Abstract: The present invention is an apparatus for dissipating heat through a heat sink, the apparatus comprising: a heat transfer member having one end with a contact surface contacting a heating element arranged on a substrate and the other end with a contact surface contacting the heat sink, the heat transfer member transferring the heat generated from the heating element to the heat sink; an elastic member for providing elastic force for pushing the heat transfer member toward the heating element; a guide member arranged in the heat sink to form a contact surface contacting the heat transfer member, the guide member mechanically guiding the heat transfer member such that the heat transfer member may slide and move toward the heating element; and a spacing member inserted between the substrate and the heat sink so as to maintain a preset spacing when the substrate and the heat sink are fixed and attached with each other.

Abstract: A heat radiation sheet including: a heat radiation layer that is formed in the form of a nano-web having a plurality of pores by electrospinning a spinning solution that is obtained by mixing a polymer material and a solvent, or the polymer material, a heat conductive material, and the solvent; and an adhesive layer that is laminated on one surface or both surfaces of the heat radiation layer, and that is formed in the form of the nano-web by electrospinning an adhesive material that is obtained by an adhesive, the heat conductive material, and the solvent.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a silicon-based base portion having a first primary surface and a silicon-based support structure. The silicon-based support structure includes a mounting end and a distal end opposite the mounting end with the mounting end received by the base portion such that the support structure extends from the first primary surface of the base portion. The support structure includes a recess defined therein to receive the edge-emitting laser diode. The support structure further includes a slit connecting the distal end and the recess to expose at least a portion of a light-emitting edge of the edge-emitting laser diode when the edge-emitting laser diode is received in the support structure.

Abstract: A system for producing heat-sink assemblies in which a series of extruded members possess mating faces, each face having an alternating series of troughs and bulbous shaped ridges which are formed from the sides of the troughs. Mating ridges of one face of each extruded member are dipped with a thermally conductive compound prior to press-fitting and at least some of the ridges and troughs possess a groove that when mated to an opposing region of an adjacent extruded member, produces a reservoir that serves as a feeder source for thermally conductive compound. Once the extruded members are press-fitted, portions of the bulbous-shaped ridges on one face are forced past portions of the bulbous-shaped ridges of the opposing face and into the troughs. Deformation of the bulbous-shaped ridges is uniformly expansive so as to reduce shearing relative to the surfaces of the troughs, and the formed reservoirs are further compressed and feed thermal compound into the interstices between mating members.

Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.

Abstract: A heat exchanger assembly, comprising: heat exchanger pipework which comprises a plurality of elongate tube elements which extend in spaced relation and a plurality of pipe end couplings which fluidly connect open ends of respective tube elements, wherein the pipe end couplings each comprise a main body part to which the open ends of the respective tube elements are fixed, and an enclosure part which is fixed to the main body part and provides a closed fluid connection between the open ends of the respective tube elements; and a plurality of fins which extend in spaced relation and optionally substantially orthogonally to the tube elements, wherein the fins each comprise a sheet element, optionally a single, continuous sheet element, which includes a plurality of apertures through which extend respective ones of the tube elements, and a plurality of fin coupling elements which are located within respective ones of the fin apertures to interface the tube elements to the sheet elements.

Abstract: This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.

Abstract: It is provided a device and method for mounting of a heat sink on a printed circuit board with one or more electronic components to be cooled reducing the mechanical stress on the electronic components and the printed circuit board. The thermal contact between the heat sink and the electronic components to be cooled is formed by a thermal pad. The surface of the heat sink which is in contact with the thermal pad has at least one cavity into which the thermal pad can spread when the electronic component and the heat sink are pressed against each other thereby compressing the thermal pad.

Abstract: The present invention relates to a device for thermal cycling of biological samples, a heat sink used in such a device and a method. The heat sink comprises a base plate designed to fit in a good thermal contact against a generally planar thermoelectric element included in the device, and a plurality of heat transfer elements projecting away from the base plate. According to the invention, the heat transfer elements of the heat sink and arranged in a non-parallel configuration with respect to each other for keeping the temperature of the base plate of the heat sink spatially uniform during thermal cycling.

