Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.

Abstract: A manifold structure is provided to cool a heat-dissipating surface and includes an inlet fluid passage, an outlet fluid passage, and at least one cooling channel that is connected between the inlet fluid passage and the outlet fluid passage and extends along a length of the heat-dissipating surface. Additively manufactured fins are arranged in the cooling channel. The fins are configured to provide a geometry transition area between fins having a first geometry and fins having a second geometry, and a material transition area between fins formed of a first material and fins formed of a second material. The manifold structure is configured to provide a gradient convection coefficient by way of the geometry transition area and a gradient thermal conductivity by way of the material transition area across the length of the heat-dissipating surface.

Abstract: A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.

Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.

Abstract: A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

Abstract: An assistance system of a motor vehicle, with a camera comprises a camera housing having a first cooling body with first cooling fins, a cap covering the camera housing, wherein the cap has a second cooling body with second cooling fins, and wherein the second cooling fins are arranged at least partially between the first cooling fins.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

Abstract: Embodiments of a thermal management system are provided herein. In some embodiments, a thermal management system may include a base plate; and a plurality of three dimensional fins coupled to the base, wherein each of the plurality of three dimensional fins comprises a first portion extending away from the base in a first direction and a second a portion extending away from the first portion in a second direction different from the first direction.

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.

Abstract: An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.

Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.

Abstract: An embodiment relates to a heat transfer device including a heat generating device configured to generate heat having predetermined intensity by a user, a cover in contact with a body of the user while covering the heat generating device, and a heat transfer medium provided between the heat generating device and the cover to transfer the heat generated by the heat generating device, wherein the heat transfer medium is a structure that is formed by entangling a single wire having a predetermined length and has a predetermined width and a predetermined height, and is a structure that is compressed in an axial direction when being in contact with the body of the user and thus has a Poisson's ratio of 0.5 or higher. Thus, a structural change in the heat generating device is not required and only a material in contact with the heat generating device is changed, so that generated heat may more rapidly reach the body of the user.

Abstract: There is described a foam article comprising: a base foam having a textured surface; a trim cover covering at least a portion of the textured surface, the trim cover comprising: (i) a finished outer layer comprising an occupant-contact outer portion and inner portion; (ii) a compressible buffer layer secured with respect to the inner portion of the finished outer layer; and (iii) a contact layer secured with respect to the compressible layer and configured to be in contact with the textured surface of the base foam, the contact layer having a secant modulus at 5% strain of at least about 7 when measured according to modified ASTM D3574-11, Test E, Tensile Test.

Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Abstract: A power supply includes a power supply unit. The power supply unit includes a first housing configured to interface with one or more of housings of one or more fan modules. The power supply unit also includes a power generation unit disposed within the housing. The power generation unit may be configured to generate power for an electrical device. The power supply further includes a first connector configured to provide power to the one or more fan modules. The power may be used to operate one or more fan units of the one or more fan modules. The power supply also includes a fan module. The fan module includes a second housing configured to interface with the first housing. The fan module also includes a fan unit disposed within the second housing. The fan unit may be configured to generate an airflow through the first housing. The fan module further includes a first attachment member configured to interface with the first connector.

Abstract: A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: The present invention relates to a heat transferring arrangement for cooling at least one light emitting diode, wherein the heat transferring arrangement comprises a centre portion configured for mounting the light emitting diode and adapted to receive heat generated from the light emitting diode when emitting light, and a plurality of elongated heat transferring elements, each having a first end portion connected to the centre portion and a second end portion which when inserted in a housing is configured to be in abutment with an inner surface of the housing, so that the generated heat is thermally transferred to the housing. Advantages with the invention includes, at least, that a passive heat transferring arrangement is provided which may reduce the need of an external fan or membranes to provide sufficient cooling.

Abstract: A light fixture includes a light engine comprising at least one light emitting diode (LED), the light engine comprising a front surface and a rear surface. The element includes an electronics housing that is configured to house a plurality of electronic components. The electronics housing is coupled at a first end with the rear surface of the light engine. The electronics housing further includes a second end and at least one side wall extending between the first end and the second end. The at least one side wall defines an aperture though which at least some of the plurality of electronic components are accessible. The light fixture also includes a cover that is coupled with the at least one side wall, the cover being sized and shaped to cover the aperture.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

Abstract: Exemplary embodiments are disclosed of thermal interface materials with wear-resisting layers and/or suitable for use between sliding components. Also disclosed are devices including thermal interface materials and methods of using thermal interface materials.

