

Abstract: A heat dissipating housing for a lighting device includes a back wall comprising an upper section and a lower section. The housing further includes a sidewall extending down from the upper section of the back wall. The back wall and the sidewall define a cavity of the housing. The upper section of the back wall is elevated from the lower section of the back wall such that when a printed circuit board (PCB) is in contact with the lower section of the back wall within the cavity, an uninsulated electrical element on a back side of the PCB is separated by an air gap from a closest point on the housing by a distance that is at least 0.063 inch. The back side of the PCB faces the upper section of the back wall.

Abstract: An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.

Abstract: Disclosed is a thermally-conductive elastic body that effectively dissipates heat generated from a heat generation source such as an electronic product and prevents a phenomenon in which small graphite fragments are separated from (fall off) a graphite layer by completely sealing up the graphite layer that conducts the heat. The thermally-conductive elastic body according to the embodiments of the present disclosure includes an elastic body and a thermally conductive layer that is formed to be wrapped around an external surface of the elastic body, in which the thermally conductive layer includes a first base film and a graphite layer that is internally arranged within an edge region of the first base film, and in which the edge region of the first base film is attached to the elastic body in such a manner that the graphite layer is sealed up.

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract: A portable electronic device is provided, in which a region for joining a body to a member-to-be-fixed is designed to be narrow, and the body and the member-to-be-fixed are strongly joined together. The portable electronic device is provided with a body 2A and a member-to-be-fixed 3a, which is bonded and fixed to the body 2A by way of an adhesive 231. The body 2A has: a first face 22, on which the member-to-be-fixed 3a is mounted; and a second face 23, which is bonded to the member-to-be-fixed 3a, in a state where the second face 23 is at a distance from the member-to-be-fixed 3a by interposing the adhesive 231, and the second face 23 is in an intersecting positional relationship with the first face 22.

Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Abstract: Heat exchanger (1) for a system for solidification and/or for crystallization of a semiconductor material, comprising a first member (2) and a second member (3), the first and second members being movable with respect to each other, characterized in that the first member comprises a first pattern of relief (21) and the second member comprises a second pattern of relief (31), the first pattern of relief being designed to cooperate with the second pattern of relief.

Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.

Abstract: A method, system, and device relating to a broad-band fragmented aperture tile and antenna system are disclosed. In one exemplary embodiment, an aperture tile comprises a plurality of unit cells. The plurality of unit cells individually comprise a driven radiating element layer, a module layer having a printed circuit board, wherein the module layer comprises one or more of a time delay module, a radio frequency distribution module, a radio frequency module, or a digital signal processor. Furthermore the aperture tile is coupled to a cold plate configured for heat transfer.

Abstract: A method including providing graphene on a growth substrate; providing a target substrate on the graphene to form a first composite including the target substrate and graphene; and removing at least a portion of the first composite from the growth substrate.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: Heat conducting mounting structure for mounting of electronic modules, comprising first surface area that is adapted to face a second surface area of the electronic module; cavity means embedded at a distance from the first surface area; said cavity means is adapted to receive a cooling means; attachment means at the first surface area adapted for attaching the electronic module; and wherein the attachment means is adapted for a transfer of the heat energy from the electronic module to the mounting structure. Further a method for mounting the electronic module on the heat conducting mounting comprising the step of adjoining an attachment means with a fixing means and the fixing means with the electronic module to obtain at least one immediate connection pressure area between the first surface area of a wall and the second surface area of the electronic module. Also a radio base station housing arrangement is provided.

Abstract: This application discloses devices, articles, and methods useful for producing lyophilized cakes of solutes. The devices and articles provide for a method of freezing liquid solutions of the solute by the top and the bottom of the solution simultaneously. The as frozen solution then provides a lyophilized cake of the solutes with large and uniform pores.

Abstract: A protective case for electronic equipment is used to dissipate heat of electronic equipment. The protective case contains a body including a through hole defined therein and a metal plate disposed in the through hole, a Nano heat dissipation layer formed on a back surface of the metal plate, such that the electronic equipment retains with a protective case and contacts with the metal plate. The metal plate has an external rim retained in the body. The body also includes a recess defined thereon, and the metal plate adheres with the recess. The protective case also contains a dissipating piece, and a back surface of the dissipating piece connects with a front surface of the metal plate, a front surface of the dissipating piece contacts with the electronic equipment.

Abstract: Described is an electronic device, including a top frame, a bottom frame, a circuit board mounted above the bottom frame, a thermal pad mounted on the circuit board, a heat sink associated with the thermal pad and a plurality of springs for providing a biasing force that retains the heat sink against the thermal pad, the heat sink including a planar portion surrounding a central depression, wherein the plurality of springs secure the thermal pad of the circuit board between the central depression portion of the heat sink and the circuit board.

