Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

Abstract: An electronic assembly for a transmission control module includes a printed circuit board and a heat sink. The circuit board includes a first side, a second side averted from the first side, and at least one heat-generating component arranged on the first side and covered with at least one flowable and curable protective compound. The heat sink has an inner face facing the second side and is, at least in sections, spaced apart from the circuit board by at least one gap. The gap is at least partially filled with the at least one flowable and curable protective compound such that the flowable and curable protective compound is in direct contact with the circuit board and the heat sink. The heat sink adheres to the protective compound in a cohesive manner when the flowable and curable protective compound is in the cured state.

Abstract: The present disclosure relates to a display screen assembly, an electronic device and a manufacturing method of the display screen assembly. The display screen assembly includes a bracket, a display screen, a cover plate and a decoration enclosure. The bracket includes a bottom wall and a side wall. The display screen includes a top surface and a bottom surface provided on the bottom wall. The display screen and the side wall are located at two opposite sides of the bottom wall respectively. The bottom surface of the cover plate is joined with the top surface of the display screen. The cover plate has a groove at a side wall thereof. The decoration enclosure includes a first joining part and a second joining part coupled mutually, the first joining part is received in the groove, and the second joining part is joined with the side wall of the bracket.

Abstract: An electronic device includes: a circuit board with mounted components including a heat-generating electronic element mounted thereon; a casing configured to internally hold the circuit board; and a heat spreader configured to be held in the casing together with the circuit board, the heat spreader being formed by enclosing a liquid or paste-like thermal conductive medium in a flexible package and configured to deform to conform to a three-dimensional shape of the heat-generating electronic element and periphery thereof on the circuit board.

Abstract: A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

Abstract: A vapor chamber having improved heat transfer capacity by efficiently returning the working fluid to the evaporating portion is provided. A hollow flat container 2 is formed by a base member 4 and a lid 3 closing an opening of the base member. Phase-changeable working fluid is held in the container, and fins 9 are arranged in the container to transmit heat of a heat generating object between the bottom plate of the base member and the lid. The fins are densely juxtaposed on an evaporating portion in comparison with the other fins juxtaposed on the outside of the evaporating portion.

Abstract: An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.

Abstract: Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.

Abstract: A heating-cooling module is disposed on an electronic component and includes a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer. The heat-dissipation element is arranged over the electronic component. The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element. The heater is arranged over the electronic component, in which the heater and the heat-dissipation element are located above the same side of the electronic component, and the heater and the heat-dissipation element are separated from each other. The second thermal conductive layer is arranged between the electronic component and the heater and is separated from the first thermal conductive layer.

Abstract: A wearable heat transfer device provides a user with haptic feedback providing sensations of hot or cold. The wearable heat transfer device comprises a heat source/sink and a programmable interface having heat transfer characteristics that are modified based on a signal received by the programmable interface. For example, a thickness of the programmable interface changes based on the received signal, altering heat transfer by the programmable interface. In another example, an electric field is applied to the programmable interface, changing one or more properties of the programmable interface affecting heat transfer.

Abstract: A wedge-based heat switch includes a plurality of wedge segments on a shaft, an energy storage element (e.g., a spring or pressurized cavity) configured to store (and release) energy via compression or expansion of the element along the shaft and a temperature activated phase transition material. A temperature stimulus activates the phase transition material to release the stored energy and move the wedge segments axially along the shaft to expand or contract the plurality of wedge segments. The wedge-based heat switch may be configured as a unidirectional switch, either conductive-to-insulating or insulating-to-conductive, or a bi-directional switch. The specific design of the wedge-based heat switch is informed by such factors as unidirectional or bi-directional, required preloading of a surface, conductance ratio between conducting and insulating states, temperature stimulus, switching speed and form factor.

Abstract: A component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.

Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Abstract: A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

Abstract: A first inner heat conductor may include a plurality of first graphite layers. A second inner heat conductor may include a plurality of second graphite layers. The plurality of first graphite layers may be stacked in a first direction which is orthogonal to a direction in which a semiconductor element and a first heat radiator are arranged. The plurality of second graphite layers may be stacked in the direction in which the semiconductor element and the first heat radiator are arranged, or may be stacked in a second direction which is orthogonal to the direction in which the semiconductor element and the first heat radiator are arranged and orthogonal to the first direction.

Abstract: A heat-transferring device is formed by a stack that includes at least one heat-conducting layer and at least one heat-absorbing layer. The at least one heat-conducting layer has at least one heat-collecting section placed facing a heat source and at least one heat-evacuating section placed facing a heat sink. The at least one heat-absorbing layer includes a phase-change material. One face of the at least one heat-absorbing layer is adjoined to at least one portion of at least one face of the heat-conducting layer.

Abstract: In an embodiment, a method of fabricating a working component for magnetic heat exchange comprises arranging at least two articles comprising a magnetocalorically active phase and an elongated form with a long axis having a length l and a shortest axis having a length s, wherein l?1.5 s, such that the shortest axes of the at least two articles are substantially parallel to one another and securing the at least two articles in a position within the working component such that the shortest axes of the at least two articles are substantially parallel to one another within the working component.

Abstract: A stage includes a plate and a heat exchanger. The plate has a front surface, on which a substrate is mounted, and a rear surface. The heat exchanger is configured to individually supply a heat exchange medium to a plurality of two-dimensionally distributed and mutually non-inclusive regions of the rear surface of the plate and to recover the heat exchange medium thus supplied.

Abstract: The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

Abstract: A flexible heat sink with a flexible base having a first side configured to engage a heat generating component, and a second side opposite the first side. A plurality of groups of fins extend from the second side of the base. The groups of fins are positioned in an array and spaced apart lengthwise and width wise across the base to enable the heat sink to flex lengthwise and width wise. The heat sink is able to flex lengthwise and width wise between the groups of fins. The fins and groups of fins also may provide some flex. The fins may define triangular, rectangular, or u-shaped channels to enable air flow through the heat sink.

Abstract: An optical module includes a housing, a PCB base board, an optical assembly, and a heat generating device. The PCB base board, the optical assembly, and the heat generating device are arranged in the housing. The heat generating device is thermally connected to the housing. A plurality of ribs are arranged outside the housing. Air flow channels are formed between the plurality of ribs and extend along a longitudinal direction of the optical module. Each one of the ribs has a first end portion, a second end portion, and a middle portion that connects the first end portion and the second end portion. A radial width of at least one of the ribs gradually increases from the first end portion of the at least one of the ribs toward the middle portion of the at least one of the ribs.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: A first chamber is configured to be positioned within a wellbore. The first chamber includes a cooling fluid. A second chamber is positioned uphole of the first chamber. The first chamber and the second chamber are configured to be lowered to a position within the wellbore. The second chamber includes a cold source at a sub-zero temperature. The cooling fluid is configured to be cooled upon contacting the cold source. A separation member is positioned between the first chamber and second chamber. The separation member separates the cooling fluid and the cold source. An activation device is connected to the separation member. The activation device is configured to cause the separation member to allow the cold source to contact the cooling fluid.

Abstract: The disclosed wireless router may include (i) an enclosure, (ii) an antenna, (iii) a printed circuit board assembly, (iv) a radiative heat sink disposed between the antenna and the printed circuit board assembly within the wireless router such that the radiative heat sink is configured to shield the antenna from spurious emissions generated by the printed circuit board assembly, and (v) a fan disposed at a center of the radiative heat sink such that the fan is configured to cool the wireless router by circulating air within the enclosure rather than pushing air through venting in the enclosure. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.

Abstract: A security arrangement (10) is adapted to improve heat dissipation from circuit board components (12, 14, 16, 18, 20) on a computer circuit board (22), where a plurality of the circuit components (12, 14, 16, 18, 20) are embedded in a security shield (5) and thermally connected to at least one heat exchanger device (24). The heat exchanger device (24) is located at a distance from the security shield (5), and at least a plurality of the circuit components (12, 14, 16, 18, 20) are thermally connected with said at least one heat exchanger device (24) via at least one heat dissipating lead (32, 33, 34) to enhance cooling of the circuit board components (12, 14, 16, 18, 20).

