Abstract: A surface cooler includes a conduit, a body having an external surface, and a plurality of fin members arranged in an array of fin members. The conduit defines an inlet, an outlet, and an internal flow path extending between the inlet and the outlet. The conduit is configured to channel a flow of fluid to be cooled from the inlet to said outlet. The conduit extends through the body. Each fin member of the array of fin members extends from the external surface of the body. Each fin member is fabricated from a thermally conductive, resilient, and pliable material.

Abstract: In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.

Abstract: The invention relates to an electronic module (100) mounted on a transmission component (112). The electronic module (100) comprises a printed circuit board element (102) that has component side (104) with at least one electronic component (108) and a contact side (106) lying opposite the component side (104), and a heat conducting film (110) that is placed between a surface section of the contact side (106) lying opposite the component (108) and a surface section of the transmission component (112). The printed circuit board element (102) can be or is tightened to the transmission component (112) such that the heat conducting film (110) is pressed against the surface section of the contact side (106) and the surface section of the transmission component (112).

Abstract: A thermoelectric generator has a heat conducting body that exchanges heat with the environment according to environmental temperature changes, a heat storing body, and a thermoelectric conversion unit and thermal resistance body arranged between the heat conducting body and the heat storing body. One end of the thermal resistance body and one end of the thermoelectric conversion unit are in contact with each other. The other end of the thermal resistance body is in contact with the heat conducting body, and the other end of the thermoelectric conversion unit is in contact with the heat storing body. The surface of the heat storing body is covered by a covering layer having certain heat insulation properties. The temperature difference generated between the heat conducting body and the heat storing body is utilized to extract electric energy from the thermoelectric conversion unit.

Abstract: A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.

Abstract: A flow path member includes a lid portion, a bottom plate portion, and side walls provided between the lid portion and the bottom plate portion, a flow path in which a fluid flows is configured with the lid portion, the side walls, and the bottom plate portion, a portion of a surface of the side walls on the flow path side includes a coarse portion that is coarser than the other portions.

Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Abstract: An automotive power electronics assembly, including: a cover plate, a cooling pipe received in a groove extending along a first surface of the cover plate, a plurality of metallic heat sink bodies provided on a second, opposite surface of the cover plate wherein first end faces of the hear sink bodies are in heat conducting contact with the cover plate, each heat sink body carrying on a side surface at least one semiconductor component to be cooled, and a printed circuit board providing electronic contacts to the semiconductor components, where the printed circuit board is in contact with second end faces of the heat sink bodies. Each heat sink body tapers from the first end face to the second end face such that the contact area with the cover plate is larger than the contact area with the printed circuit board.

Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.

Abstract: A manifold structure is provided to cool a heat-dissipating surface and includes an inlet fluid passage, an outlet fluid passage, and at least one cooling channel that is connected between the inlet fluid passage and the outlet fluid passage and extends along a length of the heat-dissipating surface. Additively manufactured fins are arranged in the cooling channel. The fins are configured to provide a geometry transition area between fins having a first geometry and fins having a second geometry, and a material transition area between fins formed of a first material and fins formed of a second material. The manifold structure is configured to provide a gradient convection coefficient by way of the geometry transition area and a gradient thermal conductivity by way of the material transition area across the length of the heat-dissipating surface.

Abstract: A computing device includes a housing having an inner surface, a first outer surface, a second outer surface, and a side extending between the first outer surface and the second outer surface. The computing device also includes a heat generating electronic device, a first heat spreader, and a second heat spreader. At least a portion of the first heat spreader abuts or is adjacent to the inner surface of the housing. The second heat spreader extends from a first position within the housing, at or adjacent to the heat generating electronic device to a second position within the housing. The second position is closer to the side of the housing than the first position. A first portion of the second heat spreader abuts the first heat spreader, and a second portion of the second heat spreader is at a distance from the first heat spreader.

Abstract: An electronic assembly comprises a circuit board having one or more electronic components mounted on the circuit board. The circuit board has a first side and a second side opposite the first side. The electronic assembly has a lower enclosure and an upper enclosure for mating with the lower enclosure to form a housing to hold the circuit board. A frame overlies the first side or the second side of the circuit board. The frame comprises a first retainer for retaining coaxial cable. The first retainer comprises a first pair of opposing arcuate members extending from the frame.

Abstract: An assistance system of a motor vehicle, with a camera comprises a camera housing having a first cooling body with first cooling fins, a cap covering the camera housing, wherein the cap has a second cooling body with second cooling fins, and wherein the second cooling fins are arranged at least partially between the first cooling fins.

Abstract: A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.

Abstract: Embodiments of a thermal management system are provided herein. In some embodiments, a thermal management system may include a base plate; and a plurality of three dimensional fins coupled to the base, wherein each of the plurality of three dimensional fins comprises a first portion extending away from the base in a first direction and a second a portion extending away from the first portion in a second direction different from the first direction.