Abstract: A power converter configured to be mounted on an electrically driven vehicle comprises a control board that controls a power module including a semiconductor device, a connector provided on the control board so as to be connected to an external controller, a strong electric component arranged so as to overlap the control board, and a housing that houses the control board and the strong electric component. A bottom portion of the housing is formed to swell in a convex-shaped manner, a part of the strong electric component is housed in an area of the housing that swells in the convex-shaped manner, and the strong electric component is formed so that a projection area thereof to the overlappingly arranged control board is smaller than a surface area of the control board. The connector is arranged in an area of the control board broader than a projection plane of the overlappingly arranged strong electric component to the control board.

Abstract: An electronic device may include at least one power component and a printed circuit board. The at least one power component may include a main body and a lead. The printed circuit board may include at least two conductive layers parallel to a plane. The printed circuit board may further include a mounting element and a conductor. The mounting element may include first conductive tubes. The conductor may include second conductive tubes. The first conductive tubes and the second conductive tubes may elongate through a thickness of the printed circuit board along a direction substantially perpendicular to the plane. The main body of the at least one power component may be fixed to the mounting element. The lead of the at least one power component may be fixed to the conductor.

Abstract: Each fin of a heat sink includes a main fin connected to a core and extending radially outwards, and a pair of branch fins extending radially outwards from a branch point at a radially outer end of the main fin. Among a plurality of fins, in each of three fins which are adjacent in the circumferential direction, a width of an end portion of the main fin viewed along the center axis expands radially outwards at an angle which is larger than an expanding angle of the pair of branch fins. A difference between a distance from the center axis to the branch point in the center one of the fins and a distance from the center axis to the branch point in each of the other two fins is equal to or larger than a width of a root of the main fin in the center radiating fin.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Abstract: A heat sink can include a folded fin with a base portion, an offset portion extending away from the base portion, the offset portion having a width, a narrowing tapering portion having a maximum width equal to the width of the offset portion, and an extension portion extending away from the narrowing tapering portion, the extension portion having a width smaller than the width of the offset portion.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: A fixing assembly includes a fixing frame, a fixing member, and a fastening member. The fixing frame includes a frame body and a guiding wall portion. The frame body is disposed between a circuit board and a heatsink. The guiding wall portion is connected to the frame body and has an elongated hole. The thicknesses of the guiding wall portion are reduced toward the frame body. The fixing member abuts against the guiding wall portion and is located over the heatsink. The fixing member has a screw hole communicated with the elongated hole. The fastening member is fastened to the screw hole via the elongated hole. The fastening member is retained by the elongated hole to move relative to the guiding wall portion along the elongated hole, so as to move the fixing member toward or away from the heatsink.

Abstract: An immersion server includes: a first surface that is exposed when the server is submerged within a cooling liquid; and at least one vapor bubble deflector physically abutting the first surface and extending away from the first surface at an angle. The deflector divides the first surface into an upper segment and a lower segment when the server is upright. When the server is submerged, the cooling liquid surrounding the lower segment absorbs sufficient heat to evaporate and generate vapor bubbles rising to the liquid surface. The vapor bubble deflector deflects the rising vapor bubbles away from the surface of the upper segment. This enables superior liquid contact with heat dissipating components at the upper segment and better cooling of those components. The deflector can be a device-level deflector separating two or more components or a component-level deflector separating a lower segment from an upper segment of a single component.

Abstract: A semiconductor device packaged adapter for electrically coupling contacts on a first circuit member to contacts on a second circuit member. The adapter typically includes first and second substrates, each with arrays of terminals. Proximal ends of the first terminals on the first substrate are arranged to be soldered to the contacts on the first circuit member and proximal ends of the second terminals on the second substrate are arranged to be soldered to the contacts on the second circuit member. Complementary engaging structures located on distal ends of the first and second terminals engage to electrically and mechanically couple the first circuit member to the second circuit member.

Abstract: The characteristics of a heat radiation member used in a semiconductor module are improved. A heat radiation member (10A) including an aluminum type member (20) which contains aluminum and a copper type member (30) which contains copper, which is embedded in the aluminum type member (20), and sides of which are enclosed by the aluminum type member (20) is formed. A semiconductor element is thermally bonded to the heat radiation member (10A) to fabricate a semiconductor module. The heat radiation member (10A) includes the aluminum type member (20) and the copper type member (30). As a result, it is possible to realize light weight while ensuring certain heat radiation. In addition, the copper type member (30) is enclosed by the aluminum type member (20). Accordingly, the strength of the heat radiation member (10A) can be increased.