Abstract: An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

Abstract: A battery module includes battery packs. Heat may be efficiently dissipated from the battery packs of the battery module, and heat dissipating efficiency may not vary according to positions of the battery packs; that is, heat may be uniformly dissipated. In addition, leakage of a cooling medium for dissipating heat may be prevented, and permeation of the cooling medium into the battery packs may be prevented.

Abstract: An electronic display assembly having forced-air cooling. A thermally conductive plate or a thermally conductive backlight surface is located behind an electronic display of the electronic display assembly and within a housing thereof such that a gap is formed between the plate or backlight surface and an adjacent wall of the housing. External cooling air may be caused to flow in a top-to-bottom direction through the gap in order to remove heat from the electronic display that has been conductively transferred to the gap. A plurality of ribs may be placed within the gap and in thermal communication with the electronic display to enhance the conductive transfer of heat from the electronic display.

Abstract: An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.

Abstract: A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.

Abstract: A thermal fin according to an exemplary aspect of the present disclosure includes, among other things, a body, a leg that extends from the body and a thickened region of the body including a first thickness that is greater than a second thickness of another region of the body.

Abstract: An apparatus for preventing bowing of an electronic display includes a housing and a cover panel. The electronic display is located behind said cover panel, and a backlight is located behind said electronic display. A closed loop pathway for circulating gas includes a first gas pathway located between said cover panel and the electronic display, a backlight cavity located between the electronic display and the backlight, and a second gas pathway located behind the backlight.

Abstract: An electronic package adapted for connection to a rear frame member of an electric machine. The electronic package includes a cooling tower having first and second axial ends. The cooling tower includes a metallic wall defining radially inner and outer wall surfaces and extending about the package central axis. The radially inner wall surface defines an axially extending air passage through the cooling tower with an inlet proximate the first axial end. Spaced metallic ribs are in conductive thermal communication with the radially inner wall surface traverse and the air passage. Power electronics devices are attached in conductive thermal communication to the radially outer wall surface. The cooling tower provides a heat sink for the power electronics devices with a primary cooling path for each of the power electronics device extending radially inwardly to the cooling tower. An electric machine including such an electronic package is also disclosed.

Abstract: Presently disclosed self-regulating thermal insulation may include one or more thermal actuators that may expand and contract in response to changes in temperature adjacent the thermal insulation, thereby automatically changing the thermal resistance of the thermal insulation. In this manner, a self-regulating thermal insulation may be configured to locally adjust in response to local changes in temperature of a part being insulated, for example, during curing or some other manufacturing process. Such self-regulating thermal insulation may be configured to respond to temperature changes without feedback control systems, power, or human intervention.

Abstract: A heat sink is for a heat source including an electronic component. The heat sink includes a base having a first surface and an opposite second surface. The first surface has a middle portion engaging the heat source. A plurality of elongate fins project from the second surface of the base and extend in directions perpendicular to the second surface. Middle ones of the fins are disposed opposite the middle portion of the first surface and have a greater height than other ones of the fins.

Abstract: A circuit assembly includes: a circuit substrate that has an upper surface on which a circuit pattern has been formed; a plurality of bus bars that are connected to the circuit substrate, and are fixed to a lower surface of the circuit substrate, the plurality of bus bars being spaced apart from each other; an electronic component that includes a package disposed on the bus bar, and a terminal provided within a contour of a lower surface of the package; a sheet substrate that includes one end connected to the terminal and the other end disposed outside the contour of the lower surface of the package; and a pressure-sensitive adhesive sheet that bonds the circuit substrate and the sheet substrate to the plurality of bus bars.

Abstract: A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.

