Abstract: An interconnect assembly includes a spacer assembly including a top surface and a bottom surface; and a flexible circuit member including a first surface and a second surface opposite the first surface. The flexible circuit member curves about at least a portion of the spacer assembly such that a first portion of the first surface of the flexible circuit member is coupled to the top surface of the spacer assembly and a second portion of the first surface of the flexible circuit member is coupled to the bottom surface of the spacer assembly. The interconnect assembly further includes at least one top electrical interface element coupled to a first portion of the second surface of the flexible circuit member; and at least one bottom electrical interface element coupled to a second portion of the second surface of the flexible circuit member. The first portion of the second surface of the flexible circuit member is spaced apart from the second portion of the second surface of the flexible circuit member.

Abstract: Methods and apparatus for processing flexible graphite sheet material involve patterning the material, on at least one major surface, prior to further processing of the material such as densification, lamination, folding or shaping into three-dimensional structures. For densification and lamination, the patterning is selected to facilitate the removal of air from the flexible graphite sheet material during the densification and lamination process. For folding or shaping, the patterning is selected to render the graphite sheet material more flexible. In some embodiments, methods for increasing the through-plane conductivity of flexible graphite sheet material are employed. Integrated heat removal devices include sheets of graphite material that have been selectively patterned in different regions to impart desirable localized properties to the material prior to it being shaped or formed into an integrated heat removal device.

Abstract: A circuit structure includes a circuit board mounted with electronic components, a heat release member overlaid by the circuit board and releasing heat of the circuit board, a screw screwing the circuit board to the heat release member, and a spacer on which an insertion hole is formed to insert a shaft portion of the screw and the spacer is arranged between the circuit board and the screw to receive the screw. The spacer includes a board presser pressing the circuit board and a heat release member presser pressing the heat release member when the circuit board is screwed to the heat release member.

Abstract: In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.

Abstract: An assembly has a two-stage cryogenic refrigerator and an associated mounting arrangement, and a sock having first and second stages corresponding to first and second stages of the refrigerator, with the first stage of the refrigerator being in thermal contact with the first stage of the sock and the second stage of the refrigerator being in thermal contact with the second stage of the sock.

Abstract: A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.

Abstract: A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.

Abstract: Methods of using heat sinks include placing a pin fin compliant heat sink on a non-flat surface. The pin fin complaint heat sink has top and bottom plates connected by a plurality of pins arranged vertically between the top and bottom plates. The top and bottom plates are vertically conformed to local deviations of the non-flat surface. The top and bottom plates are laterally conformed to an overall shape of the surface. At least either the top or bottom plate is corrugated.

Abstract: A heat dissipater resilient structure is adapted to be fixed to a connector of a motherboard and for an expansion card heat dissipater to be disposed on. The heat dissipater resilient structure includes a body, an arm and a fixing member. The body is adapted to be fixed to the connector. The arm extends from the body and is bendable between a first position and a second position. The fixing member is located at the body or the arm. The expansion card heat dissipater is adapted to be fixed to the fixing member and lean against the arm to move with the arm. When pressed, the expansion card heat dissipater is adapted to move with the arm from the first position to the second position. When not pressed, the arm moves with the expansion card heat dissipater to return to the first position. A connector module is further provided.

Abstract: 3D printed thermal management devices and corresponding methods of manufacturing are described herein. A thermal management device includes a single contiguous component including at least a portion of a first heat exchanger and at least a portion of a second heat exchanger. The second heat exchanger is of a different type than the first heat exchanger.

Abstract: A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.

Abstract: A construction kit for a housing structure of a monument for a cabin of a vehicle, in particular of an aircraft includes a plurality of integrally formed sandwich panels which each have two cover panels, which surround a core, and are formed with panel connecting structures which are each formed as a plug region or as a mating plug region. The mating plug region is formed so as to be complementary to the plug region in such a way that a plug region of a sandwich panel can be plugged into the mating plug region of another sandwich panel to connect the sandwich panels.

Abstract: A semiconductor device includes a layered package having a semiconductor die embedded therein, the semiconductor die coupled with a thermally-conductive element. The layered package includes, e.g., PCB boards with an intermediate layer having the semiconductor die arranged therein, and a pair of outer layers, with the thermally-conductive element including a thermally-conductive inlay in one of the outer layers.