Abstract: A process for producing a unitary graphene material, comprising: (a) preparing a graphene oxide (GO) gel having GO molecules dissolved in a fluid medium wherein the GO molecules contain higher than 20% by weight of oxygen; (b) dispensing and depositing a layer of GO gel onto a surface of a substrate to form a layer of deposited GO gel thereon, wherein the dispensing and depositing procedure includes shear-induced thinning; (c) removing the fluid medium from the deposited GO gel to form a GO layer having an inter-plane spacing d002 of 0.4 nm to 1.2 nm as determined by X-ray diffraction; and (d) heat treating the GO layer to form the unitary graphene material at a heat treatment temperature higher than 100° C. to an extent that d002 is decreased to a value of 0.3354 nm to 0.4 nm and the oxygen content is decreased to less than 5% by weight.

Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.

Abstract: A heat exchanger for a gas turbine engine is provided by a structure including an enclosed fluid cavity. The structure has opposing sides, and a set of fins is supported on one of the sides and arranged outside the cavity. The set of fins includes rows of discrete chevron fins separated by periodic gaps. In one application, the heat exchanger is arranged in a gas turbine engine. A core is supported relative to a fan case by structure. A fan duct is provided between a core nacelle and a fan case. The core includes a compressor section and a bleed cavity is provided within the core and is in fluid communication with the compressor section. The heat exchanger includes first and second sides opposite one another. The second side includes the set of rows of fins with the periodic gaps exposed to the bleed cavity.

Abstract: A heat-dissipating base is provided. The heat-dissipating base includes a main body and at least one first protrusion. The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface for thermally contacting at least one first component above the main body.

Abstract: A heat dissipating module includes a heat sink and a number of latching assemblies. The heat sink includes a base and a number of positioning portions. A number of positioning holes is defined extending through the corresponding positioning portions and the base. Each latching assembly includes a latching member and a resilient member. The latching member includes a connecting pole, a head located at a first end portion of the connecting pole, and a latching portion located at a second end portion of the connecting pole. The resilient member is sleeved around the connecting pole. The latching portions of the latching members are extended through the corresponding positioning holes and engaged with a bottom surface of the base. Each resilient member is pressed between the corresponding head and the corresponding positioning portion.

Abstract: A part (1) of a container for electronic equipment, having the function of a heat sink, comprises a base (2) having mainly two-dimensional extension parallel with a first plane of extension, and a plurality of dissipation fins (3) fixed to the base (2) and also having mainly two-dimensional extension parallel with one or more second planes of extension which are transversal to the first plane of extension. The part (1) comprises a supporting body (4) and one or more metal inserts (5) irremovably connected to the supporting body (4), each metal insert (5) being constituted of a single piece made by extrusion and comprising a group of fins (3) and a connecting portion (7) connecting the fins (3) of the group to one another and at least partly irremovably embedded in the supporting body (4) by overmolding of the supporting body on the insert (5); the base (2) of the part (1) is constituted of both the supporting body (4) and each connecting portion (7) of the one or more inserts (5).

Abstract: A heat dissipating device includes a base and a heat dissipating fin. The base includes an accommodating recess formed thereon. The heat dissipating fin includes a heat dissipating portion and a protruding portion, wherein the protruding portion protrudes from an end of the heat dissipating portion and is disposed in the accommodating recess. The base and the heat dissipating fin are combined with each other by a punching process, such that a first side wall of the accommodating recess covers at least a part of the protruding portion.

Abstract: A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.

Abstract: The present invention is an apparatus for dissipating heat through a heat sink, the apparatus comprising: a heat transfer member having one end with a contact surface contacting a heating element arranged on a substrate and the other end with a contact surface contacting the heat sink, the heat transfer member transferring the heat generated from the heating element to the heat sink; an elastic member for providing elastic force for pushing the heat transfer member toward the heating element; a guide member arranged in the heat sink to form a contact surface contacting the heat transfer member, the guide member mechanically guiding the heat transfer member such that the heat transfer member may slide and move toward the heating element; and a spacing member inserted between the substrate and the heat sink so as to maintain a preset spacing when the substrate and the heat sink are fixed and attached with each other.

Abstract: A heat radiation sheet including: a heat radiation layer that is formed in the form of a nano-web having a plurality of pores by electrospinning a spinning solution that is obtained by mixing a polymer material and a solvent, or the polymer material, a heat conductive material, and the solvent; and an adhesive layer that is laminated on one surface or both surfaces of the heat radiation layer, and that is formed in the form of the nano-web by electrospinning an adhesive material that is obtained by an adhesive, the heat conductive material, and the solvent.