Abstract: A structure for dissipating heat by natural convection, intended for being provided on the periphery of packaging for transporting and/or storing radioactive materials, the structure having two adjacent half-structures each comprising primary fins which are parallel and angled relative to a height direction of the structure, the primary fins of the two half-structures forming, in pairs, fins of the general shape of an inverted V when the packaging is arranged vertically with the bottom thereof oriented downwards.

Abstract: An edge sealing heat-dissipating film includes a heat radiation emitting film, a metal film and a heat radiation receiving film. The heat radiation emitting film has a first opening. The metal film is disposed to the heat radiation emitting film and the metal film has a second opening. The second opening is positioned corresponding to the first opening. The heat radiation receiving film is disposed to the metal film and the heat radiation receiving film has a third opening. Wherein, the shape of the heat radiation emitting film is the same as the shape of the heat radiation receiving film. And the area of the metal film is slightly smaller than the area of the heat radiation receiving film and the heat radiation emitting film. Therefore, the outer periphery of the heat radiation emitting film and the outer periphery of the heat radiation receiving film could be closely bonded together.

Abstract: A treatment system includes a fluid cooling supply system for chilling and delivering liquid coolant to a patient. The fluid cooling supply system includes a cooling device and a heat exchanger device. The heat exchanger device is biased to the cooling device and is in fluid communication with a treatment device in a patient. The fluid cooling supply system includes at least one biasing mechanism to provide a given biasing force between the heat exchanger device and the cooling device to effectuate and improve heat transfer. The liquid coolant may be circulated through an energy delivery device positioned in an airway of a patient to preserve tissue. The system is controlled to circulate liquid coolant at a given temperature and pressure for a selected amount of time during pulmonary treatment of a patient.

Abstract: In an exemplary electronic device with a cooling fan, a fan assembly is attached to a keyboard assembly of the electronic device. The fan assembly includes an impeller at least partially inside a fan enclosure. The fan enclosure has, on a surface, an inlet opening and an external protrusion. The electronic device further includes a bottom case. The fan assembly is positioned between the keyboard assembly and the bottom case and oriented such that the inlet opening and the external protrusion face the bottom case. The external protrusion maintains a passage between the fan enclosure and the bottom case that allows air to enter the inlet opening and also resists interference between the rotating impeller and the stationary bottom case.

Abstract: A system for mounting a heat sink to a printed circuit board includes a frame that is configured to be mounted to a printed circuit board and to receive a heat sink. The heat sink and the frame are formed as separate components. The frame is formed as a rigid component. The system further includes fastening elements that are configured to fix the heat sink to the frame in a mounting position after the heat sink has been inserted into the frame.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents. The wall also includes an exhaust zone containing a set of exhaust vents.

Abstract: A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mPa·s to 3,000,000 mPa·s.

Abstract: A shielding structure is provided. The shielding structure is adapted to be disposed on a circuit board. The shielding structure includes a main beam, a branch beam and a shielding cover. The main beam is affixed to the circuit board, wherein the main beam includes a main beam body and a main beam connection unit, the main beam connection unit is disposed on the main beam body. The branch beam includes a branch beam body and a branch beam connection unit, wherein the branch beam connection unit is disposed on the branch beam body, the branch beam connection unit is connected to the main beam connection unit, and the main beam connection unit is partially located between the branch beam connection unit and the circuit board. The shielding cover includes a cover portion and a surrounding wall which is bent from the cover portion.

Abstract: A flexible, thermal bridge element, particularly for a space flight instrument, a satellite, a transportation device, or a machine component, includes a number of carbon fiber-reinforced plastic (CFK) layers stacked on top of one another. Each of the CFK layers is composed of a plurality of heat-conductive carbon fibers embedded in a matrix. In at least two segments, particularly opposing end segments, the CFK layers are freed of the material of the matrix so that the carbon fibers of a respective CFK layer are exposed in the at least two segments. The exposed segments of the carbon fibers are provided with an associated metallization, by way of which within the framework of a thermally assisted joining process, the bridge element is connected to a thermally conductive connector element.

Abstract: Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.