Abstract: A hypersonic refractory material, including a refractory leading edge portion for a hypersonic vehicle and a high emissivity oxide coating adhered to the refractory leading edge portion. The high emissivity oxide coating is selected from the group including Sm2O3, Tm2O3, Yb2O3, Gd2O3, and mixtures thereof, and the refractory leading edge portion includes up to about 15 mole percent of a cation dopant selected from the group including Sm2O3, Tm2O3, Yb2O3, Gd2O3, and mixtures thereof, with the remainder being selected from the group including ZrB2, HfB2, and mixtures thereof. The high emissivity coating is formed by oxidation of cation dopant at elevated temperatures.

Abstract: A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the plurality of through-vias, and a plurality of electrical connectors underlying the semiconductor substrate and connected to the seal ring. An interposer is underlying and bonded to the die. The interposer includes a substrate, and a plurality of metal lines over the substrate. The plurality of metal lines is electrically coupled to the plurality of electrical connectors. Each of the plurality metal lines has a first portion overlapped by the first die, and a second portion misaligned with the die. A heat spreader encircles the die and the interposer. A wire includes a first end bonded to one of the plurality of metal lines, and a second end bonded to the heat spreader.

Abstract: Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively.

Abstract: The invention relates to a cooling element for a pyrometallurgical furnace such as for a flash smelting furnace or for a flash converting furnace or for a suspension smelting furnace. The invention relates also to a method for manufacturing a cooling element for a pyrometallurgical furnace such as for a flash smelting furnace or for a flash converting furnace or for a suspension smelting furnace. The cooling element (2) has a fire surface (2) to be in contact with an interior of the metallurgical furnace. The cooling element comprises a base element (4) containing copper and a coating (5) at least partly covering the base element (4). The coating (4) forms the fire surface (2) of the cooling element (1). The coating (5) is at least partly applied by a laser coating process such as laser deposition, and the coating (5) contains a Ni based alloy.

Abstract: A thermal switch has a first substrate, a thermally conductive region on the first substrate, a thermally insulative region on the first substrate adjacent the thermally conductive region, a second substrate arranged adjacent the first substrate, a droplet of thermally conductive liquid between the first and second substrate adjacent the thermally conductive region and the thermally insulative region, and an actuator arranged on one of the first or second substrates to cause the droplet to move between the thermally conductive region and the thermally insulative region on the first substrate.

Abstract: The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.

Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

Abstract: Altering the direction of thermal radiation of any objects into any construction directions including grazing angles. Embodiments of the invention provide a new technique for thermal control and management.

Abstract: Method for producing AIMn strip or sheet for making components by brazing and products obtained by said method, in particular fin materials of thin gauge used in heat exchangers. Rolling slabs are produced from a melt with <0.3% Si, ?0.5% Fe, ?0.3% Cu, 1.0-2.0% Mn, ?0.5% Mg, ?4.0% Zn, ?0.5% Ni, ?0.3% each of group IVb, Vb, or Vib elements, and unavoidable impurity elements, as well as aluminium that, prior to hot rolling, are preheated at <550° C. to control the number and size of dispersoid particles, hot rolled into a hot strip, cold rolled into a strip with total reduction of at least 90%, and heat treated to obtain a 0.2% proof stress value that is 50-90% of its proof stress value in the as cold rolled condition and in a range between 100 and 200 MPa. The strip may alternatively be produced by twin-roll strip casting.

Abstract: A device for providing heat dissipation is claimed. The device comprises an outer shell and an inner, heat-dissipating gel layer within said outer shell, the inner heat-dissipating gel layer that comprises a hydrogel compound that dissipates body heat without refrigeration at room temperature.

Abstract: A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.

Abstract: A device and system for dissipating heat includes a bent portion of pyrolytic graphite in which a-b planes at a center region of the bent portion follow a surface contour of the bent portion. A method for making a heat dissipating device includes bending a flat sheet of pyrolytic graphite such that a-b planes at a center region of a bent portion follow a surface contour of the bent portion.

Abstract: A corrugated fin, in particular for a heat exchanger, having a substantially corrugated design, having a plurality of fin surfaces, wherein adjoining fin surfaces are connected to one another by means of a fin arch in such a way that a medium can flow through an intermediate space between adjoining fin surfaces, wherein the fin surfaces are arranged at an angle with respect to one another perpendicularly with respect to a throughflow direction for the medium, wherein the fin surface has at least one bulge which protrudes out of the plane of the fin surface, wherein the extent of the bulge in a direction perpendicularly with respect to the air throughflow direction is smaller than the extent of the fin surface in said direction.

Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.

Abstract: In an embodiment, heat sink system can comprise: an integrally formed plastic heat sink and a printed circuit board package, wherein the plastic heat sink comprises a thermally conductive plastic having a thermal conductivity of at least 1.0 W/mK. In another embodiment, hybrid heat sink system, comprising: an integrally formed plastic heat sink and an insert, wherein the plastic heat sink comprises a thermally conductive plastic, the plastic heat sink and the insert each having a cylindrical shape, and wherein the insert comprises a feature of lancing provisions, corrugations, embossing, holes, or a combination comprising at least one of the foregoing features.

Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.

Abstract: A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance.

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract: Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories.

Abstract: Embodiments of the present invention include methods of disposing a metallic coating layer comprising a metal in an amorphous and/or fine grain microstructure over at least a portion of a surface of a pyrolytic graphite substrate, the metal comprising Nickel, Iron, a Nickel-Iron Alloy, or any combination thereof, and the grains of the metal being of 1 nm to 10000 nm in size. Embodiments of the invention also encompass the coated pyrolytic graphite articles. The coated substrate exhibits a thermal conductivity not less than the uncoated substrate.

Abstract: A method of reducing heat in an electronic device includes providing a housing, providing a heat generating component and positioning a heat reduction sheet between the housing and the heat generating component. The heat reduction sheet includes a substrate, a first porous layer and a second porous layer. Each of the substrate and first and second porous layers has a first main surface and a second main surface. The first porous layer has an average cavity diameter of between approximately 0.01 ?m and approximately 10 ?m. The second porous layer has an average cavity diameter of between approximately 0.01 ?m and approximately 10 ?m. At least a portion of the first main surface of the substrate is in contact with at least part of the first main surface of the first porous layer. At least a portion of the second main surface of the substrate is in contact with at least part of the first main surface of the second porous layer.

Abstract: A heat transfer system is provided by the present disclosure that includes, in one form, a structural member having an upper skin, a lower skin, and a foam core disposed between the upper skin and the lower skin. At least one heat conducting array extends through the foam core and between the upper skin and the lower skin, the heat conducting array defining at least one upper cap, at least one lower cap, and a wall portion extending between the upper cap and the lower cap, the upper cap being disposed proximate a heat source. A heat conducting spreader is disposed between the lower cap of the heat conducting array and the lower skin of the structural member.

Abstract: In a power supply unit, a printed circuit board is provided on which two or more different-shape components are mounted. Such components include semiconductor devices. The printed circuit board has a designated mounting surface of the board. The housing is also provided, which houses the printed circuit board and comprises a cooling member for cooling a first space formed between the mounting surface and an opposed surface in the housing. The opposed surface is opposed to the mounting surface. The cooling member is arranged at part of the opposed surface, the part of the opposed surface projects toward the semiconductor devices, and the opposed surface is opposed to the two or more types of different-shape components.

Abstract: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting a heat sink body on a circuit board is set in a projected state on the heat sink body side and both ends of a spring member are each directly or indirectly attached to an anchor, whereby the heat sink body is mounted on the circuit board. In the anchor, a main body section projecting on the circuit board is formed in a substantially circular shape or a polygonal shape. When the spring member is attached to the anchor, the spring member is attached to an attaching section in an externally fit state.

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract: The disclosure provides a cooler for use in a plasma generation chamber of a radiation source for an extreme ultraviolet wavelength range. The cooler has a heat sink which is at least partially manufactured of a substrate material having a thermal conductivity of greater than 50 W/mK. A coolant duct is formed in the substrate material, and the coolant duct is configured to have a coolant flow therethrough. The cooler also includes a connection piece made of a metal or a metal alloy for connecting a coolant line to the coolant duct. The cooler further includes a connecting element for connecting the connection piece to the heat sink so that, when the connection piece is connected to the heat sink, a continuous line is formed by the coolant duct and the coolant line.