Abstract: An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

Abstract: There is described a foam article comprising: a base foam having a textured surface; a trim cover covering at least a portion of the textured surface, the trim cover comprising: (i) a finished outer layer comprising an occupant-contact outer portion and inner portion; (ii) a compressible buffer layer secured with respect to the inner portion of the finished outer layer; and (iii) a contact layer secured with respect to the compressible layer and configured to be in contact with the textured surface of the base foam, the contact layer having a secant modulus at 5% strain of at least about 7 when measured according to modified ASTM D3574-11, Test E, Tensile Test.

Abstract: An embodiment relates to a heat transfer device including a heat generating device configured to generate heat having predetermined intensity by a user, a cover in contact with a body of the user while covering the heat generating device, and a heat transfer medium provided between the heat generating device and the cover to transfer the heat generated by the heat generating device, wherein the heat transfer medium is a structure that is formed by entangling a single wire having a predetermined length and has a predetermined width and a predetermined height, and is a structure that is compressed in an axial direction when being in contact with the body of the user and thus has a Poisson's ratio of 0.5 or higher. Thus, a structural change in the heat generating device is not required and only a material in contact with the heat generating device is changed, so that generated heat may more rapidly reach the body of the user.

Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: A power supply includes a power supply unit. The power supply unit includes a first housing configured to interface with one or more of housings of one or more fan modules. The power supply unit also includes a power generation unit disposed within the housing. The power generation unit may be configured to generate power for an electrical device. The power supply further includes a first connector configured to provide power to the one or more fan modules. The power may be used to operate one or more fan units of the one or more fan modules. The power supply also includes a fan module. The fan module includes a second housing configured to interface with the first housing. The fan module also includes a fan unit disposed within the second housing. The fan unit may be configured to generate an airflow through the first housing. The fan module further includes a first attachment member configured to interface with the first connector.

Abstract: The present invention relates to a heat transferring arrangement for cooling at least one light emitting diode, wherein the heat transferring arrangement comprises a centre portion configured for mounting the light emitting diode and adapted to receive heat generated from the light emitting diode when emitting light, and a plurality of elongated heat transferring elements, each having a first end portion connected to the centre portion and a second end portion which when inserted in a housing is configured to be in abutment with an inner surface of the housing, so that the generated heat is thermally transferred to the housing. Advantages with the invention includes, at least, that a passive heat transferring arrangement is provided which may reduce the need of an external fan or membranes to provide sufficient cooling.

Abstract: A cooling apparatus includes a plurality of containers and a plurality of connectors. Each connector connects adjacent containers of the plurality of containers. The cooling apparatus is installable in a computing device such that each electronic component to be cooled in the computing device is interposed between adjacent containers. Each container may include a body, an inlet, and an outlet. The body may include first and second ends and may define a chamber through which a coolant is to flow. The body may be expandable responsive to pressure from the coolant and deformable responsive to contacting one of the electronic components so as to conform to a profile of the electronic component. The inlet may be disposed at the first end of the body through which the coolant enters the chamber. The outlet may be disposed at the second end of the body through which the coolant exits the chamber.

Abstract: Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier.

Abstract: A light fixture includes a light engine comprising at least one light emitting diode (LED), the light engine comprising a front surface and a rear surface. The element includes an electronics housing that is configured to house a plurality of electronic components. The electronics housing is coupled at a first end with the rear surface of the light engine. The electronics housing further includes a second end and at least one side wall extending between the first end and the second end. The at least one side wall defines an aperture though which at least some of the plurality of electronic components are accessible. The light fixture also includes a cover that is coupled with the at least one side wall, the cover being sized and shaped to cover the aperture.

Abstract: Exemplary embodiments are disclosed of thermal interface materials with wear-resisting layers and/or suitable for use between sliding components. Also disclosed are devices including thermal interface materials and methods of using thermal interface materials.

Abstract: An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a current passing through the first coil pattern and a range of a current passing through the second coil pattern are different from each other. The first and second coil patterns are coil patterns having different electrical characteristics.

Abstract: A semiconductor device having enhanced thermal transfer includes at least one die, including a device layer in which one or more functional circuit elements are formed and a substrate supporting the device layer, and a support structure. The die is disposed on the support structure using at least one connection structure coupled between the device layer and the support structure. A back surface of the substrate is textured so as to increase a surface area of the back surface to thereby enhance thermal transfer between the substrate and an external environment.

Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

Abstract: An electronic device is described. The electronic device includes a body having a first surface and a second surface opposite the first surface. The first surface of the body is a first surface of the electronic the device. The electronic device also has a second surface opposite the first surface. A metal pattern is disposed on the second surface of the electronic device. The metal pattern includes a first electrode, a second electrode, and at least two thermal pads. The at least two thermal pads are electrically isolated from the first electrode and the second electrode, are located along opposite sides of the second surface of the electronic device, and have substantially identical shapes.