Abstract: According to one embodiment, a heat dissipation structure includes a heat dissipating unit and a heat accumulating unit. The heat dissipating unit includes at least one extending part which extends in a first direction, and is configured to be thermally connected to an apparatus which is configured to produce heat. The heat accumulating unit includes an accommodating unit which is configured to be thermally connected to the extending part, a heat storage material sealed inside the accommodating unit.

Abstract: An ultrasound probe and ultrasonic diagnosis apparatus that can maintain surface temperature of an ultrasound probe within a safe range, without reduction in performance. The ultrasound probe includes a casing, a transducer, an electronic circuit, and a heat-transfer construction. Elements of the transducer are aligned at one end of the casing and send out ultrasound waves in accordance with their respective delay times. The electronic circuit, disposed in the casing, includes a delay circuit setting delay times and pulsers for generating pulses in accordance with the delay times, the pulses being sent to the transducer. While the electronic circuit is being energized, the heat-transfer construction disposes a member having a low heat conductivity at least either between the electronic circuit and the casing or between the electronic circuit and the transducer. Thereby, heat from the electronic circuit is conducted to the other end of the casing.

Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

Abstract: A foam exercise block in the shape of a wedge having an inclined front face, a vertical rear face, and a bottom face defining forward, upper, and rear edges. A ball socket is formed in the front face, and upper and lower semi-circular grooves running between the front and rear faces at the upper and forward edges of the wedge provide support for an exercise ball and portions of the body. The continuity of the lateral edges at their ends is interrupted by right-angled cutouts to provide corner handholds for various exercises using the wedge as a brace against a flat surface.

Abstract: A precision pump system having a motor driver for accurately and repeatedly delivering process fluid, (e.g., photo chemicals) using a pumping fluid with minimal process fluid loss to a fabrication process and whereby the motor driver can be easily and quickly replaced without interrupting the fluid flow path. This is accomplished with the use of a process fluid reservoir and a pumping fluid reservoir that are associated with the pump, either integrated with the pump or closely adjacent. In addition, this precision pump system can be remotely monitored, viewed and controlled over the Internet. In addition, trapped process fluid within a downstream filtering block can be recirculated to the process fluid reservoir when trapped gas in the filter is removed. Furthermore, a nitrogen gas source is connected to the process fluid reservoir via a valve in case a need to insert a gas is required.

Abstract: A power converter for a railway vehicle includes a power converter body configured to be installed on the railway vehicle; a first radiating fin unit arranged on a front side on the power converter body for dissipating heat from the power converter body; a second radiating fin unit arranged on the power converter body on a rear side for dissipating heat from the power converter body; and an air duct that takes in air from a region other than regions in which the first and second radiating fin units are disposed while the railway vehicle is moving, the air duct extending into a fin separation space that is defined as a space between the first radiating fin unit and the second radiating fin unit so as to guide air that is taken in into the fin separation space.

Abstract: A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.

Abstract: An oil cooler comprises a cooler core having an oil fin. The oil fin includes a moveable window. The moveable window includes a base and a first flap on one side of the base. The first flap moves between a closed position and an open position. The first flap is in the open position when the cooler core is in a hot condition.

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract: The arrangement relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the arrangement, the heat-conducting element has at least two sub-elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.

Abstract: An igniter plug for an aircraft turbomachine includes an external electrode, an internal electrode, as well as a semiconducting body arranged between the external electrode and the internal electrode and set back from these electrodes so as to define an electrical arc forming cavity, the bottom of which is formed by an axial end surface of the semiconducting body. The free end of the external electrode is equipped with at least one scoop for discharging possible fuel residues present in the cavity.

Abstract: The present invention relates to a multilayer fluid heat exchanger container comprising a thermo-conductive sheet, said sheet comprising at least a first layer comprising a metal foil and at least a second layer comprising a biocompatible plastic material, a multilayer sheet for the fluid container and systems for heating or cooling a fluid comprising the container and a fluid heating or cooling device for receiving the container. The present invention further relates to methods for heating or cooling a fluid comprising the step of circulating a fluid through the container and a process for the manufacture of the fluid container.

Abstract: Embodiments discussed herein include an inverter with a multi-part housing and internal cooling-air duct. In one example, the inverter can comprise a first housing part with direct current connections, a second housing part with alternating current connections, a third housing part for accommodating power-electronics components of a DC voltage converter, a fourth housing part for accommodating power-electronics components of an inverter bridge circuit, and a heat sink. The housing parts each have an essentially planar rear wall and are arranged in such a way that they enclose a cooling-air duct with an essentially rectangular cross section, wherein the first housing part is arranged opposite the second housing part and the third housing part is arranged opposite the fourth housing part. The heat sink has two essentially planar cooling faces opposite one another arranged in the cooling-air duct.