Abstract: The present invention discloses a manufacturing method of heat-dissipating element, including the following steps: processing a heat-dissipating element body with a bottom plate and at least two stop plates, the stop plates being disposed at two sides of the bottom plate and bending towards surface; cutting from the bottom plate of the heat-dissipating element body to form heat-dissipating element, the dissipating element at least comprising two heat-dissipating elements of same shape or of symmetric shape. The present invention also discloses a heat-dissipating element and backlight module manufactured by the above method. The heat-dissipating element, manufacturing method and backlight module thereof can maintain optimal heat-dissipation effect and save material used to lower cost.

Abstract: An exemplary heat sink includes a tube having a tube radius and first and second heat sink portions. Each heat sink portion includes an arcuate channel having a channel radius and a channel depth. Each channel radius is greater than the tube radius, and the sum of the channel depths is less than twice the tube radius. The heat sink is assembled by positioning the tube between the first and second heat sink portions, and urging the first and second heat sink portions toward one another, thereby deforming the tube.

Abstract: Provided are a flow path member that suppresses flow path breakage, a heat exchanger and a semiconductor device using the same. This flow path member has a flow path in which a fluid flows and which is constituted by a lid portion, a partition wall portion, a side wall portion and a bottom plate portion. At least one of the partition wall portion and the sidewall portion is partly embedded in at least one of the lid portion and the bottom plate portion for direct connection.

Abstract: Flexible composites of graphite leaf, containing fillers other than natural graphite, which has higher thermal conductivity than conventional 100% natural graphite based graphite sheet/foil/paper, and methods of preparing such flexible composites. In a second embodiment, there is a thermal management system comprising at least one flexible composites as set forth just Supra, wherein a graphite surface of a flexible composite is in thermal contact with a heat source of a heat generating device.

Abstract: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane, the second plane being non-planar with the first plane. The second bottom part may include an input opening. The top portion of the base may include an output opening. The input opening and the output opening may allow air to flow from behind the electronic device to over the base.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

Abstract: An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die.

Abstract: A heat sink includes a heat conduction portion and a heat dissipation portion. The heat conduction portion has a thickness, and a flat portion of the heat conduction portion contacts a heat source. The heat dissipation portion is extended from at least one side of the thickness of the heat conduction portion and includes at least a bending portion including a plurality of holes.

Abstract: A packing element (1) for use in mass and/or heat transfer processes through which at least one liquid may flow, wherein the packing element (1): has an outer surface (2) comprising three or more outer arched rib elements (21) and two outer connecting edge elements (22), optionally has an inner surface (3) comprising optional inner arched rib elements (31), wherein the element 1 is substantially spherical or substantially ellipsoidal, and wherein the outer connecting edge elements (22) and the outer arched rib elements (21) and optional inner arched rib elements (31) are embodied such that the total projected area (4) of the packing element (1) when viewed in any direction (7), preferably a radial direction (5) or optional axial direction (6), is partially open due to the presence of an open projected area (41), wherein it is open to an extent that ranges from about 15 to about 50, preferably about 17 to about 40, more preferably about 18 to about 35, most preferably about 20 to about 30% of the total project

Abstract: A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit.

Abstract: An assembled aluminum extrusion heat dissipator includes a heat-conducting plate and a plurality of U-shaped heat-dissipating members. The surface of the heat-conducting plate has a plurality of slots, and each of the slots extends from one side of the heat-conducting plate to another corresponding side. The U-shaped heat-dissipating member has a U-shaped body and a plurality of heat-dissipating fins, and the U-shaped body having a bottom plate and a pair of lateral plates, wherein the distance between the pair of lateral plates is corresponding to the distance of the two adjacent slots, so that the pair of lateral plates insert into the two adjacent slots, and the U-shaped heat-dissipating member integrates with the heat-conducting plate.

Abstract: A heat sink (10) comprising a plurality of parallel fins (12) and a plurality of plates (14). Each plate (14) is located between an adjacent pair of fins (12) and one or more securing members is provided to secure the fins (12) and plates (14) in contact. Each of the plates (14) is formed of a material being softer than the material of the fins (12) such that compression of the fins (12) and plates (14) deforms the surface of the plates (14) to improve thermal conductivity between adjacent fins (12).