Abstract: An integrated circuit (IC) chip carrier includes an IC chip electrically connected to an IC chip carrier by a plurality of chip-carrier contacts, a cover thermally connected the IC chip upper surface, and an in-plane thermal conductance (ITC) layer upon the IC chip carrier between the IC chip carrier and the IC chip. The ITC layer includes an extension tab connected to a vertical side surface of the cover. Heat is transferred vertically from the IC chip to the cover. Heat is also transferred vertically from the IC chip to the ITC layer. Heat is also transferred within the ITC layer through the ITC layer basal plane(s). The ITC layer basal plane(s) are positioned horizontally where the ITC layer is between the IC chip and the IC chip carrier. The ITC layer basal planes are positioned vertically where the extension tab contacts the vertical side surface of the cover.

Abstract: According to one embodiment, an electronic device includes a flexible printed-wiring board which includes a first face and a second face, and is supported by the support member. One or more electronic components are mounted on the first face. The electronic device is fixed onto the second face. The flexible printed-wiring board includes a plurality of first regions, on which the one or more electronic components are mounted or to which a member secured on the support member is fixed. When viewed from a direction orthogonal to the first face, the plate is provided with an opening between two first regions of the plurality of first regions.

Abstract: A solid-state laser active medium comprising an optical gain material; a heat sink, wherein the heat sink is transparent, in particular over a wavelength range of 200 nm to 4000 nm, preferably with an absorption coefficient of <1 cm?1; the heat sink having a high thermal conductivity, in particular ?149 W/(m*K); wherein the optical gain material and the heat sink exhibit a root-mean square, RMS, surface roughness of <1 nm; wherein the optical gain material is attached to the transparent heat sink by direct bonding.

Abstract: A controller includes a machine learning device that learns an operating parameter for an operation of bonding a radiation plate by a robot. The machine learning device observes operating parameter data and heat conductor state data as state variables that express a current state of an environment. In addition, the machine learning device acquires determination data indicating a propriety determination result of the operation of bonding the radiation plate, and learns the operating parameter in association with the heat conductor state data, using the state variables and the determination data.

Abstract: Exemplary embodiments are disclosed of thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.

Abstract: Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.

Abstract: A nested finned heat sink with heat pipe(s). A heat dissipation unit includes a base seat and a first radiating fin assembly. The first radiating fin assembly includes multiple first radiating fins. Two ends of each first radiating fin are respectively formed with a first end edge and a second end edge on a first side. The respective first radiating fins are nested with height and width gradually increased. Each first radiating fin is formed with at least one first support section and a first opening in a position corresponding to the first support section. The first support section abuts against and supports another first radiating fin.

Abstract: A base plate having concave curved portions (rearward-convex parts) curved in a rearward direction to be convex and have a predetermined curvature, is fixed to a surface of a cooling fin while being in contact with the surface of the cooling fin at vertices of the rearward-convex parts. A stacked substrate is bonded on a front surface of the base plate, at an area opposing the rearward-convex part. A spacer is provided on a rear surface of the base plate, at a position closer than an edge of a solder layer to a perimeter of the base plate. The spacer is sandwiched between the base plate and the cooling fin when a screw for fixing the base plate to the cooling fin is tightened and the spacer has a function of suppressing deformation of the base plate.

Abstract: The present disclosure relates to a display screen assembly, an electronic device and a manufacturing method of the display screen assembly. The display screen assembly includes a bracket, a display screen, a cover plate and a decoration enclosure. The bracket includes a bottom wall and a side wall. The display screen includes a top surface and a bottom surface provided on the bottom wall. The display screen and the side wall are located at two opposite sides of the bottom wall respectively. The bottom surface of the cover plate is joined with the top surface of the display screen. The cover plate has a groove at a side wall thereof. The decoration enclosure includes a first joining part and a second joining part coupled mutually, the first joining part is received in the groove, and the second joining part is joined with the side wall of the bracket.

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Abstract: An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

Abstract: A differential optical modulator includes, in part, a splitter splitting an incoming optical signal into first and second input signals, a first variable coupler generating a first differential output signal in response to the first input signal, and a second variable coupler generating a second differential output signal in response to the second input signal. The first variable coupler includes, in part, first and second couplers and a phase shifter disposed therebetween. The first coupler generates a pair of internal signals in response to the first input signal. The second coupler generates the first differential output signal. The second variable coupler includes, in part, third and fourth couplers and a phase shifter disposed therebetween. The third coupler generates a pair of internal signals in response to the second input signal. The fourth coupler generates the second differential output signal.