Abstract: A fixing frame for a heat sink includes boards, at least one foldable plate, and connection members. The boards surround a hollow area, and the hollow area includes a main accommodating space and at least one subsidiary accommodating space at one side of the main accommodating space. At least one foldable plate is detachably connected to one of the boards and is disposed in the subsidiary accommodating space. The connection members are disposed on the boards. By means of the connection members, the fixing frame mounts the heat sink on a circuit board of various sizes to dissipate heat therefrom.

Abstract: An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.

Abstract: Heat dissipation configurations and methods are described herein. A heat dissipation apparatus may include an individual piece of metal having a thermally conductive metal surface. The metal surface includes a plurality of ridges or protrusions extending from a base of the metal surface, wherein an air flow channel is provided between each two adjacent protrusions, therein providing a plurality of air flow channels. The apparatus is configured to dissipate heat for an electronic device having an active cooling source directing air through the plurality of air flow channels. In some examples, the heat dissipation apparatus is a vapor chamber, and the surface includes a section having a trough and a raised area or platform surrounded by the trough, wherein the raised area is configured to contact a microprocessor die in communication with the vapor chamber.

Abstract: Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

Abstract: A heat spreader which is configured using a composite of materials to provide localized heat spreading in certain directions across portions of the heat spreader while providing generalized heat spreading in multiple directions across other portions of the heat spreader. In certain embodiments, the localized heat spreading is across an XY plane and the generalized heat spreading is substantially continuous in XYZ directions.

Abstract: Provided is a circuit assembly that includes a circuit board that has an opening, a plurality of busbars that are laid on one surface side of the circuit board, a coil that has a main portion 16 and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars that are exposed through the opening, and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that are opposite to the circuit board. Cut-out portions for evacuating the adhesive agent are formed at edges of the plurality of busbars that are opposite to each other in the opening.

Abstract: A semiconductor device includes: a semiconductor module and a heat dissipation sheet attached to a bottom surface of the semiconductor module, the heat dissipation sheet including: a sheet-shaped first conduction part that has a first main surface bonded to the bottom surface of the circuit substrate, a thermal conductivity of the first conduction part in directions along the first main surface being higher than a thermal conductivity of the first conduction part in a thickness direction; and a sheet-shaped second conduction part that is provided next to the first conduction part at an end of the first conduction part and that has a second main surface continuing from the first main surface, a thermal conductivity of the second conduction part in a thickness direction being higher than a thermal conductivity of the second conduction part in directions along the second main surface.

Abstract: A dual-use thermal and electro-optic modulator. A thermal adjustment hardware set and an electric-field adjustment hardware set adjust the thermal and electrostatic properties of a common waveguide area. The hardware sets are electrically coupled. Signals for each type of modulation are conducted to the waveguide through a shared portion of a communication medium.

Abstract: An integrated heat sink article composed of a heat collection member and at least one heat dissipation member integral to the heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source, collects heat from the heat source, and dissipates heat through the at least one heat dissipation member, and further wherein the heat sink is formed of a nano graphene platelet-reinforced composite having nano graphene platelets or sheets (NGPs) as a first reinforcement phase dispersed in a matrix material and the first reinforcement phase occupies a weight fraction of 1-90% based on the total composite weight. Preferably, these NGPs, alone or in combination with a second reinforcement phase, are bonded by an adhesive and constitute a continuous 3-D network of electron- and phonon-conducting paths.

Abstract: An electronic package adapted for connection to a rear frame member of an electric machine. The electronic package includes a cooling tower having first and second axial ends and a central axis. The cooling tower includes a metallic first wall extending about the central axis and defining radially inner and outer first wall surfaces. An axially extending air flow passage extends through the cooling tower. Spaced metallic ribs traverse the air flow space and are in conductive thermal communication with the radially inner first wall surface. A plurality of circumferentially distributed power electronics devices are in conductive thermal communication with the cooling tower and secured to the radially outer first wall surface to thereby provide a heat sink for the power electronics devices. Electronic control circuitry is operatively connected to and substantially surrounded by the power electronics devices. An electric machine with such an electronic package is also disclosed.