Abstract: An integrated circuit (IC) chip carrier includes an IC chip electrically connected to an IC chip carrier by a plurality of chip-carrier contacts, a cover thermally connected the IC chip upper surface, and an in-plane thermal conductance (ITC) layer upon the IC chip carrier between the IC chip carrier and the IC chip. The ITC layer includes an extension tab connected to a vertical side surface of the cover. Heat is transferred vertically from the IC chip to the cover. Heat is also transferred vertically from the IC chip to the ITC layer. Heat is also transferred within the ITC layer through the ITC layer basal plane(s). The ITC layer basal plane(s) are positioned horizontally where the ITC layer is between the IC chip and the IC chip carrier. The ITC layer basal planes are positioned vertically where the extension tab contacts the vertical side surface of the cover.

Abstract: A semiconductor device having enhanced thermal transfer includes at least one die, including a device layer in which one or more functional circuit elements are formed and a substrate supporting the device layer, and a support structure. The die is disposed on the support structure using at least one connection structure coupled between the device layer and the support structure. A back surface of the substrate is textured so as to increase a surface area of the back surface to thereby enhance thermal transfer between the substrate and an external environment.

Abstract: An electronic device is described. The electronic device includes a body having a first surface and a second surface opposite the first surface. The first surface of the body is a first surface of the electronic the device. The electronic device also has a second surface opposite the first surface. A metal pattern is disposed on the second surface of the electronic device. The metal pattern includes a first electrode, a second electrode, and at least two thermal pads. The at least two thermal pads are electrically isolated from the first electrode and the second electrode, are located along opposite sides of the second surface of the electronic device, and have substantially identical shapes.

Abstract: An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a current passing through the first coil pattern and a range of a current passing through the second coil pattern are different from each other. The first and second coil patterns are coil patterns having different electrical characteristics.

Abstract: According to one embodiment, an electronic device includes a flexible printed-wiring board which includes a first face and a second face, and is supported by the support member. One or more electronic components are mounted on the first face. The electronic device is fixed onto the second face. The flexible printed-wiring board includes a plurality of first regions, on which the one or more electronic components are mounted or to which a member secured on the support member is fixed. When viewed from a direction orthogonal to the first face, the plate is provided with an opening between two first regions of the plurality of first regions.

Abstract: A solid-state laser active medium comprising an optical gain material; a heat sink, wherein the heat sink is transparent, in particular over a wavelength range of 200 nm to 4000 nm, preferably with an absorption coefficient of <1 cm?1; the heat sink having a high thermal conductivity, in particular ?149 W/(m*K); wherein the optical gain material and the heat sink exhibit a root-mean square, RMS, surface roughness of <1 nm; wherein the optical gain material is attached to the transparent heat sink by direct bonding.

Abstract: Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.

Abstract: A controller includes a machine learning device that learns an operating parameter for an operation of bonding a radiation plate by a robot. The machine learning device observes operating parameter data and heat conductor state data as state variables that express a current state of an environment. In addition, the machine learning device acquires determination data indicating a propriety determination result of the operation of bonding the radiation plate, and learns the operating parameter in association with the heat conductor state data, using the state variables and the determination data.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.

Abstract: A base plate having concave curved portions (rearward-convex parts) curved in a rearward direction to be convex and have a predetermined curvature, is fixed to a surface of a cooling fin while being in contact with the surface of the cooling fin at vertices of the rearward-convex parts. A stacked substrate is bonded on a front surface of the base plate, at an area opposing the rearward-convex part. A spacer is provided on a rear surface of the base plate, at a position closer than an edge of a solder layer to a perimeter of the base plate. The spacer is sandwiched between the base plate and the cooling fin when a screw for fixing the base plate to the cooling fin is tightened and the spacer has a function of suppressing deformation of the base plate.

Abstract: Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.

Abstract: A nested finned heat sink with heat pipe(s). A heat dissipation unit includes a base seat and a first radiating fin assembly. The first radiating fin assembly includes multiple first radiating fins. Two ends of each first radiating fin are respectively formed with a first end edge and a second end edge on a first side. The respective first radiating fins are nested with height and width gradually increased. Each first radiating fin is formed with at least one first support section and a first opening in a position corresponding to the first support section. The first support section abuts against and supports another first radiating fin.

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Abstract: The present disclosure relates to a display screen assembly, an electronic device and a manufacturing method of the display screen assembly. The display screen assembly includes a bracket, a display screen, a cover plate and a decoration enclosure. The bracket includes a bottom wall and a side wall. The display screen includes a top surface and a bottom surface provided on the bottom wall. The display screen and the side wall are located at two opposite sides of the bottom wall respectively. The bottom surface of the cover plate is joined with the top surface of the display screen. The cover plate has a groove at a side wall thereof. The decoration enclosure includes a first joining part and a second joining part coupled mutually, the first joining part is received in the groove, and the second joining part is joined with the side wall of the bracket.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

Abstract: A differential optical modulator includes, in part, a splitter splitting an incoming optical signal into first and second input signals, a first variable coupler generating a first differential output signal in response to the first input signal, and a second variable coupler generating a second differential output signal in response to the second input signal. The first variable coupler includes, in part, first and second couplers and a phase shifter disposed therebetween. The first coupler generates a pair of internal signals in response to the first input signal. The second coupler generates the first differential output signal. The second variable coupler includes, in part, third and fourth couplers and a phase shifter disposed therebetween. The third coupler generates a pair of internal signals in response to the second input signal. The fourth coupler generates the second differential output signal.

Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

Abstract: An electronic device includes: a circuit board with mounted components including a heat-generating electronic element mounted thereon; a casing configured to internally hold the circuit board; and a heat spreader configured to be held in the casing together with the circuit board, the heat spreader being formed by enclosing a liquid or paste-like thermal conductive medium in a flexible package and configured to deform to conform to a three-dimensional shape of the heat-generating electronic element and periphery thereof on the circuit board.

Abstract: An electronic assembly for a transmission control module includes a printed circuit board and a heat sink. The circuit board includes a first side, a second side averted from the first side, and at least one heat-generating component arranged on the first side and covered with at least one flowable and curable protective compound. The heat sink has an inner face facing the second side and is, at least in sections, spaced apart from the circuit board by at least one gap. The gap is at least partially filled with the at least one flowable and curable protective compound such that the flowable and curable protective compound is in direct contact with the circuit board and the heat sink. The heat sink adheres to the protective compound in a cohesive manner when the flowable and curable protective compound is in the cured state.

Abstract: A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

Abstract: The present disclosure relates to a display screen assembly, an electronic device and a manufacturing method of the display screen assembly. The display screen assembly includes a bracket, a display screen, a cover plate and a decoration enclosure. The bracket includes a bottom wall and a side wall. The display screen includes a top surface and a bottom surface provided on the bottom wall. The display screen and the side wall are located at two opposite sides of the bottom wall respectively. The bottom surface of the cover plate is joined with the top surface of the display screen. The cover plate has a groove at a side wall thereof. The decoration enclosure includes a first joining part and a second joining part coupled mutually, the first joining part is received in the groove, and the second joining part is joined with the side wall of the bracket.

Abstract: An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.

Abstract: A vapor chamber having improved heat transfer capacity by efficiently returning the working fluid to the evaporating portion is provided. A hollow flat container 2 is formed by a base member 4 and a lid 3 closing an opening of the base member. Phase-changeable working fluid is held in the container, and fins 9 are arranged in the container to transmit heat of a heat generating object between the bottom plate of the base member and the lid. The fins are densely juxtaposed on an evaporating portion in comparison with the other fins juxtaposed on the outside of the evaporating portion.

Abstract: Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.

Abstract: A heating-cooling module is disposed on an electronic component and includes a heat-dissipation element, a first thermal conductive layer, a heater, and a second thermal conductive layer. The heat-dissipation element is arranged over the electronic component. The first thermal conductive layer is arranged between the electronic component and the heat-dissipation element. The heater is arranged over the electronic component, in which the heater and the heat-dissipation element are located above the same side of the electronic component, and the heater and the heat-dissipation element are separated from each other. The second thermal conductive layer is arranged between the electronic component and the heater and is separated from the first thermal conductive layer.

Abstract: A wearable heat transfer device provides a user with haptic feedback providing sensations of hot or cold. The wearable heat transfer device comprises a heat source/sink and a programmable interface having heat transfer characteristics that are modified based on a signal received by the programmable interface. For example, a thickness of the programmable interface changes based on the received signal, altering heat transfer by the programmable interface. In another example, an electric field is applied to the programmable interface, changing one or more properties of the programmable interface affecting heat transfer.

Abstract: A component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.