Abstract: An extruded fin pack assembly is provided which is positioned within an appliance cabinet. In the embodiments, the fin pack includes a plurality of fins which are mounted in a substantially vertical plane and create flowpaths for air flow currents therethrough. A cover is provided to attach to the fins and hide the fins from view when the cabinet of the refrigerator or freezer is open. The cover also increases efficiency of the flowpaths between the fins thereby increasing convection heat transfer and increasing removal of heat from within the cabinet.

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

Abstract: Environmental enhancement systems and methods are disclosed. The environmental enhancement system may include a ground source heat pump including a subsurface ground loop portion and a liquid supply system to apply liquid (e.g., wastewater) to soil that is proximate to the subsurface ground loop portion. Performance of the ground source heat pump is improved by increasing heat transfer between the ground loop portion and the soil that is proximate to the subsurface ground loop portion. A gas injection system may be used to inject a gas into the soil that is proximate to the subsurface ground loop portion thereby cooling the soil, liquid, and air at a surface of the soil.

Abstract: An apparatus and a system including the apparatus. The apparatus may include a modular electronics enclosure. The modular electronics enclosure may be configured to house an electronics device. The modular electronics enclosure may include a side portion. The modular electronics enclosure may further include angled external heat sink fins extending from the side portion.

Abstract: An electrical connector cage assembly includes a casing, a first heat sink, a second heat sink, and a heat sink attaching structure. The casing can accommodate at least one electrical connector. The heat sink attaching structure includes a connecting part, a first engagement part, a second engagement part, a first attaching part, and a second attaching part. The connecting part protrudes out of a top wall of the casing. The first and second engagement parts are disposed on two opposite side walls of the casing respectively. The first and second attaching parts are connected to the connecting part. The first and second attaching parts detachably clip to the first and second engagement parts for attaching the first and second heat sinks on the top wall respectively.

Abstract: A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.

Abstract: The invention relates to a control device which has a housing with a housing base and a housing cover In the housing, a circuit board with electronic components has been arranged in the housing, which, furthermore, has a plug connection element with a connector housing. The connector housing has been arranged on the housing base, and in the housing base an opening has been arranged, which is covered by the connector housing and penetrated by connection elements of the plug connection element. A pressure compensation element has been arranged in the connector housing.

Abstract: A connector housing with heat dissipation structure includes a housing, a heat dissipation unit and a holding member. A first end part of the holding member is fixed to a top plate of the housing by using a first tongue piece engaged with a fastening piece, so an area of an opening of top plate is decreased and the EMI shielding effect is better. Two side arms of the holding member pass through the trenches inside the heat dissipation unit, such that the width of the heat dissipation unit is not limited and a heat dissipation area can be increased. The second end part of the holding member includes a second tongue piece plugged into a convex hull at a back cover, and an arrival end of the second end part withstands a stop part, so the holding member is not released easily and can endure an external force.

Abstract: A substrate is fixed to a housing. Heating elements are mounted on a surface of the substrate on the housing-side. A radiating component is provided between the heating elements and the housing. A surface of the housing on the substrate-side includes accommodating recesses, a partitioning wall part, a peripheral wall part, and buffer parts. In each of the accommodating recesses, a corresponding one of the heating elements is accommodated. The partitioning wall part separates the heating elements from each other. The peripheral wall part surrounds the accommodating recesses and the partitioning wall part. Each of the buffer parts is formed between a corresponding one of the accommodating recesses and the peripheral wall part. Each of the buffer parts is formed to be higher than a bottom part of a corresponding one of the accommodating recesses, and to be lower than the peripheral wall part.

Abstract: Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Abstract: Disclosed are a heat exchange plate (10) and a plate-type heat exchanger using the heat exchange plate (10). The heat exchange plate (10) comprises: a body; pits and/or protrusions (3), arranged on the surface of the body in predetermined patterns; and a plurality of adjusting portions (1, 2), wherein four quadrangular adjusting portions (1, 2) are arranged at the periphery of each pit and/or protrusion (3), then a basic heat transfer unit (4) is formed by each pit and/or protrusion (3) and the adjusting portions (1, 2) at the periphery thereof, and the adjusting portions (1, 2) in each basic heat transfer unit (4) are arranged to be provided with relatively large gaps in a main flow direction (D 1) of fluid on the heat exchange plate (10) and are arranged to be provided with relatively small gaps in an auxiliary flow direction (D2) of the fluid on the heat exchange plate (10).